VIA Apollo KT333 Chipset White Paper
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2004 Gamers' Hardware Upgrade Guide
Ace’s Hardware 2004 Gamers’ Hardware Upgrade Guide 2004 Gamers’ Hardware Upgrade Guide By Johan De Gelas – January 2004 Introduction Last week, we showed you a preview of the Athlon 64 3400+. Today, we'll investigate this new CPU as an upgrade to an existing system. How much performance do you gain when upgrading? What about the other features aside from performance, such as Cool'n'Quiet and more thermal and mechanical safety? As always, we start with a base system to be upgraded. This time around, our base system is equipped with an Athlon XP 2100+, as previous polls among our readers show that the faster versions of the Athlon XP "Palomino" were very popular in the early days of 2003. Now in 2004, Palomino is getting a little long in the tooth, so it's interesting to know whether or not an upgrade may be worthwhile. Our old system also contains a GeForce Ti 4200 and 512 MB of DDR266 (PC2100) memory. We will upgrade the CPU (to the Athlon 4 3400+) and memory (to DDR400 CAS 2) and compare that upgrade with one that simply upgrades the video card. As mentioned previously, we've done this before in many of our Gamer's Upgrade Guides. However, the gaming industry is not sitting still, and we are moving from hybrid DirectX 7/8 games to DirectX 8/9 games, which - as you will see - behave quite differently. The games you'll see tested in detail today are Halo 1.03, Return to Castle Wolfenstein: Enemy Territory, and X²- The Threat. -
MIT Media Laboratory Sponsors
MIT Media Laboratory Sponsors CORPORATE RESEARCH CONSORTIA RESEARCH CONSORTIA SPECIAL INTEREST GROUPS RESEARCH AND JOINT PROGRAMS AND JOINT PROGRAMS (cont.) Counter Intelligence PARTNERS Campbell Soup Company The LEGO Group Center for Bits and Atoms NEXT Motorola, Inc. The LEGO Group Chilin Optronics* RESEARCH CONTRACTS Samsung Electronics Microsoft Corporation Chungwa Telecom Co., Ltd. AND SPECIAL FUNDS Co., Ltd. Mitsubishi Electric Research HCG (Hocheng Corporation)* Business Design Laboratory Telmex Laboratories* Hiwin Technologies Corp.* Carnegie Corporation Motorola, Inc. Industrial Technology Research CIRCLE CONSORTIA Samsung Electronics Co., Ltd. Institute Alex and Brit d’Arbeloff Fund RESEARCH Schneider Automation Inc. Sanyang Industry Disabled American Veterans Charitable SPONSORS Sun Microsystems VIA Technologies, Inc.* Service Trust BT Telmex Yang, Chang & Newworkshop Co.* Exploratorium/NSF Canon, Inc. Hewlett-Packard Company Hitachi, Ltd. Communications Futures SIMPLICITY Knight Foundation Industrial Technology Program Cleanup Corporation The MITRE Corporation Research Institute BT Johnson & Johnson Services, Inc. National Science Foundation LG Electronics, Inc. Cisco Systems, Inc. The LEGO Group NTT Comware Ricoh Co., Ltd. Comcast Motorola, Inc. Office of Naval Research Toshiba Corporation Deutsche Telekom Samsung Electronics Co., Ltd. University of Memphis/NSF Toyota Motor France Telecom/Orange Telmex University of North Carolina/USAF Corporation Intel Time Inc. Production University of Wisconsin/USAF The LEGO Group Toshiba Corporation US Air Force Motorola, Inc. US Department of Homeland Security US Army Nokia Corporation US Defense Advanced Research Projects Nortel Things That Think Agency Samsung Electronics Co., Ltd. Alps Electric Co., Ltd. US Department of Veterans Affairs Telecom Italia Brother Industries, Ltd.* US Navy Telmex BT Canon, Inc. ENDOWMENT AND NAMING GRANTS Consumer Electronics Lab Cleanup Corporation Rudge and Nancy Allen AMD Fujitsu Laboratories Ltd. -
User Manual ARK-1360
User Manual ARK-1360 Box IPC Attention! This package contains a hard-copy user manual in Chinese for China CCC certification purposes, and there is an English user manual included as a PDF file on the CD. Please disregard the Chinese hard copy user manual if the product is not to be sold and/or installed in China. Copyright The documentation and the software included with this product are copyrighted 2009 by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right to make improvements in the products described in this manual at any time without notice. No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written permission of Advantech Co., Ltd. Information provided in this manual is intended to be accurate and reliable. How- ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe- ments of the rights of third parties, which may result from its use. Acknowledgements Award is a trademark of Award Software International, Inc. VIA is a trademark of VIA Technologies, Inc. IBM, PC/AT, PS/2 and VGA are trademarks of International Business Machines Cor- poration. Intel® and Pentium® are trademarks of Intel Corporation. Microsoft Windows® is a registered trademark of Microsoft Corp. RTL is a trademark of Realtek Semi-Conductor Co., Ltd. ESS is a trademark of ESS Technology, Inc. UMC is a trademark of United Microelectronics Corporation. SMI is a trademark of Silicon Motion, Inc. Creative is a trademark of Creative Technology LTD. -
Thermal and Electrical Specification of AMD Semprontm Processors
Thermal and Electrical Specification of AMD SempronTM Processors Thermal and Electrical Specification of AMD SempronTM Processors 27 September 2004 Page 1/5 Thermal and Electrical Specification of AMD SempronTM Processors ©2004 Advanced Micro Devices Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products and are for information purposes only. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppels or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN OR FOR THE PERFORMANCE OR OPERATION OF ANY PERSON’S SYSTEM, INCLUDING, WITHOUT LIMITATION, ANY LOST PROFITS, BUSINESS INTERRUPTION, DAMAGE TO OR DESTRUCTION OF PROPERTY, OR LOSS OF PROGRAMS OR OTHER DATA, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. -
In the United States District Court for the District of Delaware
Case 1:11-cv-00857-JBS-KW Document 5 Filed 10/11/11 Page 1 of 15 PageID #: 65 IN THE UNITED STATES DISTRICT COURT FOR THE DISTRICT OF DELAWARE VIA TECHNOLOGIES, INC., a Taiwan corporation, IP-FIRST, LLC, a Delaware corporation, and CENTAUR TECHNOLOGY, INC., a California corporation, Plaintiffs, C.A. No.: 11-857-JBS-KW v. DEMAND FOR JURY TRIAL APPLE INC., a California Corporation, Defendant. FIRST AMENDED COMPLAINT FOR PATENT INFRINGEMENT Plaintiffs, VIA Technologies, Inc. (“VIA”), IP-First, LLC (“IP-First”), and Centaur Technology, Inc. (“Centaur”) (collectively, “Plaintiffs”) for their First Amended Complaint against Defendant, Apple Inc. (“Apple”), hereby allege as follows: Nature of the Action 1. This is a civil action arising under the laws of the United States relating to patents and the protection of patent rights, e.g., 35 U.S.C. § 271 et seq., alleging infringement by Apple of five U.S. Patents owned by Plaintiffs, specifically, U.S. Patent Nos. 6,253,311, 6,253,312, 6,754,810, 7,155,598, and 7,185,180. Parties 2. VIA is a corporation organized and existing under the laws of Taiwan, R.O.C., with its principal place of business at VIA Technologies, Inc., Taipei Headquarters, 1F, 535, Zhongzheng Rd., Xindian District, New Taipei City 231, Taiwan. VIA is a fabless supplier of power-efficient x86 processor platforms used in the PC, client, ultra-mobile, and embedded Case 1:11-cv-00857-JBS-KW Document 5 Filed 10/11/11 Page 2 of 15 PageID #: 66 markets that engages, among other things, in the design, research, development, manufacture, and distribution of semiconductor microprocessors and chipsets. -
Top 300 Organizations Granted U.S. Patents in 2013
Top 300 Organizations Granted U.S. Patents in 2013 Are more patents better? IPO does not attempt to answer the question above. IPO publishes patent owner lists as an information service for IPO members. This list of organizations that received the most U.S. utility patents is being published by IPO for the 31st consecutive year. It is based on data obtained from the U.S. Patent & Trademark Office. Patents granted to parent and subsidiary companies are combined in many instances. See the end notes for more information. IPO makes reasonable efforts to avoid errors, but cannot guarantee accuracy. June 6, 2014 2013 Patent Owners Numerical Listing Use care in interpreting the “percent change from 2012” column. The total number of patents granted by the USPTO in 2013 was 277,835, up 9.7 percent from 2012. The percent change for an individual organization could be affected by mergers, acquisitions, divestitures, inconsistent treatment of subsidiaries in 2012 and 2013, and many other factors. Percent Percent 2013 Change 2013 Change Rank Organization Patents From 2012 Rank Organization Patents From 2012 1 International Business Machines 6,788 5.1 39 Hong Fu Jin Precision Industry 922 17.9 Corp. (Shenzhen) Co., Ltd. 2 Samsung Electronics Co., Ltd. 4,652 -7.8 40 Cisco Technology, Inc. 910 -7.2 3 Canon K.K. 3,918 18.5 41 Boston Scientific Corp. 904 10.1 4 Sony Corp. 3,316 -8.1 42 Medtronic Inc. 893 4.6 5 LG Electronics Inc. 3,117 16.2 43 Robert Bosch GmbH 884 19.0 6 Microsoft Corp. -
Communication Theory II
Microprocessor (COM 9323) Lecture 2: Review on Intel Family Ahmed Elnakib, PhD Assistant Professor, Mansoura University, Egypt Feb 17th, 2016 1 Text Book/References Textbook: 1. The Intel Microprocessors, Architecture, Programming and Interfacing, 8th edition, Barry B. Brey, Prentice Hall, 2009 2. Assembly Language for x86 processors, 6th edition, K. R. Irvine, Prentice Hall, 2011 References: 1. Computer Architecture: A Quantitative Approach, 5th edition, J. Hennessy, D. Patterson, Elsevier, 2012. 2. The 80x86 Family, Design, Programming and Interfacing, 3rd edition, Prentice Hall, 2002 3. The 80x86 IBM PC and Compatible Computers, Assembly Language, Design, and Interfacing, 4th edition, M.A. Mazidi and J.G. Mazidi, Prentice Hall, 2003 2 Lecture Objectives 1. Provide an overview of the various 80X86 and Pentium family members 2. Define the contents of the memory system in the personal computer 3. Convert between binary, decimal, and hexadecimal numbers 4. Differentiate and represent numeric and alphabetic information as integers, floating-point, BCD, and ASCII data 5. Understand basic computer terminology (bit, byte, data, real memory system, protected mode memory system, Windows, DOS, I/O) 3 Brief History of the Computers o1946 The first generation of Computer ENIAC (Electrical and Numerical Integrator and Calculator) was started to be used based on the vacuum tube technology, University of Pennsylvania o1970s entire CPU was put in a single chip. (1971 the first microprocessor of Intel 4004 (4-bit data bus and 2300 transistors and 45 instructions) 4 Brief History of the Computers (cont’d) oLate 1970s Intel 8080/85 appeared with 8-bit data bus and 16-bit address bus and used from traffic light controllers to homemade computers (8085: 246 instruction set, RISC*) o1981 First PC was introduced by IBM with Intel 8088 (CISC**: over 20,000 instructions) microprocessor oMotorola emerged with 6800. -
VIA Technologies, Inc. and Subsidiaries
VIA Technologies, Inc. and Subsidiaries Consolidated Financial Statements for the Years Ended December 31, 2018 and 2017 and Independent Auditors’ Report INDEPENDENT AUDITORS’ REPORT The Board of Directors and Shareholders VIA Technologies, Inc. Opinion We have audited the accompanying consolidated financial statements of VIA Technologies, Inc. and its subsidiaries (collectively referred to as the “Company”), which comprise the consolidated balance sheets as of December 31, 2018 and 2017, and the consolidated statements of comprehensive income, changes in equity and cash flows for the years then ended, and the notes to the consolidated financial statements, including a summary of significant accounting policies (collectively referred to as the “consolidated financial statements”). In our opinion, the accompanying consolidated financial statements present fairly, in all material respects, the consolidated financial position of the Company as of December 31, 2018 and 2017, and their consolidated financial performance and its consolidated cash flows for the years then ended in accordance with the Regulations Governing the Preparation of Financial Reports by Securities Issuers, International Financial Reporting Standards (IFRS), International Accounting Standards (IAS), IFRIC Interpretations (IFRIC), and SIC Interpretations (SIC) endorsed and issued into effect by the Financial Supervisory Commission of the Republic of China. Basis for Opinion We conducted our audits in accordance with the Regulations Governing Auditing and Attestation of Financial Statements by Certified Public Accountants and auditing standards generally accepted in the Republic of China. Our responsibilities under those standards are further described in the Auditors’ Responsibilities for the Audit of the Consolidated Financial Statements section of our report. We are independent of the Company in accordance with The Norm of Professional Ethics for Certified Public Accountant of the Republic of China, and we have fulfilled our other ethical responsibilities in accordance with these requirements. -
USB 3.0 Adopters.Pdf
Adopting Party Name 3eYamaichi Electronics Co., Ltd. Aces Electronics Co., Ltd. ACES Electronics Co., Ltd. Action Star Enterprise Co., Ltd. Advanced‐Connectek Inc., Acon Agilent Technologies Inc. ALLTOP TECHNOLOGY CO., LTD. Amco Tec International Inc. American Megatrends, Inc. Amphenol Assemble Tech (Xiamen) Co., Ltd. Amphenol ShouhMin Industry (Shenzhen) Co., Ltd. Argosy Research Inc. Astron International Corp. Basler AG Bose Corporation Buffalo Inc. Buffalo Kokuyo Supply Inc. Cambridge Silicon Radio Limited Canon Inc. Chant Sincere Co., Ltd. Cheng Uei Precision Industry Co., Ltd. Chicony Electronics Co., Ltd. Chief Land Electronic Co., Ltd. China Electronics Technology Limited Chrontel, Inc. Circuit Assembly Corp. CNPLUS Co., Ltd. Compupack Technology Co. Ltd. Connect County Holdings Berhad DataFab Systems Inc. Digital Design Corporation Digital Information Technology Studies (ShenZhen) Ltd. DisplayLink (UK) Ltd DongGuan HYX Industrial Co., Ltd. Dongguan Kechenda Electronics Technology Co., Ltd. Dongguan Teconn Electronics Technology Co., Ltd. Dongguan Yuqin Electronics Co., Ltd. EchoStar Technologies, LLC Elektrobit, Inc. FCI USA LLC Foosung Tech Foxconn Interconnect Technology, Ltd ("FIT LTD") Freeport Resources Enterprises Corp. Fujitsu Limited Full in Hope Co., Ltd. Global Connector Technology Ltd. (GCT) Global Unichip Corp. Goodway Technology Co., Ltd. Harris Corporation Hewlett Packard High‐Top Precision Electronic Co., Ltd. Hirose Electric Co., Ltd. Hosiden Corporation Hsi Chin Electronics Co., Ltd. IBM Corporation ICT‐Lanto Limited I‐PEX USA LLC Integral Memory PLC Intel Corporation Japan Aviation Electronics Industry, Limited Jmicron Technology Corporation Jo‐Dan International Joinsoon Electronic Mfg. Co., Ltd. JPC/Main Super Inc J.S.T. Mfg. Co., Ltd. JVC KENWOOD Holdings, Inc. Kawasaki Microelectronics, Inc. Kycon, Inc. KYOCERA MITA Corporation Lenjoy Technology Limited Littelfuse Inc. -
Motherboard Basics
MOTHERBOARD BASICS A recent Tech Tip covered the basics of selecting a computer caseand made mention of the various sizes that correspond to motherboards of different form factors. A few people wrote in expressing interest in understanding more about the basics of motherboards, and that’s exactly what this Tech Tip intends to address. A motherboard, also known as a main board, is the primary circuit board inside of a computer, and is where the central processing unit (CPU), memory, expansion slots, drives, and other peripheral devices are connected. The circuitry on a motherboard facilitates the communication between all of the devices in the computer, making them as critical to a system’s performance as items such as the CPU or memory. The core circuitry of a motherboard is referred to as its chipset, and generally the manufacturer of the motherboard is not the manufacturer of the chipset. Intel does produce motherboards with their own chipsets, but buying a motherboard brand such as Gigabyte, Biostar, and ASUS means getting a board with either a VIA, Nvidia, SIS, or Intel brand chipset. 1. Form Factor The different basic shapes and sizes of motherboards are categorized as form factors. There are several standard form factors available, but some of the more common ones found in desktop computers include: (http://www.formfactors.org/developer/specs/atx2_2.pdf), ATX (http://www.formfactors.org/developer/specs/matxspe1.2.pdf), Micro ATX (mATX) (http://www.formfactors.org/developer/specs/FlexATXaddn1_0.pdf) FlexATX (http://www.via.com.tw/en/initiatives/spearhead/mini-itx/) and Mini-ITX The basic sizes of each are as follows: ATX: 12" x 9.6" (305mm x 244mm) Micro ATX: 9.6" x 9.6" (244mm x 244mm) FlexATX: 9.0" x 7.5" (229mm x 191mm) Mini ITX: 6.7" x 6.7" (170mm x 170mm) ATX and mATX are by far the most popular motherboard sizes for desktop computers, and as seen in the list above, are also some of the largest. -
A Brief Introduction to Tsmc
TSMC commits itself to providing its customers with the best quality and most comprehensive services. LETTER TO SHAREHOLDERS Dear Shareholders, Year 2004 was a banner year for TSMC. We again set new records for revenues and earnings, while continuing to lead the semiconductor dedicated foundry sector. Our production accounted for more than 7% of the total value of the world's semi- conductor output. TSMC's performance was anchored in our "Trinity of Strength": strength in technology development and deployment, strength in manufacturing capacity and efficiency, and strength in building customer partnerships. For example: ● TSMC cumulatively shipped over one million wafers (8-inch equivalent) in 0.13-micron technology. SM ● TSMC's Nexsys 90nm, the world's first 12-inch, low-k, 90-nanometer process to reach full production, was adopted in more than 30 customer products after one year's ramp, and achieved product yields ahead of internal goals. ● TSMC served more than 300 customers and produced more than 5,000 products in our fabs. With its core manufacturing and logistics competencies, TSMC's experience in integrating front-end design and back-end turn- key services has helped customers resolve many daunting challenges in advanced chips designed with our 90nm technology. We collaborate closely with customers, enabling them to deliver their products on time and to achieve success in their end markets. Financial Strength and Results TSMC broke new records in both revenues and net income in 2004. Revenue reached NT$255.9 billion, an increase of 26.8% compared with the previous record set in 2003. Net income was NT$92.32 billion, an increase of 95.3% compared with 2003 results, while fully diluted earnings per share were NT$3.97 (US$0.59 per ADS unit), an increase of 96.8 %. -
5 Microprocessors
Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 5 Microprocessors “MEGAHERTZ: This is a really, really big hertz.” —DAVE BARRY In this chapter, you will learn or all practical purposes, the terms microprocessor and central processing how to Funit (CPU) mean the same thing: it’s that big chip inside your computer ■ Identify the core components of a that many people often describe as the brain of the system. You know that CPU CPU makers name their microprocessors in a fashion similar to the automobile ■ Describe the relationship of CPUs and memory industry: CPU names get a make and a model, such as Intel Core i7 or AMD ■ Explain the varieties of modern Phenom II X4. But what’s happening inside the CPU to make it able to do the CPUs amazing things asked of it every time you step up to the keyboard? ■ Install and upgrade CPUs 124 P:\010Comp\BaseTech\380-8\ch05.vp Friday, December 18, 2009 4:59:24 PM Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 Historical/Conceptual ■ CPU Core Components Although the computer might seem to act quite intelligently, comparing the CPU to a human brain hugely overstates its capabilities. A CPU functions more like a very powerful calculator than like a brain—but, oh, what a cal- culator! Today’s CPUs add, subtract, multiply, divide, and move billions of numbers per second.