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Computer on Modules Magazine English ISBN 3-8259-1944-7 19,80 % German Computer-On-ModulesComputer-On-Modules Computer-On-Modules With high scalability and Value-Add Service Computer-On-Modules for your customized solution Basics COMs for your high scalability ETXexpress® / COM Express up to Intel Multi-Core processor microETXexpressTM for your mobile applications ETX® 3.0 – Your ETX Long Term Support E²Brain – Technology and Applications Smart Battery Module MARS – Requirements for mobile applications Intel Multi-Core in Embedded Systems A look at the future of COMs Hands-On Company Profi les for your Computer-On-Modules customised COM solution & A VOGEL and Kontron Special for professionals in collaboration with: Intel, b-plus, datakamp System, FORTEC Elektronik, HY-LINE Computer Components, ies Industrie-Elektronik Schmitz, Ineltro, next System, Ultratronik, VDC, PRAXIS PROFILINE Venco Electronica S. A. PRAXIS PROFILINE Into the future with Computer-On-Modules The standardized Computer-On-Modules DIMM-PC, X-board, E2Brain, ETX, microETXexpress and ETXex- press/COM Express, provide the standard functionality you need, while the custom features demanded by your application are integrated into the baseboard design. This separation allows for a high degree of flexibility in the mechanics of the base-board since it is a custom made part, but offers you the flexibility to switch boards within the module family. Total design time for the baseboard is very short compared to a full custom design cycle. This keeps the costs down and ensures a short time-to-market. Products based on embedded modules are highly scalable and have longer lifecycles than the alternatives. A VOGEL and Kontron publication In collaboration with: b-plus GmbH www.b-plus.com datakamp Sytem GmbH www.datakamp.de FORTEC Elektronik AG www.fortecag.de HY-LINE Computer Components GmbH www.hy-line.de ies Industrie-Elektronik Schmitz GmbH & Co. KG www.ies-gmbh.de Ineltro AG www.ineltro.ch Intel GmbH www.intel.com next system Vertriebsges.m.b.H. www.nextsystem.at Ultratronik GmbH www.ultratronik.de VDC www.vdc-corp.com Venco Electronica S.A. www.vencoel.com Fax +49 931 418 - 2543 [email protected] Yes, please send me the marked title for the price mentioned plus forwarding expenses (Germany 2,50 P; other countries 5 P) qÊÊPRAXIS PROFILINE Sender Computer-On-Modules (COM) February. 2007 issue Name, first name Company Approx. 100 pages German/English ISBN 3-8259-1944-7 Adress Copy price Telephone/Fax E-mail % 19,80 Vogel Industrie Medien · 97064 Würzburg · www.praxis-profiline.de Editorial COM Express – modular solutions for embedded processing The advent of the Computer-on-Module interconnects like USB and Serial ATA created (COM) turned the old notion of add on the opportunity to defi ne a standardized pro- modules on its head. Originally, daughter cessing module form factor and interconnect. boards or add on modules were designed This effort was undertaken within the PICMG to add specifi c IO functionality to a general process and resulted in the PICMG COM.0, or purpose processor base boards. OEMs would COM Express specifi cation that was approved add their unique connectivity or input output by PICMG on 10th July 2005. requirements to an off the shelf processor The specifi cation incorporates all the latest board to develop a complete computer interfaces necessary to support a complete based control system. Over the years the Computer-on-Module while providing fl exibi- computing functions have become more lity to support a wide range of performance generalized, more integrated, smaller and and functional requirements. Two modules less expensive to the point where it is now sizes are defi ned so customers can choose the application specifi c functions that take from the basic form factor or an extended up more of the design time and board space form factor that supports more memory, in an embedded application. larger processors and a higher thermal enve- Keeping track of chipset advances and lope. Two rows of connectors are part of the synchronizing them with processor evolution specifi cation with the second being optional is a major challenge that most embedded if more interfaces and capacity is required. system OEMs don’t want to deal with. The COM Express modules are already making relentless advances in processor speed and inroads in the embedded computing market density call for designs that are “future where OEM designed systems are common. proofed” with a clearly defi ned growth These markets include medical, test and path to the next round of improvements. measurement, gaming, industrial automation, The use of Computer-on-Modules based security, point of sale, advertising, military designs simplifi es the life of the embed- and others. ded system designer and leaves them The COM Express specifi cation has effec- free to concentrate on their specialty tively aligned the latest needs of embedded will providing them with an automatic systems developers with the latest advances upgrade path. in computer and interface technologies and The latest generation of interconnects provides the leading modular solution for based on Low Voltage Differential Signaling embedded processing. (LVDS) technologies have made it possible to generalize the interfaces to a generic pro- cessing module. The advent of new LVDS based interconnects such as PCI Express as well the next generation of peripheral Rob Davidson, Vice President Marketing, PICMG www.picmg.org PRAXIS PROFILINE – Computer on Modules – February 2007 3 Table of Content Computer-On-Modules With high scalability and Value-Add Service for your customised solution Editorial 3 Basics Intel Multi-Core Processors for COMs 6 A rich array of options for applications requiring increased performance Computer-On-Modules 8 A global market analysis A comparison of embedded COMs 10 Processing power and expansion buses determine COM form factors Small Footprint, Great Potential 16 microETXexpress heralds the second COM Express standardization round ETX 3.0 18 Small Footprint, Great Potential Sound Investment for Hundreds of Thousands of ETX Designs microETXexpress was developed in response Multi Core COMs 19 to the huge demand for PCI Ex- One processor, two cores, a wealth of options for COM press-based COMs in the A Standard for Embedded-RISC-Systeme 20 segment for microapplica- Defi ne the choices tions such as mobile appli- The Case for Ready Made-Processor Modules 22 cations. It takes the shape of High-end Digital Camera with RISC-COMs more compact COM Express COM Management made easy 24 module and is compatible with EVA: A single board handling standard for all COMs other ETXexpress/COM Express Easy Graphic Adaption 26 products. The right fl at panel controller is usually available as an accessory page 16 Service for COMs 27 Customer-specifi c solutions increasingly important Power supply via “copy and paste” 28 The Case for Ready-Made Processor Modules MARS: Modular energy management development platform Selecting an appropriate processor module can save large The borrowed Eye 30 amounts of development and test effort and allow a Wearable PC with Kontron ETX COM used around the world in mobile service company to concentrate Flash as Hard Drive 32 on using its expertise Robust but only long-lived when the right technology is used in a target market to add unique value. page 22 4 PRAXIS PROFILINE – Computer on Modules – February 2007 Table of Content embedded solutions for industrial and automotive markets B-plus develops, manufactures and sells electro- Computer-On-Modules nic system components for industrial applications. At the forefront are With high scalability and Value-Add Service for your customised solution modern embedded computer systems, on the basis of ARM, Xscale and X86 architectures. page 46 Talk to Experts Teamwork with COMs 14 More service for developers – Armin Schwarz talks with Kontron CTO Dirk Finstel Solution, service and Support from one source Application News HY-LINE Computer Compo- ETX-Modules - the third generation 34 nents GmbH is specialised in sales and support of Product News embed ded computing and Latest COMs 37 display technology page 42 Company Portraits Datakamp 40 Flexible and high quality Fortec 41 All the Know-how of a reliable partner Hy-Line 42 Solutions, service and support from one source Speed & versatility IES 43 ies Industrie-Elektronik Speed & versatility Schmitz GmbH & Co. KG Ineltro 44 develops, pro duces and mar- Comprehensive range kets electronic system com- Ultratronic 45 ponents which are designed Successful for more than 30 years for industrial applications. B-Plus 46 page 43 Embedded solutions for industrial and automotive markets Next System 47 Head up in the sky - feet on the ground Venco Electronica S.A. 48 Complete solutions from customized to COTS systems Successful for more than 30 years COM Partner-List 49 Products of Ultratronik are essential in automation and process controlling. The cur- Imprint, Copyrights and Trademarks 12 rent product portfolio ranges from electronic components to servers, from industrial displays to so called Open Frame Smart Panels with included operating system. page 45 PRAXIS PROFILINE – Computer on Modules – February 2007 5 Basics IntelProcessors Multi-Core for COMs A rich array of options for applications requiring increased performance “The trend across the Intel Core Micro- architecture industry will be in Forecasted Normalized Performance vs. Initial Intel® Pentium® 4 Processor Intel Core microarchitecture the direction of mul- provides enhanced energy-effi cient Multi-Core processors: delivering performance Multi-Core performance to help equipment ti-core processors to improvments well into the future Processor manufacturers optimally balance increase performance processing capabilities within power while maintaining or and space constraints. This allows decreasing chip power 10X for the use of Intel processors in embedded and communications consumption.” applications where they had not Single-Core Processor been thought before. The key new Jim McGregor, Principle features include: 2000 2004 2008+ Intel Wide Dynamic Execu- Analyst with In-Stat tion: Executes four instructions per clock cycle to improve exe- cution speed and effi ciency.
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