IBM Power Systems
POWER7TM Announcement, The Next Generation of Power Systems
Power your planet.
February 25, 2010 IBM Power Systems
2 February 25, 2010 IBM Power Systems
POWER7 System Highlights
.Balance System Design - Cache, Memory, and IO .POWER7 Processor Technology - 6th Implementation of multi-core design - On chip L2 & L3 caches .POWER7 System Architecture - Blades to High End offerings - Enhances memory implementation - PCIe, SAS / SATA .Built in Virtualization - Memory Expansion - VM Control .Green Technologies - Processor Nap & Sleep Mode - Memory Power Down support - Aggressive Power Save / Capping Modes 600
500
.Availability 400 - Processor Instruction Retry 300 - Alternate Process Recovery 200 100
- Concurrent Add & Services 0 JS23 JS43 520 550 560 570/16 570/32 595
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4 February 25, 2010 IBM Power Systems Power Processor Technology IBM investment in the Power Franchise Dependable Execution for a decade
POWER8 POWER7 45 nm Globalization and globally POWER6 available resources 65 nm •Performance/System Capacity POWER5 •4-5X increase from Power6 130 nm •Multi Core – Up to 8 POWER4 •SMT4 – 4 threads/core 180 nm . Dual Core •On-Chip eDRAM . High Frequencies • Energy . Dual Core . Virtualization + . Enhanced Scaling • Efficiency: 3-4X Power6 . Memory Subsystem + . SMT • Dynamic Energy . Dual Core . Altivec . Distributed Switch + Management . Chip Multi Processing . Instruction Retry . Distributed Switch . Core Parallelism + • Reliability + . Dyn Energy Mgmt . Shared L2 . FP Performance + . SMT + •Memory DIMM – DRAM . Dynamic LPARs (32) . Memory bandwidth + . Protection Keys Sparing . Virtualization •N+2 Voltage Regulator Redundancy •Protection Keys +
5 February 25, 2010 IBM Power Systems
POWER6 – POWER7 Compare
Wireless world Mobile platforms are developing as new means of identification. Security technology is many years behind the security used to protect PCs. Supply chain The chain is only as strong as the weakest link… partners need to shoulder their fair share of the load for compliance and the responsibility for failure. Clients expect privacy An assumption or expectation now exists to integrate security into the infrastructure, processes and applications to maintain privacy.
Compliance fatigue Organizations are trying to maintain a balance between investing in both the security and compliance postures.
6 February 25, 2010 IBM Power Systems POWER7 Processor Chip
Cores : 8 ( 4 / 6 core options ) Local SMP Links 567mm2 Technology: 45nm lithography, Cu, SOI, eDRAM POWER7 POWER7 POWER7 POWER7 F Transistors: 1.2 B CORE A CORE CORE CORE S Equivalent function of 2.7B L2 Cache T L2 Cache L2 Cache L2 Cache eDRAM efficiency L3 REGION Eight processor cores 12 execution units per core MC0 MC1 L3 Cache and 4 Way SMT per core – up to 4 threads per core Chip Interconnect 32 Threads per chip L2 Cache L2 Cache L2 Cache L2 Cache L1: 32 KB I Cache / 32 KB D Cache L2: 256 KB per core POWER7 POWER7 POWER7 POWER7 L3: Shared 32MB on chip eDRAM CORE CORE CORE CORE Dual DDR3 Memory Controllers 100 GB/s Memory bandwidth per chip Remote SMP & I/O Links Scalability up to 32 Sockets 360 GB/s SMP bandwidth/chip 20,000 coherent operations in flight
Binary Compatibility with POWER6
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Memory Channel Bandwidth Evolution
POWER5 POWER6 POWER7
Memory Performance: Memory Performance: Memory Performance: 2x DIMM 4x DIMM 6x DIMM
D D D D D D D D D D D D D D D D D D D D R R R R R R R R R R 3 3 3 3 3 3 3 3 3 3
DDR2 @ 553 MHz DDR2 @ 553 / 667 MHz DDR3 @ 1066 MHz Effective Bandwidth: Effective Bandwidth: Effective Bandwidth: 1.1 GB/s 2.6 GB/sec 6.4 GB/sec
8 February 25, 2010 IBM Power Systems Multi-threading Evolution
Single thread Out of Order S80 HW Multi-thread
FX0 FX0 FX1 FX1 FP0 FP0 FP1 FP1 LS0 LS0 LS1 LS1 BRX BRX CRL CRL POWER5 2 Way SMT POWER7 4 Way SMT FX0 FX0 FX1 FX1 FP0 FP0 FP1 FP1 LS0 LS0 LS1 LS1 BRX BRX CRL CRL
No Thread Executing Thread 0 Executing Thread 1 Executing
Thread 2 Executing Thread 3 Executing
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POWER7 TurboCore Mode Power 780 TurboCore Chip
. TurboCore Chips: 4 available cores Core Core Core Core . Aggregation of L3 Caches of unused cores. P O . TurboCore chips have a 2X the L3 Cache W L2 L2 L2 L2 per Chip available E S R - 4 TurboCore Chips L3 = 32 MB M P . Performance gain over POWER6. G 32 MB F - Provides up to 1.5X per core to core X L3 Cache A . Chips run at higher frequency: B R - Power reduction of unused cores. I C . With “Reboot”, System can be reconfigured B L2 L2 L2 L2 U to 8 core mode. S
- ASM Menus Core Core Core Core
Unused Memory Interface TurboCores Core
1 February 25, 2010 0 IBM Power Systems
Active Memory Expansion
Effectively up to 100% more True True True Expanded Expanded Expanded memory memory memory memory memory memory memory
True True True Expanded Expanded memory Expanded memory memory memory memory memory
POWER7 advantage
Expand memory beyond physical limits More effective server consolidation Run more application workload / users per partition Run more partitions and more workload per server
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Active Memory Expansion
Innovative POWER7 technology For AIX 6.1 or later For POWER7 servers Uses compression/decompression to effectively expand the true physical memory available for client workloads Often a small amount of processor resource provides a significant increase in the effective memory maximum Processor resource part of AIX partition’s resource and licensing Actual expansion results dependent upon how “compressible” the data being used in the application A SAP ERP sample workload shows up to 100% expansion, Your results will vary Estimator tool and free trial available
12 February 25, 2010 IBM Power Systems
Active Memory Expansion & Active Memory Sharing
Active Memory Expansion Active Memory Sharing Effectively gives more memory capacity to Moves memory from one partition to the partition using compression / another decompression of the contents in true Best fit when one partition is not busy memory when another partition is busy AIX partitions only AIX, IBM i, and Linux partitions
15 #10 #9 #8 10 #7 #6 #5 5 #4 #3 #2 0 #1
Active Memory Expansion Active Memory Sharing Supported, potentially a very nice option Considerations Only AIX partitions using Active Memory Expansion Active Memory Expansion value is dependent upon compressibility of data and available CPU resource (Source: CSI 2007 Survey, n= 494, US)
13 February 25, 2010 IBM Power Systems
TPMD: Thermal Power Management Device
. TPMD card is part of the base hardware configuration. . Residing on the processor planar . TPMD function is comprised of a risk processor and data acquisition . TPMD monitor power usage and temperatures in real time . Responsible for thermal protection of the processor cards . Can adjust the processor power and performance in real time. . If the temperature exceeds an upper (functional) threshold, TPMD actively reduces power consumption by reducing processor voltage and frequency or throttling memory as needed. . If the temperature is lower than upper (functional) threshold, TPMD will allows POWER7 cores to “Over clock” if workloads demands are present.
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15 February 25, 2010 IBM Power Systems Power Systems – February 2010
. New POWER7 in middle of the line Power 780 . Power 750 Express . Power 755 for HPC Power 770 . Power 770 modular . Power 780 modular high-end . POWER6 continues . Power 520, Blades Power 750 . Power 550 . Power 560 . Power 570 . Power 575 Power 560 . Power 595
Power 755
JS Blades
IBM Systems Software
16 February 25, 2010 IBM Power Systems Processor Offerings for Rack / HPC POWER7 Processor Offerings Cores / Socket 4 6 8 Power 750 - Yes Yes (3) Power 755 - - Yes
Configuration Options Sockets 1 2 3 4 6 Core Chips 6 Cores 12 Cores 18 Cores 24 Cores 8 Core Chips 8 Cores 16 Cores 24 Cores 32 Cores
1-4 Socket System
17 February 25, 2010 IBM Power Systems Processor Offerings for Modular Systems
POWER7 TurboCore / CoD Processor Offerings
Cores / Socket 4 TurboCore 6 8 Base 8 Enhanced
Power 770 - Yes Yes - Power 780 Yes - - Yes
Configuration Options Enclosures 1 2 3 4 4 Core Chips 8 Cores 16 Cores 24 Cores 32 Cores 6 Core Chips 12 Cores 24 Cores 36 Cores 48 Cores 8 Core Chips 16 Cores 32 Cores 48 Cores 64 Cores
18 February 25, 2010 IBM Power Systems
POWER7 Model 750
8233-E8B
19 February 25, 2010 IBM Power Systems Power 750 System 8233-E8B 6 Cores @ 3.3 GHz POWER7 Architecture 8 Cores @ 3. 0, 3.3, 3.55 GHz Up to 181,000 CPW! Max: 4 Sockets DDR3 Memory Up to 512 GB Up to 8 Drives (HDD or SSD) System Unit SAS SFF 73 / 146 / 300GB @ 15k (2.4 TB) Bays (Opt: cache & RAID-5/6) PCIe x8: 3 Slots (2 shared) System Unit PCI-X DDR: 2 Slots IO Expansion Slots 1 GX+ & Opt 1 GX++ 12X cards 4U Integrated SAS / SATA Yes Depth: 28.8” System Unit 3 USB, 2 Serial, 2 HMC Integrated Ports Integrated Virtual Quad 10/100/1000 Ethernet Optional: Dual 10 Gb System Unit Media Bays 1 Slim-line DVD & 1 Half Height IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = Max 8 Cluster 12X SDR / DDR (IB technology) Redundant Power and Yes (AC or DC Power) Cooling Single phase 240 VAC or -48 VDC Certification (SoD) NEBS / ETSI for harsh environments Active Thermal Power Management EnergyScale Dynamic Energy Save & Capping
20 February 25, 2010 IBM Power Systems Power 750 Information….
.Physical Specifications: - Width: 440 mm (17.3 in) - Depth: 730.8 mm (28.8 in) - Height: 175 mm (6.89 in) - Weight: 54.4 kg (120 lb) .Operating voltage: - 200 to 240 V .Operating Frequency: 50/60 Hz .Power Consumption: 1950 watts (maximum) .Power Factor: 0.97 .Thermal Output: 4778 Btu/hour (maximum) .Power-source Loading Recommend either - 1.443 KVA (maximum configuration) rack acoustic doors or .Noise Level and Sound locating in a machine room. - Rack-mount drawer: 7.0 Bels operating
21 February 25, 2010 IBM Power Systems POWER7 / POWER6 Bandwidth Comparison
Power 550 Power 750
70
60
50
40
30
20
10
0 Memory Intra IO
22 February 25, 2010 IBM Power Systems POWER7 / POWER6 Comparison
Power 750 Power 550 Power 560
9000 8000 7000 6000 5000 4000
3000 2000 1000 0 Energy Consumption Thermal Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active
23 February 25, 2010 IBM Power Systems Power 750 CPW Performance …
3.0GHz (8 core) 44600 (8) = 5575 82600 (16) = 5510 122500 (24) = 5104 158300 (32) = 4946
3.3GHz (6 core) 37200 (6) = 6200 69200 (12) = 5766 94900 (18) = 5272 135300 (24) = 5637
3.3GHz (8 core) 47800 (8) = 5975 88700 (16) = 5543 129700 (24) = 5405 168800 (32) = 5275
3.55GHz 181000 (32) = 5656
Power 550 Power 560 Power 750 8 Core 16 Core 32 Core @ 5GHz @ 3.6GHz @ 3.55GHz 37,950 CPW 48,500 181,000 CPW
24 February 25, 2010 IBM Power Systems
POWER7 Model 755
8236-E8C
25 February 25, 2010 IBM Power Systems Power 755 4-Socket HPC System Power 755 POWER7 4 Processor Sockets = 32 Cores Architecture 8 Core @ 3.3 GHz DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots Up to 8 disk or SSD System Unit 73 / 146 / 300GB @ 15K (up to SAS SFF Bays 4U x 28.8” depth 2.4TB) PCIe x8: 3 Slots (1 shared) System Unit PCI-X DDR: 2 Slots Up to 8.4 TFlops per Rack Expansion ( 10 nodes per Rack ) GX++ Bus Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Quad 1Gb Copper Ethernet (Opt: Dual 10Gb Copper or Fiber) System Unit 1 DVD-RAM ( No supported tape Media Bay bay ) Up to 64 nodes Cluster Ethernet or IB-DDR Yes (AC or DC Power) Redundant Power Single phase 240vac or -48 VDC Certifications NEBS / ETSI for harsh (SoD) environments Active Thermal Power 5.3 / 6.1 RHEL / SLES EnergyScale Management Dynamic Energy Save & Capping
26 February 25, 2010 IBM Power Systems
POWER7 Model 770 Model 780
9117-MMB
9179-MHB
27 February 25, 2010 IBM Power Systems Power 770 Power 770 Up to 292,700 CPW! 6 Cores @ 3.55 GHz Processor Technology 8 Cores @ 3.1 GHz L3 Cache On Chip Redundant Power & Cooling Yes
Redundant Server Processor Yes / Two Enclosure minimum 4U x 32 inches Depth Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes System Unit Single Enclosure 4 Enclosures Processors Up to 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Std: Quad 1Gb Std: Four Quad 1Gb Integrated Ethernet Opt: Dual 10Gb + Opt: Four x Dual 10Gb + Maint Coverage: 9 x 5 Dual 1 Gb Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X
28 February 25, 2010 IBM Power Systems Power 780 Power 780 4 Cores @ 4.14 GHz TurboCore Processor Technology 8 Cores @ 3.86 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes System Unit Single Enclosure 4 Enclosures Processors 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays (CEC) 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 Maint Coverage 24 X 7 PCIe (CEC) 6 PCIe 24 PCIe PowerCare Support GX++ Slots (12X DDR) 2 8 Std: Quad 1Gb Std: Four Quad 1Gb Integrated Ethernet Opt: Dual 10Gb + Dual Opt: Four x Dual 10Gb + Dual 1 Gb 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X
29 February 25, 2010 IBM Power Systems POWER7 Modular Information….
. Physical Specifications (4 EIA units) - Width: 483 mm (19.0 in.) - Depth: 863 mm (32.0 in.) - Height: 174 mm (6.85 in) - Weight: 70.3 kg (155 lb) . Operating voltage: - 200 to 240 V . Operating Frequency: 50/60 Hz . Power Consumption: 1600 watts (maximum) - Per enclosure with 16 cores active . Power Factor: 0.97 . Thermal Output: 5461 Btu/hour (maximum) - Per enclosure with 16 cores active . Power-source Loading - 1.649 kva (maximum configuration) . Noise Level and Sound - One enclosure with 16 active cores: • 6.8 bels / 6.3 bels with acoustic rack doors (operating/idle) - Four enclosures with 64 active cores: • 7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)
30 February 25, 2010 IBM Power Systems Power 770 & 780 vs Power 570 Differences
Power 570 Power 770 & 780 Up to 8 sockets, Up to 32 Cores Up to 8 Sockets, Up to 64 cores
Up to 768 GB Memory Up to 2 TB Memory ( Initial GA will be 1 TB)
DDR2 DIMMS DDR3 DIMMS
Six 3.5” SAS Bays / Enclosure Six SFF SAS Bays / Enclosure
4 PCIe & 2 PCI-X slots per Enclosure 6 PCIe slots per Enclosure
No write cache or RAID-5/6 support Write cache & RAID-5/6 support
Single integrated DASD / Media Cntlr Three integrated DASD / Media Controllers Standard Split backplane Optional Split Backplane Optional Tri-Split Backplane Power & Thermal management No Power & Management Thermal TPMD support
Clock Cold Failover Clock Hot Failover ECC with bit steer ECC with DRAM sparing Concurrent Drawer Maint restrictions No Restrictions ( 4Q / 2010 ) Concurrent Drawer Add cable restrictions No Restrictions
31 February 25, 2010 IBM Power Systems Power Modular value grows through 2010
4Q
• Large DIMM support • 640 partition support • Additional Hot-node Add & Repair June support
• General Availability for upgrades • CSP enabled for ordering April
• Planned additional benchmark results • eConfig support for upgrades and MES orders
March
General Availability
February
Announce Power 770 and Power 780
32 February 25, 2010 IBM Power Systems POWER7 Modular Concurrent Maintenance… Enclosure 1 16 Core 2
Remove
1
Update
Enclosure 2 Enclosure 4 16 Core 16 Core 3
Enclosure 3 16 Core Return
1. 64 core Partition environment 2. 48 core Partition environment Additional support 2H / 2010 3. 64 core Partition environment
33 February 25, 2010 IBM Power Systems Power 570/32 vs Power 770 Bandwidth Comparison
POWER6 POWER7
1200
1000
800
600
400
200
0 Memory Inter Intra IO
34 February 25, 2010 IBM Power Systems POWER7 / POWER6 Comparison
Power 750 Power 550 Power 560
9000 8000 7000 6000 5000 4000
3000 2000 1000 0 Energy Consumption Thermal Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active
35 February 25, 2010 IBM Power Systems Power 780 CPW Performance
Power 570/32 Power 780
3.9GHz processors (8 core) 180 3.1GHz processors (8 core) 105200 (16) =6575 88800 (16) = 5550 177400 (32) = 5543 155850 (32) = 4870 265200 (48) = 5525 160 229800 (48) = 4787 343050 (64) =5360 292700 (64) = 4573
140 3.5GHz processors (6 core) 73100 (12) 6091 131050 (24) = 5460 120 248550 (48) = 5178
100
80
60
40
20
0 8 Core 16 Core 32 Core
36 February 25, 2010 IBM Power Systems
37 February 25, 2010 IBM Power Systems IBM Power Systems Comparisons
Power 750 Power 770 Power 780 Power 595 Nodes One Up to four Up to four Up to eight Cores (single system 6, 12, 18, 24 or 8 – 64 4 – 64 4 – 64 image) 8, 16, 24, 32 Upgradeable to 256 Frequency 3.0, 3.3, 3.55 GHz 3.1, 3.5 GHz 3.8, 4.1 GHz 4.2, 5.0 GHz SMP buses 4 byte 8 byte 8 byte 8 byte System memory Up to 512 GB Up to 2 TB* Up to 2 TB* Up to 4 TB Memory per core 16 or 21 GB 32 or 42 GB 32 or 64 GB 64 GB Memory Bandwidth 273 GB/s 1088 GB/s 1088 GB/s 1376 GB/s (peak)
Memory Bandwidth per 8.5 GB/s 17 or 22 GB/s 17 or 34 GB/s 21.5 GB/s core (peak) Memory controllers 1 per processor 2 per processor 2 per processor 2 per processor I/O Bandwidth (peak) 30 GB/s 236 GB/s 236 GB/s 640 GB/s I/O Bandwidth per core 0.9GB/s 3.6 or 4.9 GB/s 3.6 or 7.3 GB/s 10 GB/s (peak) I/O loops Up to 2 Up to 8 Up to 8 Up to 32 Total disk drives Up to 576 Up to 1200 Up to 1200 Up to 2640 rPerf per core Up to 11 Up to 11 Up to 13 Up to 10.8 Maximum LPARs Up to 320* Up to 640* Up to 640* Up to 254 Enhanced Memory Enhanced Memory Enhanced Memory RAS Standard Dynamic FSP & clocks Dynamic FSP & clocks Dynamic FSP & clocks
Warranty 9 x 5 9 x 5 24 x 7 24 x 7 PowerCare No No Yes Yes
38 February 25, 2010 IBM Power Systems
Power 5 / Power 6 / POWER7 550 and 570 Comparison
550 Power 5 550 Power 5+ 8204-E8A 8233-E8B Power 6 750 POWER7 12,000 14,000 27,600 181,000 4-core 4-core 8-core 32 core
570 Power 5 570 Power 5+ 9117-MMA 9117-MMB Power 6 750 POWER7 44,700 58,500 77,600 / 104800 292,700 16-core 16-core 16-core / 32- 64 core core
39 February 25, 2010 IBM Power Systems
IBM Upgrades/Migrations to POWER7
40 February 25, 2010 IBM Power Systems
*Power 5 and Power 5+ 570 CANNOT upgrade to POWER7 770
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47 February 25, 2010 IBM Power Systems Supported Expansion Units on POWER7 •Supported Expansion Units •Expansion units on 12x loops •5796 PCI-X I/O Expansion (max 4 per loop) •Expansion units on 12x DDR loops •5802 PCIe I/O W/Disk Drawer (max 2 per loop) •5877 PCIe I/O NoDisk Drawer (max 2 per loop) •Disk Expansion Drawers •5786 EXP24 Disk Drawer (SCSI) •No new SCSI disk drives available •5886 EXP12S Disk Drawer (SAS)
•No HSL loop available on POWER7 systems •Common expansion units NOT supported •5094 •5294 •5088/0588 •5095/0595 •5790 •This means NO IOPs supported •No IOA adapter cards that require an IOP are supported •Common IOA cards that requite an IOP •4746 Twinax •2749 tape/3995/3996 •2742/4745/2793 2-line WAN •5702/5712/5736/571A SCSI (most commonly used for SCSI LTO tape drives) •5761 and 5760 Fibre Channel (tape / disk) •2849 10/100 Ethernet •5700/5701 1B Ethernet •2757/2780/5580/5590 (etc) SCSI Disk adapters •More… •SCSI devices attached to adapters that require an IOP will not be able to migrate •LTO LVD and HVD SCSI tape drives will not migrate •SAS or fibre attached tape drives can be used (will require V6R1 or higher) •Only IOP-less adapters are supported
48 February 25, 2010