The Global Semiconductor Value Chain a Technology Primer for Policy Makers
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Quantum Imaging for Semiconductor Industry
Quantum Imaging for Semiconductor Industry Anna V. Paterova1,*, Hongzhi Yang1, Zi S. D. Toa1, Leonid A. Krivitsky1, ** 1Institute of Materials Research and Engineering, Agency for Science Technology and Research (A*STAR), 138634 Singapore *[email protected] **[email protected] Abstract Infrared (IR) imaging is one of the significant tools for the quality control measurements of fabricated samples. Standard IR imaging techniques use direct measurements, where light sources and detectors operate at IR range. Due to the limited choices of IR light sources or detectors, challenges in reaching specific IR wavelengths may arise. In our work, we perform indirect IR microscopy based on the quantum imaging technique. This method allows us to probe the sample with IR light, while the detection is shifted into the visible or near-IR range. Thus, we demonstrate IR quantum imaging of the silicon chips at different magnifications, wherein a sample is probed at 1550 nm wavelength, but the detection is performed at 810 nm. We also analyze the possible measurement conditions of the technique and estimate the time needed to perform quality control checks of samples. Infrared (IR) metrology plays a significant role in areas ranging from biological imaging1-5 to materials characterisation6 and microelectronics7. For example, the semiconductor industry utilizes IR radiation for non-destructive microscopy of silicon-based devices. However, IR optical components, such as synchrotrons8, quantum cascade lasers, and HgCdTe (also known as MCT) photodetectors, are expensive. Some of these components, in order to maximize the signal-to-noise ratio, may require cryogenic cooling, which further increases costs over the operational lifetime. -
Global Semiconductor Industry | Accenture
GLOBALITY AND COMPLEXITY of the Semiconductor Ecosystem The semiconductor industry is a truly global affair. Around the world, semiconductor chip designers use intellectual property (IP) licenses and design verification to provide designs to wafer fabricators, which use raw silicon, photomasks, and equipment to create chips for package manufacturing to assemble with printed circuit board (PCB) substrates for delivery to end customers. In fact, components for a chip could travel more than 25,000 miles by the time it finds its way into a television set, mobile phone, automobile, computer, or any of the millions of products that now rely on chips to operate (Figure 1). 2 | Globality and Complexity of the Semiconductor Ecosystem Figure 1: Components for a chip could travel more than 25,000 miles before completion IP Licenses Euipment Modules Package Raw Silicon Manufacturing PC Substrates Asembly Standard Products and Test components Wafer Fabrication Equipment Chip Design Design Verification Photomask Wafer Manufacturing Fabrication The Global Semiconductor Alliance (GSA) and Accenture have teamed up to conduct a joint study on the globality and complexity of the semiconductor ecosystem to explore the interdependencies and benefits of the cross-border partnerships required to produce semiconductors, as well as to illustrate what’s needed to keep this global ecosystem operating efficiently and profitably. Industry executives can use this study to inform their company strategies, as well as to educate non-semiconductor partners, including policy makers, on the nature of their business to promote a better understanding of the important role semiconductors play in everyday life and on the globe-spanning ecosystem that’s needed to produce them. -
ECTC 2021 Conference Program
WELCOME TO THE 71st ECTC FROM THE GENERAL CHAIR AND PROGRAM CHAIR On behalf of the Program Committee and Executive ECTC will also feature a record twelve special sessions with Committee, it is our pleasure to welcome you to the 71st invited industry experts covering several important and Electronic Components and Technology Conference (ECTC), emerging topic areas. Rozalia Beica and Ed Sperling will chair which will be held virtually on a digital platform from June 1 a special session covering “Market Trends and Geopolitical until July 4, 2021. This premier international conference brings and Economic Outlook” addressing market trends in the together key stakeholders of the global microelectronics semiconductor industry, emerging applications, economic and packaging industry, such as semiconductor companies, foundry geopolitical uncertainties, and impact on the global supply chain and OSAT service providers, equipment manufacturers, in microelectronics packaging. The ECTC Panel Session will be materials suppliers, research institutions and universities all chaired by IEEE EPS President Christopher Bailey and IEEE EPS under one roof. Vice President of Conferences Sam Karikalan. This panel session The virtual platform will allow for recorded presentations of all will hear from several leading companies who will discuss their technical session talks to be available on-demand throughout future vision for advanced electronics packaging. the conference. During the last two weeks of the conference, We are continuing our tradition and bringing back the a live teleconferencing meeting for each session will be held networking events focused on young professionals and diversity. by the session chairs; all the presenters of the session will be Yan Liu and Adeel Bajwa will chair the Young Professionals available live to field questions from the attendees. -
Amd Filed: February 24, 2009 (Period: December 27, 2008)
FORM 10-K ADVANCED MICRO DEVICES INC - amd Filed: February 24, 2009 (period: December 27, 2008) Annual report which provides a comprehensive overview of the company for the past year Table of Contents 10-K - FORM 10-K PART I ITEM 1. 1 PART I ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF EQUITY SECURITIES ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURE ABOUT MARKET RISK ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS, EXECUTIVE OFFICERS AND CORPORATE GOVERNANCE ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATTERS ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS AND DIRECTOR INDEPENDENCE ITEM 14. PRINCIPAL ACCOUNTANT FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EX-10.5(A) (OUTSIDE DIRECTOR EQUITY COMPENSATION POLICY) EX-10.19 (SEPARATION AGREEMENT AND GENERAL RELEASE) EX-21 (LIST OF AMD SUBSIDIARIES) EX-23.A (CONSENT OF ERNST YOUNG LLP - ADVANCED MICRO DEVICES) EX-23.B -
EEMBC and the Purposes of Embedded Processor Benchmarking Markus Levy, President
EEMBC and the Purposes of Embedded Processor Benchmarking Markus Levy, President ISPASS 2005 Certified Performance Analysis for Embedded Systems Designers EEMBC: A Historical Perspective • Began as an EDN Magazine project in April 1997 • Replace Dhrystone • Have meaningful measure for explaining processor behavior • Developed business model • Invited worldwide processor vendors • A consortium was born 1 EEMBC Membership • Board Member • Membership Dues: $30,000 (1st year); $16,000 (subsequent years) • Access and Participation on ALL Subcommittees • Full Voting Rights • Subcommittee Member • Membership Dues Are Subcommittee Specific • Access to Specific Benchmarks • Technical Involvement Within Subcommittee • Help Determine Next Generation Benchmarks • Special Academic Membership EEMBC Philosophy: Standardized Benchmarks and Certified Scores • Member derived benchmarks • Determine the standard, the process, and the benchmarks • Open to industry feedback • Ensures all processor/compiler vendors are running the same tests • Certification process ensures credibility • All benchmark scores officially validated before publication • The entire benchmark environment must be disclosed 2 Embedded Industry: Represented by Very Diverse Applications • Networking • Storage, low- and high-end routers, switches • Consumer • Games, set top boxes, car navigation, smartcards • Wireless • Cellular, routers • Office Automation • Printers, copiers, imaging • Automotive • Engine control, Telematics Traditional Division of Embedded Applications Low High Power -
Advanced Packaging Solutions
Advanced Packaging Solutions Highlights Providing silicon-scaling • Advanced packaging capabilities in solutions for tomorrow’s applications 2.5D, 3D, WLP and Silicon Photonics GLOBALFOUNDRIES post-fab services provide complementary and extended • Power, performance, cost and solutions with complete supply chain management including bump, probe, form-factor optimized solutions packaging and final test. The flexible supply chain model is tailored to your • Industry leader in smart interposers needs with services ranging from bump and probe only to a more comprehen- sive spectrum of services including package design, assembly and test. • In-house bump and wafer probe capabilities In addition to in-house bump and probe capabilities, we provide packaging • Advanced memory integration services in collaboration with a network of established OSAT partners, includ- with stacked memories ing 2D packages as well as 2.5D and 3D advanced package technologies. Test development and capabilities include RF, analog, embedded memory, • Ownership and process maturity for HVM and mmWave applications, with wide array of tester platforms for wafer sort operations. • Advanced silicon node CPI and qualification Packaging Requirements • RF system-in-package and Package types are selected based on performance requirements and optimized mmWave packaging capability for market segments including IoT, RF, Automotive, Mobile, High-end • Partnerships and strong relationships Computing, Networking and Storage. with leading-edge OSATs • Flexible supply chain and Mobile IoT RF Automotive Computing Networking Storage collaborative business models QFN FBGA WLCSP FOWLP SiP fcCSP FCBGA 2.5D 3D Si-PH Advanced Packaging Solutions Packaging Technologies TSV Si Interposer Availability GF Si nodes are qualified in a wide range of package Full Reticle 26x33mm2 technologies including 2D wirebond designs, flip Stitched Interposer >1300 mm2 chip, WLCSP and FOWLP configurations, as well 10:1 Aspect Ratio TSV 10um Dia./ 100um Depth as 2.5D, 3D and Si-Photonics. -
MIT Media Laboratory Sponsors
MIT Media Laboratory Sponsors CORPORATE RESEARCH CONSORTIA RESEARCH CONSORTIA SPECIAL INTEREST GROUPS RESEARCH AND JOINT PROGRAMS AND JOINT PROGRAMS (cont.) Counter Intelligence PARTNERS Campbell Soup Company The LEGO Group Center for Bits and Atoms NEXT Motorola, Inc. The LEGO Group Chilin Optronics* RESEARCH CONTRACTS Samsung Electronics Microsoft Corporation Chungwa Telecom Co., Ltd. AND SPECIAL FUNDS Co., Ltd. Mitsubishi Electric Research HCG (Hocheng Corporation)* Business Design Laboratory Telmex Laboratories* Hiwin Technologies Corp.* Carnegie Corporation Motorola, Inc. Industrial Technology Research CIRCLE CONSORTIA Samsung Electronics Co., Ltd. Institute Alex and Brit d’Arbeloff Fund RESEARCH Schneider Automation Inc. Sanyang Industry Disabled American Veterans Charitable SPONSORS Sun Microsystems VIA Technologies, Inc.* Service Trust BT Telmex Yang, Chang & Newworkshop Co.* Exploratorium/NSF Canon, Inc. Hewlett-Packard Company Hitachi, Ltd. Communications Futures SIMPLICITY Knight Foundation Industrial Technology Program Cleanup Corporation The MITRE Corporation Research Institute BT Johnson & Johnson Services, Inc. National Science Foundation LG Electronics, Inc. Cisco Systems, Inc. The LEGO Group NTT Comware Ricoh Co., Ltd. Comcast Motorola, Inc. Office of Naval Research Toshiba Corporation Deutsche Telekom Samsung Electronics Co., Ltd. University of Memphis/NSF Toyota Motor France Telecom/Orange Telmex University of North Carolina/USAF Corporation Intel Time Inc. Production University of Wisconsin/USAF The LEGO Group Toshiba Corporation US Air Force Motorola, Inc. US Department of Homeland Security US Army Nokia Corporation US Defense Advanced Research Projects Nortel Things That Think Agency Samsung Electronics Co., Ltd. Alps Electric Co., Ltd. US Department of Veterans Affairs Telecom Italia Brother Industries, Ltd.* US Navy Telmex BT Canon, Inc. ENDOWMENT AND NAMING GRANTS Consumer Electronics Lab Cleanup Corporation Rudge and Nancy Allen AMD Fujitsu Laboratories Ltd. -
(NASDAQ: ASML) Recommendation: Long I Current Stock Price
ASML Holding NV (NASDAQ: ASML) Recommendation: Long I Current stock price: $651 I 5-year target price: $245 / $1,039 / $1,371 (Bear / Base / Bull) All financial and valuation information is presented in Euro Shradha Mani I sm4843 I [email protected] I April 22, 2021 ASML is a market leader (almost a monopoly) in lithography equipment, an advanced, precision technology which is essential to the manufacture of semiconductor chips. In turn, semiconductors power our phones, computers, automobiles and are basically the foundation of technology as we know it today. Thus, the semiconductor industry (customers of ASML) is poised for strong secular growth. “We provide our customers with everything they need – hardware, software and services – to mass produce patterns on silicon, allowing them to increase the value and lower the cost of a chip.” ASML’s essential position in the semiconductor ecosystem, and its product lines are described below1: . Lithography systems that print the tiny features that form the basis of a microchip with precision. These systems can be new or refurbished. o Extreme Ultraviolet Lithography Systems o Deep Ultraviolet Lithography Systems . Metrology and Inspection Systems measure the quality of patterns on chips and help locate and analyze chip defects . Computational Lithography algorithms optimize the manufacturing process to minimize defects . Customer Support and Service What does ASML do i.e. how does it earn revenue and who are the company’s customers ? Revenue disaggregation 2018 2019 2020 Extreme UV lithography -
Product Engineer Program Apply Now the Product/Test Engineers at Texas Instruments Are Powered by a Passion for Continual Improvement
Product Engineer Program Apply Now The Product/Test Engineers at Texas Instruments are powered by a passion for continual improvement. Our solutions make a real difference, and yours will, too. We make the semiconductor product design process easier and faster, which helps our customers succeed in today's fast-paced marketplace. Opportunities are available in North America and Asia. About the job In this role, you will work on the development and implementation of strategies that achieve profitability targets on assigned TI product lines through a variety of new product development, cost reduction, capacity expansion and yield enhancement projects. You will serve as the primary point of contact for all operational aspects related to your assigned product portfolio, resolve customer quality and application issues, and facilitate cross- functional teams for problem solving. You will also take a leadership role to establish relationships with key contacts in TI wafer fabrication and assembly manufacturing sites to ensure strong communication and effective problem solving. About the program In this empowering, two-year rotation program, you will be on an accelerated development track that’s focused on the product development cycle. As a program participant, you will rotate through four six-month assignments centered on improving product efficiency and quality, which contributes directly to the company’s bottom line. Here, you will have the opportunity to establish solid customer relationships and make deep and meaningful connections. You will also have the chance to be mentored and develop strong collaboration skills through cross-functional group interaction and international travel. Program participants begin with a two-week orientation. -
Imagination Technologies Group Plc Annual Report 2006
Imagination Technologies Group plc Annual Report 2006 The data and projections shown on pages 1-24 are the product of consolidated partner data, analyst information and Imagination Technologies research. Imagination Technologies, the Imagination Technologies logo, PowerVR, the PowerVR logo, Metagence, the Metagence logo, Ensigma, the Ensigma logo, PURE Digital, IMGworks, CodeScape, META, MTX, MBX, MBX Lite, SGX, UCC, MiniEngine, PocketDAB, ReVu, the Bug, the Bug logo, Legato, EVOKE-1, TEMPUS, CHRONOS, OASIS, PURE ONE, SONUS-1XT and Élan are trademarks or registered trademarks of Imagination Technologies Limited. All other logos, products, trademarks and registered trademarks are the property of their respective owners. Copyright © 2006 Imagination Technologies Limited, an Imagination Technologies Group plc company. 4 colour print + matt lamination on 1 side, 215x280mm (h) trim size with 4mm spin, 300gsm board fold, gather and perfect bind 19/06/2006 Contact Oscar Tse / IMG Publications / 01923 260511 / [email protected] Introduction Improvements in technology mean that more and more functions can be integrated onto just one silicon chip. Whilst in the past, half a dozen companies might each have made a specialised chip to go into an advanced product like a TV or mobile phone, now it is more likely that one large semiconductor company will make a single chip that contains most, if not all, of that specialised knowledge. That’s where silicon IP, or ‘intellectual property’ comes in. Semiconductor companies can licence parts of a chip design from companies that specialise in those advanced technologies, instead of developing the technology themselves. They are especially likely to do this in new market areas. -
A Report on Semiconductor Foundry Access by US Academics (Discussion Held at a Meeting Virtually Held at the National Science Foundation on Dec 16, 2020)
A Report on Semiconductor Foundry Access by US Academics (Discussion held at a meeting virtually held at the National Science Foundation on Dec 16, 2020) Organizers: Sankar Basu1, Erik Brunvand2, Subhasish Mitra3, H.-S. Philip Wong4 Scribes: Sayeef Salahuddin5, Shimeng Yu6 1 NSF, [email protected] 2 NSF, [email protected] 3 Stanford University, [email protected] 4 Stanford University, [email protected] 5 University of California, Berkeley, [email protected] 6 Georgia Institute of Technology, [email protected] 2 Executive Summary Semiconductor technology and microelectronics7 is a foundational technology that without its continued advancement, the promises of artificial intelligence (AI), 5G/6G communication, and quantum computing will never be realized in practice. Our nation’s economic competitiveness, technology leadership, and national security, depend on our staying at the forefront of microelectronics. We must accelerate the pace of innovation and broaden the pool of researchers who possess research capability in circuit design and device technologies, and provide a pathway to translate these innovations to industry. This meeting has brought to the fore the urgent need for access to semiconductor foundry and design ecosystem to achieve these goals. Microelectronics is a field that requires sustained and rapid innovations, especially as the historical rate of progress following a predictable path, is no longer guaranteed as it had been in the past. Yet, there are many plausible paths to move forward, and the potential for further advances is immense. There is a future in system integration of heterogeneous technologies that requires end-to-end co-design and innovation. Isolated push along silos, such as miniaturization of components, will be inadequate. -
Lam Research Corporate Social Responsibility Report for 2015 Lam Research | Corporate Social Responsibility Report for 2015
Lam Research Corporate Social Responsibility Report for 2015 Lam Research | Corporate Social Responsibility Report for 2015 Further information on the material topics prioritized in this About This Report report are found in the Company Overview section. Lam Research Corporation (Lam Research, Lam, or the company) has developed this Corporate Social Boundaries Responsibility (CSR) Report to provide an overview of the company’s facilities and operations relating to Data reported in this document are for Lam Research. This environmental, social, and economic performance. This information covers subsidiaries, except for a few places report covers calendar year 2015. where we are still harmonizing our global systems to incorporate all of our data worldwide. Other exceptions and limitations are noted throughout the report. Content Our report is informed by the Global Reporting Initiative Company Data (GRI) G4 Guidelines, which provide a globally relevant framework for a standardized approach to reporting Lam Research is headquartered in Fremont, California, environmental, social, and economic performance. We and maintains a network of facilities throughout Asia, have included a GRI G4 Guideline Index to show our Europe, and the United States to meet the needs of our alignment with GRI reporting elements and to document global customer base. Our research and development our progress at integrating sustainability into our business. (R&D) facilities are located in Fremont and San Jose, As we continue to refine our reporting process, we are California; Tualatin, Oregon; and Villach, Austria. We have working to further align our report with the GRI framework. manufacturing facilities in the U.S. (California and Oregon), Austria, and Korea.