RTD Embedded Technologies, Inc. All Rights Reserved

Evolution of an Icon The new ATHENA III SBC with Intel Atom E640T 1.0GHz processor and on-board Data Acquisition

Athena

Athena II

Athena III

CPU + DAQ

Athena III is the newest incarnation of our Athena III features: highly popular Athena embedded SBC family, o 1.0GHz Intel Atom E640T CPU o ering the latest generation of computing o 1GB memory soldered on board and I/O technologies. It provides CPU and data o 1.6GHz CPU / 2GB memory available acquisition integrated onto a single board, o providing rugged performance in a highly 4 serial, 4 USB, 1 Gigabit Ethernet, 1 SATA compact form factor with PC/104 expansion. o LVDS and VGA support o 24 digital I/O Athena III¹s backwards compatibility enables o 16 channel 16-bit A/D, 150KHz longer product lifecycles and simplies o 4 channel 12-bit D/A technology refresh e orts. It o ers upgraded o Autocalibration of A/D and D/A features plus triple the performance while o maintaining equivalent power consumption. PC/104 stackable I/O expansion o -40°C to +85°C operating temperature o Fanless cooling www.diamondsystems.com o Backward compatible with Athena II

© 2013, Diamond Systems. Inc., PC/104™ is a trademark of the PC/104 Embedded +1-800-367-2104 Consortium. All other trademarks are the property of their respective owners. EXCALIBUR SYSTEMS www.smallformfactors.com ON THE COVER: www.pc104online.com The world of digital signage is a small one after all, and semiconductor companies are taking note. Intel and AMD offer their interpretations on SFFs the digital signage space, and ZigBee member Volume 17 • Number 1 companies talk smart energy for the home in the PC/104 and Small Form Factors 2013 Resource Guide!

FEATURES IT'S A SMALL (FORM FACTOR) WORLD COLUMNS Digital signage systems Small matters 7 Power and programming Inside Intel’s Open Pluggable 10 By Brandon Lewis Specification Interview with James Tan, Intel SFF-SIG 8 Where advertising meets connector technology Achieving ultra-compact, 14 By Alexander Lochinger, SFF-SIG President multi-display digital signage systems with high-performance PC/104 Consortium 9 Accelerated Processing Units PC/104 architecture: Solid By Dave Jessel, AMD By Dr. Paul Haris, PC/104 Consortium Board Director Consolidating heterogeneity 16 with OpenCL RESOURCE GUIDE 14 By Brandon Lewis PROFILE INDEX 26

Application Specific 27 THE BIG YET SMALL PICTURE Complete Systems 28 Smart energy COMs and SOMs 29 ZigBee Application 20 I/O Boards 35 Solar Energy Profiles converge to bring Interface and Expansion 37 Smart Energy home Mezzanines and Carriers 38 Q&A with Thomas Barber, Packaging 39 20 Silicon Laboratories, and PC/104 40 Mark Grazier, Texas Instruments SBCs and Boards 46

E-CASTS EVENTS

Managing safety and security through open architectures Design & Manufacturing New England March 26, 2013 2:00 PM EDT April 10-11, 2013 Presented by: Esterel, GE Intelligent Platforms, RTI, Wind River Boston Convention & Exhibition Center ecast.opensystemsmedia.com/384 http://DM-NewEngland.com

Understanding Concurrency, Performance Optimizations, and Debugging for Multicore Platforms DESIGN West 2013 March 27, 2013 2:00 PM EDT April 23-25, 2013 Presented by: Freescale The San Jose McEnery Convention Center ecast.opensystemsmedia.com/382 http://ubmdesign.com/sanjose/

Published by: PC/104 and Small Form Factors www.linkedin.com/groups?gid=1854269 2013 OpenSystems Media® © 2013 PC/104 and Small Form Factors All registered brands and trademarks used in PC/104 and Small Form Factors are property of their respective owners. @sff_mag ISSN: Print 1096-9764, ISSN Online 1550-0373

4 S Spring 2013 S PC/104 and Small Form Factors Resource Guide

ADVERTISER INFORMATION

Page Advertiser/Ad title Small Form Factors Editorial/Production Staff 18 ACCES I/O Products, Inc. – Brandon Lewis, Associate Editor Dr. Paul Haris USB embedded I/O solutions – [email protected] PC/104 Consortium Board Director rugged, industrial strength USB Alexander Lochinger Steph Sweet, Creative Director 5 AMD – Fueling innovation for SFF-SIG President [email protected] tomorrow’s technology ... today Sales Group 2 Diamond Systems Corporation – Tom Varcie International Sales Evolution of an Icon – Athena III Senior Account Manager Elvi Lee, Account Manager – Asia SBC [email protected] [email protected] 3 Excalibur Systems, Inc. – Rebecca Barker Gerry Rhoades-Brown Dragon – it’s not a myth Strategic Account Manager Account Manager – Europe [email protected] [email protected] 24-25 RTD Embedded Technologies, Eric Henry, Strategic Account Manager Regional Sales Managers Inc. – PCI Express, PCI, and [email protected] Barbara Quinlan, Southwest ISA experts [email protected] Ann Jesse, Strategic Account Manager 15 Technologic Systems – [email protected] Denis Seger, Southern California [email protected] Industrial controllers and Christine Long Modbus peripherals Vice President, Online Business Sydele Starr, Northern California [email protected] 21 Themis Computer – [email protected] Take your virtual environment Ron Taylor to the edge Reprints and PDFs East Coast/Mid Atlantic [email protected] [email protected] 13 WDL Systems – The power inside tomorrow’s technology OpenSystems Media Editorial/Production Staff 48 WinSystems, Inc. – Atom powered SBCs high-performance, small and fanless Brandon Lewis, Associate Editor Joe Pavlat, Editorial Director 19 X-ES – Rugged, powerful xTCA and CompactPCI Systems xTCA and CompactPCI Systems COM Express PC/104 and Small Form Factors [email protected] [email protected] Jerry Gipper, Editorial Director Reader Resources Warren Webb, Editorial Director VITA Technologies Embedded Computing Design [email protected] Subscribe to magazines and E-letters: Industrial Embedded Systems Monique DeVoe, Assistant Managing Editor www.opensystemsmedia.com/subscriptions [email protected] VITA Technologies E-casts: Sharon Hess, Managing Editor EDA Digest ecast.opensystemsmedia.com Embedded Computing Design DSP-FPGA.com Military Embedded Systems [email protected] TechChannels: Industrial Embedded Systems tech.opensystemsmedia.com Curt Schwaderer [email protected] Technology Editor White Papers: Jim Turley, Embedded Moderator Steph Sweet whitepapers.opensystemsmedia.com Embedded Computing Design Creative Director [email protected] Videos: David Diomede video.opensystemsmedia.com Mike Demler, Editorial Director Art Director EDA Diges, DSP-FPGA.com Get news via RSS: [email protected] Joann Toth, Senior Designer www.smallformfactors.com/news/rss.xml John McHale, Editorial Director Konrad Witte, Senior Web Developer Advertiser Resources Military Embedded Systems Matt Jones, Web Developer [email protected] Submit information: submit.opensystemsmedia.com Editorial/Business Ofﬁce

Media kits: Patrick Hopper, Publisher Rosemary Kristoff, President www.opensystemsmedia.com/publications Tel: 586-415-6500 n Fax: 586-415-4882 [email protected] [email protected] Join the Discussion Wayne Kristoff, CTO Subscriptions Updates 16626 E. Avenue of the Fountains, Ste. 201 Twitter: @sff_mag www.opensystemsmedia.com/subscriptions Fountain Hills, AZ 85268 Karen Layman, Business Manager LinkedIn: www.linkedin.com/groups/ Tel: 480-967-5581 n Fax: 480-837-6466 30233 Jefferson PC-104-Small-Form-Factors-1854269 St. Clair Shores, MI 48082

6 S Spring 2013 S PC/104 and Small Form Factors Resource Guide www.smallformfactors.com small MATTERS

By Brandon Lewis

Power and programming

New processors, new programming … in the world of technology things move problems Multicore processors – they’ve been pretty fast, often too fast for end users to keep here for some time now, and it appears as though they’re here to stay. So per- track of currently available products that can haps a better question than “what’s after multicore?” is “what comes next help them day in and day out. for multicore?” as a framework for simultaneously pro- particular moment, Grazier stressed Traditionally, multicore processors have gramming multiple processor resources that it will take time for consumers to been a collection of homogeneous CPUs with shared memory has not existed. In become aware of even simple, cost- arranged in either cache-coherent Non- the Digital Signage section of this issue, effective technologies, and that some Uniform Memory Architecture (ccNUMA) Dave Jessel of AMD goes into further entity (in this case the utility provider) or Symmetric Multi-Processor (SMP) detail about heterogeneous processing, must assume the responsibility of groups. Today, however, as designers and Neil Trevett, President of the Khronos spreading the word about useful new are increasingly concerned with saving Group and VP of Mobile Content at products. The point being that in the board real estate while improving the NVIDIA, explains how the OpenCL world of technology things move pretty price/performance ratio of their offer- framework can help ease heteroge- fast, often too fast for end users to keep ings, conventional concepts of the multi- neous programming pains. More infor- track of currently available products that core architecture have begun to change. mation on heterogeneous processing can help them day in and day out. can also be found through the Hetero- The latter was a topic of discussion at geneous System Architecture (HSA) Although the technologies we cover the Real-Time & Embedded Computing Foundation at www.hsafoundation.com, aren’t typically geared directly at the Conference (RTECC) in Phoenix, AZ this or the Khronos Group website at mass consumer market, PC/104 and past December, where representatives www.khronos.org. Small Form Factors is in the business of from AMD and multicore programming making sure that the latest small form startup Texas Multicore Technologies The power of knowledge factor embedded tools and solutions are turned the conversation to heteroge- Something that can’t be stressed exposed to the engineers, product man- neous processor architectures. Unlike enough in the world of small form factors agers, and executives that can use them. traditional multicore, heterogeneous is power, particularly in more commer- Some of these are available in the 2013 architectures look to unlock the power cialized applications that often measure Resource Guide beginning on page 26, of diverse processors so that a pool consumption on the scale of hundreds including COM, SBC, I/O, Packaging, of programmable, high-performance or thousands of units. Speaking on smart and Application Specific products. graphics processing elements can be energy for the ZigBee feature in The Big integrated and applied to non-graphics Yet Small Picture section, Mark Grazier, In a final word on power, our summer data (this architecture is often in refer- ZigBee Alliance member and Program issue will focus on low power solutions ence to combining a CPU and GPUs, Manager, Wireless Sensor Networks and medical systems. If you or your but can be extended to a range of em- and Worldwide Third Party Developer company are interested in contributing bedded processors). Network, Texas Instruments, empha- expertise on either topic, please feel sized the importance of educating free to send along a short abstract. Eventually the goal of this type of consumers on the availability of power- design is to combine the memory of the saving technologies and the importance Brandon Lewis various regions of the processor into a of energy consumption. Associate Editor unified model so that the communications overhead involved with copying As he described to me a refrigerator data between CPU and GPU memory is magnet technology being developed removed. For now, however, this pres- that can indicate how much energy is ents basic challenges for programmers, being consumed by a household at a [email protected]

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 7 Small Form Factor www.sff-sig.org SIG

By Alexander Lochinger, SFF-SIG President

Where advertising meets connector technology

Whether for commercial, industrial, or on humidity and dust in the environment, consumer markets, advertising plays an and even shocks caused by nearby trucks undeniable role in the marketing and rolling over potholes. sales cycle. The case for Return On Invest- ment (ROI) is compelling as long as ads By contrast, board-to-board mated con- reach the target markets. With digital nectors are designed for high-reliability advertising mainstream by now, system and harsh environments. They have “uptime” gets lost by integrators and substantial connector wiping during installers who heavily prioritize price when insertion and strong retention forces. selecting digital signage players, Point Of Several memory module manufacturers Figure 1 | A CoreExpress module from SysLogic targets compact customized Sale/Point Of Interaction (POS/POI) termi- used this approach and collaborated display applications. nals, kiosks, and video wall systems. Poor with embedded Single Board Computer reliability can impact ad revenue directly. (SBC) manufacturers to define a truly the mezzanine module, even under rugged-by-design module standard shock and vibration loads. Much of the growth in these segments is called XR-DIMM. This standard was for outdoor use – along freeways, at gas created within the Small Form Factor Similarly, the CoreExpress specification station pumps, and so on. Wide tem- Special Interest Group (SFF-SIG), a trade uses Tyco board-to-board connectors perature operation becomes a factor, group that targets rugged and reliable for all signals that pass from pro- such as not overheating during Phoenix embedded applications rather than con- cessor module to custom carrier board. summers and successfully booting and sumer and enterprise markets. CoreExpress, adopted and maintained by re-booting during Chicago winters. the SFF-SIG, even goes a step further as a Other than the LCD itself, which is cer- Closing the remaining loopholes purely digital module. The Ethernet PHY tainly challenged when it comes to tem- In the non-backplane embedded com- goes on the carrier board so that analog perature extremes, the “media player” puting SFF space, there are two product signals do not go through the additional computer board is challenged in sev- types: SBCs and Computers-On-Module set of connectors, unlike other COM eral ways. Besides the obvious limita- (COMs). If the required feature set can standards. For both SBCs and COMs, the tions of consumer-grade motherboards be satisfied with an off-the-shelf SBC SFF-SIG has closed the shock/vibration in outdoor settings, more ruggedized and I/O cards (if needed), this approach high-reliability connectivity loophole. embedded boards can still fall short of minimizes time-to-market and up-front reliability requirements when designed design effort. If not, a COM and a car- The SFF-SIG has provided a full family with consumer market connectors. rier board is the new popular approach of specifications that can be used for to just-right I/O. computer/player boards and memory Losing your memory modules alike. Discriminating outdoor Low-cost motherboards feature vertical Since both approaches (SBC and COM) signage integrators and installers will DIMM slots or horizontal SODIMM sock- are popular now, the SFF-SIG has several need to maximize uptime and adver- ets that hold system RAM. The modules standards that also use board-to-board tising revenue while greatly reducing field and sockets were developed for com- connectors for ultra-reliability. The service “truck rolls.” In outdoor display puters that sit on desks and in data cen- Stackable Unified Module Interconnect market segments, reputations are at stake ters, not for outdoor environments where Technology (SUMIT) is an expansion bus as advertisers can quickly pull ads if the temperatures vary over wide ranges. connector for mezzanine I/O cards (in coveted Frequency x Reach = Impressions Rapid temperature changes create con- other words, cards that mount horizon- equation plunges due to equipment ditions known as “thermal shock.” If tally, parallel to the SBC) that are secured downtime. More information about the the connector pins don’t wipe the gold- with four mounting holes, screws, and CoreExpress, SUMIT, and XR-DIMM spec- plated card-edge fingers well enough, standoffs. SUMIT consists of a mix of ifications can be found at www.sff-sig.org. tiny air pockets can form between the high-speed and easy connectivity buses metal surfaces, causing code and data in a single, compact 52-pin Samtec QFS/ Small Form Factor bit errors due to intermittent contacts or QMS mated connector pair. The center Special Interest Group open circuits. The risk is worse depending “blade” provides a reliable ground to 408-480-7900 • [email protected]

8 S Spring 2013 S PC/104 and Small Form Factors Resource Guide www.pc104.org PC/104 Consortium

By Dr. Paul Haris, PC/104 Consortium Board Director

PC/104 architecture: Solid

Evaluation of the challenges of the Therefore, the Consortium chose for its embedded marketplace is a never- PCIe/104 specification a high quality, ending saga. Each technology has surface mount connector with signal its benefits and drawbacks, and each bandwidth headroom and mechan- feeds the ideas of tomorrow. Throughout ical properties that were specifically its history, the PC/104 Consortium has developed to account for standoff toler- taken the approach of stressing the ances and provide large connector-to- characteristics of stability, evolution, connector wipe. It was also developed backward compatibility, interoperability, with ruggedness in mind for products maintainability, and upgradability for its that might be exposed to the entire PC/104 architecture. These characteris- spectrum of environmental conditions, tics have enabled its long-term surviv- from the static in ambient tempera- ability and have provided embedded tures to the worst shock and vibration developers and end users a mechanism in extreme temperatures. And this Figure 1 | PCIe/104 provides paths to to maximize product lifecycle invest- choice has paid off since, as this is being evolving mainstream bus architectures ments and reductions in costs. written, a new revision of the PCIe/104 while allowing users to continue leveraging past investments.. specification that incorporates the ability The PC/104 specifications begin by to run PCI Express Gen 2 and 3 is being and versatility, compatibility, and inter- focusing on the evaluation of main- released to Consortium members for changeability of the specification are stream bus architectures for their sound- a vote. If adopted, this capability pro- maximized. ness and acceptance in the marketplace. vides two benefits: overall increased bus This provides a solid foundation from bandwidth and potential reductions in By paying close attention to optimizing which everything else can evolve. the number of high-speed serial links backward compatibility with their other Testaments to the effectiveness of this needed to connect to a peripheral card specifications, the PC/104 Consortium approach are the PC/104 stackable functionality since more data can be provides paths to evolving mainstream ISA and PCI-104 stackable PCI buses, transferred for a given link number. bus architectures while allowing users which have proven themselves for over to continue leveraging past investments 20 years in the harshest of conditions, The surface mount characteristics of (Figure 1). This helps minimize software leading to their vast adoption. the stackable PCIe/104 connector also changes, mechanical system modifica- allow the top and bottom side connec- tions, and recertification requirements. But as the computer industry acceler- tors to be electrically detached if the And these standards will remain viable ated in its advancements, so did the board developer so desires. This feature as long as processor manufactures, complexity and choice of bus archi- can expand the potential capabilities FPGA IP cores, and peripheral device tectures, making the creation of next- of the stack by allowing simultaneous vendors continue to support the em- generation stackable specifications up and down stacking, doubling of bedded market. This is what gives that much harder. As high-speed, low- the number of available bus links, and all of the Consortium’s specifications voltage differential serial interfaces having different bus configurations, such lasting power, and why there are so came onto the market, new challenges as Type 1 going down and Type 2 going many products available using stackable emerged for PCB and connector con- up. The choices are limited as a function PCI Express, PCI, and ISA busses today. struction that had to be addressed for of the processor of choice, PCI Express future evolution. This evolution came switches involved, or bandwidth sharing The versatile family of complementary, quickly with refinements to transfer incorporated. And since the connector stackable specifications based on the rates, protocols, and encoding schemes, is surface mount, one can even eliminate PC/104 architecture has been providing leading to PCI Express alone seeing a the top or bottom connector on a host long-term solutions for a vast array of move from Gen 1 (2.5 GTps) to Gen 2 if stacking in one direction is desired, applications for more than 20 years, and (5 GTps) to Gen 3 (8 GTps) in 2003, thereby realizing additional usable PCB is still finding itself in new areas every day. 2007, and 2010, respectively. And so real estate. Compound this with the too did the speeds of USB and SATA universal configuration of each function- For more information visit the PC/104 increase. ality found on the PCIe/104 connector, Consortium website at www.pc104.org.

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 9 IT'S A SMALL (FORM FACTOR) WORLD IT'S A SMALL (FORM FACTOR) WORLD Digital signage systems

Inside Intel’s Open Pluggable Speciﬁcation

Q & A

Interview with James Tan, Intel

As we continue the march into the age of intelligent systems, digital signage platforms will play a large part in the evolution of the commercial and retail markets. Noticing fragmentation in the digital signage space, Intel released the Open Pluggable Specification (OPS) in 2010, defining a modular, integrated hardware architecture that could link digital signage media players and their corresponding displays to create cost-efficient intelligent signage platforms that use EPIC and smaller sized boards. In this PC/104 and Small Form Factors interview, spec author James Tan describes how the OPS is enabling intelligent and connected digital signage deployment. Edited excerpts follow.

SFF: What were the drivers behind While there were a few integrated solu- Taiwan Digital Signage Special Interest the development of the Intel Open tions out there at that time – some with Group (Taiwan DS SIG), the OPS was Pluggable Specification (OPS) for an internal motherboard into the display launched by Intel in October 2010. digital signage? and some with modular solutions that TAN: When Intel started to focus on the could easily attach and detach from the SFF: What is the importance of digital signage industry roughly four display – there was no standard hard- using small form factor boards in years ago, the first thing we noticed was ware architecture in place when it came the development of digital signage how fragmented the market was, not to the integration between the display systems, and why in particular does only in terms of software offerings, but panel and media player. Due to this, the specification call for EPIC and also for the computing system solutions some key display vendors and signage smaller-sized boards? (commonly known as the digital signage providers that we engaged with voiced TAN: This relates closely to the practical media player) available in the market- concern about the limited compatibility sense of things. Digital signage media place itself. There was no standard solu- and interoperability between a display players are mostly attached to the back tion in place; each digital signage media panel and media player, which was of the screen or embedded inside the player provider was pretty much offering halting the strategic growth of the digital screen (as is the case with the OPS) their own proprietary solution. While signage solution space. Developers where space or system real estate could this was acceptable for an independent, (especially display companies) also be limited, so small form factor boards standalone media player system that had to fork out substantial amounts of are obviously desirable. As to the ques- you can easily attach to a display panel, funding and resources each time they tion of why EPIC-and-smaller boards there was a growing demand for inte- wanted to upgrade their systems, as were selected for the OPS, we knew grated solutions, especially from display they had to modify the display archi- from the start that we did not want too providers and system integrators as they tecture and form factor to fit in a new big of a system for OPS modules since expanded their product portfolios into integrated media player as those solu- displays are getting slimmer with a total solutions rather than separate dis- tions were most likely outsourced from variety of sizes to fit retail and signage play panels and media players. Also, as a third-party vendor that provided their applications. We did some studies on the digital signage segment matured, own proprietary solutions. Taking all practical component placement, as well there was a need to address the inef- these factors into account, we decided as thermal simulation for mainstream ficiency around system deployment, to take the initiative to lead the industry, Intel mobile processors, and found that usage, maintenance, and infrastructure and together with some key ecosystem EPIC-sized boards were a good fit. There upgrades. partners such as NEC, Microsoft, and are only a few key baseline features that

10 S Spring 2013 S PC/104 and Small Form Factors Resource Guide you would really need for signage applications, so you can focus on designing a Figure 1 and 2 | The dimensions of an board that is very lean and highly effec- OPS module are 200 mm x 119 mm x tive to service the signage requirements, 30 mm (7.87" x 4.69" x 1.18"), including and strip out other features that are not the mounting frame. needed – so, practically, you do not really need a board bigger than the EPIC size. From a thermal perspective, we had to ensure that the form factor of the OPS module was reasonably adequate for Figure 1 thermal dissipation when plugged into the display panel. Figure 2

SFF: What are the physical dimensions of an OPS system? Does this make it more viable for particular sizes or types of digital signage? TAN: The overall dimension of an OPS module, including the mounting frame, is 200 mm x 119 mm x 30 mm (discount- ing the mounting frame, which is 10 mm on each side, the physical volume of the body of the module is actually at 180 mm x 119 mm x 30 mm (Figures 1 and 2). This is ideal for 32" display sizes and above, however the module is still fairly compact and we have seen it go into screens as small as 24", which is mainly in space-constrained environments such as buses or trains.

SFF: Does an Intel OPS-compliant system have the ability to handle multiple displays simultaneously? TAN: For the module developers, the this can mean that airflow is provided Can it be used for video walls? thermal requirement is pretty straight- by the fan from the OPS module (if it TAN: It is important to note that OPS forward. Regardless of the platform, is an active cooling module) and/or defines the scope of interoperability the module designed must be able to that airflow is provided by the system and integration between a media player operate at up to 45 ºC (113 °F). This fan within the display panel itself. Also, to a single display panel, so the speci- means that all the major components there is a defined minimum vent hole fication basically just covers that. As to in the module such as memory, storage, area, which can provide better exposure whether it can handle multiple displays, voltage regulators, and so on, including of the module to ambient air, dramati- that is inherent to the media player (OPS the processor, are still operational within cally helping dissipate heat. As long as module) platform capabilities, and most the thermal spec in an ambient tempera- these baseline requirements serve as a Intel-based OPS platforms can definitely ture of up to 45 ºC. There is also the con- guiding factor, display developers have support additional display interfaces dition of sufficient airflow either from the the freedom to design products as they if they are being designed externally, environment or from an active cooling see fit while still factoring in the thermal which is not limited by the OPS spec. solution provided by the module itself. considerations of OPS modules. The same goes for video wall solutions: developers can leverage the OPS archi- As for the display developers, due to SFF: Why was the 80-pin JAE plug tecture and provide additional features different designs and implementations and receptacle connector chosen and benefits on top of it to position their of the display panel in the market we as the interface model, and what products better as a whole and create try to be as “flexible and open” as pos- type of signaling does it support? differentiation in the marketplace. sible with regards to a display’s thermal What capabilities does this enable requirements. Touching on a couple of between media player and display? SFF: What are the thermal design key examples, the spec merely states TAN: Since this is an open spec, one considerations that developers using that there must be sufficient airflow important aspect is that the connector the OPS need to account for? provided to the module. Subjectively, chosen had to be easily sourced by

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 11 IT'S A SMALL (FORM FACTOR) WORLD

developers and had to come from a reli- Developers can easily integrate touchscreen, able supplier. The other criteria mainly focused on the electrical, thermal, and gesture technologies, or even RFID or NFC readers mechanical aspects of the connector. The 80-pin JAE TX24/TX25 connector and devices into an OPS system using the interfaces series allows a sufficient current rating provided, effectively revolutionizing the usage (1 A per pin with 8 total pins allo- cated for power), which is important in model of the digital signage by making it something that ensuring that the module is sufficiently powered, as the OPS actually relies on the viewer can engage and interact with rather the Power Supply Unit (PSU) from the than just a dumb advertising screen. display side to operate. Signal integrity is also an important factor, and this connector is capable of supporting higher of the module and of its power status; as it can then be applied to run specific speed signals such as DisplayPort. system fan control; pluggable signal ON, content that is closely related to the Thermally, it can support a wide range which can be used to power up/down viewer’s demographic, enabling smarter of operating temperatures, from -40 ºC the module from the display side (as and more effective digital signage. to +80 ºC. The connector can also sus- when using a remote control); and also tain at least 500 insertion lifecycles, and HDMI Consumer Electronics Control In terms of Total Cost of Ownership is very robust when it comes to shock/ (CEC), which is basically a single wired (TCO), the OPS architecture encourages vibration environments. All of these control signal that can be used to detect display developers to design a so-called factors coupled with the fact that it is the status of the display and even con- vPRO-capable display, which supports cost effective (roughly $1 per connector) figure settings like brightness, contrast, the usage model of remote manage- made the 80-pin JAE TX24/TX25 con- and display audio volume. ability through Intel Active Management nector a suitable choice for OPS. Technology (AMT). If you are managing SFF: Are Intel OPS systems able multiple screens it can be very trouble- As for the signaling through the JAE to operate as “intelligent systems” some and costly to manage over time, connector, we defined key features that that interact with people and other particularly at locations like airports are instrumental in turning a normal intelligent devices? If so, what is where the number of displays could be professional-grade display into a smart, the technology behind this? in the hundreds or thousands and you intelligent, and connected screen. This TAN: Absolutely. There are many other have to send an IT person or technician enables the display panel to work seam- key features that Intel is evangelizing on-site to repair a signage screen every lessly with the OPS module so that they in parallel with the OPS that can enrich time an issue is being flagged. The issue function effectively as a single entity. OPS systems and increase their func- could be either a hardware or software Besides being powered up natively within tionality in this area. As mentioned conflict or sometimes both, and more the display, which eliminates the need previously, the OPS enables the digital often than not faulty signage can be for a separate power cable/adapter for signage ecosystem to turn a normal easily troubleshot by doing a software the media player, the module also pro- display into a smart, intelligent, and fix or reboot. AMT expects the signage vides multimedia features to the display connected screen. to be connected to the management through the options of TMDS for DVI server all the time (either through wired and HDMI or DisplayPort and audio. The From a Return On Investment (ROI) LAN or Wi-Fi) so that the IT person is able OPS architecture also allows expansion standpoint, advertisers or screen owners to manage all of the screens remotely, capability through USB 2.0 and USB 3.0 can now measure the effectiveness and AMT-enabled OPS systems can be ports, which can be used for integrating of their screens by observing demo- managed out-of-band, which means that devices within displays such as cam- graphics through sensors or cameras even when the Operating System (OS) eras, touchscreens, RFID readers, and integrated in the OPS system that can is corrupt or not running, you can still the like, or even serve as a USB hub for anonymously detect gender, age group, access the system remotely and perform the display. UART signals are also avail- and impression time by using the Intel hardware diagnostics through AMT’s able for increased communication and Audience Impression Metric (AIM) Suite various features and attempt to fix the control functions between the display anonymous viewer analytics software. system. Only if all else fails and it is and the module. The data collected can be sent back found to be a hardware issue in which to a server or the cloud for further ana- some parts need to be replaced would In addition, there are also a few OPS lytics by the advertiser, which can, for it require sending a technician on-site. control signals that can be utilized by example, be used to crosscheck the sales In addition, AMT also allows you to developers. These signals can enhance data of a particular product being adver- do system ON/OFF scheduling, which the functionality of displays through capa- tised through the screen. The AIM appli- makes your signage smarter and saves bilities such as detecting the presence cation also makes the screen intelligent, on the electricity bill.

12 S Spring 2013 S PC/104 and Small Form Factors Resource Guide Also, modular and integrated system James Tan is a Platform Systems Architect for the Retail Solutions Division (RSD), architectures like OPS can further boost Intelligent Systems Group (ISG) at Intel, and is the author of the Intel Open system-level initiatives, especially in Pluggable Specification (OPS). the areas of interactivity. Developers can easily integrate touchscreen, ges- Intel ture technologies, or even RFID or NFC [email protected] readers and devices into an OPS system edc.intel.com using the interfaces provided, effectively revolutionizing the usage model of the Digital Signage Open Pluggable Specification: digital signage by making it something http://www.intel.com/content/www/us/en/intelligent-systems/digital-signage/ that the viewer can engage and interact open-pluggable-specification-simplify-digital-signage-development.html with rather than just a dumb advertising Intel Embedded Board Planner: screen. www.intel.com/p/en_US/embedded/designcenter/tools/board-builder/planner

SFF: Do OPS developers need to be particular in their processor selection? Are there recommended processors for use with the OPS, and if so, why? TAN: While this is an open spec, which means that OPS developers have the complete freedom to choose the processor type that suits them, in order to reap the maximum benefits of what an OPS architecture has to offer for the Rugged by Design Dual-core 3rd generation Intel® Core™ processor usage models and technologies I just Industrial grade memory: up to 4GB soldered ECC DDR3 explained, it is highly recommended and up to 8GB SSD that an Intel Core i5 processor or above PCI/104-Express Type 1 and PCI/104 expansion is used to meet processing requirements and leverage technology sup- One PCIe x16 (Gen 3) and 1 x4 or 4 x1 (Gen 2) port like AMT. Features like audience SATA 6 Gb/s x2, GbE x2, USB 2.0 x2, Serial x2 measurement with AIM will also require Up to 3 simultaneous digital displays higher processing capability for viewer analytics, which runs perfectly on i5 and Extended Temperature: -40C to +85C CoreModule® 920 above processors since it is optimized 50% thicker PCB for high vibration environments for the Core series and can simultaneously run multimedia signage content such as HD videos, flash, and tickers. As for thermal considerations, OPS platforms are scalable to support different types of processor with an ideal range DM&P SoC CPU Vortex86DX- 800MHz of up to 40 W. XGI Volari Z9s Chipset, onboard 32MB VGA Memory SFF: How has the Intel PC/104 standard; PCI-104 & PCI/104+ (Optional) OPS spec faired in the industry Watchdog Timer, software programmable to date? TAN: Since its launch, more than twenty Integrated 10/100Mbps Ethernet ecosystem partners and counting that Up to 512MB DDR2 onboard VDX-6354 have designed and launched OPS-based products in the marketplace. This shows that the industry is responding well to the standardization effort, and with OPS settling in to become a de-facto hardware standard for digital signage, we hope more and more solution providers The embedded ProducTs source will adopt the architecture and reap its 1.800.548.2319 www.wdlsystems.com [email protected] benefits and advantages.

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 13 IT'S A SMALL (FORM FACTOR) WORLD IT'S A SMALL (FORM FACTOR) WORLD Digital signage systems

Achieving ultra-compact, multi-display digital signage systems with high-performance Accelerated Processing Units

By Dave Jessel

Designers of digital signage systems have long been challenged to achieve high-end graphics and video performance with conventional CPU- and discrete GPU-based embedded boards that present board area and cooling challenges. With the advent of Accelerated Processing Units (APUs), however, digital signage system designers are equipped to achieve new levels of multimedia performance and visual immersion while striking a balance of form and function in small form factor, power-efﬁcient solutions.

ith the continued evolution Designing on x86 embedded boards efﬁciencies yield signiﬁcantly leaner cost of embedded system technol- and modules enables these designers structures for embedded board providers Wogy, digital signage design- to achieve PC-caliber performance and and designers alike, and help provide ers are better equipped than ever before agility complemented by a rich ecosystem smooth scalability from low-end digital to achieve ambitious design goals that of industry-standard, x86-optimized signage offerings to high-end offerings meet customers’ exacting multimedia per- software, applications, and develop- via a single underlying embedded pro- formance and functionality requirements. ment environments. Collectively, these cessing platform.

14 S Spring 2013 S PC/104 and Small Form Factors Resource Guide Industrial Controllers and Modbus Peripherals Controllers start at 199 qty 100 Yet digital signage designers continue APUs for advanced processing Peripherals start at qty 100 to bump up against frustrating perfor- performance and space savings 119 mance and flexibility limitations when Conventional chipset architectures that using embedded boards built around integrate graphics processing rely on conventional processing platforms and/ the CPU to interface with the GPU via a or ad-hoc chipsets, particularly when North Bridge connection, sending calls developing HD-enabled, multi-display to the GPU to invoke code running on signage systems for space-constrained the co-processor that would then send environments. Where previously power- results back to the CPU. This serial data hungry multicore CPUs and add-on processing approach adds consider- graphics cards dominated the digital able memory latency, consumes system signage technology landscape, the power, and uses more board space. emergence of embedded boards and modules equipped with new-generation High-performance APUs combine a APUs is facilitating advanced graphics CPU and advanced HD-caliber GPU in capabilities within an extremely small a tightly integrated, power efficient, picture of TS-1400 Modbus Peripheral footprint. The merging of advanced x86 and extremely compact form factor computing capabilities with the parallel (Figure 1). The CPU takes care of the Industrial Controllers processing power of a General-Purpose scalar processing, including memory, 250MHz to 1GHz CPUs Graphics Processing Unit (GPGPU) in networking, and storage processing, Fast startup (under 3 seconds) a single device allows OEMs to design and runs the Operating System (OS), Opto-isolated ports available graphics-intensive digital signage sys- applications, and User Interface (UI). tems that deliver advanced multimedia The on-die GPU offloads graphics and Industrial screw down connectors experiences in single-screen and/or multimedia processing using Single Digital counters, quadrature multi-screen configurations. Instruction, Multiple Data (SIMD) parallel Program in Ladder Logic or C Debian Linux Modbus Peripherals TS-1400 6 Relays TS-1700 DIO / One-Wire TS-1720 Thermo Couple temp sensor TS-1740 RTD temp sensor TS-1760 Thermistor temp sensor Peripherals in development feature analog and digital inputs and outputs

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Technologic Systems Figure 1 | A Heterogeneous System Architecture (HAS) combines a CPU and We use our stuff. GPU into one Accelerated Processing Unit (APU), which is then coupled with a visit our TS-7800 powered website at companion controller hub to produce an efﬁcient two-chip processing architecture. www.embeddedARM.com (480) 837-5200 IT'S A SMALL (FORM FACTOR) WORLD Consolidating heterogeneity with OpenCL By Brandon Lewis

As the emphasis in computing has shifted away from clock OpenCL affords a high degree of portability across device speed and toward multiple cores, programming paradigms and hardware implementations because it is a device-agnostic have begun to fall short. With the integration of multicore framework. Programmers must be aware of architectural system CPUs, GPUs, and other processors onto the same die, general- differences and may be required to make code adjustments purpose programming models that traditionally focused on when porting, Trevett says, but OpenCL compliance supports extracting maximum performance from a single processor have compute-intensive data-parallel algorithms across embedded struggled with splitting algorithms and programs to get the processors, DSPs, FPGAs, and other architectures. Compliance most out of diverse sets of processor resources, a problem that is ensured by an extensive set of functional and numeric confor- is compounded by the memory sharing that typically occurs mance tests, available through the Khronos Group. between processing elements within Heterogeneous System Architectures (HSAs). Furthermore, GPU and accelerator Memory jogging and food for thought models provided by semiconductor companies are typically Because OpenCL’s programming kernel is based on standard hardware, platform, or vendor specific, making it difficult for C99 language with limited changes, controlling parallelism and developers to access the compute horsepower of heteroge- the layout of data in the OpenCL memory model should be neous architectures from a single code base. familiar to programmers. However, for OpenCL novices Trevett identifies how the framework’s memory and execution models “There has not been a single programming framework that control a system’s parallel resources as perhaps the biggest enables all of these compute resources to be programmed learning curve (Figure 1). “It is relatively straightforward to write together,” says Neil Trevett, President of the Khronos Group OpenCL code that is functionally portable,” he says. “However, and Vice President of Mobile Content for NVIDIA. “Open as is normal in parallel programming, the key step is almost standard graphics APIs include compute shaders that enable always understanding how to exploit parallelism in your appli- programmers to write GLSL shaders that can be very effective cation, regardless of the programming environment you use. at providing GPU compute acceleration for diverse tasks within OpenCL is powerful, but it is not magic.” the context of the graphics pipeline. However, compute shaders do not enable more than a single GPU, or general-purpose C Programming frameworks will be a prerequisite for maximizing code, to be used. Standards such as OpenMP enable multi- compute resources as the transition to heterogeneous architec- ple CPUs to be effectively programmed, but do not provide tures continues in the embedded space. “The OpenCL working programming of accelerators and GPUs.” group is actively working on a major release following the current OpenCL 1.2 specification,” says Trevett. “OpenCL is widely Unlocking data-parallelism and portability with OpenCL available on desktop systems today, but the next 12-18 months In 2008 the Khronos group began work on the Open Computing should see mobile and embedded OpenCL-capable systems Language (OpenCL) specification, an open-standard, multi- coming to market.” platform development programming interface for writing task-based and data-parallel programs that can leverage all More information on OpenCL can be found at of an HSA’s resources. In a general sense, OpenCL achieves www.khronos.org/opencl/resources. data-parallel programming tasks by hierarchically indexing compute instructions in an N-dimensional space, which allows developers to define the number of work items to execute in Private Private Private Private parallel and divide them into working groups. Alternatively, the task-based programming model executes kernel instances Thread1 Thread M Thread1 Thread M independent of an index, translating to a single-item work Compute Unit 1 Compute Unit 2 group that can use vector data types or queues to express parallelism. Local Memory Local Memory “OpenCL is designed to be a low-level programming framework that provides a high degree of control over where and Global/Constant Memory Cache how compute kernels are executed,” says Trevett. “It includes Compute Device an API framework to define and control the platform in terms of a host (the CPU) and one or more compute devices (GPUs), plus a C99-based programming language for writing kernel pro- Global Memory grams that are executed across those compute devices.” These characteristics have made OpenCL an excellent acceleration Compute Device Memory and porting layer for high-level languages, Trevett says, and help simplify heterogeneous programming across particular Sidebar Figure 1 | OpenCL contains a unique memory platforms and domains. model.

Sidebar 1 | Programming HSAs with OpenCL

16 S Spring 2013 S PC/104 and Small Form Factors Resource Guide processing, while driving high-definition APU-based embedded boards, electricity systems, thus helping preserve board video displays through DisplayPorts costs deriving from the power consump- space while limiting system noise and or HDMI. tion of the media player itself may not be lowering Bill of Material (BoM) costs. the most critical consideration. Indeed, Because the integration of the CPU and This CPU plus GPU combination onto a for these types of installations, the com- GPU on the same die eliminates the single APU die provides a robust archi- bined power draw of the displays may need for a PCIe or MXM graphics card, tecture. APUs can offload data parallel dwarf the power consumption of the APUs equip designers to save consider- processing from the CPU to the GPU, media player itself. However, embedded able power – at least 25-35 W. including multimedia streaming. Freed board-level power consumption remains from this task, the CPU can focus on an especially important consideration With between 128 and 384 compute compute, memory, and I/O requests with regard to system cooling, and here units delivering a calculated 172-563 SP with much lower latency, thereby APUs afford several advantages. GFLOPs[1] of performance and a improving real-time graphics processing Thermal Design Power (TDP) ranging performance via a fully optimized data Fan-cooled digital signage can, of from 17-35 W (average power below path and shared access to the memory course, be vulnerable to airborne par- 13 W), the PPW advantages yielded by controller. Additionally, with both CPU ticulates and debris, as well as shock AMD Embedded R-Series APUs help and GPU architectures collocated on and vibration – all of which are common provide greater power efficiency and the same die, an application can be environmental factors in high-traffic lower heat dissipation than comparably- written as one program using OpenCL (pedestrian and/or vehicular) environ- performing conventional processing thus reducing latency and overhead ments. Digital signage designers are platforms. Though R-Series APUs are (Sidebar 1). This CPU plus GPU combina- therefore understandably wary of fan deployed with fan cooling at the board tion is called the Heterogeneous System cooling mechanisms due to the inherent level in most cases, continued advance- Architecture (HSA). risk of failure. Passively cooled, ventless ments in heat pipe cooling technology signage systems are the ideal end goal are beginning to yield improved reli- An APU eliminates the need for add-on for these designers. ability in a new generation of fanless, graphics cards for digital signage R-Series APU-based digital signage systems, and reduces the footprint of The net Performance Per Watt (PPW) systems. a traditional three-chip platform to just gains enabled by APUs bring greater two chips – the APU and the companion power efficiency and lower heat dissipa- Multi-screen, multimedia immersion controller hub. This two-chip archi- tion, which in turn can preclude the need The ability to support multiple displays tecture simplifies design complexity for fan cooling within digital signage simultaneously from a single digital through a reduction in embedded board layers, enabling digital signage designers to achieve aggressive form factor goals while driving down overall system cost (Figure 2).

By providing native, high-performance graphics processing at the silicon level, APUs also preclude the need for right-edge connectors that are usually required by add-on graphics cards. In space-constrained designs, an edge connector takes up more space (card-edge boards are typically 3" to 5" taller) and exposes the board to additional shock and vibration that can lead to signal integrity issues. Designing APU-caliber graphics capabilities directly onto a carrier board is a more rugged, long-term option, ultimately yielding book-sized digital signage systems that can ﬁt into tight spaces behind wall-mounted video CONTROLLER APU displays. HUB

Power and cooling considerations For retailers deploying high-end digital Figure 2 | The reduced two-chip architecture of APUs plays well into the tight space signage systems using high-performance requirements of small form factor COTS boards.

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 17 IT'S A SMALL (FORM FACTOR) WORLD

signage system is emerging as a key conservation, as well as power and source for each display, DisplayPort only requirement for realizing immersive, cost efﬁciencies. requires a single reference clock source eye-catching displays and independent to drive as many DisplayPort streams as multimedia content feeds. But many As mentioned previously, the on-die GPU there are display pipelines in the pro- designers remain challenged to unlock in APUs utilizes the Video Electronics cessing platform. the full promise of multi-display digital Standards Association’s (VESA’s) royalty- signage, and are therefore limited in free DisplayPort connectivity standard Signage systems with advanced APU- their ability to transcend conventional to interface high-definition displays, enabled multi-display capabilities can “single screen” visual experiences in DisplayPort is built upon a micro-packet therefore be optimized to present mul- favor of panoramic, “surround sight” architecture that enables the addressing tiple feeds of dynamic video content display configurations. Today, many and control of several displays through cycling across multiple independent digital signage systems require one one DisplayPort connector, otherwise displays, or present a single multimedia controller to power each individual known as daisy-chaining. Where DVI and feed distributed across a multi-panel screen – far from ideal in terms of space HDMI both require a dedicated clock display, both in full HD resolution. In the case of AMD R-Series-based embedded boards, up to four displays are supported from a single APU. AMD R-Series APUs also feature an option to include an additional onboard AMD Radeon GPU, which can be utilized in combination with the APU to power up to ten screens using AMD EyeFinity technology.

Accelerating digital signage With APUs at the heart of a new generation of x86 embedded boards and modules, digital signage OEMs and customers alike are afforded dramatic gains in both media performance and space savings, with additional power and cooling efﬁciencies and multi-display ﬂexibility rounding out the value prop- osition. In this way, APUs are enabling digital signage developers to provide visually-arresting multimedia capabilities that exceed those of traditional static and/or single-screen signage systems built on conventional processing platforms.

Dave Jessel is a Sr. Product Marketing Manager of the Broadbase Market Development team at AMD Embedded Solutions.

AMD [email protected] www.amd.com/embedded

[1] Calculated SP GFLOPs = (Number of x86 cores * (128-bit (FPUs)/32-bit (SP Operation)) * CPU Base Frequency) + (Number of shader units * (64-bit (shader)/32-bit (SP Operation)) * GPU Max Frequency)

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ZigBee Application Proﬁles converge to bring smart energy home Q & A

Q&A with Thomas Barber, Silicon Laboratories, and Mark Grazier, Texas Instruments

In the context of the residential space, the term “smart energy” can be in reference either to the intelligent infrastructure that powers the home, or the smart energy products and applications that reside within it. Silicon Labs’ Thomas Barber and Mark Grazier of Texas Instruments explain how ZigBee Smart Energy, Home Automation, and related features are coming together to provide convenience and energy savings on both sides of the utility meter.

SFF: What are the steps that the battery life and data updates. In addi- such as gas meters, with a 20-year ZigBee Alliance has taken to ensure tion, the ZigBee protocol does not battery life. inexpensive, low-power solutions for require any resynchronization of the wireless communications? sleeping end device when it wakes, so SFF: What have been the Alliance’s GRAZIER: The concept of a ZigBee the data transfer to its parent is very form factor considerations with mesh is to rely on other devices to route efﬁcient. On average, ZigBee nodes ZigBee modules, and what must messages to end devices that for what- consume 100x less power than Wi-Fi and small form factor developers account ever reason can’t be connected directly 10x less power than Bluetooth. for when planning to incorporate via a star or point-to-point system. By ZigBee modules? having devices route messages through ZigBee is a hybrid-mesh network that GRAZIER: From a form factor perspec- other participants, we can lower the includes powered routers and battery- tive, the ZigBee Alliance has spent a lot total average current consumption powered end devices. When an end of time making sure we don’t have a lot of without polluting or putting excess device sends a message to its parent, external components outside of the radio radio energy out in the space; in other the parent is then responsible for for the matching network. We’ve chosen words, we don’t have to shout when we ensuring the data reaches its destination IEEE 802.15.4 technology, which in very can whisper. in the network. If necessary, the mes- specific terms uses Direct-Sequence sage is retried by the parent device to Spread Spectrum (DSSS) modulation; The intent here is to create a low-power ensure delivery. This allows the battery- in layman’s terms what we’re doing is mesh network. What we want to do is operated device to minimize its awake smoothing the amount of energy sent out keep end devices off and only powered time while still providing reliable com- in a particular transmission in a way that when they need to send some sort of munications. In addition, parent devices the receiver can pick it up and quickly message, something has fallen out of can hold messages for sleeping end acknowledge it, and then have the trans- exception, or when we want to initiate devices, which allows the end device to mitting or far device turn back to sleep. a transaction, at which point the device wake and retrieve messages over one will turn on, report its data, and then go hop rather than wait for the messages BARBER: Since the limiting factor in back to sleep. to transfer across the network. This mini- many designs is the size of the battery, mizes the on time for the end device and low power consumption is a key factor BARBER: The ZigBee communications increases battery life. in small form factor designs. The area protocol was designed to allow sleeping required for two AA alkaline batteries is end devices to control their battery Using these techniques, designers have almost 10x larger than the area required life. Sleeping end devices set their own built devices with 5-7 year battery life for a single coin cell (CR2032) battery, so schedule for waking and interacting using standard batteries. Using spe- there is a strong desire to use coin cell with the network to allow designers to cialized low-leakage batteries, manu- batteries. However, a typical coin cell determine the proper balance between facturers are building long-life devices, battery has a capacity of 225 mAh and a

20 S Spring 2013 S PC/104 and Small Form Factors Resource Guide peak current of 15-20 mA. To achieve a for devices so they can interoperate. ZigBee Home Automation, Building 10-year battery life, the average power Bluetooth also has defined “profiles” Automation, and Smart Energy all use consumption of the device must be less to enable devices to interoperate. the ZigBee PRO communications pro- than 2.5 µA, which means the circuit However, since Bluetooth has evolved as tocol, so in theory all Home/Building must have extremely low leakage and a PC and mobile phone standard, most Automation and Smart Energy devices support low-duty cycle transmission. To of the Bluetooth profiles define connec- could reside on the same network and keep the peak current under 15-20 mA, tions between a PC or mobile phone and exchange messages. In practice, the the transmit output power must be a Bluetooth peripheral. Since ZigBee utility companies manage the Smart limited to 3-6 dBm. has always been focused on low-power Energy network and tightly control wireless sensing and control networks, access to that network, so a typical Achieving good performance in small ZigBee has defined Applications Profiles home or business would have a ZigBee form factor RF designs can be chal- for applications such as Smart Energy, Smart Energy network and a ZigBee lenging. As the size of the antenna is Home Automation, and Lighting. Home/Building Automation network. reduced, the efficiency is reduced. The 2.4 GHz frequency band used by ZigBee is ideal for small form factors because a high-efficiency 2.4 GHz antenna requires less than half the area of an equivalent TAKE YOUR VIRTUAL ENVIRONMENT TO THE EDGE antenna for one of the sub-GHz Industrial, Scientific, and Medical (ISM) frequencies. When the RF components are closely spaced, the amount of interference is increased. This increase in interference can be mitigated by using a single-chip solution where all of the RF and processing is integrated in a single device. A single-chip solution also requires less PCB area, which enables smaller form factors.

ZigBee is a wireless networking standard, so developers must be aware of the RF regulations in their target market. The 2.4 GHz ISM frequency band used by ZigBee is available worldwide, but the maximum output power varies by region. Even though the 2.4 GHz ISM The RES-mini Ruggedized Small Form Factor Server band is unlicensed, ZigBee devices Designed for demanding environmental conditions where Size, Weight, and typically must be certified by the local Power (SWAP) optimization is severely limited, the RES-mini combines the regulator such as the FCC in the U.S. robust design of the RES server family and the latest E5 1600 and 2600 Intel There are a number of test houses than Xeon processors (four, six, or eight cores). Designed to be fully compatible with popular virtualization technologies including VMWare® and Citrix® can provide certification services. XenServer®, the RES-mini brings next generation technology to mission-critical military, commercial, and industrial applications. SFF: What is the significance • Intel® Xeon® processor (four, six, or eight cores) of ZigBee’s Applications Profiles, • Up to 256 GB DDR3 ECC and what is the relationship of • Eight 2.5 inch drive bays • Two expansion slots the Smart Energy Profile to home • 3 axis, 35G, 25ms operating shock energy savings in particular? • 3.0 Grms, 8 Hz to 2000 Hz operating vibration BARBER: Unlike Wi-Fi, which is purely • 0°C – Up to 50°C operating temperature • 8% to 90% non-condensing operating humidity a data communications network, ZigBee • 15 lbs (6.8 kg) has defined Applications Profiles to 13.5 in x 4 in x 11 in • MIL-STD-810G, MIL-STD-901D, MIL-STD-167-1 (W x H x D) • Single 110/220 VAC (50/60Hz, 400Hz), single 28 allow devices to interoperate. A data VDC, or single 18 VDC power supply options communications stack only provides the method of transferring messages For current Themis product information, please, go to www.themis.com between devices, but does not define ©2013 Themis Computer. All rights reserved. Themis, the Themis logo, and RES-mini what messages should be passed are trademarks or registered trademarks of Themis Computer. All other trademarks are the property of their respective owners. between devices. ZigBee Applications Profiles define a common “language”

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 21 THE BIG YET SMALL PICTURE

GRAZIER: When we talk about the Smart Energy Proﬁle what we’re really talking about is the ability for energy providers to reduce total demand. The way we can do that is if the devices in the home can report back on how much energy they’re using to the consumer, Solar Energy the consumer can take action by either reducing the amount of time they’re on or switching to off periods to get a cost savings.

There’s a clear differentiator between the smart grid that goes to the meter from the energy generation facilities, and from the meter inside the home. Figure 1 | Though complementary, ZigBee Smart Energy and Home Automation From a regulatory and business model reside on opposite sides of the utility meter. The Home Automation Profile perspective, the electric market wanted facilitates communications between devices on the Home Area Network (HAN) a clear firewall between the meter and and the utility meter, while Smart Energy controls communications from the the devices in the home because they meter to the energy provider. did not want to incur the maintenance responsibility of deploying to an issue and enables the use of self-powered BARBER: Self-powered devices can inside the home like a broken ther- devices (Figure 2). To enable lower reduce installation and maintenance mostat. So as a result, Smart Energy power operation, the communications costs and are environmentally friendly. is about how we control devices from protocol was redesigned to scale to Since no wires are required, Green the meter into the home via the energy the amount of energy available. For a Power devices can be added to existing service portal or firewall (Figure 1). device like an energy harvesting switch systems without the need to run new that produces a short burst of power wiring through existing structures. For The original ZigBee PRO stack supports only when used, the protocol reduces to new construction, the amount of wiring both the domain that resides within the transmitting as many times as the avail- can be reduced, saving both material electric meter communicating to the able energy allows. For a device that and labor costs. Since Green Power utility provider, and it also supports the uses a solar cell with an energy storage devices do not include a battery that Home Area Network (HAN). Basically, device, the accumulated energy can be needs to be replaced, they are virtu- 99 percent of all of the devices in the tracked, and two-way communication is ally maintenance free and eliminate the home will be on the Home Automation possible if the energy is available. need to dispose of discharged batteries. Profile side of this, whereas the Smart Energy side is really just how the elec- GRAZIER: The idea is that a green SFF: How are the various Profiles tric meter and the gas meter report power device does not have a battery and features working together to their data back. So it’s no surprise that so it has to get its energy somewhere – enable ubiquitous connectivity, and the Department of Energy funded the in most cases, this is a very simple what does this mean for consumers major meter and infrastructure providers piezoelectric harvester that pushes and utilities alike? to get that piece jumpstarted. That’s an iron core through a coiled copper GRAZIER: What we’re seeing now is a really how the emphasis started in the wire to generate electricity. Within the convergence of Home Automation and Smart Energy space, as opposed to the ZigBee protocol there is a very specific Smart Energy application layers. They do Home Automation space, which is all packet that has a sync bit and preamble, reside in different locations, but some about connecting devices that hereto- as compared to Green Power that has of these devices will be sitting in the fore would really not have been logically a more truncated packet of informa- same product – a thermostat is a great connected, or if they were connected, tion. Because Green Power devices use example of that. So, ZigBee member would have been limited. smaller packet sizes, they’re typically companies are making sure that we have one-way applications that are trans- enough flash in our SoCs to accommo- SFF: What is the concept behind mitting to a proxy that’s always on and date both Profiles. Again, most cases on the recently released, battery- listening for messages from these end the Smart Energy side are just recording free ZigBee Green Power feature, switches or simple alarm systems. The how much energy you’re using through and what kind of benefits does proxy receives this telegram of infor- an in-home display so somebody can act it afford? mation saying, “I’m a light switch, I on it, or it’s passed back through the fire- BARBER: The Green Power feature just sent my packet, dim that light bulb wall to the energy utility reporting how reduces the power consumption of on the network down to a set amount much energy my home has consumed ZigBee by another order of magnitude of lumens.” today as opposed to another.

22 S Spring 2013 S PC/104 and Small Form Factors Resource Guide in most of the U.S. to connect the utility to the home. This connection allows customers to receive real-time data on their energy consumption and real-time pricing. The next step in the evolution of smart energy is development of in- home smart energy networks that can take advantage of the energy data.

The in-home smart energy network will start with relatively expensive devices such as in-home displays and smart appliances where the differential cost of adding wireless connectivity is relatively small today. As the cost of adding wireless decreases, the smart energy network will expand until the consumer can monitor each individual outlet or light ﬁxture in the home. Small, low- cost smart energy devices are required for mass deployment of in-home smart energy networks. A standard 110 V outlet costs less than $0.50 retail, while the equivalent smart energy outlet costs more than $20. Innovative solutions are required to enable the cost of smart energy devices to approach the much lower cost of standard devices.

Figure 2 | The ZigBee Green Power feature provides an additional order of The final step in the smart energy evo- magnitude of energy savings in ZigBee networks, consuming only 200 micro joules. lution is the development of monitoring and control systems that allow you to BARBER: Recently, new multi-network in general, and what kind of access your energy data and manage devices have been introduced that innovation is needed to realize your energy consumption on any device. can act as a bridge between the Smart those predictions reality? These systems will allow you to do Energy network and the Home/Building GRAZIER: We see Smart Energy and everything from remotely turning off the Automation network. The bridge device Home Automation operating in parallel oven you accidently left on when you left is typically a router on the Home/Building but very important paths. As the build the house to programming your lights to Automation network and a sleeping end out continues with electric meters using turn on and off at random times while device on the Smart Energy network, but ZigBee Smart Energy, we’re going to you are on vacation. may be a router on both networks. These see more and more devices in the home bridge devices allow a device on the network space hanging off that and Thomas Barber is the Director of Home Automation network, such as a reporting energy. For example, smart Marketing for wireless consumer smart appliance, to request billing infor- plugs where you would plug your white products in Silicon Labs’ Embedded mation from the Smart Energy network. hood appliance or a light into a wall Systems group. switch can be installed on a network very For the utility, a bridge device allows quickly. As these devices become more Mark Grazier is the program the consumer to access the energy and more prevalent on the Smart Energy manager wireless sensor networks data without the utility company pro- side, we’re going to see many more and worldwide third party developer viding and managing a large number of Home Automation devices become part network, Low Power RF at Texas devices. For consumers, the availability of this network and offer the consumer Instruments. He is also a member of energy data from the meter allows more flexibility without having to worry of the ZigBee, EnOcean, and them to optimally manage their energy about the control lighting architecture IPSO Alliances. consumption by automatically shifting or the security wire that you have to demand, enabling them to take advan- restring through a typical system now. Silicon Labs tage of lower utility rates. www.silabs.com BARBER: We are at the beginning of Texas Instruments SFF: What do you see in the the smart energy era. Over the past five www.ti.com future of ZigBee and smart energy years, smart meters have been deployed

PC/104 and Small Form Factors Resource Guide S Spring 2013 S 23 PCI Express, PCI, and ISA Experts RTD Designs and Manufactures a Complete Line of High-Reliability Embedded Products & Accessories AS9100 and ISO9001 Certi ed

Single Board Computers Data Collection Modules Peripheral Modules • Intel Core 2 Duo, Pentium M, Celeron M • Auto-Calibrating Analog I/O • Mass Storage • Low-Power AMD Geode LX • Advanced Digital I/O • Motion Control • Rugged, Surface-Mount Soldered RAM • Simultaneous Sampling • Synchro/Resolver • Onboard Industrial Flash Disk • High-Speed McBSP • Video Control • -40 to +85˚C Operation • Pulse Width Modulation • FireWire • Incremental Encoding • USB 3.0 & USB 2.0 Specialty Modules • Opto-Isolated MOSFET • CAN Bus Bus Structures • 5-Port Ethernet Switch • User Programmable FPGA • CAN Spider • PCIe/104 • Delta-Sigma Analog I/O • Gigabit Ethernet • PCI/104-Express • Hot-Swappable Removable SATA Power Supplies • GPS • PCI-104 • User-Configurable Mini PCIe • High-Efficiency Power Supplies • GSM/GPRS/EDGE Modem • PC/104-Plus • Digital Signal Processors • Uninterruptible Power Supplies • Wireless Telematics • PC/104

Copyright © 2013 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. www.rtd.com • [email protected] The products above are just a sampling of RTD’s board-level and ruggedized packaging solutions. From low-power to high performance, RTD can tailor a system for your mission-critical application. Visit www.rtd.com to see our complete product list.

AS9100 & ISO9001 Certi ed

RTD Embedded Technologies, Inc. 2013 RESOURCE GUIDE

Welcome to the PC/104 and Small Form Factors 2013 Resource Guide!

If there’s one thing for certain in computing, it’s that size DOES matter. In all aspects of embedded, getting the most performance out of the smallest footprint is critical to reducing power, shedding heat, and cutting costs, three aspects of design that won’t be going out of style.

Whether you prefer Computers-On-Module or Single Board Computers, proven PC/104 or cutting-edge COM Express, the PC/104 and Small Form Factors 2013 Resource Guide contains solutions from across the SFF space to help combat the demanding Size, Weight, Power and Cost (SWaP-C) constraints of today’s embedded applications. We hope that what follows is instrumental in helping you realize your aggressive form factor goals.

Sincerely,

Brandon Lewis, Associate Editor [email protected]

2013 PROFILE INDEX

ACCES I/O Products, Inc...... I/O Boards ...... 35-37 ADL Embedded Solutions Inc...... PC/104 ...... 45 28 ADLINK Technology, Inc...... Application Speciﬁc ...... 27 ADLINK Technology, Inc...... COMs and SOMs ...... 29 Alphi Technology Corporation ...... Interface and Expansion ...... 37 29 Avnet Integrated, Inc...... COMs and SOMs ...... 29 Connect Tech, Inc. (CTI) ...... Mezzanines and Carriers ...... 38 Connect Tech, Inc. (CTI) ...... PC/104 ...... 40, 44 35 Diamond Systems Corporation ...... SBCs and Boards ...... 46 EMAC, Inc...... COMs and SOMs ...... 32, 34 ICOP Technology, Inc...... SBCs and Boards ...... 47 37 Micro Technic, A/S ...... SBCs and Boards ...... 47 MSC Embedded ...... COMs and SOMs ...... 31, 34 PEAK-System Technik GmbH ...... PC/104 ...... 41-44 38 Sensoray Co., Inc...... PC/104 ...... 45 Sundance DSP Inc...... PC/104 ...... 46 Technologic Systems ...... Complete Systems ...... 28 39 Technologic Systems ...... COMs and SOMs ...... 30, 33 WinSystems, Inc...... Application Speciﬁc ...... 27 40 WinSystems, Inc...... I/O Boards ...... 36 WinSystems, Inc...... Packaging ...... 39-40 WinSystems, Inc...... PC/104 ...... 41-43 46 Extreme Engineering Solutions (X-ES) ...... COMs and SOMs ...... 31, 32

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WinSystemsInc smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 Facebook: , Linux, and other x86 RTOS ® i7 Processor ™ : WinSystems, Inc. : [email protected] : [email protected] : WinSystemsInc • • WinSystemsInc : Gen3 Core PC/104 and Small Form Factors Resource Guide ® Contact LinkedIn Contact Twitter Small SWaP2C2-efficient Sealed Enclosure Small SWaP2C2-efficient Three Digital DisplayPort/HDMI/DVI Simple Expansion and Configuration Intel Soldered DDR3L-1333 8GB – Up to 16GB RAM Quad Gigabit Ethernet Ultra-Fast 12GB/s Solid-State-RAID with Secure Erase 16-lane 3rd Generation PCI Express to optional GPGPU Two Gigabit Ethernet channels on a PC/104-Plus module Gigabit Two POE compliant Each channel is IEEE 802.3at/af PSE applications Up to 25W for single port Next Page capability Auto-Negotiation with support IEEE 802.3x-compliant full duplex flow control 64Kbyte Rx and 8Kbyte Tx packet FIFO per channel Support for Windows -40°C to +85°C temperature operation Models: PPM-GIGE-2-POE and PPM-GIGE-1-POE

FEATURES › › › › › › › › FEATURES › › › › › › › › › 3rd gen- ® Computer System ™ Plus compliant dual Military and Aerospace COTS Military and Aerospace COTS Communications and Networking and Communications : : lives the power of Intel ™ www.adlinktech.com www.WinSystems.com Application Speciﬁc Application Speciﬁc Application i7 processor and optional GPGPU parallel processing High Performance Extreme Rugged

™ HPERC’s standards-based design provides a non-proprietary HPERC’s with ultimate cost/value ratio. The system’s rugged capabilities with ultimate cost/value ratio. The system’s HPERC-IBR – eration Core solution engine. Dual removable Secure Erase RAID-0 SSDs provide a screaming 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC reserves connector pins for expansion interfaces. GPGPU sits on a 16-lane 3rd generation PCI Express a wide Uniquely-keyed MIL-DTL-38999 connectors provide interface. array of fast I/O. are ideal for ground, air, and sea deployments. HPERC systems survive are ideal for ground, air, shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes. Inside the tiny footprint of HPERC ADLINK Technology | 408-360-0200 ADLINK Technology Sealed, Rugged COTS Computing Platform and rugged form factor standard Built around the emerging SWaP 75, VITA WinSystems’ PPM-GIGE-2-POE is a WinSystems’ PPM-GIGE-2-POE PC/104- module with Power over Ethernet (POE) channel, Gigabit Ethernet module can provide power to two 802.3af/ PSE support. This add-in up from an external DC source supporting at compliant POE devices to 25W each. triple-speed IEEE Gigabit Ethernet controllers combine The module’s Ethernet transceivers. It offers high-speed 802.3 compliant MAC and the 32-bit 5 UTP cable. The device supports transmission over CAT host communications and is compliant with PCI v2.2 interface for for 10/100Mbps Ethernet and the IEEE the IEEE 802.3 specification 802.3ab specification for 1000Mbps Ethernet. with or WinSystems also offers single and dual channel, without the POE supply. WinSystems, Inc. | 817-274-7553 Dual Gigabit Module with POE PSE Module with POE Dual Gigabit PC/104-Plus PC/104 and Small Form Factorsesource R Guide 28

Technologic Systems| 480-837-5200 Industrial Touch PanelComputers peripherals. Quantity100startsat$599. functionality tomanyofTechnologic Systemsoff-the-shelfPC/104 also includesa64pinPC/104busthatcanbeusedtoexpandthe XBee socket,DIO,I2C,builtinspeaker, andRTC.TheTS-TPC-8900 2 Ethernetports,1PoE,USBRS232,uptoRS485 an The TS-TPC-8900isapanelmountcomputerthatfeatures 10.4” 800x600-TS-TPC-8900Touch ScreenComputer mountable plasticenclosure.Quantity100startsat$345. This touchscreen computer isfully enclosed inalowcostDIN Multitech Cellularmodemorabuiltinwireless802.11BGN adapter. 1 USB,builtinspeaker, RTC,XBeesocket,andsupportfora The TS-TPC-8380includes1ModbusRJ45,2Ethernetports, Computer 7” 800x480-TS-TPC-8380LowCostFullyEnclosedTouch Screen A/D. Quantity100startsat$415. CAN ports,DIO,I2C,builtinspeaker, RTC,and6channelsof16-bit ports, 1PoE,4USBHost3RS232,upto2RS485 The TS-TPC-8390isapanelmountcomputerthatfeatures2Ethernet 7” 800x480-TS-TPC-8390Touch ScreenComputer TS-4800 –800MHzCortex-A8with256MBRAM TS-4710 –1066MHzARM9with512MBRAM TS-4700 –800MHzARM9with256MBRAM SOCKET Macrocontrollers enabled TS- three video choice of support a touchscreens All 3 path betweenpowerefﬁcientandhighperformancemodules. rocontrollers (computeronmodules)thatallowasimplemigration Systems TPCsarepoweredbyfanless,lowpowerTS-SOCKETMac- range offeaturesandindustrystandardconnectors.Technologic and point-of-saleterminals.Theyofferanexcellentvaluewithafull industrial automation,homeself-servicemachines, such as interface, screen human touch applications requiringa ARM CPUswithhardwarevideoacceleration.Theyareidealfor Technologic SystemsoffersthreeindustrialTPCspoweredby S

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PC/104 and SmallFormFactors ResourceGuide Complete Systems www.embeddedARM.com : Other CompleteSystems FEATURES FEATURES › › › › › › › › › › › › › › › › › › › › › ›

Resistive touchscreen DIO I2C SPI Stereo AudioOutputJack Mono speakeronPCB RS-485 RS-232 ports CAN USB ports Dual Ethernet Debian Linux Fast Startup(under3seconds) Programmable FPGA MicroSD slot 256MB SLCXNANDorDoubleStoreSD Up to512MBRAM 1066MHz or800MHzARMCPU Fanless operationfrom-20°Cto+70°C Tough powdercoatedﬁnish Gasketed construction LED backlitdisplay www.embeddedarm.com/Ind-Ctrl Contact : [email protected] Touch PanelComputers $415 qty 100 start at smallformfactors.com/p99 10261 PC/104 and Small Form Factorsesource R Guide 29

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™ smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 i7/i5/i3 Processor ™ QM77 Express Chipset ® : [email protected] Quad or Dual Core PC/104 and Small Form Factors Resource Guide ® [email protected] Contact 1 x Ethernet port (10/100/1000) 2-compatible pinout PICMG COM Express Type Carrier Board available for rapid startup MicroATX Extended availability assured, 3rd-party integration welcome Supports AMD Socket S2 processor family including AMD Turion 64 X2 dual-core mobile and Mobile AMD Sempron Up to 4GB DDR2 SDRAM VGA, option TV Out Video – Dual-channel LVDS, AC'97 audio interface, optional HD Audio 4 x PCI Express interfaces (x8, x1, x1, x1) 8 x USB Ports II Ports 4 x SATA Intel Mobile Intel DDR3 SDRAM at 1600MHz Up to 16GB Dual Channel (DDI) for DisplayPort /HDMI/DVI/ Three Digital Display Interfaces SDVO x16 (Gen3) for graphics (or general Seven PCIe x1, one PCIe purpose x8/4/1) four USB 3.0, 6 Gb/s, Gigabit Ethernet, 3 Gb/s, two SATA SATA Two four USB 2.0

FEATURES FEATURES › › › › › › › › › › › › › › › › › X2 TL-62. ™ Advance Vector Advance Vector ® COM Express COM Express COM : : i7/i5/i3 processor support- ™ Core ® www.adlinktech.com COMs and SOMs COMs and SOMs and COMs AVX v1.0), with its improved Floating Point Intensive AVX ® www.avnetintegrated.com/pinnacle_home/ 2100+ to the dual-core muscle of the AMD Turion HD Graphics integrated on the CPU with three independent HD Graphics integrated on the CPU with three ™ ® Applications, and offers the benefits of increased bandwidth provided Applications, and offers the benefits of increased by USB 3.0. ing Intel design is fully compliant with PICMG The Computer-on-Module 2 specifications, offering a large variety of inter- COM Express Type graphics, and data, audio, high-resolution faces for high-speed companion COM Express Carrier Board (COMX-CB) more. Avnet's provides a plug-and-go platform with physical ports for virtually all of the I/O types supported by the COM Express Module. Avnet Integrated, Inc. | (614) 748-1150 Avnet AMD Socket S1 COM Express Module ADLINK Technology | 408-360-0200 ADLINK Technology Extensions (Intel The Express-IB features an Intel Intel displays. The Express-IB also supports Express-IB form factor provides value by enabling The COM Express modular based on pricing and performance multi-vendor board customization risk by enabling easy upgrades without requirements, and reduces baseboard. touching the customized 6 module performance COM.0 R2.0 Type Express-IB high ADLINK’s digital signage medical, government, military, targets applications in markets, and is ideal for those customers and communications performance and graphics requirements with advanced processing time by outsourcing the base design looking to reduce development on application functionality. of their system and focusing Avnet's AMD Socket S1 COM Express Module (COMX-S1) is a AMD Avnet's low cost, compact, embeddable computing core with the capability to drive a broad range of OEM applications. Built around AMD’s x86-based Socket S1 processors, it enables 64-bit computing at a progression of performance levels from the ultra-low-power AMD Sempron PC/104 and Small Form Factorsesource R Guide 30

Technologic Systems| 480-837-5200 Technologic SystemsIndustrialControllers Perl, oranylanguagesupportedby Debian. servers, webandcustom applicationsinJava,PHP, Python, supported, allowingsophisticatedsoftwaresolutionssuchasdatabase SLC XNANDdrive,foraguaranteedbootup.FullDebianLinuxisalso kernel canbeloadedfromaDoubleStoreSDcardoranindustrial onds, allowingyourapplicationtostartworkingimmediately. TheLinux Technologic SystemsIndustrialControllersbootLinuxinunder3sec- Software Verilog projectsformostcontrollers. do theirownFPGAdevelopment,Technologic Systemshasopen-core elegant andcosteffectivesolution.Forourcustomerswhoprefer to integrate thatfunctionalityintoacustomFPGAconﬁgurationfor an digital counters,orothercustomlogic.Technologic Systemscan interfaces, PWMoutputs,quadraturedecoding,CAN,pulsetiming, solution forapplicationsrequiringadditionalUARTs, non-standardbus Our industrialcontrollerproductsfeatureFPGAsmakingthemanideal FPGA Flexibility high speedcommunicationupto4096Kbaud. lers andperipheralssupportlegacymodbuscommunication,aswell cate withmultipleperipherals.Technologic Systemsindustrialcontrol- that allowspoweranddatatobesentoverasingleCAT5 tocommuni- Technologic Systemscontrollersfeaturea2W-Modbus RS-485port Modbus Peripherals TS-8820-BOX ispricedat$588(qty100),includingtheenclosure. H-bridges, relays,isolatedCAN,RS-232,andRS-485. terminals ontheTS-8820-BOXbringout16I/O-ADC,DAC,optional while protectingthemoresensitiveelectronics.120screw terminals a ruggedextrudedaluminumenclosurethatexposestheI/Oonscrew trial applications.Thiscontrollerfeaturesan800MHzCPUhousedin The TS-8820-BOXisapowerfulsolutionforwidevarietyofindus- The TS-8820-BOX TS-7520-BOX alsofeaturestheCavium250MHzARM9processor. channels, pulsecounters,CAN,RS232,and2ModbusRJ45ports.The available through12RS485ports.ThisincludesDAC,8x12-bitADC The TS-7520-BOXisaversatilesolutionwithverydenseI/O The TS-7520-BOX 8 ADCisalsoavailable. and 50 DIO ADC. TS-7520-BOXwith inputs, isolatedoutputs,and4 ing theplasticenclosure.Screwterminalsbringout16I/O-isolated ARM9 architecture,theTS-7558-BOXispricedat$199(qty100)includ- trial controlapplications.DesignedaroundthematureCavium250MHz The TS-7558-BOXisacompletesolutionforextremelylowcostindus- The TS-7558-BOX can beimplementedatlowcostwithaminimalnumberofcomponents. With Technologic Systemscontrollers,anintelligentautomationsystem trial processcontrol,TS-8820-BOX,TS-7558-BOX,andTS-7520-BOX. Technologic Systemsoffersthreepowerfulcomputerstargetingindus- S

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PC/104 and SmallFormFactors ResourceGuide COMs andSOMs www.embeddedARM.com : COM Express FEATURES › › › › › › › › › › › › › › › › FEATURES

ARM CPUsfrom1066MHzto250MHz DIN mountoption User-programmable opencoreFPGA Industrial DoubleStoreﬁlestorage Industrial SLCXNANDdrive RS-232, RS-485,CAN USB Hostports PoE capable10/100Ethernet Digital counters 16-bit or12-bitADC Opto-isolated digitalI/O Rugged industrialscrew-downconnectors Expandable ModbusTemperature Sensors,DIO,ADC 2W-Modbus RS-485 Program inC/C++,ormanyotherlanguages Fanless operationfrom-40°Cto+85°C www.embeddedarm.com/Ind-Ctrl Contact : [email protected] Industrial Controllers $199 qty 100 start at Picture ofTS-8820-BOX smallformfactors.com/p99 10306 PC/104 and Small Form Factorsesource R Guide 31

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smallformfactors.com/p368773 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 x1 lanes ™ : [email protected] Ivy Bridge with Core™ i7, i5, and i3 offerings Ivy Bridge with Core™ i7, HD Graphics 4000 7-Series PCH PC/104 and Small Form Factors Resource Guide ® ® ® [email protected] Contact twitter.com/XES_INC UEFI Firmware Intel Intel Intel dual channel Up to 16GB DDR3-1600 SDRAM, interfaces mass storage Four SATA-300 interfaces Three DisplayPort/HDMI/DVI interfaces Embedded DisplayPort Two and CRT interface (24-bit, dual channel) LVDS independent display support Triple DirectX 11, OpenGL 3.1, OpenCL 1.1 Resolution up to 2560x1600 Seven PCI Express Four USB 3.0 and four USB 2.0 interfaces Three Gigabit Ethernet ports Serial ports Two USB 2.0 Port Up to 256 MB of NOR ﬂash (with redundancy) Up to 16 GB of NAND ﬂash Freescale QorIQ P2010 and P2020 processors with dual PowerPC e500v2 cores at up to 1.2 GHz or conduction-cooled Air- Extended shock and vibration tolerance Up to 8 GB of DDR3-800 ECC SDRAM x2 PCI Express interface x1 PCI Express interface

FEATURES › › › › › › › › › › › › › › › › › › › › › › › › › FEATURES processors brings triple processors brings triple COM Express COM COM Express ™ : : www.mscembedded.com xes-inc.com COMs and SOMs and COMs COMs and SOMs MSC Embedded | 650-616-4068 MSC C6B-7S The design of the MSC C6B-7S module is based on Intel‘s 22nm CPU C6B-7S module is based on Intel‘s 22nm CPU The design of the MSC for embedded highest performance levels the enabling technology, generation of Core applications. The 3rd independant display support, DirectX 11, fast DDR3-1600 memory support, DirectX 11, fast DDR3-1600 memory independant display module. Different Core i3, i5, i7 and and USB 3.0 on a compact an are supported by this design. Besides Celeron processors C6B-7S offers MSC and features, the interfaces set of extensive for CPUs and graphics controllers, accel-turbo boost capabilities securitydecoding and hardware based / erated video encoding Computing Group). of TCG (Trusted compliant to the requirements 6 pin-out allows direct access to the latest digital The Type new and DVI. USB 3.0 inter- display interfaces like DisplayPort, HDMI currently available. faces support the fastest peripheral devices The XPedite5550 is a ruggedized COM Express module that com- plies with the COM Express Compact x 95mm) form factor (95mm 5 pinout. COM Express provides a and supports an enhanced Type range to a wide bring processing form factor to standards-based of applications. With dual PowerPC e500v2 cores running at up to 1.2 GHz, the P2020 delivers enhanced performance and efﬁciency for today's network information processing and other embedded computing applications. The XPedite5550 provides a high-performance, feature-rich solution for current and future generations of embedded applications. For customers seeking lower overall power consumption, the XPedite5550 can be designed with the Freescale P1020 processor. Operating system support packages for the XPedite5550 include and Linux 2.6. Green Hills INTEGRITY, Wind River VxWorks, Extreme Engineering Solutions | 608-833-1155 XPedite5550 Freescale QorIQ P2020 COM Express Module XPedite5550 Freescale QorIQ P2020 COM Express PC/104 and Small Form Factorsesource R Guide 32

EMAC, Inc.| 618-529-4525 SoM-9x25 reduced cost.Quantity1pricebeginsat$180. provides theﬂexibilityofafullycustomizedproductatgreatly components thatmayberequired.TheSystemonModuleapproach carrier board containing all theconnectors and any additional I/O The SoM-9x25isdesignedtoplugintoacustomoroff-the-shelf Timer/Counters, A/D, DigitalI/Olines,Clock/Calendar, andmore. Memory, SerialPorts,Ethernet,SPI, I2C,I2SAudio,CAN2.0B,PWMs, ARM processorcoreisincludedonthistinyboard,including:Flash, and istheidealprocessorengineforyournextdesign.Allof small SODIMMformfactorutilizedbyotherEMACSoMmodules, Designed andmanufacturedintheUSA,SoM-9x25usessame Extreme EngineeringSolutions|608-833-1155 XPedite7450 Intel Microsoft Windowsdrivers. and LinuxBoardSupportPackages(BSPs)areavailable,aswell face (UEFI)BIOScustomizedwithBITsupport.WindRiverVxWorks Extensible FirmwareInter-The XPedite7450usesthelatestUniﬁed environments, whileprovidinganupgradepathforthefuture. form factormaketheXPedite7450perfectforportableandrugged and militaryapplications.Thesmallfootprintstandards-based processing-intensive requirementsoftoday’s commercial,industrial, of applications.TheXPedite7450isidealforthehigh-bandwidthand standards-based formfactortobringPCprocessingawiderange Core i7processorandIntelQM67chipset.COMExpressprovidesa on the2ndgenerationIntelCorei7processoror3rd The XPedite7450isanenhanced,Type 6COMExpressmodulebased S

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PC/104 and SmallFormFactors ResourceGuide ® Core COMs andSOMs COMs andSOMs www.emacinc.com ™ i7COMExpressModule xes-inc.com : : Other COMsandSOMs CM Express COM 368591 FEATURES › › › › › › › › › › › › › › › › › FEATURES

2 SPI&I2Cports,CAN2.0B 1I2SAudioport SD/MMC FlashCardInterface Device port 2 USB2.0(FullSpeed)Hostports&1 6 serialports,3withhandshake 10/100 BaseTEthernetwithon-boardPHY(2ndOptional) 400MHz Processor Wide-temperature SoM-9X25basedontheAtmelAT91SAM9X25 enhancements Intel HighDeﬁnitionAudioport Two digitaldisplayinterfaces(DP/DVI/HDMI) Six SATA 3.0Gb/sports Four USB2.0ports Two 10/100/1000BASE-TGigabitEthernetports ports Two x8PCIExpress,onex4andtwox1Express Up to16GBofDDR3-1600ECCSDRAMintwochannels Standard COMExpress Technology Dual- orquad-coreprocessorwithIntelHyper-Threading Intel Corei7processors Supports 2ndgenerationIntelCorei7processorsand3rd 32 MBNORbootﬂashandupto16GBofNAND http://www.emacinc.com Contact: twitter.com/XES_INC Contact : [email protected] [email protected] ™ Basicformfactorwithruggedization smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p9910299 smallformfactors.com/p368591 PC/104 and Small Form Factorsesource R Guide 33

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$92 smallformfactors.com/p99 series starts atseries starts qty 100 : [email protected] PC/104 and Small Form Factors Resource Guide Contact www.embeddedarm.com/Ind-Ctrl Dual 100-pin connectors Secure connection with mounting holes Common pin-out interface Low proﬁle with 6 mm spacing Simpliﬁes custom embedded systems Rapid design process gets products to market faster Several COTS base boards for evaluation and development Design your own base board or use our design services upgrades Macrocontrollers are interchangeable for future TS-4200: Atmel ARM9 with super low power & PCIe TS-4300: Cavium ARM11 with 25K LUT FPGA, SATA TS-4600: 450MHz at extremely low cost + 2 Ethernets TS-4710: Marvell PXA168 with video and 1066MHz CPU TS-4712: like TS-4710 + 2 Ethernets TS-4800: FreeScale iMX515 with video and 800MHz CPU available April 2013. Macrocontrollers are available now. TS-4600 Several COTS development base boards are also available. TS-TPC-8390 is available as a complete touch panel computer product using either TS-4700 or TS-4800 Macrocontroller CPUs. Prices start at $92 at quantity 100. 75 mm x 55 mm (credit card sized)

BENEFITS TS-SOCKET MACROCONTROLLER PROJECTS PRICE AND AVAILABILITY FEATURES FEATURES › › › › › › › › › › › › › › › › › › › › Other COMs and SOMs and COMs Other : www.embeddedARM.com COMs and SOMs and COMs JUMP-START YOUR EMBEDDED SYSTEM DESIGN YOUR EMBEDDED SYSTEM JUMP-START The TS-SOCKET Macrocontrollers are a The TS-SOCKET Macrocontrollers series of embed- on the TS-SOCKET connector standard. ded computers based These CPU core connect modules securely to your custom base reduced board, enabling drastically design time and com- of our embedded system design around one Start your plexity. to reduce your overall project risk TS-SOCKET Macro-controllers and accelerate time-to-market. TS-SOCKET MACROCONTROLLER STANDARD TS-SOCKET is an embedded computer standard designed and TS-SOCKET is an embedded computer standard Systems, Inc. It both a form defines controlled by Technologic based on two 100-pin factor and a connection pin-out and is connection between a low-profile connectors, allowing secure Macrocontroller and a base board. CPU board that A TS-SOCKET Macrocontroller is an embedded implements the TS-SOCKET specification. The form factor is 75 mm implements the TS-SOCKET specification. The addition to two 100-pin x 55 mm, about the size of a credit card. In feature off-board male connectors, TS-SOCKET Macrocontrollers Ethernet MAC/PHY and CPU, RAM, NAND Flash, SD Card socket, can include USB requires a single 5 V power source. Peripherals video, touchscreen, host and device, I2C, CAN, GPIO, external bus, and no moving parts All parts are soldered-on audio, SPI, and UART. reliability. are used, ensuring embedded ruggedness and of hardware, supplied A TS-SOCKET base board can be any piece by the customer or Technologic Systems, that interfaces with a by the customer or Technologic standard connectors. Macrocontroller through the dual TS-SOCKET TIME-TO-MARKET INEXPENSIVE CUSTOM DESIGNS, FAST All TS-SOCKET Macrocontrollers are designed with a common pin-out, which means that they are interchangeable. This gives the developer more options and flexibility when selecting an embedded system, since a base board can multiple Macro-be used with controllers. As an application example, a base board designed to provide video and touchscreen functionality can have its CPU easily upgraded to improve video playback performance or later as a second generation upgrade. Lower design costs and faster time-to- market directly result from the TS-SOCKET board interchangeability feature because the standardization significantly reduces design complexity. Technologic Systems | 480-837-5200 Technologic TS-SOCKET MACROCONTROLLERS PC/104 and Small Form Factorsesource R Guide 34

Flash, Memory, SerialPorts,Ethernet,SPI,I2C,I2SAudio,CAN2.0B, of theARMprocessorcoreisincludedonthistinyboard,including: modules, andistheidealprocessorengineforyournextdesign.All same small SODIMM form factor utilized by other EMACSoM Designed andmanufacturedintheUSA,SoM-3517uses MSC Embedded |650-616-4068 ARM new i.MX6CPU,offeringquad-core,dual-coreandsingle-core on Freescale’sMSC Q7-IMX6moduleisbased The designofthe MSC Q7-IMX6 EMAC, Inc.|618-529-4525 nents thatmayberequired.Quantity1Pricebeginsat$198. board containingalltheconnectorsandanyadditionalI/Ocompo- SoM-3517 isdesignedtoplugintoacustomoroff-the-shelfcarrier rotation. LikeothermodulesinEMAC'sSoMproductline,the coprocessor, and2D/3D accelerated video with imagescaling/ Calendar,more. TheSoM-3517Madditionallyprovidesamath and PWMs, Timer/Counters, lines, Video,Clock/ A/D, DigitalI/O SoM-3517M Embedded Compact7,andother OSs. kit. TheMSCQ7-IMX6moduleissupportedbyLinux,Windows MSC providesadevelopmentplatform,targetplatformandstarter baseboards. Forevaluationanddesign-inoftheQ7-IMX6modules, standard Qseveninterface,allowingsimpleintegrationwith extensive setofinterfacecontrollers.Themoduleprovidesthe to 4GBDDR3DRAM,andup8Flashmemory, aswellan Cortex-A9 CPU(single,dual,orquadcore)withupto1.2GHz, up functional integration.ItincorporatestheFreescalei.MX6ARM sumption, excellentgraphicsperformance,andahighdegree of S

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-A9 computeperformanceatverylow power con- PC/104 and SmallFormFactors ResourceGuide COMs andSOMs COMs andSOMs www.emacinc.com www.mscembedded.com : : Qseven Other COMsandSOMs › › › › › › › › › › › › › › › › › › › › FEATURES FEATURES

DualLite, Soloupto1.2GHz 2D/3D LCDVideow/Touch 10/100 BaseTFastEthernet 4 SerialPorts,2I2C&SPIports,CAN2.0BController 2 HighSpeedUSB2.0Hostports,1OTGport Up to512MBofDDR2SDRAM,2GBeMMCFlash TI ARMCortex-A8600MHzFanlessProcessor Linux andWindowsEC7Support(Android onrequest) AC’97 Audio Up to8USB2.0ports One SATA-II Interface(3Gbit/s,not forSingle-CoreCPU) Triple independentdisplaysupport Dual-Channel LVDS 18/24-bitupto1920x1200 HDMI/DVI upto1920x1200@30Hz PCI Expressx1Port Gigabit Ethernet Up to8GBNANDFlash Up to4GBDDR3SDRAM "Triple-Play" GraphicsandVideoSubsystem Freescale Qseven StandardFormFactor [email protected] http://www.emacinc.com Contact: [email protected] ™ i.MX6ARM ® Cortex ™ smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 -A9 CPU:i.MX6Quad,Dual, 10300 10431 PC/104 and Small Form Factorsesource R Guide 35

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smallformfactors.com/p365054 smallformfactors.com/p369571 [email protected] : [email protected] : [email protected] PC/104 and Small Form Factors Resource Guide Contact @accesio Follow us on Twitter Contact: @accesio Follow us on Twitter Wide range of flexible signal conditioning types Autocalibration and oversampling for real-time accurate data or external trigger A/D starts via software, timer, 16-bit analog outputs and 16 high-current digital I/O lines Two 16-bit programmable counter/timer 3.5" front panel drive bay mounting provision 32, 64, 96, or 128-channel single-ended or differential analog inputs High-speed USB 2.0 multifunction DAQ Sustained sampling speeds up to 500kHz 12 or 16-bit resolution A/D converter Flexible, software configured functionality per 8-channel 18 input ranges, 9 unipolar and 9 bipolar, programmable Rugged, industrialized, four-port USB hub Rugged, industrialized, four-port USB 3.0 and 1.1 compatible High-speed USB 2.0 device, (-40°C to +85°C) Extended temperature operation 480 Mbps Data transfer rates up to self-powered modes Supports bus-powered and (power jack, screw terminals, or Three power input connectors 3.5" drive Berg power connector) power and overcurrent fault conditions for LED status indicators for each downstream port USB/104 form factor for OEM embedded applications size and mounting OEM version (board only) features PC/104 module in parallel Includes micro-fit embedded USB header connectors with all standard USB connectors design Industrial grade USB connectors feature high-retention Small (4" x 4" x 1"), low profile, steel enclosure

FEATURES FEATURES › › › › › › › › › › › › › › › › › › › › › › › › Data acquisition Data acquisition Data : : I/O Boards I/O Boards I/O http://acces.io www.accesio.com This small industrial/military grade hub features extended temp- This small industrial/military to 85°C), high retention USB connectors, erature operation (-40°C enclosure for shock and vibration mitiga- and an industrial steel tion. The OEM version (board only) is PC/104 sized and can easily existing PC/104-based systems as well. The be installed in new or I/O it easy to add additional USB-based USB-104-HUB now makes or to connect peripherals such as exter- to your embedded system GPS, wireless and more. Real-world nal hard drives, keyboards, Automation, Embedded OEM, Laboratory, markets include Industrial and Military/Government. Kiosk, Transportation/Automotive, powered. powered or self can be bus four port hub versatile This DC power may choose from three power input connectors: You power connector (Berg). drive or 3.5" screw terminals, input jack, front panel drive bay Mounting provisions include DIN rail, 3.5" mounting, and various panel mounting plates. ACCES I/O Products, Inc. | 858-550-9559 ACCES I/O Products, Inc. | ing, analyzing, and monitoring in a variety of applications. These data acquisition and control devices can be used in many current real-world applications such analysis, as precision measurement, monitoring, and control in countless embedded applications. Multifunction DAQ-PACK Series (Up to 128 Channels) Multifunction DAQ-PACK Series is a highly integrated multifunction data The DAQ-PACK acquisition and control system. The system offers an ideal solution for adding portable, easy-to-install high-speed analog and digital I/O capabilities to any PC or embedded system with a USB port. It performs signal conditioning such as RC ﬁltering, current inputs, RTD measurement, bridge completion, thermocouple break detection, voltage dividers, small signal inputs, and sensor excitation voltage supply. Series units pro- compact, multifunction I/O DAQ-PACK The small, vide the user with everything needed to start acquiring, measur- ACCES I/O Products, Inc. | 858-550-9559 USB-104-HUB – Rugged, Industrial Grade, 4-Port USB Hub Grade, 4-Port USB – Rugged, Industrial USB-104-HUB PC/104 and Small Form Factorsesource R Guide 36

-40° to+85°C.Softwaredrivers are availableforDOS,Windows The PCM-MIOoperatesoverthe industrialtemperaturerangeof output, oroutputwithreadback. TTL-compatible digitalI/Olinescanbesoftwareconﬁguredasinput, age rangesof±5V, ±10V, 0-5V, and0-10V. Atotalof48bidirectional analog (D/A)outputswith individual software programmable volt- ±5V, ±10V, 0-5V, and0-10V. Thereare also eight,12-bitdigital-to- (A/D) inputchannels.Thesoftwareprogrammablerangesare It willsupportupto16single-endedor8differentialanalog-to-digital age referencesrequirenocalibration. put, anddigitalI/Oboard.Theboard’s precisionconvertersandvolt- The PCM-MIOis a versatile, PC/104-based analog input, out- and Linux. WinSystems, Inc. | 817-274-7553 WinSystems, Inc. |817-274-7553 Multifunction PC/104A/D,D/A&DIOModule ACCES I/OProducts,Inc.| 858-550-9559 boards forquickandeasyconnectivity. accessories includeawidevarietyofcablesandscrewterminal type B connector forstackingandembeddedapplications.Available USB headerconnectorisprovidedinparallelwiththehighretention to reducecrosstalkandmaintainindustrycompatibility. Amini pin 49ofeachconnectorwithgroundsonallevennumberedpins headers with24linesperconnector. Utility5VDCisavailableon These boardsuse2or4industrystandard50pinIDC-typeshrouded laboratory, industrialautomation,andembeddedOEM. equipment. Applicationsincludehome,portable,laptop,education, trolling external devices such as LEDsandother indicators or system is usefulformonitoringdrycontactsorgeneratingoutputscon- I/O to any PC orembeddedsystemwith a USBport. The USB-DIO-96 device isanidealsolutionforaddingportable,easy-to-installdigital uct features96or48industrialstrengthTTLdigitalI/Os.ThisUSB Designed forcompactcontrolandmonitoringapplications,thisprod- USB-DIO-96 High-DensityDigitalI/O S

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PC/104 and SmallFormFactors ResourceGuide www.WinSystems.com www.accesio.com I/O Boards I/O Boards : : Multifunction Digital ® , › › › › › › › › › › › › › › › › › › FEATURES FEATURES

mounting compatibility OEM version(boardonly)featuresPC/104modulesizeand Resettable fused+5VDCoutputsper50-pinconnector to ground,orﬂoating Jumper selectableI/Opulledupto5Vforcontactmonitoring,down I/O Bufferscanbeenabledortri-statedunderprogramcontrol capabilities All I/Olinesbufferedwith32mAsource,64mAsinkcurrent or outputs Twelve orsix8-bitportsindependentlyselectableforinputs High-speed USB2.0device,1.1backward-compatible 96 or48linesofdigitalI/O Model: PCM-MIO Long-term productavailability Product evaluationprogram Low costD/AanddigitalI/Oonly versionavailable Low costA/DanddigitalI/Oonlyversionavailable -40° to+85°Ctemperatureoperation Software driversinDOS,Windows 48 bi-directionalTTL-compatibledigitalI/Olines Two quad12-bitDigital-to-Analog(D/A) converters 16-bit 100Ksamples/secAnalog-to-Digital(A/D)converter Follow usonTwitter @accesio Contact LinkedIn Twitter Contact : WinSystemsInc • : [email protected] : [email protected] : WinSystems,Inc. Facebook: smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p364998 ® WinSystemsInc , andLinux 10502 PC/104 and Small Form Factorsesource R Guide 37

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smallformfactors.com/p349340 smallformfactors.com/p99 smallformfactors.com/p99 : [email protected] : [email protected] : [email protected] PC/104 and Small Form Factors Resource Guide Contact Contact @accesio Follow us on Twitter watchdog timer card with software selectable timeout PC/104-Plus watchdog timer card with from 4µsec reset outputs open collector Watchdog and alarm monitor, measurement, Temperature Fan status and speed control alarm interrupt PCI/104 power monitor/limit reset Opto-isolated input to trigger input, two outputs General purpose opto-isolated general purpose 8-bit A/D inputs Two External fused 5V and 12V power Light sensor for enclosure security Extended temperature (-40°C to +85°C) available Programmable 2nd order anti-alias analog ﬁlter capability with digital ﬁlter Over-sampling PCI Express compliant 8 channels 16-bit A/D converter simultaneously sampled Fast throughput rate: 200 KSps for all 8 channels 8 channels SE or 4 pseudo differentials Single-ended or 4 differential channels ±5 V – selection applies to bipolar analog input ranges: ±10 V, True all channels Analog input clamp protection 1MΩ analog input impedance

FEATURES › › › › › › › › › › › › › › › › › › › › › FEATURES Multifunction PCI Express : : I/O Boards I/O www.AlphiTech.com www.accesio.com Interface and Expansion ACCES I/O Products, Inc. | 858-550-9559 ACCES I/O Products, Inc. | and even a security light sensor that can be used to detect if theand even a security light sensor that can darkened interior of an enclosure is opened. Want more?! One general purpose optically isolated input, two more?! Want external events, two isolated digital outputs to control/switch purpose A/D inputs, non-isolated digital outputs, two general PC/104-based embedded system. Applications include kiosks, indus-PC/104-based embedded asset management and trial automation, military/mission-critical, embedded OEM, temperature measurement, tracking, retail, medical, systems. and many others which require self-reliant embedded a variety of system hardware parameters such as temperature,a variety of system hardware was designed and more. The board voltage, fan speed, humidity, peace of mind when planning your next to allow for complete Watchdog Timer Board Timer PC/104-Plus Watchdog P104-WDG-CSMA will vigilantly stand guard over board This feature-rich Watchdog help avoid costly system failures. The board your system and will as the operation of your application program can be used to monitor of and will initiate a system reset in case well as operating system P104-WDG-CSMA can monitor and controllockup. In addition, the Alphi Technology Corporation | 480-838-2428 Alphi Technology PCIe-Mini-AD8200 The PCIe-Mini-AD8200 with 1X Lane PCI Express Mini card and a simultaneously sampled A/D, offers a mix of up to 8 single-ended or 4 differential analog input channels. All channels feature programmable gain 1 or 2 and can be programmed to handle analog input with a single-ended or differential conﬁguration. The 16-bit A/D converters can provide a global acquisition and con- version time of ≤5μsec per sample per channel. The board offers a programmable digital ﬁlter with ±5 V range and the −3 dB frequency is typically 15 kHz. In the ±10 V range the −3 dB frequency is typically 23 kHz. Mini cards: PCIe- offers a variety of PCI Express Alphi Technology Mini-DA16, PCIe-Mini-1553, PCIe-Mini-ARINC429, PCIe-Mini-CAN, PCIe-Mini-DIO and more. PC/104 and Small Form Factorsesource R Guide 38

FPGA modules. data acquisition,highspeedEthernet,cellularandusercustomizable PMC, XMCorMini-PCIeadd-oncardsincludingwireless,videocapture, application-speciﬁc solutionbyselectingfromanextensiverange of board whichoffersdualPMCandXMCexpansion.Quicklycreate an small carrierwhichmatchesthesizeofaCOMExpress support thelatestinhighperformance processors,includingThird COM Express LVDS/VGA/HDMI video. 5 serialports,4xUSB2.0/3.02GigabitEthernet,8-bitGPIO,and and includesMini-PCIeexpansion,MicroSDcard,4xSATA ports, Although smallinsize,theUltraLitecarrierisalsofeature-rich (95 x125mm),makingitidealforspace-constrainedapplications. and performance. Connect Tech Inc.|519-836-1291 |800-426-8979 Generation Intel The COMExpress Connect Tech’s COMExpress COM Express Connect Tech Inc.|519-836-1291 800-426-8979 AMD, Intel Qseven CarrierBoardsofferembeddedprocessoroptionsincluding solutions. options tofull-featuredPCI-104andPCIe/104embeddedcomputing Connect Tech’s QsevenCarrierBoardsrange fromlightandlowcost Qseven CarrierBoards&SingleBoardComputers VGA video,2xRS-232andRS-422/485serialports. provide accessto2xSATA, 1xGigabitEthernet,4xUSB2.0,LVDS and I/O fromtheextensivePC/104ecosystem.Theon-boardconnectors are completelyscalableandcanbeusedwithanyindustry-standard factor, ConnectTech’s PCI-104and PCIe/104 SingleBoardComputers For applications that require deep I/Ofunctionalityanda rugged form carrier boardsofferMini-PCIeandSIM-cardexpan sion capability. able toaccommodatefuturegenerations.Thesebus-independent www.connecttech.com/sub/Products/Com-Express-Carrier-Boards.asp S

www.connecttech.com/sub/Products/Qseven.asp?l1=qseven Spring 2013 Mezzanines andCarriers Mezzanines andCarriers ® , Freescale,TI,NVIDIAandVIA,whichareeasilyupgrade-

® S Type 6PMC/XMCCarrierBoardisafeature-richcarrier ®

Type 6CarrierBoards ® PC/104 and SmallFormFactors ResourceGuide Core ® Type 6UltraLiteandPMC/XMCcarrier boards ™ i7processorsforimprovedprocessing power ® Type 6Ultra LiteCarrierBoardisaunique : : CarrierBoards Carrier Boards ® Basicmodule › › › › › › › › › › › › › › › › FEATURES FEATURES

Free technicalsupport Lifetime warranty Custom solutions Multi-vendor supportfrombothQsevenandPC/104 Scalable andcompatiblewithindustrystandardI/Ooptions -20°C to70°C(-4°F158°F),optional-40°C85°C(-40°F185°F) VGA video,2xRS-232andRS-422/485serialports Board features:2xSATA, 1xGigabitEthernet,4xUSB2.0,LVDS & Mini-PCIe &SIMCardExpansion AMD, Intel Pico-ITX, PCIe/104andPCI-104 Custom DesignServices Extended temperature,-40to+85degreesC 428mm x190mm,for1Urackmountuse 125mm x95mm,forspace-restricteduse PMC, XMC,Mini-PCIe,mSATA expansion Type 6andType 2compatibility Facebook: Twitter: www.connecttech.com • [email protected] Facebook: Twitter: www.connecttech.com • [email protected] twitter.com/connecttechinc twitter.com/connecttechinc ® facebook.com/connecttechinc facebook.com/connecttechinc , Freescale,TI,NVIDIAandVIA smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 10451 10450 PC/104 and Small Form Factorsesource R Guide 39

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WinSystemsInc WinSystemsInc smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 Facebook: Facebook: : WinSystems, Inc. : WinSystems, Inc. : [email protected] : [email protected] : WinSystemsInc • • WinSystemsInc : • WinSystemsInc : PC/104 and Small Form Factors Resource Guide Contact Twitter LinkedIn Contact Twitter LinkedIn Auxiliary 16 – 60VDC input supported Isolated voltage outputs: +5VDC, +12VDC, and -12VDC Line and load regulation ±100mV for all outputs -40°C to +85°C fanless temperature operation Long-term product availability Models: PCM-PS397-POE-1, PPM-PS397-POE-1, and ISM-PS397-POE-1 Models: PCM-PS394-500, PPM-PS394-533, and ISM-PS394-533 Models: PCM-PS394-500, PPM-PS394-533, and PC/104 POE Powered Device power supply POE input voltage: 42 – 57VDC Dual Polarity Power Sourcing Equipment (PSE) supported 802.3af/at compliant with support for Class 4 signature Dual fused inputs accept solar panel, wind turbine, Dual fused inputs accept or other DC sources 32VDC Wide input range: 9V to @ 10A (other options available) output: +5V Voltage pack UPS operation with battery MPPT charging supported for solar panels Outputs have short circuit/overload protection -40° to +85°C operation supported Custom conﬁgurations available Long-term product availability

FEATURES FEATURES › › › › › › › › › › › › › › › › › › › › Power Supplies Power Supplies Power : : highly integrated, power Plus highly integrated, power Packaging Packaging www.WinSystems.com www.WinSystems.com The PCM-PS397-POE-1 is a PC/104 compatible Power over Ethernet Powered Device (POE-PD) DC/DC supply. Configured as either an Powered Device (POE-PD) DC/DC supply. endpoint or midspan device, it is designed to extract power from a 5 Ethernet cable and conforms to the conventional twisted pair CAT IEEE 802.3af and 802.3at POE standard with two stage class detection. The PCM-PS397-POE-1 accepts positive or negative polarity power in the 42 – 57VDC range from the RJ45 Ethernet interface. It converts the power to three rails: +5VDC, +12VDC, and -12VDC. These three output power rails are available to the PC/104 and auxiliary output connectors. The PCM-PS397-POE-1 can alternatively take power from an auxiliary input power connector rather than from the Ethernet POE interface. The auxiliary input power range is from 16 – 60VDC. The PS397 is available in two additional standard configurations and can be customized for OEM applications. Available in three standard configurations, each of the modules in three standard configurations, Available cooling for extended temperature operation require only convection and not do require a heat sink. For applications such as telemetry, transportation, and security, pipelines, outdoor signage, military, solutions. these modules are cost-effective, highly-integrated WinSystems’ PC/104 and PC/104- WinSystems’ PC/104 for remote applications requiring renew- supply modules are built The PS394 series of DC/DC supplies support able power sources. panels, wind turbines, or other DC sources. two inputs from solar a controller for battery charging and These modules include for supply (UPS) operation making them ideal uninterruptable power run off the standard AC power grid. applications not able to WinSystems, Inc. | 817-274-7553 PC/104 POE-PD Power Supply Module WinSystems, Inc. | 817-274-7553 PC/104 DC/DC Modules for Renewable Energy Modules for Renewable PC/104 DC/DC PC/104 and Small Form Factorsesource R Guide 40

heat sinks. All configurationswilloperatefrom-40°to+85°Cwithoutfansor WinSystems offersthismoduleinthreeoff-the-shelfconfigurations. sets employingsleepmodesandactivepowermanagement. shutdown andpowermonitoringforSBCswithadvancedCPUchip- DC input.ThePPM-DC-ATX-P canalsosupportsoftwarecontrolled It generatesfiveregulatedDCoutputvoltagesfromonecommon 12, 24,or48voltbattery-operateddistributedDCpowersystems. voltage inputrangefrom10to50volts.Themodulewilloperate Well suited forharsh, rugged environments, it features awide ATX powercontrols. PC/104, EPIC,andEBXSingleBoardComputers(SBCs)thatsupport WinSystems’ PPM-DC-ATX-P isaDC/DCpowersupplydesignedfor Connect Tech Inc.|519-836-1291 |800-426-8979 communication. Tech’swireless for CANbus,serial, wiredand Xtreme/Multi-I/Oisideal versatile options,Connect temperature, and setup, extendedoperating and increasedsystemprotection.With USBconnectivityandjumperless tection andindividual+5VDCisolatedpowersupplies,providinglessnoise The 4xRS-232portsand1xRS-485/J1708portfeatures2500Visolationpro- capabilities. 2500V isolationprotectionandadvancednetworkingconfiguration Xtreme/Multi-I/O includestwogalvanicisolatedCANbuscontrollerswith tion oftheboard,withFPGAprovidingafull-featuredJ1708controller. On-board FPGAandPIC32microcontrollerfacilitatejumperlessconfigura- high-voltage isolationandadvancedcommunicationfunctionality. configuration, the latesttechnologiesinjumperless takes fulladvantageof board offersanall-in-onecommunicationsolution.Thisinnovativeproduct sockets onasinglePC/104boarddesign.Thishigh-densitycommunication lers, isolatedserialandCANports,twoMultiTech Universalcompatible Connect Tech’s Xtreme/Multi-I/OfeaturesdualSJA1000CANbuscontrol- Xtreme/Multi-I/O WinSystems, Inc.|817-274-7553 PC/104-Plus ATX-compatible DC/DCPowerSupplyModule S

Spring 2013 www.connecttech.com/sub/Products/Xtreme-Multi-IO.asp

PC/104 and SmallFormFactors ResourceGuide www.WinSystems.com Packaging PC/104 : : Power Supplies PC/104 › › › › › › › › › › › › › › › › › › › FEATURES FEATURES

Long-term productavailability Off-the-shelf productavailability Custom OEMconﬁgurationsavailable -40° to+85°Cfanlesstemperatureoperation Outputs haveshortcircuit/overloadprotection power managementandsleepmodes Power On/Off,Good,and+5VSBsupportedfor Voltage outputs:+5V, +3.3V, +12V, -12V, and+5VSB Wide 10Vto50VDCinputrange PC/104-Plus ATX DC/DCpowersupply Free technicalsupport Lifetime warranty Custom solutions Extended operatingtemperature 5x isolatedLEDs,1xUSB 2x MultiTech compatiblesockets 4x RS-232/1xRS-485/J1708 2x SJA1000controllers,1Mbps 2500V isolationprotection Model: PPM-DC-ATX-P Facebook: Twitter: www.connecttech.com • [email protected] LinkedIn Twitter Contact : WinSystemsInc • twitter.com/connecttechinc : [email protected] : WinSystems,Inc. facebook.com/connecttechinc Facebook: smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 WinSystemsInc WinSystemsInc 10501 10452 PC/104 and Small Form Factorsesource R Guide 41

10506 10402 ® Spring 2013

WinSystemsInc smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 Facebook: 102) ® www.peak-system.com : WinSystems, Inc. : [email protected] : WinSystemsInc • • WinSystemsInc : : [email protected] : [email protected] PC/104 and Small Form Factors Resource Guide Contact Twitter LinkedIn E-Mail Website: Channel-to-channel and channel-to-system isolation Onboard isolated 1W power supply for interface -40° to +85°C operating temperature Software drivers available for Linux and Windows Non-isolated and single channel versions are available Long-term product availability PC/104-compatible Control Area Network (CAN) card Compliant with CAN specifications 2.0A (11-bit ID) and 2.0B (29-bit ID) rates to 1 Megabits per second Transfer PC/104 form factor be operated in parallel (interrupt sharing) Multiple PC/104 cards can are available for configuration 14 port and 8 interrupt addresses using jumpers Bit rates up to 1 Mbit/s 2.0A and 2.0B Compliant with CAN specifications D-Sub slot bracket, 9-pin Connection to CAN bus through (in accordance with CiA 16 MHz clock frequency NXP SJA1000 CAN controller, NXP PCA82C251 CAN transceiver through supply to the CAN connection can be connected 5-Volt e.g. for external bus converter a solder jumper, to 185 °F Extended operating temperature range from -40

FEATURES FEATURES › › › › › › › › › › › › › › › › › › › PC/104 PC/104 PC/104 PC/104 : : and the programming interface ® PC/104 PC/104 www.WinSystems.com www.peak-system.com CAN Interface for PC/104 The PCAN-PC/104 card enables the connection of one or two CAN enables the connection of one or two CAN The PCAN-PC/104 card system. Multiple PCAN-PC/104 cards cannetworks to a PC/104 interrupt sharing. The card is available easily be operated using version. The opto-decoupled versions as a single or dual-channel the between isolation of up to 500 Volts also guarantee galvanic The package is also supplied with the CAN PC and the CAN sides. monitor PCAN-View for Windows WinSystems’ PCM-CAN-2-ISO is built for operation in high-voltage renewable energy, industrial control, or unpredictable transportation renewable energy, applications. high-speed isolated data couplers and power This PC/104 module’s supplies provide 1000V protection between its two CAN controllers and the network interface. Each CAN channel can provide isolated +5VDC power or receive isolated +5 to +12VDC power from the interface for additional flexibility. This module is offered in four off-the-shelf configurations. The PCM- CAN-2 is a dual channel, non-isolated unit. The PCM-CAN-1 is a single channel, non-isolated unit. The PCM-CAN-1-ISO is a single channel, isolated unit. Special OEM configurations are also available. WinSystems, Inc. | 817-274-7553 Dual Channel Isolated CAN PC/104 Module Dual Channel Isolated CAN PC/104 Module PEAK-System Technik GmbH PEAK-System Technik 6151-8173-29 (0) +49 Fax: • 6151-8173-20 (0) +49 Phone: PCAN-PC/104 PCAN-Basic. PC/104 and Small Form Factorsesource R Guide 42

with systemintegrationofourSBCsandI/Omodulesintheirdesigns. WinSystems providestechnicalphonesupporttoassistcustomers opment. ItsupportsLinux,DOSandotherx86operatingsystems. a widerangeoftoolstoaidinyourapplication’s programdevel- The PCM-VDX-2hasx86PCsoftwarecompatibility, whichassures an embeddedPCdesign. rugged applicationsrequiringexcellentprocessorperformancein well suitedfor is +85°C. Thisboard -40°C to from temperature range ports. Itslowpowerdissipationpermitsfanlessoperationovera two 10/100Ethernetchannels,fourUSB2.0portsandserial 512KB DRAM,and1MBbattery-backedSRAM.I/Osupportincludes that includesa1GHzVortex86DX,cations. Itisafull-featuredSBC Board Computerdesignedforspace-limitedandlow-powerappli- PCM-VDX-2 isahighly-integratedPC/104-compatibleSingle The supplied withtheCANmonitorPCAN-ViewforWindows 500 Volts betweenthePCandCANsides.The packageisalso decoupled versionsalsoguaranteegalvanicisolationofup to The cardisavailableasasingleordual-channelversion.opto- connected usinga9-pinD-Subplugontheslotbracketsupplied. be operatedwitheachpiggy-backingoffthenext.TheCANbus is two CANnetworkstoaPC/104- connection ofoneor The PCAN-PC/104-Pluscardenablesthe CAN InterfaceforPC/104-Plus Phone: +49 (0) 6151-8173-20 • Fax: +49 (0) 6151-8173-29 PEAK-System Technik GmbH programming interfacePCAN-Basic. PCAN-PC/104-Plus WinSystems, Inc.|817-274-7553 -40° to+85°CPC/104SBCwithDualEthernet S

Spring 2013

PC/104 and SmallFormFactors ResourceGuide www.peak-system.com www.winsystems.com PC/104 PC/104 Plus system.Uptofourcardscan : : PC/104-Plus PC/104 ® andthe › › › › › › › › › › › › › › › › › › › › FEATURES FEATURES

Model: PCM-VDX-2 -40°C to+85°Coperatingtemperature MiniPCI andPC/104expansionconnectors CompactFlash andPATA supported LPT, PS/2keyboardandmousesupport 16 digitalI/Olineswitheventsense Four serialRS-232/422/485channelswithFIFOs Four USB2.0portswithovercurrentprotection Two 10/100MbpsEthernetcontrollers Fanless 1GHzVortex86DX processor Extended operatingtemperaturerange from-40to185°F a solderjumper, e.g.forexternalbus converter 5-Volt supplytotheCANconnectioncanbeconnectedthrough NXP PCA82C251CANtransceiver NXP SJA1000CANcontroller, 16MHzclockfrequency (in accordancewithCiA Connection toCANbusthroughD-Subslotbracket,9-pin Compliant withCANspeciﬁcations2.0Aand2.0B Bit ratesupto1Mbit/s Up tofourcardscanbeusedinonesystem Use ofthe120-pinconnectionforPCIbus PC/104 formfactor Website: E-Mail LinkedIn Twitter Contact : [email protected] : WinSystemsInc • : [email protected] : WinSystems,Inc. www.peak-system.com ® 102) Facebook: smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 WinSystemsInc WinSystemsInc 10400 10403 PC/104 and Small Form Factorsesource R Guide 43

10401 10404 Spring 2013

WinSystemsInc smallformfactors.com/p99 smallformfactors.com/p99smallformfactors.com/p99 smallformfactors.com/p99 Facebook: 102) and other x86 operating systems ® ® Atom™ CPU ® www.peak-system.com : WinSystems, Inc. : [email protected] : WinSystemsInc • • WinSystemsInc : : [email protected] : [email protected] PC/104 and Small Form Factors Resource Guide Contact Twitter E-Mail Website: LinkedIn Four serial COM ports (two RS-232, two RS-232/422/485) Eight USB 2.0 ports with polyfuse protection (2.0) channel and CompactFlash supported SATA Runs Linux, Windows Long-term product availability Model: PPM-C393 Extended operating temperature range from -40 to 185 °F Extended operating temperature range from -40 1.66GHz N455 Intel Up to 2GB of DDR3 SODIMM supported and CRT video Simultaneous LVDS Intel Gigabit Ethernet controller PC/104 form factor for the PCI bus Use of the 120-pin connection used in one system Up to four cards can be Bit rates up to 1 Mbit/s 2.0A and 2.0B Compliant with CAN speciﬁcations D-Sub slot brackets, 9-pin Connection to CAN bus through (in accordance with CiA CAN controller (FPGA implementation) NXP SJA1000 compatible NXP PCA82C251 CAN transceiver separate for V, Galvanic isolation on the CAN connection up to 500 each CAN channel through supply to the CAN connection can be connected 5-Volt e.g. for external bus converter a solder jumper,

FEATURES FEATURES › › › › › › › › › › › › › › › › › › › › › PC/104-Plus Plus PC/104- : : PC/104 PC/104 Atom™ PC/104-Plus SBC and the programming interface and the programming , and other x86-compatible real-time ® ® ® system. Up to four cards can be Plus system. Up to four cards www.WinSystems.com www.peak-system.com Four-Channel CAN Interface for PC/104-Plus CAN Four-Channel is piggy-backing off the next. The CAN bus operated with each D-Sub plug on the slot brackets supplied. connected using a 9-pin between the computer of up to 500 Volts There is galvanic isolation is also supplied with the CAN monitor and CAN sides. The package Quad card enables the connection of four Quad card enables the The PCAN-PC/104-Plus CAN networks to a PC/104- WinSystems’ PPM-C393, featuring high-integration with WinSystems’ PPM-C393, featuring high-integration with PC/104-Plus expansion, provides a ﬂexible and cost-effective solution for demanding embedded applications. This combination provides designers access to the low power performance of Intel Atom processors and to the thousands of PC/104, PC/104-Plus, and PCI-104 modules available worldwide. It is well suited for new applications and for upgrading existing designs. The PPM-C393’s -40ºC to +85ºC operation and low power designs. The PPM-C393’s Mil/COTS, medical, trans- opens up applications such as security, portation, data acquisition, and communications in a small, rugged, form factor proven in these industries. It supports Linux, Windows WinSystems, Inc. | 817-274-7553 Extended Temperature Intel Extended Temperature PEAK-System Technik GmbH PEAK-System Technik 6151-8173-29 (0) +49 Fax: • 6151-8173-20 (0) +49 Phone: PCAN-View for Windows PCAN-Basic. Plus Quad PCAN-PC/104- operating systems. PC/104 and Small Form Factorsesource R Guide 44 www.connecttech.com/sub/Products/power-supply-solutions.asp?l1=PSU

can bestackedtogether. TheCANbusisconnectedusinga9-pin two CANnetworkstoaPCI/104-Expresssystem.Upthreecards The PCAN-PCI/104-Expresscardenablestheconnectionofone or CAN InterfaceforPCI/104-Express Phone: +49 (0) 6151-8173-20 • Fax: +49 (0) 6151-8173-29 PEAK-System Technik GmbH Windows monitor PCAN-Viewfor PC andtheCANsides.Thepackageisalsosuppliedwith also guaranteegalvanicisolationofupto500Volts betweenthe a singleordual-channelversion.Theopto-decoupledversions D-Sub plugontheslotbracketsupplied.Thecardisavailable as PCAN-PCI/104-Express Connect Tech Inc.|519-836-1291 800-426-8979 well asoperatewithoutaheatsink. allowing ourpowersuppliestofullymeetthePC/104standardas All Connect Tech power supplies are builtusing current components tional optionsincludeisolationandsmartchargingUPSsolutions. protection featurestowithstandtheharshestenvironments.Addi- ranges andupto195Wofoutputpoweralldesignedwithadvanced Choose fromanumberofpowersupplyoptionsofferingwideinput suitable formilitary, industrial,aswellairandgroundvehicles. applications, ConnectTech’srange ofrugged PowerSuppliesare use inabroad and PCIe/104.Builtspeciﬁcallydesignedfor sion busessuchasPC/104,PC104- ture capabilitiesanddirectlypowerallofthePC/104familyexpan- PC/104 formfactorpowersupplysolutionswithextendedtempera- Connect Tech’s PowerSuppliesarehighefﬁciency, highpowered Power Supplies PCAN-Basic. S

Spring 2013

PC/104 and SmallFormFactors ResourceGuide (Xtreme/PSU, Xtreme/PSU-XP, Xtreme/PSU-UPS) www.peak-system.com PC/104 PC/104 ® and the programming interface the and Plus, PCI-104,PCI/104-Express : : PCI/104-Express PCI/104-Express › › › › › › › › › › › › › › › › › › FEATURES FEATURES

Free technicalsupport Custom solutions Extended OperatingTemperature ,-40to+85degreesC (heat sinkingnotrequired) Oversized MOSFETs forimprovedthermalperformance inductors, andMOSFETs Uses latestgenerationhighestefﬁciencypowercontrollers, Meets PC/104componentheightrequirements Up to195Woftotaloutputpower Wide inputvoltageranges,from-6Vto+36VDC Extended operatingtemperaturerange from-40to185°F a solderjumper, e.g.forexternalbus converter 5-Volt supplytotheCANconnection canbeconnectedthrough NXP PCA82C251CANtransceiver NXP SJA1000CANcontroller, 16MHzclockfrequency (in accordancewithCiA Connection toCANbusthroughD-Subslotbracket,9-pin Compliant withCANspeciﬁcations2.0Aand2.0B Bit ratesupto1Mbit/s Up to3cardscanbeusedinonesystem PC/104 formfactor PCI/104-Express card,1lane(x1) Website: E-Mail Facebook: Twitter: www.connecttech.com • [email protected] : [email protected] twitter.com/connecttechinc www.peak-system.com facebook.com/connecttechinc ® 102) smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 10449 10405 PC/104 and Small Form Factorsesource R Guide 45

™ 10321 10379 Atom M, Intel ® ® Spring 2013

Pentium ® GS45 Express chipset. ® smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 processors in dual and quad core ™ Core ® 2 Duo processors 2nd and 3rd generation ™ Core ® : [email protected] : [email protected] Duo, Intel ™ PC/104 and Small Form Factors Resource Guide Contact Contact www.sensoray.com/products/911.htm variants. Peripheral possibilities include: GSM, WLAN, WWAN, GPS, Peripheral possibilities include: GSM, WLAN, WWAN, storage drives, power supplies and many more functions 3G cellular, including custom board services for specialty applications. Small stack footprints ranging from 95mm x 96mm for Intel Atom processors to 96mm x 115mm for Intel Core processors. Custom enclosures can be designed! Second generation Intel Board is drop-in compatible with future third generation Intel Core processors, codename Ivy Bridge. Extended temperature -40ºC to +85ºC available. Broad portfolio of alternate PC/104 SBCs based on Intel 4 input channels: 4 NTSC/PAL composite/S-Video + 4 stereo audio 4 input channels: 4 NTSC/PAL full frame rate video on all channels; Simultaneously captures 100 FPS for PAL up to 120 FPS for NTSC and video Captures raw RGB or YUV I/O signals are provided for controlling 4 general-purpose digital sources, alarm signal monitoring and cameras and illumination can be conﬁgurable as inputs or outputs Supports both stack-up and stack-down SDKs for both Windows and Linux Intel Core processors, and the Mobile Intel Core processors Z510/Z530, D525 and N2600, Intel

FEATURES FEATURES › › › › › › › › › › › › › processors, codename PCIe/104 PCI/104-Express ™ : : Core ® PC/104 PC/104 Processor Performance, Dual and Quad Core ™ www.adl-usa.com www.sensoray.com Core ® Intel Designed and manufactured in the USA, the Sensoray Model 911 in the USA, the Sensoray Model 911 Designed and manufactured Frame Grabber with Audio Capture PCI/104-Express 4-Channel four channels of analog video and four simultaneously captures It channels of stereo audio. captures raw video frames from each frame rate, resulting in an aggregate frame channel at up to full The 120 FPS for NTSC and 100 FPS for PAL. capture rate of up to interface, PCIe bus links of through two x1 rate, frame capture high for applications that require uncompromised makes it well-suited such video sources in a compact form factor, capturing of multiple and traffic monitoring. as remote video surveillance support both stack-up PCI/104-Express connectors The board’s to the PCI/104-Express and stack-down, and its full conformance interfere with specification guarantees that it won't mechanically adjacent boards. ADL Embedded Solutions Inc. | 858-490-0597 ADLQM67PC – The ADLQM67PC is a stackable PC/104-based form factor SBC utilizing second generation Intel Sensoray Co., Inc. | 503-684-8005 with Audio Capture Sensoray Model 911, PCI/104-Express 4-Channel Frame Grabber 4-Channel Frame 911, PCI/104-Express Sensoray Model Sandy Bridge. This small, highly-rugged form factor is ideal for applications where ruggedness and processor performance are critical. It brings unparalleled performance to applications such as radar and sonar processing, image signal processing, tactical command and control, surveillance and reconnaissance, transpor- The stackable nature of this SBC form factor tation and railway. coupled with a large ecosystem of stackable peripherals make this a perfect solution for a broad variety of transportation applications with evolving or variable specification requirements. PC/104 and Small Form Factorsesource R Guide 46

Diamond Systems Corporation|650-810-2500 Athena IIIPC/104SingleBoardComputer Americas: +1-914-495-1146|ROW: +44-1494-793-167 SUNDANCE MULTIPROCESSOR TECHNOLOGY ICE105: EmbeddedI/OProgrammableSystem 2GB ofon-boardDRAM. modifications. Specialorderoptions include1.6GHzE680TCPU,and settings, ruggedheatsinkmounting,conformalcoating,andBIOS Options includelatchingconnectors,hardwiredconfiguration cooling. AthenaIIIcanbecustomizedforincreasedruggedness. memory, full-40°Cto+85operatingtemperature,andfanless Standard Diamondruggedfeaturesincludesolderedon-board in ahighlycompactformfactorwithPC/104expansion. performance board, givingyoustate-of-the-art,rugged single onto a form factor. AthenaIIIprovidesCPUanddataacquisitionintegrated embedded computingandI/Otechnologiesinapopular, compact lar AthenaembeddedSBCseries,bringingyoulatestgeneration Athena IIIis the newest incarnation of Diamond’s highly popu- • GigE,Camera-Link,DVItransceiversforVisionsystems. • Multi-gigabitEthernetforNetworkcommunications • 2.3-5GHzRFFront-endsforWirelessapplications • High-speedD/AconvertersforArbitraryWaveform Generators • MultichannelA/Dforhigh-resolutionRadars including: mable solutionscompatiblewithourwiderangeofmezzaninecards PCIe/104 smallformfactor, stackable I/O-configurableandprogram- The form factorsandCOTSembeddedsystems. class SUNDANCE isaworldwidesupplierandmanufacturerofindustrial- S

Spring 2013 ICE105 isaruggedsystembuiltaroundcompleterangeof PCIe/104 digitalsignalprocessing(DSP),conﬁgurablesmall www.diamondsystems.com/products/athenaiii

PC/104 and SmallFormFactors ResourceGuide SBCs andBoards www.PCI104.biz PC/104 : : Other SBCsandBoards PCIe/104 › › › › › › › › › › › › › › › › The newrangeICEsmallformfactorsystemsforthePC/104 FEATURES FEATURES factor modulesfeatures: • Lightweight • Extendedindustrial-gradetemperature • UptoIP67water-tight seal • Anti-shockwithvibrationisolator • Ruggedenclosure The ICEenclosureisthebesthostingsolutiontointegrateyour Avionics andTransportation applications. Series-1 platformsinharshenvironmentsfoundIndustrial,Military,

Supported byUniversalDriversoftware 2 programmablecounter/timers 4 analogoutputs,12-bitD/A Programmable inputranges Interrupt-based A/Dsamplingwith512FIFO 150KHz maxsamplingrate 16 analoginputs,16-bitA/D -40°C to+85operation PC/104 ISAexpansionbus 24 programmabledigitalI/Olines PS/2 keyboard&mouse 4 RS-232/422/485serialports;USB2.0ports 1 SATA portforharddrive VGA CRTandLVDS LCDdisplaysupport 1 GigabitEthernet 1GHz IntelAtomE-SeriesCPU with1GBmemorysolderedonboard Contact Contact : [email protected] : [email protected] www.PCI104.biz orwww.SUNDANCE.com For moreinformation,pleasevisit: smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 10385 10364 PC/104 and Small Form Factorsesource R Guide 47

10365 10382 Spring 2013

smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 smallformfactors.com/p99 [email protected] : www.icoptech.com/DB/upload/sheet/6453_datasheet.pdf : [email protected] PC/104 and Small Form Factors Resource Guide Contact: http://www.linkedin.com/company/micro-technic-a-s USB connectivity: 2x USB host and USB device, wide temperature range: -20° to +70°C Applications: vehicular data logging; track, control and monitor everything that moves Also available as a box solution – Nanobird MS-2800 Multipurpose SBC module including: ARM9 CPU, 180MHz, Linux support for microSD Flash bootloader, Communication: GSM/GPRS modem (quad-band), GPS receiver, GPS data via AUX port battery UPS circuitry, 8-50V power supply integrated; power supply, charger for Li-Ion Data accquisition and control I/O, 16 isolated 24-bit A/D ch, 16 isolated digital I/O 800Mhz Vortex86MX CPU, L1 and L2 Cache, 512MB or 1GB RAM CPU, 800Mhz Vortex86MX Mbps LAN, 3 Serial, Parallel, Integrated VGA/LCD, 10/100 4 USB 2.0 and Audio (available in 512MB and 1024MB) Soldered-on system memory storage (option: 512MB, 1GB, 2GB Onboard bootable ﬂash or 4GB) function 16-bit GPIO conﬁgurable to watchdog timer, Two as PWM Single 5VDC @ 920mA range -20°C to +85°C industrial operating temperature Embedded, Windows XP Support available for Windows XP, RTOSs Windows Embedded CE 5.0/6.0, Linux and popular

Contact Datasheet FEATURES FEATURES › › › › › › › › › › › › › › › single ™ Other SBCs and Boards Other SBCs and Boards and SBCs Other : : SBCs and Boards SBCs and Boards and SBCs www.micro-technic.com/sbc2800 www.icoptech.com/pddetail.aspx?id=171&pid=4 The VMXP-6453 SBC is based on the Vortex86MX System-on- is based on the Vortex86MX The VMXP-6453 SBC processor designed for embedded and Chip (SoC), an x86-based At 800MHz, this low-power SBC drawsindustrial applications. design, soldered-on DDR2 RAM, fanless 920mA at 5VDC. The SBC’s that meets the PC/104 stacking speciﬁcation, low-proﬁle heat-sink Video/LCD, Ethernet, Audio, USB 2.0, along with the integrated IDE storage, GPIOs, PWM, keyboard/mouse serial ports, Parallel, ideal hardware platform to develop broad and RTC, provides the industrial-automation, medical and retail range of device for the as popular modern embedded OSs such markets. This SBC supports CE, Windows XPLinux, Windows Embedded Compact 7, Windows Micro Technic A/S | +45 6615 3000 Micro Technic AT command set. AT The power supply can be backed-up by an external Li-Ion battery. Built-in charger will insure that the battery is fully charged. 16 isolated analog (±10V or 0-2.0V) inputs and 16 digital I/O channels. It is ideal for data logging and alarm systems, and withstands extended temperatures, shock and vibration of mobile equipment. Online demo: www.micro-technic.com/2800 A combination of a power supply/charger for an external Li-Ion a GPS receiver and analog and a GSM/GPRS modem, battery, digital I/O makes this module very useful in many standalone GE863-GPS with a quad band applications. SBC-2800 uses Telit’s (900/950/1800/1900MHz) cellular engine and a SiRFstarIII SBC-2800 Micronix SBC-2800 is a Single Board CPU module based on Atmel’s microcontroller. AT91SAM9260 ICOP Technology, Inc. | 626-444-6666 ICOP Technology, 91732 CA Monte, El • #B Blvd Valley 12328 applications running on older versions of Linux, Windows and DOS. applications running on older versions of Linux, Embedded and WES 2009. Support is also available for legacyEmbedded and WES 2009. Support is also 800MHz VMXP-6453 PC/104 SBC 800MHz VMXP-6453 chip GPS receiver. The modem is controlled by AT commands, The modem is controlled by AT chip GPS receiver. with the and is fully compatible supported by an on-board UART, Atom™ Powered SBCs High-Performance, Small and Fanless For your next design, select rugged WinSystems’ single board computers powered with single- or dual-core Intel® PC/104 Atom™ processors. Our Industry Standards-based SBCs have a wealth of onboard I/O, plus expansion capabilities. Long-life Intel® Atom™ CPUs Simultaneous VGA and LVDS Video Gigabit Ethernet Port(s) EPIC Eight USB 2.0 Ports Four Serial Ports SATA and CompactFlash Interface Digital I/O with Event Sense -40ºC to +85ºC Operation Outstanding Technical Support Industry Standard Platforms • PC/104 – 3.6 x 3.8 inches • PC/104-Plus – 3.6 x 3.8 inches • SUMIT-ISM™ – 3.6 x 3.8 inches • EPIC – 4.5 x 6.5 inches • EBX – 5.75 x 8.00 inches Software Support: EBX Windows®, Linux, and x86-compatible RTOS Our SBCs are the right choice for industrial, pipe- Call 817-274-7553 or line, communications, transportation, medical, Visit WinSystems.com/AtomPC instrumentation, and MIL/COTS applications. Go to WinSystems’ SBC Selection Guide at www.WinSystems.com/SBCsPC

Ask about our evaluation program. 715 Stadium Drive • Arlington, Texas 76011 Phone 817-274-7553 • FAX 817-548-1358 E-mail: [email protected]

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