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IBM Power 770 and 780 Technical Overview and Introduction

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IBM Power 770 and 780 Technical Overview and Introduction Front cover IBM Power 770 and 780 Technical Overview and Introduction Features the 9117-MMC and 9179-MHC based on the latest POWER7 processor technology Describes MaxCore and TurboCore for redefining performance Discusses Active Memory Mirroring for Hypervisor Alexandre Bicas Caldeira Carlo Costantini Steve Harnett Volker Haug Craig Watson Fabien Willmann ibm.com/redbooks Redpaper International Technical Support Organization IBM Power 770 and 780 Technical Overview and Introduction December 2011 REDP-4798-00 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. First Edition (December 2011) This edition applies to the IBM Power 770 (9117-MMC) and Power 780 (9179-MHC) Power Systems servers. © Copyright International Business Machines Corporation 2011. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix The team who wrote this paper . ix Now you can become a published author, too! . xi Comments welcome. xi Stay connected to IBM Redbooks . xii Chapter 1. General description . 1 1.1 Systems overview . 2 1.1.1 IBM Power 770 server . 2 1.1.2 IBM Power 780 server . 3 1.2 Operating environment . 4 1.3 Physical package . 5 1.4 System features . 6 1.4.1 Power 770 system features . 6 1.4.2 Power 780 system features . 8 1.4.3 Minimum features . 10 1.4.4 Power supply features . 12 1.4.5 Processor card features . 12 1.4.6 Summary of processor features . 15 1.4.7 Memory features . 19 1.5 Disk and media features . 21 1.6 I/O drawers . 23 1.6.1 PCI-DDR 12X Expansion Drawers (#5796) . 23 1.6.2 12X I/O Drawer PCIe (#5802 and #5877). 24 1.6.3 EXP 12S SAS Drawer. 24 1.6.4 EXP 24S SFF Gen2-bay Drawer . 24 1.6.5 I/O drawers and usable PCI slot . 24 1.7 Comparison between models . 25 1.8 Build to Order . 26 1.9 IBM Editions . 26 1.10 Model upgrade . 26 1.11 Hardware Management Console models . 28 1.12 System racks. 29 1.12.1 IBM 7014 model T00 rack. 29 1.12.2 IBM 7014 model T42 rack. 30 1.12.3 IBM 7014 model S25 rack. 30 1.12.4 Feature number 0555 rack . 30 1.12.5 Feature number 0551 rack . 30 1.12.6 Feature number 0553 rack . 30 1.12.7 The AC power distribution unit and rack content . 31 1.12.8 Rack-mounting rules . 32 1.12.9 Useful rack additions. 33 Chapter 2. Architecture and technical overview . 37 2.1 The IBM POWER7 processor . 40 2.1.1 POWER7 processor overview. 41 © Copyright IBM Corp. 2011. All rights reserved. iii 2.1.2 POWER7 processor core . 42 2.1.3 Simultaneous multithreading. 43 2.1.4 Memory access. 44 2.1.5 Flexible POWER7 processor packaging and offerings . 44 2.1.6 On-chip L3 cache innovation and Intelligent Cache . 46 2.1.7 POWER7 processor and Intelligent Energy . 47 2.1.8 Comparison of the POWER7 and POWER6 processors . 47 2.2 POWER7 processor cards . 48 2.2.1 Two-socket processor card. 48 2.2.2 Four-socket processor card . 50 2.2.3 Processor comparison . 51 2.3 Memory subsystem . 52 2.3.1 Fully buffered DIMM . 52 2.3.2 Memory placement rules. 52 2.3.3 Memory throughput. 58 2.3.4 Active Memory Mirroring . 59 2.4 Capacity on Demand. 60 2.4.1 Capacity Upgrade on Demand (CUoD). 60 2.4.2 On/Off Capacity on Demand (On/Off CoD). 60 2.4.3 Utility Capacity on Demand (Utility CoD) . 62 2.4.4 Trial Capacity On Demand (Trial CoD) . 62 2.4.5 Software licensing and CoD . 63 2.5 CEC Enclosure interconnection cables. 63 2.6 System bus . 68 2.6.1 I/O buses and GX++ card . ..
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