Rest of World Company Profiles Acer Laboratories
ACER LABORATORIES
Acer Laboratories, Inc. 11F, 45 Tung Hsing Road, Taipei 110, Taiwan, ROC Phone: (886) (2) 2762-8800 Fax: (886) (2) 2762-6138
IC Manufacturer
Financial History ($M)
1996 1997
Sales 100 110 (est.)
Employees — 200
Company Overview and Strategy
Acer Laboratories was founded in 1987 as an independent research and development center for the Acer Group. In 1993, the company separated from Acer Inc. and became a member company of the Acer Group.
The company’s primary activity is the design and manufacturing of integrated circuits for the personal computer and embedded systems markets. Present products include core logic chipsets, multimedia chips and peripheral chips.
The headquarters are in Taipei. The manufacturing and test activities are in the Hsinchu Science Park.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-1 Alphatec Rest of World Company Profiles
ALPHATEC
Alphatec Electronics Public Co., Ltd. 17/2 Moo 18, Suwintawong Road Saladang, Amphur Bang-Num-Priow Cha-Cherng-Sao, 24000 Thailand Telephone: (66-38) 593-223 Fax: (66-38) 593-229
IC Manufacturer
Regional Headquarters/Representative Locations
North America: Alphatec Electronics Corporation • San Jose, California Telephone: (408) 998-4620 • Fax: (408) 998-4711
Alphatec has undergone extensive changes in the past year. In prior years they had IC Manufacturing capability but now they are only an Assembly house. Profile kept in for historical value.
Company Overview and Strategy
Alphatec Electronics Corporation is currently made up of three independently financed and operated Assembly and Test operations which are linked through agreement for management: Alphatec Electronics Public Co. Ltd. (ATEC), NS Electronics Bangkok (NSEB) and Alphatec Electronics Corporation of Shanghai (ATES). Headquarters are located in Bangkok, Thailand; Sales and Management offices are also located in San Jose, California.
Combined, these plants produce a full range of PDIP, SOIC, PLCC, MQFP, TQFP, TSOP, SSOP, TSSOP, Q & VSOP packages plus many hermetic packages. Total output exceeds 100 million units per month. Hermetic volume is approximately 1 million units per week. Approximately 80 percent of assembled product goes through final test at the assembly site.
All facilities are ISO certified; ATEC and NSEB are also SAC certified. They have World Class performances indices.
Combined, the plants total approximately 575K square feet and employ about 5,000 people.
5-2 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Alphatec
Management
Bob Mollerstuen Acting Chief Executive Officer Willem de Vries President, Manufacturing K.Y. Wong Vice President, Worldwide Sales H.K. Foo General Manager, Alphatec Electronics Corporation of Shanghai Thavisakdi Thangsuphanich Chief Executive Officer, NS Electronics Bangkok Udom Udompanyavit President, NS Electronics Bangkok John Griffin President, Alphatec Electronics Corporation (U.S.) Thom Dietmeier Director, North American Sales and Marketing
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-3 Amkor / Anam Rest of World Company Profiles
AMKOR / ANAM SEMICONDUCTOR
Amkor / Anam Semiconductor A division of Amkor Electronics, Inc. 222 Dodang-dong, Wonmi-gu Buchon, Kyunggi-do, 420-130 South Korea Telephone: (82) 32 680 4700 Fax: (82) 32 683 8104 Web Site: www.amkor.com
IC Foundry Founded: 1968
Regional Offices/Representative Locations
U.S.: U.S. Sales Santa Clara, CA 95054 Telephone: 408-496-0303 • Fax: 408-496-0148
Customer Engineering Boise, ID 83712 Telephone: 208-345-9300 • Fax: 208-345-8199
Europe: Euroservices SARL (AAES) 01210 Ferney-Voltaire, France Telephone: 33-2-50-40-9797 • Fax: 33-4-50-40-9888
Financial History ($M)
1996 1997 * Corporate Sales 1,171 — Net Income 34.2 —
Employees 8,180 —
*Company did not disclose.
Ownership: Privately held (35 percent - owned by the Kim family, the founders of the Anam Group).
5-4 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Amkor / Anam
Company Overview and Strategy
Amkor is well known as one of the largest subcontractors for semiconductor packaging, assembly and test. With the opening of their new wafer fabrication facility, Amkor is now offering fully integrated IC manufacturing, including masks, wafer processing packaging, assembly and test. The company intends to provide overall solutions through what they call Silicon-Package Architecture (SPA). SPA is an “architectural level concept” used to design a package in concert with device and system design requirements, so as to optimize product and process capabilities. Reported FY 1996 corporate sales were $1,171 (M) and net income $34.2 (M), and the 1997 sales were unavailable due to possible initial public offering of the company.
The fab will provide dedicated and independent contract manufacturing services for CMPS logic semiconductors. It will use 0.25 and 0.35µm, five metal layer processes. Amkor’s strategy is to provide better total system engineering solutions that combine silicon, package and test through vertical integration. Vertically integrated semiconductor manufacturing service can provide significant advantages in operations, logistics, quality, reliability, and offer a better engineering system solution.
Management
James J. Kim Chairman and Chief Executive Officer John N. Boruch President Frank J. Marcucci Chief Financial Officer Michael D. O’Brien Vice President Eric R. Larson Vice President
Products and Processes
Anam has replicated a CMOS process from Texas Instruments’ DMOS-5 fabrication facility in Dallas, Texas; it’s TI’s proven robust and most advanced 25C10 process family, used for advanced digital circuits. Briefly described, the 25C10 process uses an epitaxial silicon starting wafer, 0.25µm polysilicon critical dimensions (0.20µm effective gate length), shallow trench isolation, retrograde twin-well fabrication with MeV ion implantation, five metal interconnect levels with 0.898µm minimum metal pitch, chemical mechanical polishing planarization, and tungsten-plug vias and contacts. The process provides leading edge gate delay performance and circuit densities that are on the mainstream of industry trends. Options are available for 3.3 and 2.5 volt power supplies. Amkor’s process roadmap includes upgrades to even tighter design rules for 0.18µm and below.
Semiconductor Fabrication Facilities
In December of 1997, Amkor / Anam celebrated the opening of their deep submicron wafer foundry in Buchon, South Korea. The fab has both 0.25µm and 0.35µm capability. The five-metal-layer processes that will be used, were obtained from a long-term cooperative agreement between Texas Instruments, Dallas, TX, and Anam.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-5 Amkor / Anam Rest of World Company Profiles
Amkor / Anam 222 Dodang-dong, Wonmi-gu Buchon, Kyunggi-do, 420-130 South Korea Cleanroom size: 67,000 sq. ft. Capacity (wafers/week): 25,000 Wafer sizes: 125mm, 150mm Process: CMOS Products: MCUs, EEPROMs, EPROMs, ASSPs Feature sizes: 0.25µm-0.35µm
Amkor / Anam maintains assembly and test facilities in the Philippines, and Korea.
Key Agreements
• The five-metal-layer processes that Amkor/Anam will be using were obtained from a long-term cooperative agreement between Texas Instruments, Dallas, Texas and Anam. As part of the agreement, TI has contracted to purchase a significant portion of the fab’s wafer capacity.
• Anam has a joint venture with Photronics Korea from which it can obtain critical photomask technology to support its wafer fabrication operations.
5-6 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Angstrem
ANGSTREM
Angstrem 103460 Zelenograd Russia Telephone: (7) (095) 531-1470/2515 Fax: (7) (095) 531-2756/0306
IC Manufacturer
Regional Headquarters/Representative Locations
Russia: Angtrade Joint Stock Company • Moscow, Russia Telephone: (7) (095) 531-5530 • Fax: (7) (095) 531-2756
Employees: 2,000
Ownership: Privately held as of 1993.
Company Overview and Strategy
Angstrem was created in June 1963, as the leading microelectronics enterprise of the Soviet Union and integrated a research institute and an experimental plant. It was primarily targeted to develop and master IC technologies and devices for their subsequent transfer to mass production to more than 30 factories in the former USSR.
Angstrem has 56 patents; six licenses sold to foreign firms.
Before 1990, Angstrem served primarily the domestic and East Europe markets.
In the early 90’s Angstrem started development and mass production of IC chips for consumer electronics in the framework of a conversion project.
Management
Valery L. Dzhkhunyan, Ph.D. General Director Anatoly J. Sukhoparov, Ph.D. First Deputy General Director Vladimir S. Travnitsky Deputy General Director, External Relations
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-7 Angstrem Rest of World Company Profiles
Products and Processes
Current Development Trends • Consumer Electronics (calculators, electronic games, watches, etc.); • Special-Purpose Electronic Products; • Industrial Electronics; • Telecommunication Systems; • SmartCards; • Display Units; and • Power Consumption Monitoring.
Angstrem has several experimental and pilot facilities, a Foundry, several Design centers, including external ones, a Technological center, and a Foreign trade firm.
Semiconductor Fabrication Facilities
Angstrem Angstrem 103460 Zelenograd 103460 Zelenograd Russia Russia Fab 0 Fab 1 Cleanroom size: 21,500 square feet (Class 10) Cleanroom size: 25,000 square feet (Class 10) Capacity (wafers/week): 7,500 Capacity (wafers/week): 1,250 (future: 3,000) Wafer size: 100mm Wafer size: 150mm Processes: CMOS, BiCMOS (1 and 2 metals) Processes: CMOS, BiCMOS (1 and 2 metals) Products: Consumer electronics ICs, logic ICs Products: Consumer electronics ICs, logic ICs Feature sizes: 1.5-2.0µm Feature sizes: 1.0-1.2µm
Angstrem 103460 Zelenograd Russia Fab 2 New facility, anti vibration platform, cleanrooms of Class 10 Capacity (wafers/week); 5,000 Wafer size: 6 inch (150mm) and 8 inch (200mm) Processes: CMOS, BiCMOS (2-4 metals) Feature sizes: 0.35-0.5µm (Scheduled for launch in 1999).
Angstrem’s Foundry makes customized CMOS devices with design rules 2.0 and 1.2 microns. Typical lead time is 45 to 60 days.
5-8 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Asicom Technologies
ASICOM TECHNOLOGIES, LTD.
Asicom Technologies, Ltd. MATAM, Building 6/2 P.O.B. MATAM Haifa 31905 Israel Telephone: (972) (4) 831-3322 Fax: (972) (4) 831-3551 Web Site: www.asicom-tech.com Email: [email protected]
Fabless IC Supplier
Company Overview and Strategy
ASICOM Technologies Ltd. operates as a design and service operation and provides the following services.
•System definition •IC design and technology selection •Foundry Selection and interface •Testing
Products and Processes
The company works with the following technologies.
Voltages: 100V, 20V, 5V, 3V, 1.2V
Processes: CMOS, BiCMOS, EEPROM
Geometries: 1.5, 1.2, 0.8, and 0.5 micron.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-9 ASMC Rest of World Company Profiles
ADVANCED SEMICONDUCTOR MANUFACTURING (ASMC)
Advanced Semiconductor Manufacturing Corp. of Shanghai 385 Hong Cao Road Shanghai 200233, China Telephone: (86) (21) 64851900 Fax: (86) (21) 64851056 Web Site: www.asmcs.com
IC Manufacturer
Company Overview and Strategy
Advanced Semiconductor Manufacturing Corp. of Shanghai (ASMC) was established in 1995 when Nortel (then Northern Telecom) of Canada made an agreement with Philips Electronics of the Netherlands and the Chinese government to jointly own and operate Philips’ semiconductor fabrication facility in Shanghai. Formerly known as Philips Semiconductor Corp. of Shanghai, the operation was initially intended to manufacture ICs primarily for Philips’ own television sets.
As ASMC, the operation now functions as an independent foundry, owned 38 percent by Philips, 34 percent by Nortel, and 28 percent by Chinese banks. It is a QS-9000 certified wafer foundry providing subcontract manufacturing to international companies. Currently, ASMC’s customers include several IC manufacturers in the U.S. and Europe. It is looking to add additional customers, including both IC suppliers for subcontract manufacturing or foundry services. Meanwhile, services for local design houses are also being developed.
Management
John Montesi President Jon Macro Chief Technical Officer
Products and Processes
As a wafer foundry, ASMC targets the niche technology market. Its current process capabilities include 3.0µm bipolar with voltages up to 60 volts, 3.0µm SACMOS (self-aligned contact CMOS) with an EEPROM option, 1.0µm CMOS double-level metal and double-level polysilicon, and 8.0µm powerMOS. Some of these processes are licensed from the company’s technical partners for use in producing wafers for design houses.
Wafer testing is an optional service. ASMC can also arrange for local assembly and final testing of devices.
5-10 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles ASMC
Semiconductor Fabrication Facilities
ASMC ASMC Cao He Jing Hi-Tech Park Cao He Jing Hi-Tech Park Shanghai, China Shanghai, China Fab 1 Fab 2 Cleanroom size: 16,150 square feet, Class 10 Cleanroom size: 16,150 square feet, Class 1 Capacity (wafers/week): 5,250 Capacity (wafers/week): 3,750 (1,750 currently) Wafer size: 125mm Wafer size: 150mm Processes: CMOS, bipolar, powerMOS Process: CMOS (bipolar in 1998) Products: Linear ICs, discretes Products: Foundry Feature sizes: 3.0µm-8.0µm Feature sizes: 0.8µm-1.0µm
Key Agreements
• Both Philips Semiconductors and Nortel have technology transfer cooperation agreements with ASMC.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-11 Bharat Electronics Rest of World Company Profiles
BHARAT ELECTRONICS LTD. (BEL)
Bharat Electronics Ltd. Integrated Circuits Division Bangalore Complex Jalahalli, Bangalore 560 013 India Telephone: (91) (80) 8382626 Fax: (91) (80) 3832927/2322 Web Site: www.bel-india.co.
IC Manufacturer Founded: 1954 / 1970
Employees (Integrated Circuits Division): 210
Regional Offices/Representative Locations
North America: Bharat Electronics Ltd. • Garden City, New York Telephone: (516) 248-4020 • Fax: (516) 741-5894
Company Overview and Strategy
Bharat Electronics Ltd. (BEL) manufactures a broad spectrum of products ranging from semiconductors to large radar systems. Target markets include defense communication, radars, optical and opto-electronics, telecommunications, sound and vision broadcasting, and electronic components. In addition to manufacturing, BEL offers a variety of services including telecom consultancy, contract manufacturing, calibration of test and measuring instruments.
BEL was established in 1954 to meet the defense needs of the Government of India. Since then, BEL has grown to a multi-product technology driven company. BEL's Integrated Circuits Division was started in 1970, in technical collaboration with M/S RCA of the U.S. to manufacture linear bipolar and digital CMOS ICs. Today, the division manufactures a wide range of linear bipolar circuits and digital CMOS circuits for the telecommunications, consumer electronics, computer, and professional markets.
To support its commitment to new product development, BEL established its Central Research Labs (CRL) where development is focused on futuristic technologies in the areas of signal processing, computing, communications systems, materials and devices, microelectronics, and manufacturing.
5-12 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Bharat Electronics
Management
Y. GopalaRao General Manager, Semiconductors V. Muthuswamy Additional General Manager, ICs H.V. Ananda, Ph.D. Deputy General Manager, Design Centre and Mask Fab D.A. Mohan Deputy General Manager, Marketing
Products and Processes
Linear Integrated Circuits: Digital Integrated Circuits: Operational amplifiers Standard TTL circuits Voltage comparators and regulators Low-power Schottky TTLs Telecom circuits CMOS CD4000 series Special function circuits CMOS 74HC series Radio/Audio circuits Television circuits Automotive electronic circuits
Besides the manufacture and sale of ICs, Bharat Electronics also undertakes contract jobs for external customers in the areas of design, mask manufacture, test, and assembly.
Semiconductor Fabrication Facilities
Bharat Electronics Ltd. Bangalore Complex Jalahalli, Bangalore 560 013 India Wafer size: 100mm Processes: Bipolar, CMOS Products: Linear and digital ICs Feature size: 5.0µm
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-13 Chartered Semiconductor Rest of World Company Profiles
CHARTERED SEMICONDUCTOR MANUFACTURING (CSM)
Chartered Semiconductor Manufacturing Ltd. (CSM) 60 Woodlands Industrial Park, Street 2 Singapore 738406 Telephone: (65) 362-2838 Fax: (65) 362-2938 Web Site: www.csminc.com
IC Manufacturer Founded: 1987
Regional/Representative Locations
North American: Chartered Semiconductor Manufacturing, Inc. • Milpitas, California Telephone: (408) 941-1108 • Fax: (408) 941-1297
Europe: Chartered Semiconductor Manufacturing • Germering, Germany Telephone: (49) (89) 84108-599 • Fax: (49) (89) 84108-601
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 50 100 160 285 360 472 Capital Expenditures — — 100 550 700 921
Employees 450 600 600 1,800 2,000 2,800
Company Overview and Strategy
Chartered Semiconductor Manufacturing Ltd. (CSM) is a dedicated foundry, providing advanced technology wafer manufacturing services for the global semiconductor industry. It was the first high technology semiconductor company in Singapore to create, produce, and market leading edge ICs. Today, Chartered manufactures ICs for such diverse applications as graphics, communications, computing, and networking, as well as backbone technologies like memories.
Chartered’s services include chip design assistance, mask making, wafer fabrication, wafer sort, assembly, and test. Customers can choose from a comprehensive portfolio of design services and products, including standard cell and gate array libraries, I/Os, memory compilers, datapaths, and intellectual property cells. The company also offers customers a turnkey solution that includes some or all of Chartered’s services.
5-14 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Chartered Semiconductor
Chartered was established in 1987 as a captive foundry. In 1991, the company became a pure, independent foundry. Chartered is part of Singapore Technologies Semiconductors (STS), a group of companies that provide a full range of services for the semiconductor industry. STS is a strategic business unit of Singapore Technologies, a holding company that comprises more than 100 companies whose total revenues exceed $3.2B.
Management
Tan Bock Seng President and Chief Executive Officer Chia Song Hwee Chief Financial Officer Choong Chan Yong Senior Vice President, Asia/Europe Sales and Marketing Tom Gurnee President, Chartered Semiconductor Manufacturing, Inc., North America Rick Hodgman General Manager, Chartered Silicon Partners Pte. Ltd. John Martin, Ph.D. Vice President, Research and Development Subash Gupta, Ph.D. Fellow and Vice President, Advanced Technology
Products and Processes
Chartered offers a full complement of leading-edge CMOS processes ranging from 0.8µm to 0.35µm line widths, with a 0.25µm process in development. Technologies offered include digital, analog, mixed-signal, EEPROM (0.8µm and 0.6µm in development), ROM (0.6µm, 0.45µm, 0.40µm, and 0.35µm in development), SRAM (0.5µm, 0.45µm, 0.40µm, 0.35µm, and 0.30µm in development), and flash memory ROM (0.7µm, 0.5µm, and 0.35µm in development). The company’s technology in embedded logic/memory is as follows: DRAM (both 0.35µm and 0.25µm in development), SRAM (0.35µm in development), EEPROM (0.8µm, and 0.6µm in development) and Flash (both 0.5µm and 0.35µm in development). Also in Chartered’s process technology portfolio is BiCMOS in 0.8µm and in development is 0.6µm. Options include multiple voltages/poly/metal. For designs requiring high performance and low contact resistance, customers can also select a salicide option, which Chartered has used in volume production since the 0.8µm process generation. There are also 0.6 or smaller micron processes generally available in polycide and salicide.
Semiconductor Fabrication Facilities
In April 1997, Chartered announced the development of a new joint venture foundry company with partner, Hewlett-Packard, and the Economic Development Board of Singapore. The new venture, called Chartered Silicon Partners, will be located adjacent to Chartered’s existing facilities in the Woodlands Industrial Park in Singapore. In July 1997, groundbreaking began on the construction of a 200mm wafer manufacturing with production beginning in mid-1999. HP will receive a specified amount of wafers (0.35µm and 0.25µm ASICs) from the venture in exchange for its investment, while the remaining capacity will be offered as part of Chartered’s usual foundry services.
Similarly, in 1997, a joint venture company with Lucent Technologies Microelectronics Pte. Ltd. was formed. The new fab will also be located next to Chartered’s existing facilities in the Woodlands Industrial Park. The foundry facility is expected to begin operations in 1999 to produce ASICs and other products, yet to be announced.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-15 Chartered Semiconductor Rest of World Company Profiles
Chartered Semiconductor Manufacturing Ltd. Chartered Semiconductor Manufacturing Ltd. No. 2 Science Park Drive 60 Woodlands Industrial Park D Singapore Science Park Street 2 Singapore 0511 Singapore 738406 Fab I Fab II Cleanroom: 35,000 square feet (Class 10) Cleanroom size: 70,000 square feet (Class 1 SMIF) Capacity (wafers/week): 6,100 Capacity (wafers/week): 10,500 Wafer size: 150mm Wafer size: 200mm Process: CMOS Process: CMOS Products: Foundry services Products: Foundry services Feature sizes: 0.8µm-0.6µm Feature sizes: 0.6µm-0.35µm (0.20µm capability)
Chartered Semiconductor Manufacturing Ltd. Silicon Manufacturing Partners, Pte., Ltd. Woodlands Industrial Park D (A joint 60 venture with Lucent Technologies Street 2 Microelectronics Pte. Ltd.). Singapore 738406 60 Woodlands Industrial Park D Fab III Street 2 Cleanroom size: 46,000 square feet (Class 1 SMIF) Singapore 738406 Capacity (wafers/week): 4,700 Cleanroom size: 46,000 square feet (Class 1 SMIF) Wafer size: 200mm Capacity (wafers/week): 6,100 Process: CMOS Wafer size: 200mm Products: Foundry services Processes: CMOS digital, analog, SRAM, BiCMOS Feature sizes: 0.35µm-0.25µm (0.18µm capability) Products: Foundry services Feature sizes: 0.35µm-0.18µm Chartered Silicon Partners, Pte. Ltd. (Operational beginning Q4 1999). (A joint venture with Hewlett-Packard Company and Singapore Economic Development Board). 60 Woodlands Industrial Park D Street 2 Singapore 738406 Cleanroom: Class I, SMIF Capacity (wafers/week): 8,100 Processes: ASIC; others TBA Groundbreaking: July 1997 (Operational beginning 1999).
Key Agreements
• In February 1998, Chartered Semiconductor Manufacturing and Fairchild Semiconductor formed a foundry relationship for EEPROM supply. Under the terms of the agreement, Chartered will manufacture EEPROM products based on Fairchild’s advanced EEPROM process. Fairchild has transferred its EEPROM technology to Chartered, and Chartered returned test runs of silicon with high yields. The Chartered-produced EEPROM wafers will augment existing production from Fairchild’s Salt Lake City, UT fabrication facility.
5-16 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Chartered Semiconductor
• In September 1997, Chartered Semiconductor Manufacturing and Avant! Corporation formed a joint marketing agreement to calibrate the Avant! suite of full chip validation tools for Chartered silicon technologies. This agreement makes Chartered the first silicon foundry to formally partner with Avant!’s Silicon Blueprint Program. Avant! Tools provide a validation suite for deep-submicron (DSM) designs that Chartered and Avant! customers will use for full chip verification before IC commitment to silicon.
• In January 1998, Lucent Microelectronics Group and Chartered announced the formation of a $1B-plus joint venture in Singapore to manufacture integrated circuits. The new venture, called Silicon Manufacturing Partners Pte., Ltd., will eventually employ 800 people and will manufacture a variety of integrated circuits using process technology by Lucent’s Bell Laboratories, as well as technologies developed by Chartered. The company will produce 8 inch wafers using 0.25 micron processing technology, and at full capacity will produce 26,000, 8 inch wafers per month. The venture expects to migrate to 0.18 micron technology by the year 2000.
• In July 1997 Chartered Semiconductor Manufacturing and Mentor Graphics Corporation’s Inventra Business Unit announced a joint marketing and technology agreement. This collaboration will enable integrated circuit design teams to utilize silicon-proven libraries with selected intellectual property in designs and have chips fabricated using Chartered’s leading edge manufacturing processes. Inventra™ will develop and supply standard cell, memory and datapath libraries for Chartered’s 0.35 micron fabrication process. The two companies will jointly develop test chips based on a subset of Inventra’s CoreAlliance pre-designed circuits, for design verification in silicon. This agreement will help Chartered’s objective to shorten the time between product design and market entry for customers.
• In June 1997, Chartered and Toshiba Corporation forged a five year technology and manufacturing partnership on embedded DRAMs. Under the agreement, Chartered will manufacture embedded DRAM products for Toshiba and other customers through gaining Toshiba’s license on its embedded DRAM technology (0.35µm to 0.25µm). This relationship will expand Chartered’s offerings to their diverse customer base.
• In April 1997, Chartered announced a joint venture company, Chartered Silicon Partners, with Hewlett-Packard Company and Singapore Economic Development Broad Investments. This joint venture company will complement Chartered’s foundry business and provide semiconductor wafer manufacturing services to Hewlett-Packard and other foundry customers. Chartered Silicon Partners will produce ASICs utilizing both Hewlett-Packard’s and Chartered Semiconductor Manufacturing’s deep-submicron process technologies.
• Simtek entered into a manufacturing and development agreement with Chartered Semiconductor Manufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at least through 3Q89.
• In 1996, Chartered established a technical and marketing agreement with Excellent Design Inc. Under the agreement, Chartered will supply Excellent with design rules, Spice models, and process data that Excellent will use to create the methodology and tools to produce libraries optimized for Chartered’s deep-submicron processes. The agreement will last three years and will cover all the technologies Chartered intends to develop during that period. Previously, Chartered also signed a similar agreement with Aspec Technology.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-17 Chartered Semiconductor Rest of World Company Profiles
• Since 1995, Chartered established technical and marketing agreements with a number of electronic design automation/assistance (EDA/A) companies and intellectual property (IP) providers. Under these agreements, Chartered supplies design rules, Spice models, process data and test chips that verify libraries, tools and IP cores are compatible with Chartered fabrication processes. Alliances include Artisan Components; Aspec Technology; Avant! Corporation, Cadence, Cascade, Leda, Compass-Galax!, Leda Systems; Mentor Graphics; SiArc-Synopsys; Simplex Solutions; TriTech Microelectronics, Inc.; Virage; and Quadic.
• Since early 1994, Chartered has made several strategic agreements with semiconductor companies — with or without their own fabrication facilities — that have involved investments in Chartered in exchange for guaranteed wafer output. Those companies include Actel, Alliance Semiconductor, Analog Devices, Brooktree (a division of Rockwell), LSI Logic, Rockwell Semiconductor Systems (Newport Beach, CA), and Standard Microsystems. In addition, Chartered has process technology alliances with VLSI Technology and Toshiba.
5-18 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles Continental Device India Limited
CONTINENTAL DEVICE INDIA LIMITED (CDIL)
Continental Device India Limited C-120, Naraina Industrial Area New Delhi – 110 028 India Telephone: (91-11) 579-6150 Fax: (91-11) 579-9569 Web Site: www.cdil.com
IC Manufacturer Founded: 1964
Regional Offices/Representative Locations
India: Continental Device India Ltd. • Bangalore, India Telephone: (080) 2255968
Continental Device India Ltd. • Mumbai, India Telephone: (022) 8717262
Company Overview and Strategy
Continental Device India Limited (CDIL) initiated in 1964 the manufacturing of silicon semiconductor devices in India. With 1997 total sales of $14.5 million, CDIL manufactures discrete semiconductor components.
Management
Dr. Gurpreet Singh Chairman and Managing Director Mr. Inderdeep Singh Executive Director Mr. Pankaj Gulati Vice President Mr. Pradeep Maitra Vice President, Engineering Mr. G.V. Subramaniam Vice President, QA Dr. Navin Kapur General Manager, Technical
Product and Processes
CDIL supplies a wide range of discrete semiconductors. The company fabricates silicon wafers for both transistors and diodes (zener and switching). Transistors range from small signal bipolar, Darlington power, to high power general purpose (up to 150W) transistors. The products also include single and dual Schottky Barrier Rectifiers, and surface mounted semiconductors.
Continental Device India Limited also offers subcontract assembly services.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-19 Continental Device India Limited Rest of the World Company Profiles
Semiconductor Fabrication Facilities
Continental Device India Ltd. C-120 Naraina Industrial Area New Delhi – 110 028, India Telephone: (91-11) 5796150
Continental Device India Ltd. 132, Industrial Area Chandigarh – 160 002 Telephone: 32021, 32022 Fax: 01744757
Continental Device India Ltd. 14/5, Marthura Road, Faridabad Telephone: 8275708, 8275709
Continental Device India Ltd. Rangreth, Srinagar (J&K) Telephone: 31082
5-20 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Faraday Technology
FARADAY TECHNOLOGY
Faraday Technology Corporation 7F, 9, Prosperity First Road Science-Based Industrial Park Hsinchu, Taiwan, R.O.C. Telephone: (886) (3) 578-7888 Fax: (886) (3) 578-7889
Fabless IC Supplier
Employees: 100
Regional Headquarters/Representative Locations
North America: Faraday Technology Corp. • Santa Clara, California Telephone: (408) 235-8888 • Fax: (408) 235-8889
Company Overview and Strategy
Faraday Technology Corporation is Taiwan’s leading full-service ASIC design company, offering high performance, high density and low power deep sub-micron gate array and standard cell products. Clientele includes several international companies involved in the areas of computers, communications and consumer products. Established in June 1993, the company has 100 employees at present. Revenue by November, 1997 was U.S. $18M.
Supported by its unique, integral design flow, Faraday has claimed more than 500 successful cases of high performance, top quality design projects since 1993. Products include 0.6µm Gate Array, 0.5µm/0.35µm Standard Cell, and 0.25µm Standard Cell, which the company expects to put on the market in January, 1998. In addition, Faraday offers complete Memory Building Blocks, Datapath Building Blocks, Megacells, and Analog Cells.
Management
M.K. Tsai Chairman H.P. Lin President
Products and Processes
Faraday's ASIC products include high-performance, high-density 0.6µm three-layer-metal CMOS gate arrays, 0.5µm three-layer-metal CMOS standard cells, and 0.35µm three- and four-layer-metal CMOS standard cells.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-21 Faraday Technology Rest of World Company Profiles
Gate Arrays 0.6µm series — Single poly and double- or triple-metal CMOS process — 3,000 to 104,100 usable gates — 68 to 296 I/Os — Provide variety RAM/ROM memory compilers — 3V, 5V, and mixed-voltage applications supported — Propagation delay: 90ps 0.45µm series (2Q98) — Single poly two- or three-layer-metal CMOS — 10,000 to 150,000 usable gates — Up to 352 I/Os — Provide variety RAM/ROM compilers — 3V, 5V, and mixed-voltage applications supported — Propagation delay: 65ps
Standard Cells 0.5µm series — Single poly and two- or three-layer-metal CMOS process — Up to 470 core cell 300 I/O — Provide variety RAM/ROM memory compilers — 3V, 5V and mixed-voltage application supported — Propagation delay: 73ps — Power consumption: 2.22µw/Gate/MHz
0.35 series — Single poly and three- and four-layer-metal CMOS process — Up to 500 core cells and I/O cells
Analog Cell
PLL, AGP, 8-bit AD, 10-bit AD, USB Buffer, IEEE1394 Buffer, PECL.
Magacell
8031, 8032, 8051, 8052, 8032 turbo, USB, XA51, UART, PCI, FR3000 (32-bit RISC CPU), EPP/ECP, IEEE1394.
Semiconductor Fabrication Facilities
Faraday's ASICs are manufactured by UMC, USI, UICC, and USC in Taiwan using Faraday's CMOS process technologies. In order to offer Faraday’s customers with the flexibility of multiple fab solutions, Faraday is presently cooperating with several new fab companies to acquire versatile services.
5-22 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Galileo Technology
GALILEO TECHNOLOGY LTD.
Galileo Technology Ltd. Moshav Manof D.N. Misgav 20184 Israel Telephone: (972) (4) 999-9555 Fax: (972) (9) 999-9574 Web Site: www.galileot.com
Fabless IC Manufacturer Founded: 1993
Financial History ($M) 1996 1997 Sales 6 37 Net Income (1) 10 R&D Expenditures 3 6
Employees — 100
Ownership: Publicly held. NASDAQ: GALTF.
Company Overview and Strategy
Galileo Technology Ltd. is a fabless semiconductor company that designs and markets advanced digital semiconductor devices that perform critical functions for network and communications systems. The Company is focused on mid-to-high-end embedded control applications, as represented by systems that typically sell for more than $500 and predominantly use high-performance RISC microprocessors. The largest segments of this market are data communications and imaging areas.
Galileo was founded in Karmiel, Israel in January 1993, with the charter of providing advanced semiconductor devices to the embedded control market. In March 1994, Galileo opened its marketing and business development group, Galileo Technology Inc., in San Jose, California. Galileo also has business offices in San Jose, Boston, London, and Israel.
The Israeli operation is responsible for the architecture and design of all chip and board-level products offered by Galileo as well as product engineering, test engineering, and quality control. The responsibility of the U.S. organization include sales, marketing, technical support, operational logistics and customer service for all customers worldwide. The U.S. and Israeli operations work closely with customers to define new products and provide technical support.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-23 Galileo Rest of World Company Profiles
Galileo obtained seed capital from various private placements with individuals in 1993. In August of 1994, Galileo concluded its first venture capital round of $1.5M with the Nitzanim Venture Fund, which was founded by Kyocera, Oxford Partners, AVX, and leading officers within these organizations. In November 1995, Galileo concluded its second venture capital round of $3M, with Weiss, Peck & Greer acting as the lead investor and with participation from the Nitzanim Venture Fund, and the Tikvah Fund started by Mr. Sanford Bernstein.
Galileo went public on NASDAQ in July 1997, raising over $50M USD.
Management
Avigdor Willenz Chief Executive Officer and Founder Manuel Alba President Eyal Waldman Vice President, Engineering Eliaz Lavi Vice President, Operations, Quality and Reliability David Shemla Vice President, Communications Mitchell Kahn Vice President, Marketing John C. Mein Vice President, Sales
Products and Processes
Galileo products are divided into three areas: high-performance core logic, data communications controllers and WAN interface devices, all of which are key building blocks of embedded systems. These product areas are detailed below:
High Performance Core Logic Products PCI and Core Logic Products include Advanced PCI System Controllers for MIPS, PCI Interface and System Controllers for IDT, and PCI Integrators (i.e., high-integration PCI bridge/memory controllers). Galileo’s highly integrated system controller chips complement the leading embedded RISC microprocessors to form CPU subsystems. This product line is targeted at performance-sensitive applications, including bridges, routers, switches, cellular base stations, laser printers, digital video distribution equipment, etc. Some of the most demanding applications are found in the area of data communications, for which Galileo’s products are well-suited.
Data Communications Controllers Galileo data communications controllers include Galileo’s family of GALNET and FALAZ\XY Ethernet switches. These devices provide unparalleled levels of value and performance to OEM Ethernet Switches ranging in scope from workgroups to enterprise backbones. Galileo is the inventor of the single-chip Ethernet switch, and is the acknowledged leader in the field.
WAN Interface Devices Galileo’s remote access controllers provide the high-performance necessary to build WAN access devices such as USDN/xDSL routers and frame relay access devices.
Galileo also provides evaluation platforms for nearly all of their products. These systems can help the customer jump-start software development or help them to evaluate silicon during the design phase.
5-24 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Galileo
Semiconductor Fabrication Facilities
Galileo contracts the manufacturing of its semiconductor products to leading providers of standard cell ASIC technology. Current fabrication facilities include TSMC in Taiwan, Samsung in Korea and Matra MHS in France.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-25 Holtek Microelectronics Rest of World Company Profiles
HOLTEK MICROELECTRONICS
Holtek Microelectronics Inc. No. 5 Creation Road II Science-Based Industrial Park Hsinchu, Taiwan Telephone: (886) (3) 5784888 Fax: (886) (3) 5770879 Web Site: www.holtek.com
IC Manufacturer
Regional Headquarters/Representative Locations
North America: Holmate Technology Corporation • San Jose, California Telephone: (408) 573-8050 • Fax: (408) 573-8055
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 45 58 70 90 105 135 Capital Expenditures — 8 10 25 30 50
Employees 560 620 760 960 1,160 1,500
Company Overview and Strategy
Holtek Microelectronics Inc. was established in 1983 as an ASIC design house, but in 1989 added a 125mm wafer fab. Today, Holtek is a manufacturer of not only ASICs, but also consumer electronics ICs, PC peripheral and communication ICs. The company was the first in Taiwan to design and manufacture 4- and 8-bit microcontrollers.
During 1996, Holtek initiated a major company reorganization, focusing its efforts on three main business units: Sales and Product Development, Fab I operations, and Fab II operations. Holtek also renewed its commitment to maintain a diversified product line by focusing future product development on PC peripherals, microcontrollers, one-time programmable (OTP) 8-bit MCUs, non-volatile memory products, and high-level telecom products such as network ICs and digital signal processors.
In addition to a variety of planned new product developments, Holtek’s commitment to the future can also be demonstrated by its major investment in a new 0.25µm 200mm wafer manufacturing facility.
5-26 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Holtek Microelectronics
Management
Keith Wu Chairman and President
Products and Processes
The following provides a sampling of various Holtek products.
ASIC Microcontroller • Gate Arrays • 4-bit MCUs • Standard Cells • 8-bit MCUs • Full Custom ICs
Memory PC Peripheral • Mask ROMs • I/O Series • SRAMs • Keyboard Series • EEPROMs • Mouse Series • EPROMs • Misc. Series • OTP ROMs
Consumer Telecom • Speech Synthesizer Series • All-in-one Dialers • Voice Processor Series • Dialer IDD Lock Dialers • Melody Series • French Dialers • Tone Series • ABR Dialers • Remote Series • Talking Dialers • LCD Driver Series • Pager ICs • Power Manager Series • Digital Answering Machine ICs • Home Appliance Series
Semiconductor Fabrication Facilities
Holtek Microelectronics Inc. Holtek Microelectronics Inc. No. 5 Creation Road II No. 5 Creation Road II Science-Based Industrial Park Science-Based Industrial Park Hsinchu, Taiwan Hsinchu, Taiwan Fab I Fab II Cleanroom size: 1,400 square feet (Class 10) Cleanroom size: 9,000 square feet (Class 1) Capacity (wafers/week): 7,500 Capacity (wafers/week): 1,500 (8,750 by 2001) Wafer size: 125mm Wafer size: 200mm Process: CMOS Process: CMOS Products: MCUs, ASICs, ASSPs, memories Products: MCUs, ASICs, ASSPs, foundry, memory Feature sizes: 0.6µm-1.2µm Feature sizes: 0.18µm-0.5µm (Operational by January 1998).
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-27 Huajing Electronics Rest of World Company Profiles
HUAJING ELECTRONICS
China Huajing Electronics Group Corporation 14 Liangxi Road Wuxi, Jiangsu, China Telephone: (86) (510) 6707123 Fax: (86) (510) 6701391
IC Manufacturer
Company Overview and Strategy
Founded in 1960, China Huajing Electronics has grown into the largest solely state-owned microelectronics manufacturer in China. It is one of the five largest and most advanced semiconductor plants in China. Huajing manufactures a wide range of MOS, bipolar, and BiCMOS integrated circuits and discrete semiconductor products for applications such as communications, computer systems, instrumentation and metering, automobile electronics, power supply, machinery, and consumer electronics.
Approximately 60 percent of Huajing’s MOS IC output is exported, while only about 5 percent of its traditional bipolar and discrete devices are exported.
Management
Guang Ping Su President Jiang Fu Lai Vice President Guo Yong Fu Vice President
Products and Processes
Huajing’s semiconductor products include analog ICs, ASICs, microprocessors and controllers, memory ICs, BiCMOS ICs, full-custom ICs, thick-film hybrids, and discretes.
For MOS production, Huajing uses 100mm and 125mm wafers with 3.0µm to 2.0µm technology, and for bipolar, it uses 100mm wafers with 5.0µm to 3.0µm technology and 125mm wafers with 3.0µm to 2.0µm technology. The company also is pushing its CMOS lines for foundry production. Huajing is said to be manufacturing microcontrollers for Seiko Epson and logic ICs for Fujitsu.
Semiconductor Fabrication Facilities
Huajing is expected to complete construction of a new 150mm wafer fab during 1997. The facility will produce MOS ICs with 0.8µm to 1.0µm feature size technology obtained from Lucent Technologies. When complete, the fab will have the capacity to produce about 2,500 wafers per week.
At press time, unable to confirm if the wafer fab construction was completed.
5-28 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Huajing Electronics
China Huajing Electronics Group 14 Liangxi Road Wuxi, Jiangsu, China Capacity (wafers/week): 8,750 Wafer sizes: 100mm, 125mm (upgrading to 150mm) Processes: MOS, bipolar, BiCMOS, CMOS Products: Linear ICs, ASICs, MPUs, MCUs, memory ICs, BiCMOS ICs, discretes, hybrids Feature sizes: 1.25µm-5.0µm (upgrading to submicron)
Key Agreements
• In September 1996, Huajing purchased Promis Systems’ Manufacturing Execution System (MES) software (PROMIS®). The investment is estimated at half a million dollars. The new system will provide Huajing with flexibility and performance for quick turnaround in the electronics industry.
• In early 1995, Huajing licensed some of Toshiba’s older 1M DRAM technology, making it the first of China’s state-run companies to field DRAMs.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-29 Hualon Microelectronics Rest of World Company Profiles
HUALON MICROELECTRONICS (HMC)
Hualon Microelectronics Corporation Science-Based Industrial Park Number 1, R&D 4th Road Hsinchu, Taiwan Telephone: (886) (3) 5774945 Fax: (886) (3) 5774305 Web Site: hmc.com.tw/index_e.htm
IC Manufacturer
Regional Headquarters/Representative Locations
North America: Hualon Microelectronics Corporation • San Francisco, California Telephone: (415) 288-0390 • Fax: (415) 288-0399
Financial History ($M)
1992 1993 1994 1995 1996 1997 Semiconductor Sales 101 112 128 150 175 189 IC Sales 91 97 108 125 150 162 Discrete Sales 10 15 20 25 25 27 Capital Expenditures — 5 80 60 50 54
Employees 850 850 1,100 1,150 1,170 1,263
Company Overview and Strategy
Hualon Microelectronics Corporation (HMC) is part of the Hualon Group, a conglomerate with over $2.5 billion in annual sales. The Hualon Group first invested in the semiconductor industry in 1984, by establishing Chino-Excel Technology (CET), an IC assembly house. Then in 1987, HMC's fab was constructed.
HMC is a broad-based manufacturer of integrated circuits and discrete devices. The company is divided into seven major business units: memory, foundry, microcomponent, ASIC, CCD, consumer, and telecommunications.
Management
D.M. Oung President and Chief Executive Officer C.F. Hsu Research and Development Manager H.S. Huang Plant Manager Gene Tsai Vice Plant Manager Chiu-Chung Jung Director, Sales and Marketing
5-30 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Hualon Microelectronics
Products and Processes
Memory ICs ASICs ROMs up to 16M in density, EPROMs up to 256K, Gate arrays and standard cells EEPROMs up to 1M, SRAMs up to 1M
Microcomponent ICs CCDs 4-bit and 8-bit MCUs, 4-bit, 8-bit, and 16-bit Image sensors, bar code chipsets, DSPs, GUI and SVGA circuits, mass storage fax scanner ICs controllers, network ICs, and PC chipsets
Consumer ICs Telecom ICs Speech synthesizer and recognition, Dialers and controllers, receivers, watch, and calculator circuits cordless phone controllers
Foundry Service 0.5µm to 3.0µm silicon gate
HMC's current facilities operate with CMOS, BiCMOS, and NMOS processes down to 0.5µm.
Semiconductor Fabrication Facilities
Hualon Microelectronics Corporation Science-Based Industrial Park Number 1, R&D 4th Road Hsinchu, Taiwan Fab I and II Cleanroom size: 21,000 square feet Capacity (wafers/week): 34,000 Wafer size: 125mm Processes: CMOS, NMOS, BiCMOS Products: Memory ICs, telecom ICs, consumer ICs, ASICs, discretes, foundry services Feature sizes: 0.5µm, 0.6µm CMOS, BiCMOS; 0.8µm CMOS; 1.0µm CMOS, BiCMOS; 1.2µm NMOS
In 1994, Hualon announced plans to build a new $400 million 200mm wafer fab that would be operational by the end of 1996. In early 1996, however, plans for the new facility were put on hold indefinitely.
Key Agreements
• HMC holds a 10 percent stake in Seeq Technology and is providing foundry services for the supplier. The two companies also agreed to jointly develop and market network ICs.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-31 Hyundai Rest of World Company Profiles
HYUNDAI
Hyundai Electronics Industries Co., Ltd. (HEI) Semiconductor Division 12th Floor, Hyundai Building 140-2, Kye-dong, Chongro-gu Seoul, Korea 110-793 Telephone: (82) (2) 746-4288 Fax: (82) (2) 746-4277 Web Site: www.hei.co.kr/www.hea.com
IC Manufacturer Founded: 1983
Regional Headquarters/Representative Locations
North America: Hyundai Electronics America (HEA), Semiconductor Division • San Jose, California Telephone: (408) 232-8000 • Fax: (408) 232-8125 • Web Site: www.hea.com
Financial History ($M)
1992 1993 1994 1995 1996 1997 Corporate Sales (HEI) 1,150 1,575 2,600 5,036 3,751 5,031
Semiconductor Sales 455 1,020 1,750 3,953 2,450 3,348 Capital Expenditures 225 400 600 2,100 2,500 3,000
Ownership: Publicly held, Korea: 7825.
Company Overview and Strategy
Hyundai Electronics Industries Co., Ltd. (HEI) was founded in 1983 as a part of the Hyundai Business Group, a $70 billion Korean conglomerate involved in over 40 business areas ranging from steel fabrication, petrochemicals, engineering and construction to electronics, automobiles, and finance.
HEI is made up of the following business divisions: Semiconductors, Semiconductor Assembly and Testing, Information Systems, Telecommunications, and Industrial Electronics. The Semiconductor Division is further divided into the Memory IC and System IC subdivisions. Its semiconductor assembly business was launched in 1985. HEI had developed its own 4M DRAM by 1989, 16M part by 1991, and its own 64M part by 1992.
5-32 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Hyundai
Today, Hyundai is among the world's leading memory IC producers, with a memory portfolio that includes DRAMs up to 64M in density, SRAMs up to 4M in density, mask ROMs up to 16M in density, VRAMs, and flash devices. The company is moving to become less dependent on the memory IC business by aggressively expanding its capabilities in logic ICs. A major part of this effort was the acquisition in early 1995 of the NCR Microelectronic Products Division of AT&T for $340 million. Renamed Symbios Logic Inc., the business operates as an independent, autonomous subsidiary of Hyundai Electronics America (HEA) offering products such as bus interface chips, ASICs, and Ethernet controller ICs.
In mid-1996, Hyundai Electronics America spun-off its Digital Media Division into a separate entity, called Odeum Microsystems Inc. The new company focuses on the development of silicon and software solutions for home entertainment systems.
Management
Hyundai Electronics Industries Young Hwan Kim President and Chief Executive Officer K. H. Oh Executive Vice President, Semiconductor Division D.S. Kim Executive Vice President, Assembly and Test I.B. Jeon Senior Vice President, Semiconductor Sales and Marketing S.I. Kim Vice President, Semiconductor Manufacturing S. C. Kim Senior Vice President, Semiconductor Research and Development H. J. Shim Vice President, System IC, Research and Development Laboratory
Hyundai Electronics America C.S. Park President and Chief Executive Officer Steve Grossman Senior Vice President, Marketing, Flash Memory Division Mark Ellsberry Vice President, Memory Marketing Alex Chenok Vice President, Assembly and Test James Hartman Chief Executive Officer, Hyundai Semiconductor America Anil Sawe Chief Executive Officer, Odeum Microsystems Inc. Charles F. Christ President and Chief Executive Officer, Symbios Logic Inc.
Products and Processes
Hyundai manufactures and markets primarily DRAMs and SRAMs, but also offers other memory ICs (SIMM or DIMM), microperipheral ICs, logic ICs, ASSPs, and ASIC devices. In October of 1997, Hyundai announced that it had succeeded in developing the world’s first 1-gigabit Synchronous DRAM using 0.17 micron SOI technology. Currently, the whole range of Hyundai’s ICs are fabricated solely using CMOS process technology.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-33 Hyundai Rest of World Company Profiles
MOS MEMORY ANALOG ✔ DRAM Amplifier ✔ SRAM Interface ✔ Flash Memory Consumer/Automotive ✔ EPROM Voltage Regulator/Reference ✔ ROM Data Conversion ✔ EEPROM Comparator Other (Including Non-Volatile RAM) Other (Includes Telecom)
MOS LOGIC DIGITAL BIPOLAR General Purpose Logic Bipolar Memory ✔ Gate Array General Purpose Logic ✔ Standard Cell Gate Array/Standard Cell ✔ Field Programmable Logic Field Programmable Logic ✔ Other Special Purpose Logic Other Special Purpose Logic MPU/MCU/MPR MOS MICROCOMPONENT MPU OTHER ✔ MCU ✔ Full Custom IC ✔ MPR Discrete DSP Optoelectronic
Memory ICs • 256K, 1M, 4M, 16M, and 64M DRAMs (low voltage and wide versions are available). • 16M, 64M and 128M synchronous DRAMs (SDRAMs). • 8M and 16M SGRAM • 64K, 256K, 1M, and 4M SRAMs (high-speed 256K and 1M versions are available for Cache applications). • 1M, 4M, and 16M mask ROMs. • 256K and 1M EPROMs. • Serial EEPROMs. • 4M and 16M flash memories for PCs and peripherals, telecom switches, cellular phones, internetworking, instrumentation and automotive devices.
ASICs • Gate arrays based on a sea-of-gates architecture and 1.2µm and 0.8µm CMOS double-level-metal technologies or 0.8µm triple-level-metal technology. Usable gate counts vary from 800 to 200,000 gates. • Standard cells based on 0.8µm CMOS double-level-metal technology. • A limited line of PLDs based on technology from ICT Inc. are available. • BiCMOS ASICs and mixed-signal capabilities are being developed.
ASSPs • SmartCard and Terminal ICs based on 0.35µm and 0.25µm technologies. • 16-bit DSP Cores. • MPEG-II, QPSK, Line Drivers.
5-34 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Hyundai
Other ICs • TFT LCD ICs • Image Sensors for digital imaging and multimedia. • PC chipsets. • PCMCIA peripheral function ICs. • RAMDACs. • ICs for digital audio and cordless phone applications.
Semiconductor Fabrication Facilities
In March 1997, Hyundai broke ground on its second overseas wafer fab, to be located in Scotland. The facility will manufacture DRAMs on 200mm wafers using a 0.3µm process technology. Initial production of 64M DRAMs is expected to begin in December 1998, moving later to 256M DRAMs. Full capacity of the fab will be 30,000 wafers per month. Construction on the facility will take place in two phases, together costing an estimated $3.0 billion. The plant is expected to employ 1,000 workers.
Production at Hyundai’s first overseas fab — a $1.3 billion 200mm, sub-micron CMOS production facility located in Eugene, Oregon — was expected in 2H97, but has been held up due to environmental permit issues.
Hyundai Electronics Industries Co. Hyundai Electronics Industries Co. San 136-1, Ami-Ri, Bubal-Eub San 136-1, Ami-Ri, Bubal-Eub Ichon-kun, Kyungki-Do Ichon-kun, Kyungki-Do Korea 467-860 Korea 467-860 Telephone: (82) (2) 741-0661 Telephone: (82) (2) 741-0661 Fab 1 Fab 4 Capacity (wafers/week): 6,250 Capacity (wafers/week): 2,500 Wafer size: 125mm Wafer size: 200mm Process: CMOS Process: CMOS Products: SRAMs, EPROMs, EEPROMs, Products: DRAMs ASICs, Logic ICs. Feature size: 0.5µm Feature sizes: 0.8µm, 1.0µm
Hyundai Electronics Industries Co. Hyundai Electronics Industries Co. San 136-1, Ami-Ri, Bubal-Eub San 136-1, Ami-Ri, Bubal-Eub Ichon-kun, Kyungki-Do Ichon-kun, Kyungki-Do Korea 467-860 Korea 467-860 Telephone: (82) (2) 741-0661 Telephone: (82) (2) 741-0661 Fab 2 Fab 5 Capacity (wafers/week): 6,250 Capacity (wafers/week): 6,250 Wafer size: 150mm Wafer size: 200mm Process: CMOS Process: CMOS Products: DRAMs, SRAMs Products: DRAMs Feature sizes: 0.45µm, 0.6µm, 0.65µm Feature sizes: 0.35µm
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-35 Hyundai Rest of World Company Profiles
Hyundai Electronics Industries Co. Hyundai Electronics Industries Co. San 136-1, Ami-Ri, Bubal-Eub San 136-1, Ami-Ri, Bubal-Eub Ichon-kun, Kyungki-Do Ichon-kun, Kyungki-Do Korea 467-860 Korea 467-860 Telephone: (82) (2) 741-0661 Telephone: (82) (2) 741-0661 Fab 3 Fab 6 Capacity (wafers/week): 6,000 Capacity (wafers/week): 6,250 Wafer size: 150mm Wafer size: 200mm Process: CMOS Process: CMOS Products: DRAMs Products: DRAMs Feature sizes: 0.5µm Feature sizes: 0.22µm-0.28µm
Hyundai Electronics Industries Co. Hyundai Semiconductor America San 136-1, Ami-Ri, Bubal-Eub Eugene, Oregon Ichon-kun, Kyungki-Do Fab E-4 Korea 467-860 Capacity (wafers/week): 7,500 Telephone: (82) (2) 741-0661 Wafer size: 200mm R&D I Process: CMOS Capacity (wafers/week): 3,200 Products: DRAMs Wafer sizes: 150mm, 200mm Feature size: 0.20µm Process: CMOS (Operations to begin 1H98). Products: R&D Feature sizes: 0.25µm-0.6µm Hyundai Electronics Industries Co. San 136-1, Ami-Ri, Bubal-Eub Hyundai Semiconductor Europe Limited Ichon-Kun, Kyungki-Do Dunfermline, Scotland Korea 467-860 Capacity (wafers/week): 7,500 R&D II Wafer size: 200mm Capacity (wafers/week): 6,000 Process: CMOS Wafer Size: 200mm Products: DRAMs Process: CMOS, DRAMS Feature size: 0.3µm Products: R&D (Operations to begin in late 1998). Feature Size: 0.2µm
Hyundai Electronics Industries Co. San 136-1, Ami-Ri, Bubal-Eub Ichon-Kun, Kyungki-Do Korea 467-860 Fab 7 Capacity (wafers/week): 6,250 Wafer size: 200mm Process: CMOS Products: DRAMS Feature sizes: 0.22µm-0.28µm
5-36 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Hyundai
Key Agreements
• In February 1998, Adaptec Inc. announced it will buy Symbios Logic Inc. from Hyundai Electronics America for $775M. The sale of Symbios, one of Hyundai’s only remaining profitable businesses, gives the Korean company much needed capital.
• Hyundai licensed Rambus’ technology for the development of 16M and 64M Rambus DRAMs (RDRAMs).
• Hyundai signed a licensing agreement with LSI Logic that gave it permission to develop products based on LSI Logic's 1.2µm and 2.0µm double-level-metal gate arrays.
• As a major equity holder in ICT Inc., Hyundai offers a limited line of PLDs based on ICT's designs.
• Hyundai and Fujitsu formed a DRAM manufacturing and development alliance in 1993, under which 4M and 16M Hyundai-designed DRAMs are produced worldwide by both companies. They also are codeveloping 64M DRAM products.
Noteworthy News
• In March of 1998, the U.S. Department of Commerce assessed 12.64 percent dumping penalties against Hyundai Electronics Industries Co., Ltd. for violations occurring for the 12 month period, ended April 30, 1997. The Commerce Department is expected to complete its investigation and issue a final dumping decision in July which could adjust the penalty duties up or down, or could eliminate them altogether.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-37 Industrial Technology Research Institute Rest of World Company Profiles
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Industrial Technology Research Institute 195 Chung Hsing Road, Sec. 4 Chu Tung, Taiwan 310, ROC Telephone: (886) (3) 582-0100 Fax: (886) (3) 582-0045 Web Site: www.itri.org.tw/english
Research Laboratory
Regional Headquarters/Representative Locations
U.S.: Industrial Technology Research Institute • Milpitas, California Telephone: (408) 946-3015 • Fax: (408) 946-3019
Company Overview and Strategy
Industrial Technology, in addition to R&D activities, provides technical consulting and training programs to the industry. The technical services include testing, processing and consulting.
5-38 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles LG Semicon
LG SEMICON
LG Semicon Co., Ltd. LG Yeong-Dong Building 891, DaeChi-Dong, KangNam-Gu Seoul 135-280, Korea Telephone: (82) (2) 508-1067 Fax: (82) (2) 508-1068 Web Site: www.lgsemicon.co.kr
IC Manufacturer Founded: 1989, S. Korea
Regional Offices/Representative Locations
North America: LG Semicon America, Inc. • San Jose, California Telephone: (408) 432-5000 • Fax: (408) 432-6067
Financial History ($M)
1992 1993 1994 1995 1996 1997 Corporate Sales (Goldstar Co.) 4,700 5,400 6,300 10,000 12,500 11,000
Semiconductor Sales 690 1,000 1,800 3,600 2,500 2,700 Capital Expenditures 320 200 300 2,100 2,300 1,500
Employees 3,600 3,750 3, 900 6,600 8,400 9,445
Ownership: Publicly held.
Company Overview and Strategy
LG Semicon (formerly Goldstar Electron) was formed in 1989, through the consolidation of the memory chip business of LG Electronics (formerly Goldstar) and the ASIC/Micro businesses of Goldstar Semiconductor. It is now 62 percent owned by LG Electronics, the flagship company of the $60 billion Korean conglomerate LG Group. LG Electronics is Korea’s largest maker of electrical appliances and consumer electronics.
LG Semicon is one of the world's leading DRAM suppliers. The company is a world-class producer of ICs for information systems, consumer electronics and new media systems. Ongoing R&D activities include highly integrated multifunctional and ultra-high speed semiconductors, (i.e., giga-DRAMs, high-value-added ASICs and micro products).
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-39 LG Semicon Rest of World Company Profiles
Future product development at LG Semicon will be directed more toward non-memory IC products in an effort to decrease its reliance on the memory market. Approximately 94 percent of total semiconductor sales in 1996 were from memory devices, primarily DRAMs. Over the next several years, the company plans to increase its sales of non-memory products to 30 percent of total chip sales. As part of this strategy, LG Semicon has adapted its 64M DRAM technology to a 0.35µm standard-cell ASIC process. LG Semicon is now developing the 256M DRAM, a new generation memory chip, and many other advanced customer chips such as ASIC and MICRO.
LG Companies are comprised of multiple organizations that support six different markets — Chemicals and Energy, Electric and Electronics, Machinery and Metals, Trade and Service, Finance, Public Service/Sports. LG Semicon is one of 12 different companies supporting the Electric and Electronics business sector in Korea.
Management
Bon-Jun Koo Chief Executive Officer B. D. Sun Vice President, Memory S. H. Kang Vice President, System ICs D.M. Koo Vice President, Sales J.H. Bae Director, Marketing, LG Semicon America
Products and Processes
LG Semicon offers memory ICs (1M to 64M DRAMs, 64K to 1M SRAMs, 1M to 32M flash memories, and 1M to 32M ROMs), application-specific ICs (including gate arrays, standard cells, and full custom devices), bipolar and CMOS general-purpose logic ICs, and other specialized semiconductor devices such as ICs for personal computers (including sound generators and LCD panel controllers) and 8-bit, 16-bit, and 32-bit microcontrollers. In 1996, LG Semicon began production of Mpact™ single-chip media processors, licensed from Chromatic Research Inc. Volume production of the Mpact1 began in 2Q97 at LG Semicon’s Cheongju facility. The company also offers a 2Mx9 Rambus DRAM for the multimedia buffer and plans to offer the associated Mpact glue logic integrated into an ASIC.
MOS MEMORY ANALOG ✔ DRAM Amplifier SRAM Interface ✔ Flash Memory Consumer/Automotive EPROM Voltage Regulator/Reference ✔ ROM Data Conversion EEPROM Comparator Other (Including Non-Volatile RAM) Other (Includes Telecom)
5-40 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles LG Semicon
MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic Bipolar Memory ✔ Gate Array General Purpose Logic ✔ Standard Cell Gate Array/Standard Cell Field Programmable Logic Field Programmable Logic Other Special Purpose Logic Other Special Purpose Logic MPU/MCU/MPR
MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU ✔ Full Custom IC ✔ MPR Discrete ✔ DSP Optoelectronic
Semiconductor Fabrication Facilities
In January 1997, LG Semicon began construction on its first fab facility outside of Korea. The facility, to be located in Newport, South Wales, will be used for 64M and 256M DRAM production and assembly, starting in 1999.
LG Semicon Co., Ltd. LG Semicon Co., Ltd. Cheongju Facility Gumi Facility Cleanroom size: 345,155 square feet Cleanroom size: 106,749 square feet Capacity (wafers/week): 30,000 Capacity (wafers/week): 10,000 Wafer sizes: 150mm, 200mm Wafer sizes: 100mm Processes: CMOS, MOS Processes: NMOS, CMOS, bipolar Products: DRAMs, ROMs, ASICs, Products: Logic ICs, ASICs, MPUs, MCUs, flash memories, MCUs. HDTV ICs, LCD ICs Feature sizes: 0.25µm, 0.35µm, 0.5µm, 1.0µm Feature sizes: 0.35µm – 1.0µm
LG Semicon Co., Ltd. Newport, South Wales Capacity (wafers/week): 7,500 Wafer size: 200mm Process: CMOS Products: DRAMs Feature sizes: 0.25µm (Expected to begin production in 1999).
In the Fall of 1997, LG Semicon announced that it had independently developed a third-generation digital signal processor. This makes LG the first Korean firm to develop this core non-memory technology. LG plans to produce 200,000 DSP units per month starting in the first half of next year. The size of the world DSP market is expected to be worth $8.5B in 1997, with projected growth of 40 percent per year. Given this projection, the market is set to be worth $290B by the year 2001.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-41 LG Semicon Rest of World Company Profiles
Key Agreements
• In early 1999, LG Semicon will produce 64M Flash Memory with SIMP cell which is originally patented by LG Semicon.
• In February 1998, LG Semicon and Tannisys Technology signed an agreement to provide quick turn design, manufacturing, testing and distribution of board-level products. Tannisys will provide design services, manufacturing and supply management services.
• In 1996, LG Semicon licensed the Java processor from Sun Microsystems.
• In March 1996, LG Semicon announced an agreement with Crosspoint Solutions involving both licensing and manufacturing of Crosspoint’s FPGAs.
• In early 1996, LG Semicon entered into a two-year foundry agreement with Chips and Technologies, Inc. Under the agreement, Chips is guaranteed monthly wafer output for the production of its own graphics controllers.
• LG Semicon signed an agreement with Siemens to develop 8-bit microcontrollers for use in consumer electronic products, automobiles, and communications equipment.
5-42 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Libit Signal Processing Ltd.
LIBIT SIGNAL PROCESSING LTD.
Libit Signal Processing Ltd. 2 Chenkar Street P.O. Box: 12670 Herzliya, Israel, 46766 Telephone: (972) 9 956-4937 Fax: (972) 9 956-5183 Web Site: www.libit.com Email: [email protected]
Fabless IC Manufacturer Founded: 1994
Regional Offices/Representative Locations
U.S. – East Coast: Libit Signal Processing Co. Telephone: (201) 816-9232 • Fax: (201) 816-0557
U.S. – West Coast: Libit Signal Processing Co. Telephone: (415) 949-2864 • Fax: (415) 917-0636
Taiwan: Libit Signal Processing Co. Telephone: (886) 22 785-0172 • Fax: (886) 22 653-7952
Employees: 39
Ownership: Privately held.
Company Overview and Strategy
Libit Signal Processing Ltd. delivers cutting-edge modem technologies and products for high-speed digital communications applications. Libit is a pioneering supplier of IC modem devices compliant with the emerging MCNS-DOCSIS industry standard for cable modem and set-top box applications. Libit also provides advanced technologies of V.34+/V.PCM telephone-line modem solutions.
Targeted to the OEM market, Libit’s products have tested for interoperability with modem hardware provided by leading suppliers such as Toshiba, Bay Networks, 3Com and Cisco. The Company has established strategic partnerships with prominent industry players possessing complementary skills and market access, including Analog Devices and Fujitsu Electronic Devices.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-43 Libit Signal Processing Ltd. Rest of World Company Profiles
Management
Ehud Weinstein, Ph.D. President Mordechai Segal, Ph.D. Vice President, Technologies Ofir Shalvi, Ph.D. Vice President, Research and Development Alan V. Oppenheim, Ph.D. Chairman of Executive Committee
Products and Processes
Libit has an extensive line of Cable Modem and Telephone-line Modem Products. Libit’s cable modem product- line consists of IC modem devices enabling high-speed applications such as digital video broadcast and fast Internet access at data rates of tens of Mbps over the cable TV infrastructure. Products are based on a proprietary core technology and very powerful algorithms, achieving highly efficient silicon implementation and significant cost-performance benefits. This product line is fully compliant with the MCNS, DVB, DAVIC and IEEE9\802.14 standards, and is directed to the cable modem and set-top box OEM markets.
Libit has developed, in cooperation with Analog Devices, Inc., a complete V.34+ modem technology, implemented as a software package on the Analog Devices family of fixed-point DSP chips. This technology is optimally designed to operate at the high data rate of 33.6Kbps, exhibiting superior performance over competing V.34+ technologies.
5-44 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Macronix International
MACRONIX INTERNATIONAL (MXIC)
Macronix International Co., Ltd. No. 3, Creation Road III Science-Based Industrial Park Hsinchu, Taiwan Telephone: (886) (3) 5788-888 Fax: (886) (3) 5788-887 Web Site: www.macronix.com
IC Manufacturer
Regional Headquarters/Representative Locations
North America: Macronix America Co. Ltd. • San Jose, California Telephone: (408) 453-8088 • Fax: (408) 453-8488
Europe: Macronix International Co., Europe Office • Strombeek, Belgium Telephone: (32) (2) 267-7050 • Fax: (32) (2) 267-9700
Japan: Macronix International Co., Japan Office • Kawasaki-shi, Kanagawa, Japan Telephone: (81) (44) 246-9100 • Fax: (81) (44) 246-9105
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 63 143 221 328 373 368 Net Income (23) 18 35 114 95 50 R&D Expenditures — — 16 29 34 33 Capital Expenditures — 20 42 113 250 184
Employees 800 980 1,440 1,700 2,000 2,230
Ownership: Publicly held, Taiwan Stock Exchange and NASDAQ: MXICY.
Company Overview and Strategy
Macronix International Company (MXIC) designs, manufactures, and markets memory ICs for the personal computer, telecommunications, and data communications market segments. MXIC is currently Taiwan’s largest supplier of EPROMs, Flash memories and Mask ROMs. Unlike so many of it’s competitors, it has largely avoided going into the foundry business, preferring to produce it’s own designs.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-45 Macronix International Rest of World Company Profiles
The company is divided into two groups: the Memory Product Group, which designs and develops non-volatile memory ICs, and the Logic Product Group, which designs and develops logic ICs for PC, communications, and high-end consumer applications.
Plans for 1997 include an increased focus on the U.S. market. The company announced its strategy to expand its U.S.-based subsidiary, Macronix America, to expose its flash, EPROM, and mask ROM products line to a broader range of OEMs. In particular, the company will promote the pin-to-pin compatibility of its non-volatile memory chips.
In addition, Macronix America is developing ASSPs with embedded non-volatile memory and has established three engineering units to work on communications, graphics, and mixed-signal applications. The company plans to acquire more intellectual property that will be used as building blocks for the ASSPs. The company is a MIPS’ licensee and has developed its own microcontroller and DSP cores.
EPROM Flash 12% 12% Mask ROM Logic 57% 19%
1997 Sales by Product Type
Management
Ding-Hua Hu Chairman Miin Wu President Ray Mak Vice President and Chairman, Macronix America Chris Kao Vice President Y.S. Tan Vice President Tom Yiu Vice President Alan Portnoy President, Macronix America
Products and Processes
Macronix International's products include flash memories (1M to 16M capacities), EPROMs (256K to 8M), mask ROMs (1M to 64M), 32-bit RISC microprocessors, 16-bit DSPs, standard cell ASICs, graphics/video controllers, audio chips, clock generators, and LAN ICs.
5-46 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Macronix International
Memory Products • Flash memories — 1M, 2M, 4M, 8M, and 16M densities. • Mask ROMs — 1M, 2M, 4M, 8M, 16M, 24M, 32M, and 64M densities. • EPROMs — 256K, 512K, 1M, 2M, 4M, and 8M densities. • Macronix is developing a new EPROM technology resembling flash memory that is called multiple-time- programmable EPROM.
Logic Products • Video chips — GUI/video accelerators and JPEG circuits. • Audio chips — 16-bit DSPs, codecs, and digital answering machine engines. • Networking chips — 10Mbps Ethernet and 100Mbps Fast Ethernet LAN ICs. • ASICs — standard cells based on 0.8µm DLM, 0.6µm DLM/TLM, 0.5µm DLM/TLM, and 0.35µm DLM/TLM CMOS technologies. Its cell/core library consists of RAMs, ROMs, flash memories, DMAs, 8-/16-/32-bit microcontrollers, 16-bit DSPs, 32-bit FPUs, timers, PLLs, DACs, ADCs, datapath elements, and others.
Other Products • Auto focus ICs. • 32-bit RISC embedded processors compatible with the MIPS R3000. • Clock generators. • RAMDACs. • New system-on-a-chip designs targeted at video projection and LCD monitor markets.
Semiconductor Fabrication Facilities
Macronix International Co., Ltd. Macronix International Co., Ltd. No. 3, Creation Road III No. 3, Creation Road III Science-Based Industrial Park Science-Based Industrial Park Hsinchu, Taiwan Hsinchu, Taiwan Fab I Fab II Cleanroom size: 62,500 square feet (Class 1) Capacity (wafers/week): 10,000 Capacity (wafers/week): 8,250 Wafer size: 200mm Wafer size: 150mm Process: CMOS Process: CMOS Products: EPROMs, ROMs, flash memories, logic ICs Products: EPROMs, ROMs, flash memories, Feature size: 0.35µm (0.2µm capability) DSPs, MPUs, MPRs, logic ICs . (Began operations in 2Q97). Feature sizes: 0.4µm-0.8µm
Key Agreements
• In January 1998, MXIC announced a technology alliance with Matsushita Electronics Industrial. Under the terms of the agreement, Matsushita will license its 16Mbit and 64Mbit DRAM technology to MXIC for foundry services and future technology transfer. These products will not be sold on the open market but will be built for Matsushita on a foundry basis. In the long term, MXIC will use Matsushita’s technology to develop and sell its own line of embedded memory products. Also included in the agreement.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-47 Macronix International Rest of World Company Profiles
• In August 1997, Macronix announced an alliance with Netherlands based Phillips Electronics NV. Under terms of the agreement, MXIC will manufacture and sell microcontrollers developed by Phillips and gain the right to combine MXIC’s flash-memory technology with Philips 16-bit XA microcontroller cores. This will be used to create embedded flash controllers and hybrid ASIC chips that can be programmed with new instructions after they are built.
• In July 1997, MXIC announced long term plans to spend an additional $7B for three more fabs beginning in 2000. The company requires about $1.3B over the next year to complete its latest production expansion.
• In April 1996, Macronix (MXIC) and IBM announced a mutual agreement on the cross licensing of patents.
• Since 1995, MXIC has been Nintendo’s biggest supplier of 64Mbit Mask-ROM chips, used in Nintendo’s newest generation of video game cartridges.
5-48 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Metalink
METALINK
Metalink Ltd. 24 Habarzel Street Ramat Hachayal Tel Aviv, 69710 Israel Telephone: (972) (3) 645-4333 Fax: (972) (3) 648-8022 Web Site: www.metalink.co.il Email: [email protected]
Fabless IC Supplier
Regional Headquarters/Representative Locations
North America: Metalink, Inc. • Mountain View, California Telephone: (650) 903-2290 • Fax: (650) 903-2237
Employees: 50
Metalink is a privately-held company headquartered in Kidmat Atidim, the high-tech business park of Tel Aviv.
Company Overview and Strategy
Founded in 1993, Metalink is a fabless chip vendor with a QA program designed and implemented in accordance with ISO 9000. Metalink uses suppliers it certifies as ISO 9002 compliant in fabrication, assembly and test. Metalink’s management team worked together developing communications equipment for the Israeli Ministry of Defense for 10 years prior to founding the company. Metalink markets its products through direct sales and distributors worldwide.
Metalink has distributors in San Jose and Irvine, California; Ontario, Canada; Tullnerbach, Austria; Bievres Cedex, France; Munich; Limerick, Ireland; Milano; Warsaw; Lisbon; Madrid; Istanbul; Bucks, UK; NSW, Australia; Hong Kong; Yokohama; Seoul; Singapore; Taipei Hsien; and Sao Paulo.
Management
Avi Kliger Technologies Director Paul Nurflus HDSL Product Manager Avi Shabtay VDSL Product Manager
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-49 Metalink Rest of World Company Profiles
Products and Processes
Metalink’s products include ETSI- and ANSI-compliant high-performance, low-power high-bit-rate Digital Subscriber Line (HDSL) and Medium Digital Subscriber Line (MDSL) system-on-a-chip connectivity solutions for multimedia broadband access over copper. Metalink solutions transmit over one to three pairs of copper wires from 272Kbps to 2.3Mbps.
Rather than relying upon Decision-Feedback-Equalizer (DFE) techniques for signal decoding, Metalink has developed an algorithm called Maximum Likelihood (ML) in its DSPs, thereby achieving higher noise immunity boost and extended distance reach. This led to the ETSI Standards Board adopting Metalink’s HDSL 1-pair chipset performance capabilities as the industry standard for single pair (ETR-152).
Metalink’s products are targeted at business and residential applications. In the Data Communications market, access applications include: Fast Internet, Frame Relay, ATM, Public Network, and Private Network. In the Telecommunications market, applications include: Digital Pair-Gain Systems, Cellular Base Station, Public Network and Private Network access. Metalink offers five chipset products to include DSP, AFE and Framer components.
5-50 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Mikron
MIKRON
Mikron Corporation Zelenograd, Moscow, 103460 Russia Telephone: (7) (095) 535-1509 Fax: (7) (095) 535-6264
IC Manufacturer
Company Overview and Strategy
Mikron was one of the principle IC firms in the former USSR. Founded in 1964, the company's focus was traditionally in the field of bipolar technology. Today, Mikron is a private company focusing on advanced process technologies, including CMOS, BiCMOS, and GaAs. Its product offerings includes logic, memory, and linear ICs, as well as ASICs. It is the leading source for GaAs LSI and gate array ICs in Russia. The company's linear devices are expected to gain emphasis in the future.
Mikron’s standard and custom IC products can be found in a variety of applications such as digital and analog watches, televisions, VCRs, supercomputers, and control systems. Roughly half of the company’s production output is sold in international markets.
Management
Gennady Ya. Krasnikov General Director Evgenii Gornev Deputy General Director Pavel S. Prikhodko Deputy General Director Alexander P. Nechiporenko, Ph.D. Chief of External Department Vitaly N. Panasuk Head of Technology and Research and Development
Products and Processes
Mikron uses bipolar, CMOS, BiCMOS, and GaAs process technologies for the production of general purpose logic ICs; ROMs and PROMs; SRAMs; MPUs; PLDs; CMOS, BiCMOS, and ECL gate arrays (up to 10K-gate complexity); linear ICs; and GaAs digital and analog ICs.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-51 Mikron Rest of World Company Profiles
Semiconductor Fabrication Facilities
Mikron joined Hong Kong-based Hua Ko Electronics to create a joint venture facility, located in Russia, that will manufacture 150mm wafers on 0.8µm-1.2µm processes. In addition to funding, Mikron’s investment into the joint venture includes its EEPROM technology and its cleanroom design experience.
Mikron Corporation Zelenograd, Moscow, 103460 Russia Cleanroom size: 73,200 square feet (Class 10) Capacity (wafers/week): 15,000 Wafer sizes: 100mm, 150mm Processes: CMOS, BiCMOS, bipolar, GaAs Products: Logic, memory, and linear ICs; ASICs Feature sizes: ≥0.8µm
Key Agreements
• Mikron has an alliance with Samsung under which Mikron produces ICs for the Korean company.
5-52 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Mosel-Vitelic
MOSEL-VITELIC
Mosel-Vitelic Inc. 1 Creation Road I Science-Based Industrial Park Hsinchu, Taiwan Telephone: (886) (3) 5783344 Fax: (886) (3) 5792838 Web Site: www.moselvitelic.com
IC Manufacturer Founded: 1991
Regional Offices/Representative Locations
North America: Northwest Office Northeast Office Mosel-Vitelic Corporation • San Jose, CA Mosel-Vitelic Corporation • Nashua, NH Phone: (408) 433-6000 • Fax: 433-0952 Phone: (603) 889-4393 • Fax: 889-9347
Southwest Office Central & Southeastern Office Mosel-Vitelic Corporation • Long Beach, CA Mosel-Vitelic Corporation • Richardson, TX Phone: (562) 498-3314 • Fax: 597-2174 Phone: (972) 690-1402 • Fax: 690-0341
Japan: Mosel-Vitelic Japan • Nagano-Ku, Tokyo Phone: (813) 3365-2851 • Fax: 3365-2836
Europe & Israel: Mosel-Vitelic • Germany Phone: (49) (70)-32-2796-0 • Fax: 2796-22
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 213 238 285 540 461 302
Employees — 880 1,411 1,800 1,916 1,884
Ownership: Publicly held, (Taiwan Stock Exchange).
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-53 Mosel-Vitelic Rest of World Company Profiles
Company Overview and Strategy
Mosel-Vitelic designs, manufactures, and markets high-performance, application-specific memory ICs and logic devices. The company's main business focus is on DRAMs and VRAMs for graphics accelerators used in workstations, and desktop, notebook, and subnotebook PCs. Other core markets for its DRAM products include data storage equipment, telecommunications peripherals, and printers. More than half of the company's DRAMs are sold in North America.
Mosel-Vitelic was formed in October 1991, through the merging of MOS Electronics Taiwan Inc. (Mosel) and U.S.- based fabless chip firm Vitelic Corporation, both of which were originally established in 1983.
Audio Products SRAMs 4% Other 1% 5%
DRAMs and VRAMs 90%
1997 Sales by Product Type
Management
Hung-Chiu Hu Chairman and President William Chen Executive Vice President, Administration and Finance John Fulton Executive Vice President, Sales John Seto Executive Vice President, Memory Products Hsing Tuan Executive Vice President, Product Development Rajit Shah Vice President, Marketing Thomas Chang Vice President, Manufacturing M.L. Chen President, ProMOS Technologies, Inc.
Products and Processes
Mosel-Vitelic offers specialized DRAMs (256K to 16M), standard SRAMs (16K to 1M), high-speed SRAMs (64K to 1M), VRAMs (256K and 1M), FIFOs and other specialty memories, SIMMs, and voice chips. The company plans to introduce a 120MHz version of a synchronous graphics RAM (SGRAM), as well as several new SRAM versions, including very low power parts (200µA standby current).
5-54 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Mosel-Vitelic
Semiconductor Fabrication Facilities
In early 1997, Mosel-Vitelic announced plans to break ground on a 256M DRAM 300mm wafer fabrication facility sometime after 1998, with full production to begin in 2003. The company has chosen the Science-Based Industrial Park near Tainan, Taiwan, as a possible location.
Mosel-Vitelic Inc. ProMOS Technologies, Inc. 1 Creation Road I (Joint venture between Mosel-Vitelic and Siemens). Science-Based Industrial Park Science-Based Industrial Park Hsinchu, Taiwan Hsinchu, Taiwan Capacity (wafers/week): 7,500 Cleanroom size: 66,000 square feet Wafer size: 150mm Capacity (wafers/week): 5,000 Process: CMOS Wafer size: 200mm Products: Memory ICs Process: CMOS Feature sizes: 0.4µm-0.6µm (0.35µm capable) Products: Memory ICs Feature size: 0.35µm (0.25µm capable) (Operations started in mid-1997).
Supplementing its own internal production, Mosel-Vitelic has foundry relationships with Oki, Fujitsu, TSMC, and UMC.
Key Agreements
• In October 1997, 64Mbit DRAMs became available by Mosel-Vitelic and Siemens AG. Both companies plan to expand their 64Mbit portfolio with the release of 64Mbit synchronous DRAMs.
• In September 1996, Mosel-Vitelic announced the formation of ProMOS technologies, a $1.7 billion joint venture company with Siemens. The joint venture facility, located in Hsinchu, will be used to manufacture advanced high-density DRAMs using technology transferred from Siemens. The facility began production of 64M DRAMs in mid-1997 and expects to move to 256M DRAMs in 1998. Mosel holds 62 percent interest in the venture, while Siemens holds the remaining 38 percent.
• Mosel-Vitelic has a foundry and technology exchange partnership with Oki.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-55 Novacom Technologies Ltd. Rest of the World Company Profiles
NOVACOM TECHNOLOGIES LTD.
Novacom Technologies Ltd. 4 Harharoshet St. P.O. Box 2660 Raanana, Israel, 43657 Telephone: (09) 7464411 Fax: (09) 7464422 Web Site: www.novacom.com E-Mail: [email protected]
Fabless IC Supplier Founded: 1988
Regional Offices/Representative Locations
U.S.: Novacom Technologies, Inc. • Hyannis, Massachusetts Telephone: (508) 862-0606 • Fax: (508) 862-0605
Employees: 20
Ownership: Privately held; private investors and an Israeli public telecom company.
Novacom Technologies Ltd. specializes in the design, development and marketing of multi-functional ICs for the data communications and networking industries. Annual sales for 1995 and 1996 were $1.6 million and $2.0 million, respectively. Novacom’s business is largely supported by off-shore sales — nearly 70 percent of Novacom’s 1996 revenues were attributed to exported products.
Management
Avishay Noam President Sara Friedman Vice President, Marketing and Sales
Products and Processes
All of Novacom’s ICs are based on the company’s proprietary repeating technologies. Crystal Controlled Adaptive Reclocking Technology (C2-ART) performs full regeneration of the data signals in the system, enabling the user to connect a larger number of stations over longer distances, using all types of cabling media, without being concerned with noise or accumulated jitter in the network. Another key product, Hi-PHY™, provides complete, multi-port digital PHY solutions for data rates of up to 700Mb/sec.
5-56 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles Novacom Technologies Ltd.
Novacom’s products are divided into several major environments.
ICs for ATM 25.6 MBPS Networks Provide a complete solution for the design and implementation of PHY layer and system interface for ATM hubs, switches and NICs. Simplify the link between the PHY and ATM layers.
ICs for Token Ring Local Area Networks Provide a complete solution for the design and implementation of active retiming concentrators and repeaters as well as Token Ring switching hubs providing extensive management support.
ICs for the IBM AS/400 5250 Midrange Environment Provide a complete solution for designing and implementing Multiplexers and DeMultiplexers, Stars and repeaters all active in the IBM 5250 environment.
ICs for the IBM 3270 Mainframe Environment Provide a complete solution for building multiplexers and repeaters for the IBM 3270 environment.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-57 RCL Semiconductors Limited Rest of the World Company Profiles
RCL SEMICONDUCTORS LIMITED
RCL Semiconductors Limited 3, Dai Fu Street Tai Po Industrial Estate Tai Po, N.T. Hong Kong Telephone: (852) 2665-9229 Fax: (852) 2665-2201 Web Site: www.eleccom.com/rel Email: [email protected]
IC Manufacturer Founded: 1979
Company Overview and Strategy
RCL Semiconductors Limited is one of the pioneers in the Far East to enter the semiconductor business. The company started operations in 1982, and is a full service semiconductor company. RCL specializes in design, production, and testing integrated circuits.
Management
Mr. On K.W. General Manager Mr. Li S.W. Deputy General Manager Mr. Rick Fok Assistant Manager, Marketing Department
Products and Processes
RCL provides MOS Logic for special purpose logic and full custom ICs. The company’s products focus mainly on Digital CMOS, and are capable of producing digital CMOS mixed-signal ICs and a small volume of linear circuits. RCL has the ability to develop their own standard products and the experience of doing custom made designs for customers, which also include foundry services.
Their service is focused on 1.8µm-2.0µm CMOS devices, including double poly single metal CMOS. These processes have been thoroughly characterized at every critical step, based on their own SRAM and gate array products. Under development is a 1.2µm CMOS process. Other processes include 2 to 5µm CMOS, single or double poly.
Since the mid-80’s the company’s foundry service has supported customers with local offices to those with overseas buyers. They provide the finished goods in wafer form, dice form, Chip-On-Board or package ICs.
5-58 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles RCL Semiconductors Limited
RCL’s product list includes: voice synthesizers, musical-melody chip, 8-10 digits for calculator ICs, 32KHz analog watch and clock CMOS, timer and counter devices. Other products support applications such as sound effect, led flashers, and telephones – pulse dialer and DTMF tone dialer. The custom devices include customer-made pulse counter, customer-made remote controller, and digital clinical thermometer.
Semiconductor Fabrication Facilities
RCL Semiconductors Limited 3, Dai Fu Street Tai Po Industrial Estate Tai Po, N.T. Hong Kong Telephone: (852) 2665-9229 Capacity (wafers/month): 8,000 Wafer size: 130mm Process: CMOS, NMOS, linear IC Products: ASIC, SRAM, Gate Array Feature sizes: 5µm, 3µm, 2µm, 1.8µm, 1.5µm, (1.2µm available soon).
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-59 Realtek Rest of the World Company Profiles
REALTEK
Realtek No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan, R.O.C. Telephone: 886-3-578-0211 Fax: 886-3-577-6047 Web Site: www.realtek.com.tw
Fabless IC Supplier Founded: 1987
Regional Offices/Representative Regions
Asia: Realtek • Taipei, Taiwan Telephone: 886-2-2298-0098 • Fax: 886-2-2298-0097
Financial History ($M)
1997 Sales 61
Employees 220
Company Overview and Strategy
Realtek designs, tests, and distributes ICs for the consumer electronics, computer peripherals, multimedia, and communications network hardware markets. With 30 patents worldwide, the Company is one of Taiwan’s largest and most successful IC design houses, which offers complete technical counseling and systems software, in addition to design technology.
Management
Dr. Po-Len Yeh Chairman
Products and Processes
Realtek’s Bcore Technology® combines a knowledge of advanced technologies with a mastery of key components such as digital signal processors, microcontrollers, and various types of memory (SRAM, DRAM, EEPROM, etc.). The Company is able to develop standard chips, integrating these components into a single unified system, called Bsystem on a chip®. It is a distinguished circuit design, featuring mixed-mode technology.
5-60 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles Realtek
Realtek’s three product families are described below.
• Consumer Division: Melody Series, Sound Effect, Speech, MCU Based Speech/Melody Series, Controller Series, and Telecommunication Series.
• Communication Division: Full Duplex Ethernet Controller with PnP function (16Kbyte SRAM built in), Realtek PCI Full-Duplex Ethernet Controller with built-in SRAM, Single Chip Fast Ethernet Controller.
• Computer Peripheral Division: Sound ICs and Graphic Video Chip. Products for sound ICs are full duplex Wave Table Sound chip, integrated Audio Controller with 3D chip, and Plug & Play Sound Blaster pro Sound chip. A new product introduced is an Integrated PCI Audio Accelerator. Graphic video chip products include Video Graphic Adapter Controller, entry level ISA VGA chip, 128-bit Performance plus Video, 64-bit Accelerator with full-motion video chip, 64-bit Accelerator for PCI VGA chip, and 32-bit entry-level PCI, VL, ISA, VGA chip.
Key Agreements
• In December 1997, a joint venture was formed amongst Realtek, UMC, Alliance Semiconductor, SanDisk, and Xilinx. This joint venture foundry will produce 8 inch wafers at a capacity of 10,000 per month by the end of 1998. Full production capacity will be 25,000 wafers per month.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-61 SAMES Rest of World Company Profiles
SOUTH AFRICAN MICRO-ELECTRONIC SYSTEMS (SAMES)
South African Micro-Electronic Systems Pty., Ltd. 2 Rooibok Koedoespoort Industrial Area Pretoria, South Africa Telephone: (27) (12) 333-5406 Fax: (27) (12) 333-6021 Web Site: www.sames.co.za
IC Manufacturer Founded: 1979
Financial History ($M)
1995 1996 1997 Sales 16 11 30.3
Employees — — 210
Ownership: Privately held.
Company Overview and Strategy
SAMES manufactures mixed analog/digital ASICs in CMOS and BiCMOS technologies. In addition, the company provides system solutions such as single-chip telephones and electric meters for telecom and industrial applications. The company was founded by Siemens and the Industrial Development Corporation of South Africa (IDC) to manufacture ICs for the South African telecommunications industry. The company is currently the only commercial manufacturer of ICs in South Africa, and the largest in advanced CMOS technology.
The company was originally controlled by the IDC, which held 70 percent of the company. Other minority shareholders included Allied Technologies Ltd., Grinaker Electronics Ltd., Plessey South Africa Ltd., Reunert Ltd., Siemens, and Telephone Manufacturers of South Africa Ltd. In 1995, Austria Mikro Systeme International AG (AMS) acquired a 51 percent controlling interest in SAMES and IDC held the remaining 49 percent of the shares. In 1996, however, IDC made an additional investment into SAMES, increasing its share to 81 percent, leaving AMS with a 19 percent interest. As part of its relationship with AMS, SAMES receives free technology transfers from AMS and the two companies share knowledge in the area of process technology, design, and products.
In 1990, with the completion of a new 150mm wafer facility, SAMES aimed at globalizing its activities in the field of ASICs and at providing foundry capacity. The new fab facility is designed to fulfill submicron requirements in CMOS technology, with 2.0µm to 1.0µm manufacturing processes currently in operation.
5-62 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles SAMES
The company’s capabilities involve design, fabrication, packaging, testing, and qualification of customer service. SAMES has successfully fulfilled wafer second-source requirements for other foundries. SAMES can supply second-source paths either within the AMS group or at external foundry alliances. SAMES offers MPW (multi- project wafer) service and flexible design entry points. MPW allows users to share development costs and therefore, make ASICs more attractive to potential users.
Products and Processes
Since 1981, SAMES has developed telephone dialers and provides unique telephony solutions to a worldwide customer base. The SA54XX Range features are selectable pulse or tone dialing, 24 digit last number redial, selectable inter digit pause, selectable make break ration, a TBR of 100, 270, 300msec, and keypad switchable from pulse to tone. The SA253X, SA15XX Range of CMOS devices contain all the functions needed to form high performance electronic telephones. The Pulse/Tone Switchable Dialing, Tone Ringer and a high quality Speech Circuit is in one CMOS circuit that allows it to meet a wide range of PTT requirements internationally. Other key features are last number redial of 31 digits with Moving Cursor Protocol, and 14 Repertory Memories (SA2531), and two Flash Keys, Real or Complex Impedance set on Chip.
SAMES has been involved in the development of telecommunications products that are widely used in Central Switches and PBX equipment. The LED Driver SA 8803 solves the universal problem of driving LED via Microprocessor bus efficiently. The SA3488 is a non-blocking Digital Switching Matrix capable of routing any of 256 input channels to any of 256 output channels at 2Mbit/sec rates via eight serial PCM links. The control is via a standard eight-bit parallel microprocessor interface. It is hardware and software compatible to M3488/MO88 and European PCM30 and U.S. PCM24 compatible.
SAMES has 1.0µm, 1.2µm, and 2.0µm double metal and double polysilicon CMOS manufacturing processes in operation. The company has recently shipped its first 1.2µm EEPROM process.
Semiconductor Fabrication Facilities
SAMES Pretoria, South Africa Cleanroom size: 15,070 square feet (Class 10) Capacity (wafers/week): 2,500 Wafer size: 150mm Processes: CMOS, BiCMOS Products: ASICs, foundry services Feature sizes: 1.0µm, 1.2µm, 2.0µm
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-63 Samsung Rest of World Company Profiles
SAMSUNG
Samsung Electronics Co., Ltd. Semiconductor Business 10th Floor, Samsung Main Building 250, 2-ka, Taepyung-ro, Chung-gu Seoul 100-191, Korea Telephone: (82) (2) 727-7114 Fax: (82) (2) 753-0967 Web Site: www.sec.samsung.com
IC Manufacturer Founded: 1969
(See Top Ten)
5-64 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles Semiconductor Complex Ltd.
SEMICONDUCTOR COMPLEX LTD.
Semiconductor Complex Ltd. Phase VIII, S A S Nagar-160 059 (Near Chandigarh) Punjab India Telephone: (91) (172) 670065, 670085, 670110, 670409, 670443 Fax: (91) (172) 671575, 670397
IC Manufacturer Founded: 1983
Company Overview and Strategy
Semiconductor Complex Ltd. (SCL), organized in 1983, is a Government of India Enterprise. SCL designs, develops, and manufactures LSI/VLSI circuits with custom design capabilities. This company accrued 1997 total sales of $11.80 million.
SCL has two business components – VLSI division and Systems division. The VLSI division is composed of these five departments: VLSI design, process technology development, wafer fabrication, testing and assembly, and quality assurance. The System division consists of customer product development and application support, customer specific products, and standard products.
In India, SCL sells their own products, but also has marketing ties with Rockwell International and Mitel Corporation. Semiconductor Complex Ltd. has many relations with private sector companies, but enjoys preferential relationships with Indian government agencies. SCL has developed ICs for the clock and watch industry, and developed and supplied over 100 ASICs.
Management
Dr. M.J. Zarabi Chairman, President, and Chief Executive Officer Mr. M.M. Sobti Vice President, Sales and Marketing
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-65 Semiconductor Complex Ltd. Rest of the World Company Profiles
Products and Processes
In the beginning, Semiconductor Complex Ltd. started developing 5 micron technology from American Micro Systems Inc., USA. CMOS in 3 micron, 2 micron, and 1.2 micron was developed, and so were EEPROM and CCD technologies.
MOS MEMORY ANALOG ✔ DRAM Amplifier ✔ SRAM Interface Flash Memory ✔ Consumer/Automotive ✔ EPROM Voltage Regulator/Reference ROM Data Conversion EEPROM Comparator Other (Including Non-Volatile RAM) ✔ Other (Includes Telecom)
MOS LOGIC DIGITAL BIPOLAR ✔ General Purpose Logic Bipolar Memory ✔ Gate Array General Purpose Logic ✔ Standard Cell Gate Array/Standard Cell Field Programmable Logic Field Programmable Logic Other Special Purpose Logic Other Special Purpose Logic MPU/MCU/MPR MOS MICROCOMPONENT ✔ MPU OTHER ✔ MCU ✔ Full Custom IC MPR Discrete ✔ DSP Optoelectronic
Semiconductor Fabrication Facilities
The VSLI Wafer Fabrication is upgradable to process 100,000wpa in 0.6 micron CMOS.
Semiconductor Complex Ltd. Phase VIII, S A S Nagar-160 059 (Near Chandigarh) Punjab, India Cleanroom size: 8,225 square feet Wafer size: 150mm Processes: CMOS Products: Logic and Memory ICs, Analog ICs, ASICs Feature sizes: 0.8µm, 1.2µm, 2µm, 3µm
5-66 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Tower Semiconductor
TOWER SEMICONDUCTOR
Tower Semiconductor Ltd. P.O. Box 619 Migdal Haemek 23105 Israel Telephone: (972) (6) 506-670 Fax: (972) (6) 6547-788 Web Site: www.towersemi.com
IC Manufacturer
Regional Headquarters/Representative Locations
North America: Tower Semiconductor USA, Inc. • San Jose, California Telephone: (408) 551-6500 • Fax: (408) 551-6509
Financial History ($M)
1993 1994 1995 1996 1997 Sales 38 58 100 98 126 Net Income 4 8 20 10 19 Capital Expenditures 5 20 45 76 — R&D Expenditures ————7
Employees 400 455 680 620 638
Ownership: Publicly held. NASDAQ: TSEMF.
Company Overview and Strategy
Tower Semiconductor is an independent foundry-dedicated IC manufacturer, formed by the partial buyout of a National Semiconductor fab in 1993. National began commercial production of wafers at the fab in 1988. Tower is a public company traded in NASDAQ (57.2 percent). The remainder of Tower’s shares are divided between Tower Holdings (41 percent) and managers (1.8 percent). Tower Holdings is owned by Data Systems and Software Inc. (60 percent) and the Israel Corporation (40 percent).
As a foundry, Tower manufactures wafers using its advanced production capability and the proprietary IC designs of its customers. Devices produced by the company are used in a wide variety of applications including personal computer products and peripherals, communications products, office automation equipment, and consumer products.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-67 Tower Semiconductor Rest of World Company Profiles
Cellular Products 3% Office Other 14% Automation PCs/Peripherals 6% 30%
Consumer 23% Communications 24%
1997 Sales by End-Use Market (est.)
Management
Yoav Nissan-Cohen, Ph.D. Co-Chief Executive Officer Rafael M. Levin, Ph.D. Co-Chief Executive Officer Jeffrey Levy Vice President, Fab Facility Reuven Marko Director, Marketing and Sales
Products and Processes
Tower manufactures primarily differentiated ICs rather than commodity products. Such products include digital signal processors, microprocessors, microcontrollers, and mixed-signal devices. It currently uses 1.0µm, 0.8µm, 0.6µm, and 0.5µm double- and triple-level metal CMOS technologies with 0.35µm increasing in production in 1998. It focuses on supply of leading edge EPROM and flash processes for stand-alone as well as embedded application. Tower also provides specialty CMOS processes for optical sensing applications.
Semiconductor Fabrication Facilities
Tower Semiconductor Ltd. P.O. Box 619 Migdal Haemek 23105, Israel Cleanroom size: 46,575 square feet Capacity (wafers/week): 4,500 Wafer size: 150mm Process: CMOS Products: Foundry services Feature sizes: 0.35µm, 0.5µm, 0.6µm, 0.8µm, 1.0µm
Key Agreements
• Tower has an agreement with Fairchild Semiconductor to supply advanced EPROM processes for the commodity and ASSP markets. In January 1998, the parties extended their agreement to include a new family of products. The first project under way is the development of a next-generation Flash technology.
5-68 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Tower Semiconductor
• In January 1997, WSI signed a long-term technology exchange and foundry agreement with Tower Semiconductor. Under the agreement, the two companies will jointly develop manufacturing process technologies such as WSI’s AMG EPROM architecture using Tower’s 0.6µm technology. The agreement also guarantees WSI access to Tower’s wafer capacity.
• In October 1997, Tower and Saifun Semiconductors Ltd. signed a definitive agreement to license and jointly develop a new Flash technology. Tower has an exclusive license for semiconductor contract manufacturing using the Flash technology.
• Tower has supply agreements with National, Motorola, WSI and Chip Express.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-69 TriTech Microelectronics Rest of World Company Profiles
TRITECH MICROELECTRONICS
TriTech Microelectronics Ltd. 5 Yishun Street, 23 #05-01 Singapore 768442 Telephone: (65) 752-2788 Fax: (65) 752-6557 Web Site: www.tritechmicro.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
North America: TriTech Microelectronics Inc. • Milpitas, California Telephone: (408) 941-1300 • Fax: (408) 941-1301
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 15 19 57 70 63 70
Employees 48 47 60 106 145 180
Company Overview and Strategy
TriTech Microelectronics designs and markets innovative integrated circuits for telemedia applications which require the combination of multimedia and communications capabilities. TriTech’s ICs are offered as application- specific standard products (ASSPs) or as ASICs from the company’s comprehensive proprietary library of analog, mixed-signal, digital, and memory cells.
Since its founding in 1990, TriTech has focused on the design of complex analog and mixed-signal products, making this a core technology strength of the company. Its expertise in this area has enabled the company to be adept at designing mixed-signal chips in cost-effective, single-poly bulk CMOS processes. The company also uses its cell-based design approach to quickly turn new products into the market.
TriTech is a member of Singapore Technologies Semiconductors, a strategic business unit of Singapore Technologies.
5-70 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles TriTech Microelectronics
Management
Marc Birnkrant President Bettina Briz Vice President, Worldwide Marketing Alden Chauvin Vice President, Worldwide Sales Michael Harkins Director, Worldwide Regional Marketing Chong Lim Neoh Vice President, Business and Technology Development
Products and Processes
TriTech’s products are targeted at telemedia applications for the PC, including computer games and complex graphical interfaces; PC communications via e-mail, fax, and remote access; and communications/processor platforms for Internet appliances. Audio codecs are a flagship line, with nearly 40 million shipped since the company’s founding. The Pyramid3D graphics processor, introduced in 1996, provides workstation-level graphics on a PC, making three-dimensional multimedia affordable for business and entertainment applications.
In addition, deep-submicron CMOS wafer foundry services and packaging, assembly, and test services are offered through sister companies Chartered Semiconductor and ST Assembly Test Services (STATS), respectively.
Semiconductor Fabrication Facilities
TriTech is a fabless IC supplier; its products are manufactured by Chartered Semiconductor.
Key Agreements
• In March 1998, TriTech announced that Microsoft will license its bump-mapping technology.
• In November 1997, TriTech and Sebring Systems partner on ASIC process for family of PCI bus acceleration products.
• In June 1997, TriTech entered into a partnership with InnovaCom to become the ASIC supplier for InnovaCom’s DVImpact single chip MPEG-2 compressed video encoder.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-71 TSMC Rest of World Company Profiles
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)
Taiwan Semiconductor Manufacturing Co., Ltd. No. 121, Park Avenue III Science-Based Industrial Park Hsinchu 300, Taiwan, ROC Telephone: (886) (3) 578-0221 Fax: (886) (3) 578-1546 Web Site: www.tsmc.com.tw
IC Manufacturer Founded: 1987
Regional Offices/Representative Locations
North America: TSMC, USA • San Jose, California Telephone: (408) 437-8762 • Fax: (408) 441-7713
Europe: TSMC, Europe • Amsterdam, The Netherlands Telephone: (31) (20) 305-9900 • Fax: (31) (20) 305-9911
Financial History ($M)
1992 1993 1994 1995 1996* 1997* Sales 258 465 730 1,092 1,416 1,593 Net Income 46 160 320 572 697 638 R&D Expenditures 5 12 21 32 54 47 Capital Expenditures 108 147 270 574 845 866
Employees 1,893 2,294 2,681 3,412 4,117 5,600
*28.14NTD/USD
Ownership: Publicly held. TSE (Taiwan Stock Exchange) and TSM (New York Stock Exchange).
Company Overview and Strategy
Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest pure integrated circuit foundry and offers a set of IC fabrication processes, including processes to manufacture CMOS logic, mixed-mode, volatile and non-volatile memory, embedded memory, and BiCMOS chips. TSMC does not design its own brandname IC end products or second-source its customers’ products.
5-72 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles TSMC
Taiwan Semiconductor Manufacturing Company (TSMC) was founded as a joint venture of the Taiwan Development Fund, Philips Electronics of the Netherlands, and private-sector investors in Taiwan. It is 19 percent owned by the government of Taiwan, 29.5 percent owned by Philips, and 48.5 percent owned by private investors and employees.
Since its founding, the company has been dedicated to providing manufacturing services for advanced ICs. TSMC believes its customers have the ability to bring their products to market faster, more cost effectively, and without the large capital expenditures necessary for state-of-the-art manufacturing facilities. TSMC serves over 300 worldwide customers, many of them located in the U.S. and about two-thirds fabless. TSMC customers range from IC design houses, vertically-integrated IC firms, systems companies, and world leading IC companies.
Europe Japan 8% 11% United States 42% Asia 39%
1997 Sales by Geographic Region
Taiwan Semiconductor Manufacturing Company’s global growth of the market for its customer-made foundry microchips will grow 23 percent in 1998 to $6 billion NTD.
In mid-1995, TSMC began offering customers an option to guarantee long-term wafer capacity through prepayments. The deposits are allowing the company to accelerate its fab facility construction. Customers that have entered into the option agreement include Acer Labs, Analog Devices, Oak Technology, S3, Trident Microsystems, and ISSI.
Management
Morris Chang, Ph.D. Chairman and President Rick Tsai Executive Vice President, Operations Quincy Lin Senior Vice President, Corporate Development Stephen T. Tso Senior Vice President, World-Wide Sales & Marketing Kok-Choo Chen Senior Vice President and General Counsel Harvey Chang Senior Vice President and Chief Financial Officer Y.C. Huang Spokesman and Special Assistant to Chairman Jyan-Bang Chen Vice President, North Site Shang-Yi Chiang Vice President, Research and Development Ping Yang Vice President, Corporate Marketing Che-Chia Wei Vice President Ronald Norris President, TSMC USA
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-73 TSMC Rest of World Company Profiles
Products and Processes
TSMC’s state-of-the-art CMOS and other process technologies in production are as follows:
Logic: 1.2µm, 1,0µm, 0.8µm, 0.6µm, 0.5µm, 0.35µm, 0.30µm, 0.25µm Mixed-mode: 1.0µm, 0.8µm, 0.6µm, 0.5µm, 0.35µm, 0.25µm BiCMOS: 1.5µm, 1.0µm, 0.8µm Mask ROM: 0.6µm, 0.45µm DRAM: 0.5µm, 0.35µm, 0.32µm, 0.25µm SRAM: 0.5µm, 0.45µm, 0.35µm, 0.3µm FLASH: 0.8µm, 0.7µm, 0.5µm EPROM: 0.8µm, 0.7µm, 0.5µm EEPROM: 0.5µm
In new processes, TSMC provides logic-based EmbDRAM and memory-based EmbDRAM technology. Logic- based EmbDRAM process enables the integration of logic and DRAM circuits together on the same chip. Memory-based EmbDRAM combines traditional DRAM processes with additional metal layers. For example, the 0.25µm logic-based EmbDRAM technology offers high performance transistors based on TSMC’s 0.25µm logic process; and the memory-based EmbDRAM technology is structured around a 0.25µm DRAM plus three extra metal layers.
In the fourth quarter of 1997, TSMC started to offer EmbFlash with the state-of-the art 0.5µm technology. The technology is suited to products using low to medium density nonvolatile memory, such as MCU and DSP.
Currently, technologies under development include 0.18µm logic/ASIC, 0.25µm mixed-signal, 0.18µm SRAM, 0.25µm embedded FLASH, and 0.25µm embedded DRAM processes. In mid-1998, TSMC will begin development of 0.15µm generation process technology.
In addition to providing IC wafer manufacturing service, TSMC offers ASIC design services, mask making services, wafer probing services, and assembly and test services. To stay ahead of the swift upgrades in technology, TSMC continuously introduces next-generation processes to its production facilities.
Semiconductor Fabrication Facilities
In November 1995, TSMC announced plans to build WaferTech, a $1.2 billion joint venture company, with Altera, Analog Devices, and ISSI. The company will be dedicated to providing wafer manufacturing services and is one of the first U.S.-based dedicated foundries, located in Camas, Washington. The facility underwent construction in July 1996, and will have a capacity of 7,500 200mm wafers per week when production starts in 2H98.
In early 1997, TSMC announced its long-term plans for future wafer manufacturing facilities. The company announced its commitment to the Taiwanese government to invest approximately $14.5 billion over the next five years to build one 200mm and six 300mm wafer manufacturing facilities in a new Science-based industrial park in the southern part of Taiwan.
5-74 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles TSMC
TSMC will begin construction 2Q98 on Taiwan’s first 12-inch wafer fabrication facility.
TSMC, Ltd. TSMC, Ltd. Building 67, No. 195, Section 4 No. 121, Park Avenue III Chung-Hsing Road Science-Based Industrial Park Chu-Tung, Hsinchu, Taiwan, ROC Hsinchu, Taiwan, ROC Telephone: (886) 3582-1240 Telephone: (886) 3578-0221 Fab I Fab IIA Cleanroom size: 29,060 square feet Cleanroom size: 100,730 square feet Capacity (wafers/week): 5,000 Capacity (wafers/week): 9,750 Wafer size: 150mm Wafer size: 150mm Processes: CMOS, BiCMOS Processes: CMOS, mixed-mode Products: Foundry services Products: Foundry services Feature sizes: 0.8µm-2.0µm Feature sizes: 0.5µm, 0.6µm
TSMC, Ltd. TSMC, Ltd. No. 121, Park Avenue III No. 9, Creation Road I Science-Based Industrial Park Science-Based Industrial Park Hsinchu, Taiwan, ROC Hsinchu, Taiwan, ROC Telephone: (886) 3578-0221 Telephone: (886) 3578-1688 Fab IIB Fab III Cleanroom size: 100,730 square feet Cleanroom size: 113,915 square feet Capacity (wafers/week): 9,875 Capacity (wafers/week): 9,250 Wafer size: 150mm Wafer size: 200mm Processes: CMOS, mixed-mode Process: CMOS Products: Foundry services Products: Foundry services Feature sizes: 0.5µm, 0.6µm Feature sizes: 0.25µm, 0.35µm, 0.5µm
TSMC, Ltd. TSMC, Ltd. Hsinchu, Taiwan Hsinchu, Taiwan Fab IV Fab V Same address as Fab III same address as Fab II Capacity (wafers/week): 7,500 Capacity (wafers/week): 8,750 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: Foundry services Products: Foundry services Feature sizes: 0.25µm, 0.35µm, 0.5µm Feature sizes: 0.25µm, 0.35µm (0.18µm capable) (.18µm capable) (Scheduled to start-up in 1Q98).
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-75 TSMC Rest of World Company Profiles
WaferTech, LLC Camas, Washington Capacity (wafers/week): 7,500 Wafer size: 200mm Process: CMOS Products: Foundry services Feature sizes: 0.25µm, 0.35µm (0.18µm capable) (Scheduled to start up in 2H98. Joint venture with Altera, Analog Devices, and ISSI).
Key Agreements
• In March 1998, TSMC signed intellectual property agreements with San Jose based Artisan Components to create embedded memories and standard cells and I/O for it’s 0.25 micron logic process. This technology will be offered to its foundry customers exclusively. TSMC will be using Artisan’s Process Perfect HS300 (high speed 300MHz) single- and dual- port memory generators and process-perfect standard cell libraries.
• In February 1998, Taiwan Semiconductor Manufacturing Company formed a multi-year strategic partnership with NVIDIA Corporation. TSMC will assist in the manufacturing of all future NVIDIA products starting with RIVA 128ZX™. TSMC will provide NVIDIA with deep sub-micron process technology.
• In November 1997, TSMC and Avant! Corporation signed a marketing and development partnership agreement that will provide Galax!’s library technology to TSMC’s foundry customers. This partnership will create and support a comprehensive set of logic library cells, standard and special I/Os, memory compilers, datapath compilers, place and route kits and technology run sets for design rule checking tools.
• In July 1997, QuickLogic entered into a manufacturing agreement with TSMC enabling the co-development of a 0.35µm four-layer metal CMOS process for 8 inch wafers using the company’s ViaLink antifuse technology. The agreement is effective for three years and is renewable annually as a rolling three-year agreement. The agreement guaranteed certain capacity availability and requires that a minimum percentage of the total number of wafers required by the company in any one year are purchased from TSMC (excluding wafers purchased from Cypress and certain other wafer requirements), and requires “take or pay” volume commitments.
• In March 1997, Taiwan Semiconductor Manufacturing Company announced a wafer manufacturing agreement with Quantum Effect Design, Inc. (QED). TSMC will provide 0.35 and 0.25 micron capacity to meet QED’s customer requirements.
• In November 1995, TSMC announced plans to build WaferTech, a $1.2 billion joint venture company, with Altera, Analog Devices, and ISSI. WaferTech will provide wafer manufacturing services and is one of the first U.S.-based dedicated foundries. Construction of WaferTech began mid-1996 and is scheduled to commence in 1998.
5-76 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles U-Jin Electronics Company, Ltd.
U-JIN ELECTRONICS COMPANY, LTD.
U-Jin Electronics Company, Ltd. 478-17 Mangwon-dong Mapo-gu, Seoul Korea Telephone: 880-31-74-0050 Fax: 880-31-74-0038
IC Manufacturer Founded: 1976
Company Overview and Strategy
U-Jin Electronics Company, Ltd. produces LED display, lamp dot matrix, infrared LED, photo T/R, photo diode, and photo interrupters. The company is also involved in optoelectronics.
Management
Jae Chun Yoo President
Semiconductor Facilities
U-Jin Electronics Company, (BD) Ltd. SS-5 Bldg., Export Processing zone, Chittagong, Bangladesh Telephone: 880-31-74-0050 Fax 880-31-74-0038 Products: Led Display, Lamp Dot Matrix, Infrared LED, Photo T/R, Photo diode, Photo Interrupter, Optoelectronic.
5-77 UMC Rest of World Company Profiles
UNITED MICROELECTRONICS (UMC)
United Microelectronics Corporation No. 3, Industry East Road Science-Based Industrial Park Hsinchu, Taiwan Telephone: (886) (3) 5773131 Fax: (886) (3) 5774767 Web Site: www.umc.com.tw
IC Manufacturer Founded: 1980
Regional Headquarters/Representative Locations
USA: United Microelectronics Corporation • Sunnyvale, California Telephone: (408) 733-8881 • Fax: (408) 733-8090
Japan: United Microelectronics Corporation K.K. • Minato-Ku, Tokyo, Japan Telephone: (81) (3) 3455-8306 • Fax: (81) (3) 3455-8307
Europe: United Microelectronics (Europe) B.V. • Br. Amsterdam Zuidoost, The Netherlands Telephone: (31) (20) 697-0766 • Fax: (31) (20) 697-7826
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 257 376 567 900 825 883 Capital Expenditures 56 53 255 570 600 162 R&D Expenditures 20 37 40 52 66 62
Employees 1,770 1,968 2,275 2,982 2,750 2,751
Company Overview and Strategy
United Microelectronics Corporation (UMC) is a dedicated semiconductor foundry company. UMC’s range of foundry services include IC fabrication, design support, mask making, wafer probing, packaging and testing. The company offers CMOS technologies that include logic, mixed-signal, SRAM, DRAM, flash and embedded memory processes. These technologies are offered in linewidths ranging from 0.25µm to 1.0µm (and greater) and are capable of up to six levels of metal interconnections.
5-78 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles UMC
Communication ICs 4% Commercial ICs 6% Computer ICs 13%
Foundry Services 50% Memory ICs 27%
1997 Sales by Product Type (est.)
With four 8 inch IC fabs and one 6 inch fab, the UMC Group boasts a foundry capacity that is amongst the highest in the industry. The UMC Group plans to triple its capacity over the next five years to assure its customers with virtually unlimited access to leading-edge semiconductor manufacturing capacity.
A key to UMC’s strategy toward its continued expansion of foundry capacity is through the formation of joint ventures with strategic partners. A proven popular business model that renders customers as partner/owners, the joint venture fabs provide guaranteed capacity to the foundry partner/customers as well as allowing for their sharing in the ventures’ profits. United Semiconductor Corporation (USC), United IC Corporation (UICC) and United Silicon Inc. (USIC) are joint venture fabs within the UMC Group that work together in joint support of the foundry customers.
Company Background
During its 17 years as the leading IC product company in Taiwan, UMC has developed an extensive range of products that include memory ICs, PC chipsets, microcontrollers, DSPs and communication devices. These product divisions have been completely divested from the company. The spun-off companies are Integrated Technology Express, Davicom, AMIC, NovaTek and MediaTek. All these companies are independent companies in which UMC maintains only a minority and declining stake. With the transition to a dedicated IC foundry complete and the concern of any potential competition with its customers removed, UMC now devotes all its resources to maintaining world-class foundry services to its customers.
Management
Bob Tsao Chairman Don Brooks Chief Executive Officer, International Operations John Hsuan Chief Executive Officer, Domestic Operations Ing-Dar Liu Chief Operating Officer, Expansion Projects Gary Tseng Chief Financial Officer J.S. Aur Chief Administrative Officer H.J. Wu President, UMC Peter Chang President, USC C.Y. Shu President, UICC Frank Wen President, USIC
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-79 UMC Rest of World Company Profiles
Semiconductor Fabrication Facilities
United Microelectronics Corporation United Microelectronics Corporation Science-Based Industrial Park Science-Based Industrial Park No. 3, Industrial East Road No. 3, Industrial East Road Hsinchu, Taiwan Hsinchu, Taiwan Fab IC2 Fab IC3 Cleanroom size: 47,600 square feet Cleanroom size: 57,800 square feet Capacity (wafers/week): 12,000 Capacity (wafers/week): 6,250 Wafer size: 150mm Wafer size: 200mm Processes: CMOS, NMOS Processes: CMOS Products: Dedicated foundry services Products: Dedicated foundry services Feature sizes: 0.4µm-1.0µm Feature sizes: 0.25µm-0.5µm
United Semiconductor Corporation (USC) United Silicon Inc. (USIC) Science-Based Industrial Park Science-Based Industrial Park No. 3, Industrial East Road No. 3, Industrial East Road Hsinchu, Taiwan Hsinchu, Taiwan USC Fab 1C3B USIC Fab 1 Cleanroom size: 55,600 square feet Cleanroom size: 55,600 square feet Capacity (wafers/week): 8,500 Capacity (wafers/week): 6,250 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: Dedicated foundry services Products: Dedicated foundry services Feature sizes: 0.25µm, 0.35µm, 0.5µm Feature sizes: 0.25µm-0.5µm (Scheduled to begin production in 1Q98).
United Integrated Circuits Corporation (UICC) Science-Based Industrial Park No. 3, Industrial East Road Hsinchu, Taiwan UICC Fab 1 Cleanroom size: 55,600 square feet Capacity (wafers/week): 6,250 Wafer size: 200mm Process: CMOS Products: Dedicated foundry services Feature size: 0.25µm-0.5µm (Scheduled to begin production in 1Q99).
5-80 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles UMC
Key Agreements
• In March 1998, UMC and Virtual Silicon Technology, Inc., announced that they had entered into a multi-year joint marketing and technology development agreement. The agreement calls for UMC to endorse Virtual Silicon’s Diplomat-25 design rules. Chip designers utilizing UMC’s 0.25 micron manufacturing processes will be able to embed large Intellectual Property (IP) cores into their system-on-silicon designs using Virtual Silicon’s high quality Diplomat-25 standard cell libraries.
• In October 1997, Xilinx, Inc. in partnership with UMC announced the first FPGA product built with 0.25 micron process technology.
• In early 1996, UMC purchased a 10 percent stake in Catalyst Semiconductor as part of a foundry agreement. Also under the agreement, UMC and Catalyst will jointly develop 0.5µm and 0.35µm process technologies, geared for flash memory products. The first 0.5µm flash devices were shipped in 4Q96.
• In 4Q95, Alliance Semiconductor granted UMC a license to produce for itself a certain number of Alliance DRAM products in return for DRAM manufacturing capacity.
• UMC’s joint venture IC foundry, United Semiconductor Corporation (USC), was announced in 1995 in partnership with Alliance Semiconductor and S3 Inc. The fab began production in 3Q96 of 200mm wafers for UMC, Alliance, S3, and other semiconductor firms. UMC owns 50 percent of the venture.
• UMC’s second joint venture foundry fab, United Integrated Circuits Corporation (UICC), is a partnership with ATI Technologies, ESS Technology, Integrated Silicon Solution Inc., Lattice Semiconductor, Oak Technology, OPTi Inc., and Trident Microelectronics. The 200mm wafer fab began production in mid-1997. UMC owns 50 percent of the venture.
• UMC’s third joint venture fab, United Silicon Inc. (USI), is a partnership with Alliance Semiconductor, Cirrus Logic, and Xilinx. The 200mm wafer fab is expected to begin production in 1Q98. UMC will own 50 percent of the venture.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-81 Valence Semiconductor Rest of World Company Profiles
VALENCE SEMICONDUCTOR
Valence Semiconductor Design Ltd. Units 1-7, 19/F., Apec Plaza 49 Hoi Yuen Road, Kwun Tong Kowloon, Hong Kong Telephone: (852) 2656-1151 Fax: (852) 2652-2301
Fabless IC Supplier
Financial History ($M)
1992 1993 1994 1995 1996 1997 * Sales 18 24 32 40 48 —
Employees 35 40 42 45 50 —
*Company did not disclose.
Company Overview and Strategy
Valence started in 1985 designing chips for clients overseas, who were often large multinational companies. Over the years, Valence has gained crucial experience in state-of-art chip design process and design flow.
Valence has over thirty ASIC engineers, which is the largest IC design team in Hong Kong. Valence’s engineers design projects in system development and user-interface in new applications.
Valence designs and manufactures application-specific system-on-a-chip semiconductor components for multimedia and consumer products, and also sells its own chips. Moreover, it has licensed designs to multi- national companies in U.S.A., Europe, Korea, Taiwan, and Singapore.
Management
Thomas Wan Chief Executive Officer Raymond Choi President
Products Under Development
ASICs for telecommunications, PC system, consumer and multimedia applications.
5-82 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Vanguard International Semiconductor
VANGUARD INTERNATIONAL SEMICONDUCTOR (VIS)
Vanguard International Semiconductor Corporation Science-Based Industrial Park 123 Park Avenue III Hsinchu 30077, Taiwan Telephone: (886) (3) 5770355 Fax: (886) (3) 5785026 Web Site: www.vis.com.tw E-mail: [email protected] [email protected]
IC Manufacturer Founded: 1994
Regional Offices/Representative Locations
North America: VIS Micro Inc. • San Jose, California Telephone: (408) 577-1833 • Fax: (408) 895-5595
Europe: Vanguard Microelectronics, Ltd. • Blisworth, Northants, U.K. Telephone: (44) 2604-859-543 • Fax: (44) 1604-859-542
Asia: Daiwa Sanko • Tokyo, Japan Telephone: 44-2604-859-543 • Fax: 44 -1604-859-542
Marubun Corporation • Tokyo, Japan Telephone: 03-3639-9977 • Fax: 03- 5645-5330
Vision Memory Co., LTD. • Kowloon, Hong Kong Telephone: 852-2344-1964 • Fax: 852-2344-5712
Financial History ($M)
1997
Net Revenue 344 Net Income (2)
Employees 1,891
Ownership: 30 percent Taiwan government, 27 percent TSMC, 43 percent private investors.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-83 Vanguard International Semiconductor Rest of World Company Profiles
Company Overview and Strategy
Vanguard International Semiconductor (VIS) is focused on the research, development, design, manufacture, packaging, testing, and marketing of standard and application-specific memory ICs, as well as related components and system products.
VIS was formed in 1994, as the result of privatization of the Sub-Micron CMOS Process Technology Development Project, a four-year research project sponsored by the Taiwanese government under the Electronics Research and Service Organization (ERSO) of the Industrial Technology Research Institute (ITRI). Among the devices developed by the project were 4M and 16M DRAMs and 4M SRAMs. In mid-1994, a local consortium led by TSMC bought the lab’s assets, including a small-scale 200mm wafer fab. VIS is now owned 27 percent by TSMC, 30 percent by the Taiwanese government, and the remainder by local investors.
VIS sells its products primarily to customers in the local market, but its customers can also be found in other Southeast Asian countries, Europe, and the United States. International sales represented approximately one- third of total revenues in 1996.
VIS is aggressively planning the set-up of a second fab. Their short term goal is to start mass production of 64Mb DRAM by 1998, and to develop niche products. In addition to DRAM products, VIS will attempt to develop Synchronous DRAM, Logic, and other memory products as well. In the next two to three years, VIS plans to enter the market of logic products.
Management
Morris Chang, Ph.D. Chairman Feng-Churng Tseng, Ph.D. President S.J. Paul Chien Vice President, Sales and Marketing Robert Hsieh Vice President, Finance C.Y. Lu, Ph.D. Vice President, Operations Steve Pletcher Managing Director, VIS Micro Inc.
Products and Processes
VIS’s semiconductor products include DRAMs, SRAMs, and application-specific memories (ASMs), but its fab currently produces mostly 16M DRAMs using 0.4µm and 0.37µm process technologies.
In March 1996, Vanguard claimed to be the first Taiwanese IC company to develop and show a fully functional 64M DRAM. The prototype part is based on a 0.4µm process, but the company plans to migrate the device down to 0.35µm in the near future. The earliest 64M device is expected to begin shipping in 1998. An 8M SGRAM for 3D graphics is also said to be under development.
DRAM SIMM and DRAM DIMM are part of the VIS product line. The non-DRAM portion of VIS’ product line are chips for speech recognition.
5-84 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Vanguard International Semiconductor
The research and development of VIS will work on the next generation products — 64Mb DRAM and 256Mb DRAM — to provide the system industry with more advanced products and efficient services.
Semiconductor Fabrication Facilities
VIS completed the expansion of Fab 1A and the construction of a second fab (Fab 1B) in Hsinchu. Fab 1B began production of 16M DRAMs on 200mm wafers in 2Q97 and plans to move to 64M DRAMs in 1998.
VIS VIS Science-Based Industrial Park Science-Based Industrial Park Hsinchu, Taiwan Hsinchu, Taiwan Fab 1A Fab 1B Cleanroom size: 62,540 square feet Cleanroom size: 100,640 square feet Capacity (wafers/week): 4,000 Capacity (wafers/week): 8,250 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: DRAMs, SRAMs Products: DRAMs Feature sizes: 0.37µm, 0.4µm (0.35µm capable) Feature size: 0.35µm (0.25µm capable) (Began production in 1Q97).
VIS-America, a design center in the Silicon Valley, California, U.S.A., provides additional product development and design.
Key Agreements
• In mid-1997, Vanguard International Semiconductor and Texas Instruments announced a ten-year worldwide semiconductor cross-license patent agreement. This agreement enables both companies to use each other’s patents involved in making semiconductor products. This is the first semiconductor patent between a Taiwanese company (VIS) and TI.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-85 VIA Technologies Rest of World Company Profiles
VIA TECHNOLOGIES
VIA Technologies, Inc. 8F, 533, Chung-Cheng Rd. Hsin-Tien, Taipei Taiwan, R.O.C. Telephone: (886) (2) 218-5452 Fax: (886) (2) 218-5453 Web Site: www.via.com.tw
Fabless IC Supplier
Regional Headquarters/Representative Locations
North America: VIA Technologies • Fremont, California Telephone: (510) 683-3300 • Fax: (510) 683-3301
Financial History ($M)
1995 1996 1997 Chipset Sales 140 169.5 — Capital — — 700
Employees — — 180
1997 operating growth was reportedly at 100 percent over 1996.
Company Overview and Strategy
Founded in 1987, VIA Technologies Inc. is a privately held company with funding support through membership in Taiwan’s Formosa Plastics Group, a $10 billion multinational conglomerate.
Using a fabless approach, VIA designs and develops increasingly integrated, high-performance, PC-centric, desktop and portable computer system logic and peripheral controller chips. Based on shipment revenues, VIA ranked number one in the worldwide PC chipset market in 1997, second in 1996, and third in 1995. The company claims to be the top supplier of Socket-7 chipsets and is a major supplier of Slot-1 chipsets.
VIA Technologies, Inc. is moving a wide range of previously board-resident PC system functions onto chips. In producing core logic and peripheral controller chips, VIA relies on its proprietary expertise in IC design and established IC foundry relationships. The company’s goal is to become the recognized alternative to Intel for PC- centric core logic ICs.
VIA’s customers include Compaq Computer and NeoSystems (using VIA’s VP2 chipset for its Modular Digital Architecture PC concept) in the U.S. and Taiwan’s First International Computer (FIC) and Shin Ming.
5-86 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles VIA Technologies
In addition to direct sales programs in Europe, North America, and the Far East, VIA Technologies uses manufacturers’ representatives on a worldwide basis.
Management
Shir Wang Chairman Wen-Chi Chen President and Chief Executive Officer Tzu-Mu Lin Vice President, Engineering Dean Hays Vice President, Marketing, U.S. Operations Frank Jeng Manager, Marketing Section
Products and Processes
VIA has foundry relationships with Toshiba and Taiwan Semiconductor Manufacturing Corporation. VIA is using advanced CMOS and bipolar technologies from these foundries.
One of VIA’s core proprietary technologies is its Virtual Clock Synchronization (VCS). VCS refers to the use of delay-lock-loop (DLL) to enable synchronous and pseudo-synchronous operation of the processor and DRAM, AGP and PCI buses. The pseudo-synchronous setting allows the CPU and memory buses to be set at different speeds. VIA claims advantage of this is that non-PC100 main memory can be set to run stable at more traditional bus speeds even when the CPU bus is running at 100MHz.
VIA offers six Socket-7 chipsets (including the 100MHz Apollo VP2/97), one Slot-1 chipset, one 10/100 BaseT and two PCI 10 BaseT network controllers, and the following peripherals: PCI-to-USB bridge, PCMCIA socket controller, PCMCIA controller, clock generator, two real-time clocks, and a keyboard controller.
In January 1998, VIA announced that the Apollo MVP3 was in mass production and had a customer base of 20 leading OEMs. VIA claims the MVP3 is the first 100MHz core logic chipset available in mass production quantities. The predecessor VP3 was the first to support AGP, as does the MVP3. The MVP3 is positioned to deliver performance comparable to current Pentium II-based systems. VIA’s VCS technology, noted above, was the key enabler for the MVP3. The chipset supports all Socket-7 designs including IDT’s WinChip C6.
Key Agreements
• In February 1998, VIA hosted a seminar for Cyrix’s (a National Semiconductor company) announcement of its next generation MediaGX microprocessor, the MXi. VIA appears to be supplying Cyrix with key technology for the MXi which is due in the Q4 1998 and is targeted at the sub-$1000 PC market. VIA has worked with Cyrix for a number of years to support their line of processors along with those of other Intel competitors.
• In February 1997, VIA announced a licensing agreement with Advanced Micro Devices (AMD). The agreement licenses VIA’s VT82C590 Apollo VP2/97 chipset architecture to AMD. The VP2/97 supports Microsoft PC97 and features a two-chip design with up to 2Mb Cache, support for all Socket-7-level processors and up to 512Mb of mixed combination SDRAM, EDO and FPM DRAMs. AMD write allocation and Cyrix/IBM linear burst mode are also supported.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-87 VIA Technologies Rest of World Company Profiles
• The relationship with AMD has been ongoing for several years and had some problems in 1996, due to channel conflict with mutual customer Compaq Computer, as well as foundry partner TSMC. Most of the problems were attributed to poor communications between the companies which were resolved by 1997.
• Partnering with several chipset makers, Samsung began working mainly with VIA in 1996, to develop a chipset to support Samsung's bi-directional, center DQ design of a 200MHz DDR SDRAM. The relationship has progressed from an x-16 configuration to development of an x-32 configuration.
• In August of 1996, VIA was among several companies which joined forces to form a new open standard organization called the PC Common Architecture. The standard will push ISA device users to migrate to PCI bus systems in order to accelerate system I/O. The goal is to provide full support of legacy components, better system performance, lower cost, and the ability to mix peripherals.
5-88 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Winbond Electronics
WINBOND ELECTRONICS
Winbond Electronics Corporation Science-Based Industrial Park Number 4, Creation Road III Hsinchu, Taiwan Telephone: (886) (3) 5770066 Fax: (886) (3) 5792668 Web Site: www.winbond.com.tw
IC Manufacturer Founded: 1987
Regional Headquarters/Representative Locations
North America: Winbond Micro Electronics Corporation • San Jose, California Telephone: (408) 943-6666 • Fax: (408) 943-6668
Financial History ($M)
1992 1993 1994 1995 1996 1997 Sales 120 185 330 676 450 462 Net Income — 12 81 342 170 120 R&D Expenditures 12 19 25 31 35 51 Capital Expenditures — 55 150 254 350 374
Employees 1,310 1,630 1,940 2,390 2,400 3,000
Company Overview and Strategy
Winbond Electronics was established in 1987, to design, produce, and market VLSI products to personal computer, telecommunications, and consumer electronics industries. Its primary IC products include Data Communication ICs, Foundry Services, Memory ICs, Microcontroller ICs, Multimedia ICs, Personal Computer ICs, Speech ICs, Telephony ICs, and Visual Communication ICs. In addition, Winbond boosted its foundry business with its 1997 opening of Fab IVA and B, which now runs 15K, 8 inch wafers per month at full capacity. The company is building another 8 inch fab, scheduled to be on-line mid-1999.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-89 Winbond Electronics Rest of World Company Profiles
Management
Ding-Yuan Yang, Ph.D. President Ching-Chu Chang Executive Vice President, DRAM IC Business Group Yung Chin Vice President Michael Liao Assistant Vice President Archie Yeh Assistant Vice President In-Skek Hsu Assistant Vice President and Director of Sales
Products and Processes
Winbond’s IC products include memory ICs (64K to 4M high-speed SRAMs, low-power SRAMs, EPROMs, and flash memories), PC I/O controllers, LAN controllers (including Fast Ethernet controllers), telephone dialers, speech synthesizer ICs, 4-bit and 8-bit microcontrollers, MPEG-1 and MPEG-2 decoders, and JPEG decoders. The company also provides foundry services for 3.3V and 5.0V CMOS logic, embedded SRAM and flash memory, and embedded DRAM (starting in 1998). Details on these products are as follows.
Data Com IC’s • ISDN – Internet access and telecommuter applications • 128Kbps data rate with built in FIFO and one or two channel HDLC controllers
• LAN Network – Multiport repeater controller, fast Ethernet controller with PCI and MII interface • WVM TX fast Ethernet transceiver
Memory • High Speed CMOS SRAM • (256K to 4Mbit @ 3.3V, 12 to 20ns) • (64K to 4Mbit @ 5V, 12 to 20ns)
• Synchronous High Speed SRAM (1Mbit to 4Mbit @ 3.3V, 4ns to 6ns)
• Slow Speed CMOS SRAM • (64K to 1Mbit @ low power, 70ns) • (128K to 1Mbit @ 5V, 25 to 35ns) • (256K to 1Mbit @ super low power, 3V (70ns), 5V (55ns)
• NVRAM CMOS Flash Memory (512Kbit to 2Mbit)
• EEPROM (256Kbit to 1Mbit)
Microcontrollers • 4 or 8-bit ROMless (1Mbit to 2 Mbit RAM) • 4 or 8-bit MTPROM (32K to 256K MTPROM, with 1Mbit to 2Mbit RAM) • 4 or 8-bit MASROM (32Kbit to 256K MaskROM with 1Mbit to 2Mbit RAM)
5-90 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Winbond Electronics
Multimedia • MPEG-1 and MPEG-2 Audio Decoder, Video Decoder, A/V System Decoder • Video DACs (8-bit DAC-MOX with Genlock PLL)
PC ICs • PC Chipsets • Real time clocks • USB Doners • Serial and parallel port controller • CD-ROM Chipsets • Hardware Memory
Speech ICs • Voice Recorder Series (Reference Information Storage Devices) • Speech Synthesis ICs
Telephony ICs • Telephone Dialer ICs • D-TAD • Cordless • Pagers
In addition, Winbond offers monitor controller ICs and visual communication ICs (i.e. video conferencing, etc.).
Winbond had previously planned to enter the DRAM market during 1997, with a 16M part, but announced its decision to bypass development of 16M DRAMs and move directly to 64M DRAMs. Winbond licensed both 16M and 64M DRAM technology from Toshiba. DRAM production will be run in Winbond’s new Fab IV.
Currently, Winbond’s consumer products are manufactured using 0.8µm CMOS process technologies. The company’s SRAM products are fabricated with 0.4µm and 0.6µm CMOS processes. DRAM processes are currently using 0.25µm technology with plans to migrate to 0.18µm after 2000.
Semiconductor Fabrication Facilities
In October 1997, Winbond’s Fab III was shut down due to fire damage. The site will be used to build their new Fab V, to be in production by 3Q99. Meanwhile, construction continues on Fab IV, which will share production with Toshiba (see Key Agreements).
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-91 Winbond Electronics Rest of World Company Profiles
Winbond Electronics Corporation Winbond Electronics Corporation Science-Based Industrial Park Science-Based Industrial Park Number 4, Creation Road III Number 4, Creation Road III Hsinchu, Taiwan Hsinchu, Taiwan Fab I Fab II Cleanroom size: 11,680 square feet (Class 10) Cleanroom size: 35,000 square feet (Class 1) Capacity (wafers/week): 5,000 Capacity (wafers/week): 8,100 Wafer size: 125mm Wafer size: 150mm Process: CMOS Process: CMOS Products: Consumer, foundry services Products: SRAMs, NVRAM, consumer, computer, Feature sizes: 0.8µm foundry services. Feature sizes: 0.4µm-0.6µm
Winbond Electronics Corporation Winbond Electronics Corporation Number 4, Creation Road III Number 4, Creation Road III Science-Based Industrial Park Science-Based Industrial Park Hsinchu, Taiwan Hsinchu, Taiwan Fab IV (Startup in 1998) (Class 1) Fab IV B (Class 1) Capacity (wafers/week): 5,800 Capacity (wafers/week): 3,500 Wafer size: 200mm Wafer size: 200mm Process: CMOS Process: CMOS Products: Embedded DRAMs Products: DRAMs Feature sizes: 0.35µm, (0.25µm future) Feature sizes: 0.25µm, (0.18µm future). Production beginning 1999.
Key Agreements
• In July 1997, Winbond and Information Storage Devices, Inc. (ISD) announced a research and development alliance to produce flash-based memory products. The chipcorder technology and ISD will be the basis for new designs, allowing single chip voice recording capabilities without A/D or D/A conversion. Applications will include cellular phones, pagers, personal voice recorders, phone recorders, fax machines, printers and PCMCIA cards.
• In April 1997, Winbond announced the signing of a memorandum of understanding (MOU) with Asian Semiconductor Manufacturing Corporation (ASMC) to assist ASMC’s investment and preparatory team in establishing a new semiconductor foundry. ASMC’s main shareholder, China Development, invited Winbond to join the investment project to provide the necessary technical assistance to help establish ASMC semiconductor foundry in the shortest possible timeframe. Production is slated for the second half of 1998. Total fab investment will be about ten billion NT Dollars (approximately $355M). Two billion NT Dollars will be contributed by China Development, Winbond Electronics, and Syntek Design Technology.
• In 1997, Winbond made a 20 percent equity investment in Taiwanese start-up, Worldwide Semiconductor Manufacturing Co. (WSMC), valued at $73 million. As part of the agreement, Winbond will provide technology and funding for WSMC’s first wafer fab, a dedicated wafer foundry, in return for wafer capacity.
5-92 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of World Company Profiles Winbond Electronics
• In 1996, Winbond licensed Aspec Technology Inc.’s Open Design Implementation Technology (DIT). The license includes use of Aspec’s gate array architecture, the EDA design kit, and custom compilers for Winbond’s 0.5µm process. Winbond will use the DIT technology to produce PC chipsets, multimedia products, and HP PA/RISC-based microcontrollers.
• Winbond and Toshiba entered into an alliance in late 1995 for the manufacture and cooperative development of leading-edge semiconductor memory products. The agreement calls for Toshiba to provide Winbond with production technologies for 16M DRAMs and next generation 1M high-speed SRAMs. In addition, Toshiba will use Winbond as a foundry for a portion of its 16M and 64M DRAM capacity. Production will take place in Winbond’s new 200mm Fab IV, 0.35µm fab, which is under construction and will begin operations in 1998. Winbond will also market the DRAMs under its own logo.
• Winbond increased its ownership of Symphony Laboratories from 58 percent to 100 percent. Under the terms of the agreement, Symphony became a division of Winbond, changing its name to Winbond Systems Laboratory.
• Winbond acquired flash technology from Silicon Storage Technology and the two companies are developing low-voltage EPROM chips.
• Winbond licensed Hewlett-Packard's PA-RISC microprocessor technology and has the right to design, manufacture, and sell the chips for use in low-priced, high-volume products such as X-terminals, printers, and multimedia applications.
Noteworthy News
• In February 1998, the U.S. Department of Commerce issued a Final Schedule of SRAM company penalties against Taiwanese and Korean memory manufacturers. As part of the schedule, Winbond must pay duties of 102.88 percent.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-93 Worldwide Semiconductor Manufacturing Corp. Rest of the World Company Profiles
WORLDWIDE SEMICONDUCTOR MANUFACTURING CORPORATION
Worldwide Semiconductor Manufacturing Corporation 999 East Arques Avenue Hsinchu, Taiwan Telephone: (408) 822-0100 Fax: (408) 822-0199 Web Site: www.wsmc.com.tw
IC Manufacturer Founded: 1994
Ownership:Privately held; 20 percent Winbond; 34 percent China Development Corp., Hambrecht and Quist and other financial institutions; 27 percent Yue Loong Group, China Steel and other investors; 13 percent employees.
Company Overview and Strategy
Worldwide Semiconductor Manufacturing Corporation (WSMC) is an IC wafer foundry, formerly named Asian Semiconductor Manufacturing Corporation. This new company is in the process of erecting their first wafer fabrication facility in Hsin-Chu, Taiwan.
The Company will use Winbond’s 0.35-micron logic process that has been licensed in exchange for providing foundry work to Winbond. In addition to this agreement, WSMC and Winbond have agreed to codevelop a 0.25 micron process. WSMC also has established a relationship with Toshiba to produce Toshiba’s logic ICs, static RAM chips, and embedded-DRAM technology.
Management
Kuang-Yi Chiu President Lanny Ross Chief Executive Officer and Chairman Wayne Liang Vice President, Marketing
Semiconductor Fabrication Facilities
Worldwide Semiconductor Manufacturing Corporation is constructing a 0.35/0.25-micro fab in the Science-based Industrial Park that will produce its first silicon in July 1998, and to be in full production by the end of 1999. Expected wafer capacity will be approximately 25,000 wafers per month. The construction of the fab is to be completed in April or May 1998.
WSMC has aggressive plans to become a major competitor in the wafer foundry business. Future plans to build a second line of 20,000 8 inch wafers per month is scheduled for in 1999. A 12 inch wafer fab at a new science park in the southern Taiwan city of Tainanm, is also planned for 1999.
5-94 INTEGRATED CIRCUIT ENGINEERING CORPORATION Rest of the World Company Profiles Worldwide Semiconductor Manufacturing Corp.
Key Agreements
• Worldwide Semiconductor Manufacturing and Winbond made an agreement to have 150 Winbond employees to move permanently to WSMC in exchange for foundry services for Winbond. As part of the agreement, WSMC will repay Winbond for the technology and employee transfers after Worldwide’s own revenue stream is established. WSMC has licensed Winbond’s 0.35 micron logic process. Also under a separate agreement, the two companies will codevelop a 0.25 micron process.
• In December 1997, Worldwide Semiconductor Manufacturing purchased Promis Systems’ Manufacturing Execution (MES) and Automation Systems and associated services. Promis Systems develops and markets an integrated set of functionally-rich software products and services which help semiconductor and precision electronics manufacturers plan, monitor, automate and control production.
INTEGRATED CIRCUIT ENGINEERING CORPORATION 5-95