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Intel® Celeron® M Processor Datasheet Contents

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Intel® Celeron® M Processor Datasheet Contents Intel® Celeron® M Processor Datasheet June 2004 Order Number: 300302-003 IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Celeron® M Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800- 548-4725, or by visiting Intel's Web Site. Intel, Intel logo, Celeron, and MMX are registered trademarks or trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2004, Intel Corporation 2 Intel® Celeron® M Processor Datasheet Contents 1 Introduction ......................................................................................................................7 1.1 Terminology ...........................................................................................................8 1.2 References.............................................................................................................9 1.3 State of Data ..........................................................................................................9 2 Low Power Features ......................................................................................................11 2.1 Clock Control and Low Power States...................................................................11 2.1.1 Normal State ...........................................................................................11 2.1.2 AutoHALT Power-Down State.................................................................11 2.1.3 Stop-Grant State .....................................................................................12 2.1.4 HALT/Grant Snoop State ........................................................................12 2.1.5 Sleep State..............................................................................................12 2.1.6 Deep Sleep State ....................................................................................13 2.2 FSB Low Power Enhancements ..........................................................................13 2.3 Processor Power Status Indicator (PSI#) Signal..................................................14 3 Electrical Specifications................................................................................................15 3.1 FSB and GTLREF................................................................................................15 3.2 Power and Ground Pins.......................................................................................15 3.3 Decoupling Guidelines .........................................................................................15 3.3.1 VCC Decoupling ......................................................................................16 3.3.2 FSB AGTL+ Decoupling..........................................................................16 3.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking.....................................16 3.4 Voltage Identification............................................................................................16 3.5 Catastrophic Thermal Protection..........................................................................17 3.6 Signal Terminations and Unused Pins.................................................................18 3.7 FSB Signal Groups ..............................................................................................18 3.8 CMOS Signals .....................................................................................................19 3.9 Maximum Ratings ................................................................................................20 3.10 Processor DC Specifications................................................................................20 4 Package Mechanical Specifications and Pin Information ..........................................29 4.1 Processor Pin-Out and Pin List............................................................................37 4.2 Alphabetical Signals Reference ...........................................................................56 5 Thermal Specifications and Design Considerations ..................................................63 5.1 Thermal Specifications.........................................................................................65 5.1.1 Thermal Diode.........................................................................................65 5.1.2 Intel Thermal Monitor ..............................................................................66 6 Debug Tools Specifications ..........................................................................................69 6.1 Logic Analyzer Interface (LAI).............................................................................69 6.1.1 Mechanical Considerations .....................................................................69 6.1.2 Electrical Considerations.........................................................................69 Intel® Celeron® M Processor Datasheet 3 Figures 1 Clock Control States...................................................................................................................11 2 Illustration of Active State VCC Static and Ripple Tolerances ...................................................22 3 Illustration of Deep Sleep VCC Static and Ripple Tolerances....................................................24 4 Micro-FCPGA Package Top and Bottom Isometric Views .........................................................29 5 Micro-FCPGA Package - Top and Side Views ...........................................................................30 6 Micro-FCPGA Package - Bottom View.......................................................................................31 7 Intel Celeron M Processor Die Offset .........................................................................................31 8 Micro-FCBGA Package Top and Bottom Isometric Views .........................................................33 9 Micro-FCBGA Package Top and Side Views .............................................................................34 10 Micro-FCBGA Package Bottom View .........................................................................................35 11 The Coordinates of the Processor Pins as Viewed From the Top of the Package......................................................................................................................................38 4 Intel® Celeron® M Processor Datasheet Tables 1 References ................................................................................................................................9 2 Voltage Identification Definition ...............................................................................................17 3 FSB Pin Groups.......................................................................................................................19 4 Processor DC Absolute Maximum Ratings..............................................................................20 5 Voltage and Current Specifications .........................................................................................21 6 Voltage Tolerances for Intel Celeron M Processor with VID = 1.356 V (Active State) ...........................................................................................................................23 7 Voltage Tolerances for Intel Celeron M Processor with VID = 1.356 V (Deep Sleep State) ..................................................................................................................24 8 Voltage Tolerances for ULV Intel Celeron M Processor with VID = 1.004 V (Active State) ...........................................................................................................................25 9 Voltage Tolerances for ULV Intel Celeron M Processor with VID = 1.004 V (Deep Sleep State) ..................................................................................................................26 10 FSB Differential BCLK Specifications ......................................................................................26 11 AGTL+ Signal Group DC Specifications..................................................................................27
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