Capacitors Capacitors
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Introduction What Is a Polymer Capacitor?
ECAS series (polymer-type aluminum electrolytic capacitor) No. C2T2CPS-063 Introduction If you take a look at the main board of an electronic device such as a personal computer, you’re likely to see some of the six types of capacitors shown below (Fig. 1). Common types of capacitors include tantalum electrolytic capacitors (MnO2 type and polymer type), aluminum electrolytic capacitors (electrolyte can type, polymer can type, and chip type), and MLCC. Figure 1. Main Types of Capacitors What Is a Polymer Capacitor? There are many other types of capacitors, such as film capacitors and niobium capacitors, but here we will describe polymer capacitors, a type of capacitor produced by Murata among others. In both tantalum electrolytic capacitors and aluminum electrolytic capacitors, a polymer capacitor is a type of electrolytic capacitor in which a conductive polymer is used as the cathode. In a polymer-type aluminum electrolytic capacitor, the anode is made of aluminum foil and the cathode is made of a conductive polymer. In a polymer-type tantalum electrolytic capacitor, the anode is made of the metal tantalum and the cathode is made of a conductive polymer. Figure 2 shows an example of this structure. Figure 2. Example of Structure of Conductive Polymer Aluminum Capacitor In conventional electrolytic capacitors, an electrolyte (electrolytic solution) or manganese dioxide (MnO2) was used as the cathode. Using a conductive polymer instead provides many advantages, making it possible to achieve a lower equivalent series resistance (ESR), more stable thermal characteristics, improved safety, and longer service life. As can be seen in Fig. 1, polymer capacitors have lower ESR than conventional electrolytic Copyright © muRata Manufacturing Co., Ltd. -
Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits Gabriel A
Florida International University FIU Digital Commons FIU Electronic Theses and Dissertations University Graduate School 3-29-2012 Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits Gabriel A. Solana Florida International University, [email protected] DOI: 10.25148/etd.FI12050215 Follow this and additional works at: https://digitalcommons.fiu.edu/etd Recommended Citation Solana, Gabriel A., "Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits" (2012). FIU Electronic Theses and Dissertations. 606. https://digitalcommons.fiu.edu/etd/606 This work is brought to you for free and open access by the University Graduate School at FIU Digital Commons. It has been accepted for inclusion in FIU Electronic Theses and Dissertations by an authorized administrator of FIU Digital Commons. For more information, please contact [email protected]. FLORIDA INTERNATIONAL UNIVERSITY Miami, Florida MODELING OF CROSSTALK IN HIGH SPEED PLANAR STRUCTURE PARALLEL DATA BUSES AND SUPPRESSION BY UNIFORMLY SPACED SHORT CIRCUITS A thesis submitted in partial fulfillment of the requirements for the degree of MASTER OF SCIENCE in ELECTRICAL ENGINEERING by Gabriel Alejandro Solana 2012 To: Dean Amir Mirmiran College of Engineering and Computing This thesis, written by Gabriel Alejandro Solana, and entitled, Modeling of Crosstalk in High Speed Planar Structure Parallel Data Buses and Suppression by Uniformly Spaced Short Circuits, having been approved in respect to style and intellectual content, is referred to you for judgment. We have read this thesis and recommend that it be approved. _____________________________________________________ Stavros V. Georgakopoulos _____________________________________________________ Jean H. -
Capacitors Demystified: Practical Information on Capacitor Usage in EE133
EE133–Winter 2004 Capacitors Demystified Capacitors Demystified: Practical information on capacitor usage in EE133 Why do I need to read this? Despite all we know about capacitors from previous exposure (including everyone’s favorite capacitor fact – ‘Well, I know the voltage across a capacitor cannot change instantaneously!’), there is a quite a bit about the (good) properties and (bad) non- idealities of these devices that effects the way they are actually used in RF circuits. So, with the practical predisposition of EE133, let’s take another look at our old friend… The Starting Line-up Like fine cheeses or candy bars, capacitors come in wide variety of sizes, shapes, and prices- and they can be made from a host of different materials (except for nougat). However, all of these characteristics are interrelated because, in classic Murphy fashion, a capacitor that ranks well in one or two of these properties is usually terrible in the other categories. The physical size and shape are only of marginal importance to us since the former is pretty much irrelevant at the size of our solder board and the latter is only for aesthetics (which is a foreign term to EE’s anyway). But, the composite material is an important factor in determining the behavior of the capacitor, so for the purpose of this class we will identify four major types (Refer to page 21 of “The Art of Electronics” by Horowitz & Hill for a more complete listing of capacitor families): Material/Comments Picture Ceramics (10 pF – 22µF): Inexpensive, but not good at high frequencies Tantalum (0.1µF – 500µF): Polarized, low inductance Electrolytic (0.1µF – 75µF): Polarized, not good at high frequencies (NOTE: longer lead is usually the positive terminal) Silver Mica (1 pF – 4.7 nF): Expensive with only small capacitive values, but great for RF 1 EE133–Winter 2004 Capacitors Demystified Some Commonly Asked Questions about Capacitors Resistors are color-coded. -
Aluminum Electrolytic Vs. Polymer – Two Technologies – Various Opportunities
Aluminum Electrolytic vs. Polymer – Two Technologies – Various Opportunities By Pierre Lohrber BU Manager Capacitors Wurth Electronics @APEC 2017 2017 WE eiCap @ APEC PSMA 1 Agenda Electrical Parameter Technology Comparison Application 2017 WE eiCap @ APEC PSMA 2 ESR – How to Calculate? ESR – Equivalent Series Resistance ESR causes heat generation within the capacitor when AC ripple is applied to the capacitor Maximum ESR is normally specified @ 120Hz or 100kHz, @20°C ESR can be calculated like below: ͕ͨ͢ 1 1 ͍̿͌ Ɣ Ɣ ͕ͨ͢ ∗ ͒ ͒ Ɣ Ɣ 2 ∗ ∗ ͚ ∗ ̽ 2 ∗ ∗ ͚ ∗ ̽ ! ∗ ̽ 2017 WE eiCap @ APEC PSMA 3 ESR – Temperature Characteristics Electrolytic Polymer Ta Polymer Al Ceramics 2017 WE eiCap @ APEC PSMA 4 Electrolytic Conductivity Aluminum Electrolytic – Caused by the liquid electrolyte the conductance response is deeply affected – Rated up to 0.04 S/cm Aluminum Polymer – Solid Polymer pushes the conductance response to much higher limits – Rated up to 4 S/cm 2017 WE eiCap @ APEC PSMA 5 Electrical Values – Who’s Best in Class? Aluminum Electrolytic ESR approx. 85m Ω Tantalum Polymer Ripple Current rating approx. ESR approx. 200m Ω 630mA Ripple Current rating approx. 1,900mA Aluminum Polymer ESR approx. 11m Ω Ripple Current rating approx. 5,500mA 2017 WE eiCap @ APEC PSMA 6 Ripple Current >> Temperature Rise Ripple current is the AC component of an applied source (SMPS) Ripple current causes heat inside the capacitor due to the dielectric losses Caused by the changing field strength and the current flow through the capacitor 2017 WE eiCap @ APEC PSMA 7 Impedance Z ͦ 1 ͔ Ɣ ͍̿͌ ͦ + (͒ −͒ )ͦ Ɣ ͍̿͌ ͦ + 2 ∗ ∗ ͚ ∗ ͍̿͆ − 2 ∗ ∗ ͚ ∗ ̽ 2017 WE eiCap @ APEC PSMA 8 Impedance Z Impedance over frequency added with ESR ratio 2017 WE eiCap @ APEC PSMA 9 Impedance @ High Frequencies Aluminum Polymer Capacitors have excellent high frequency characteristics ESR value is ultra low compared to Electrolytic’s and Tantalum’s within 100KHz~1MHz E.g. -
Technical Notes for Electrolytic Capacitor
TECHNICAL NOTES FOR EL ECTROLYTIC CAPACITOR 2. MANUFACTURE OF ALUMINUM ELECTROLYTIC CAPACITOR Raw Aluminum Foil (1) Etching To obtain higher capacitance, surface area of aluminum foil for electrolytic capacitor increases through etching process. In etching process, aluminum foil is applied with DC or Etched Aluminum Foil AC current in a chloride solution to preferentially dissolve the surface. Surface area is increased by 60-150 times for low voltage foils and 10-30 times for high voltage foils. (2) Anodization(Formation of Dielectric Layer) Aluminum foil for electrolytic capacitor is further formed with anodic oxide film (Al2O3) on the surface as dielectric layer. Etched aluminum foil is immersed into a solution Formed Foil including ammonium salt of boric acid or phosphoric acid and applied with DC voltage so that the foil Aluminum Oxide becomes positive and the solution becomes negative. Then aluminum oxide film is formed on the surface in proportion to the applied voltage. The anodic oxide film, having the thickness of 13-15 angstrom/V (1.3-1.5 nm/V), is extremely thin, compact and highly Aluminum Substrate insulating. RUBYCON CORPORATION 2 TECHNICAL NOTES FOR EL ECTROLYTIC CAPACITOR Slitting (3) Slitting Process Etching and Forming are processed with wide roll of master foil. Then the master roll is slitted into individual rolls with specified width as per the specification. Stitching & Winding (4) Stitching and Winding Slit anode and cathode foils after slitting process are stitched with lead tabs and wound into cylindrical element together with spacer paper. Spacer paper is to contain liquid electrolyte that works as real cathode and restores damaged dielectric film, as well as maintaining the distance between anode and cathode foils constant to prevent short circuit. -
Coupling for Power Line Communication: a Survey Luis Guilherme Da S
JOURNAL OF COMMUNICATION AND INFORMATION SYSTEMS, VOL. 32, NO. 1, 2017. 8 Coupling for Power Line Communication: A Survey Luis Guilherme da S. Costa, Antonio Carlos M. de Queiroz, Bamidele Adebisi, Vinicius L. R. da Costa, and Moises V. Ribeiro Abstract—The advent of power line communication (PLC) electric power cables. These power cables could be alternating for smart grids, vehicular communications, internet of things current (AC) or direct current (DC) power lines and the signals and data network access has recently gained ample interest in of PLC transceivers are subsequently coupled to them via a industry and academia. Due to the characteristics of electric power grids and regulatory constraints, the effectiveness of coupling circuit. In the case of power lines used to transmit coupling between the power line and PLC transceivers has AC power, the coupling circuit has also to filter out the AC become a very important issue. Coupling devices used to inject or mains signal. On the other hand, the coupling circuit simply extract data communication signals into or from power lines are has to block the DC mains voltage of the DC electric power very important components of a PLC system. There is, however, grids. an obvious gap in the literature for a detailed review of existing PLC couplers. In this paper, we present a comprehensive review During the late 1970s and early 1980s, new investigations of couplers, which are required for narrowband and broadband to characterize electric power grids as a medium for data PLC transceivers. Prevailing issues that protract the design of communication showed a higher potential in the range of couplers and consequently subtended the inventions of different frequencies between 5 kHz and 500 kHz [2]. -
Beam, Coupling Impedance
Beam Impedance, Coupling Impedance, and Measurements using the Wire Technique John Staples, LBNL Beam, Coupling Impedance When a particle beam of current I travels through a structure, it may give up some of its energy to that structure, reducing its energy. The energy loss may be expressed as a voltage V, and the beam impedance Zb of the structure itself may be expressed as V loss Z b = I beam The structure may be a monitor device, where a signal V is generated by the beam and detected. In this case, we can define a coupling impedance Zp for the structure V monitor Z p = I beam In general, these are not the same, and each depends on the details of the structure itself. Stripline Monitor A beam bunch, as it travels down a pipe, induces images charges on the interior surface of the pipe. If the pipe is smooth and lossless, these charges do not affect the beam. An irregular beam pipe, however, will interact with the beam, as fields are induced in the beam pipe by the beam. The fields of a relativistic beam are concentrated along the direction of motion. One very useful type of monitor is the stripline monitor, which responds to the image charges. An electrode or electrodes are mounted in the beam pipe. Each end of the electrode is brought out and connected to a load. The electrode subtends and angle q. The geometry of the stripline resembles that of a microstrip, which has a characteristic surge impedance. The propagation velocity of an impulse along the stripline is assumed to be the speed of light c. -
Coupled Transmission Lines As Impedance Transformer
Downloaded from orbit.dtu.dk on: Sep 25, 2021 Coupled Transmission Lines as Impedance Transformer Jensen, Thomas; Zhurbenko, Vitaliy; Krozer, Viktor; Meincke, Peter Published in: IEEE Transactions on Microwave Theory and Techniques Link to article, DOI: 10.1109/TMTT.2007.909617 Publication date: 2007 Document Version Peer reviewed version Link back to DTU Orbit Citation (APA): Jensen, T., Zhurbenko, V., Krozer, V., & Meincke, P. (2007). Coupled Transmission Lines as Impedance Transformer. IEEE Transactions on Microwave Theory and Techniques, 55(12), 2957-2965. https://doi.org/10.1109/TMTT.2007.909617 General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. Users may download and print one copy of any publication from the public portal for the purpose of private study or research. You may not further distribute the material or use it for any profit-making activity or commercial gain You may freely distribute the URL identifying the publication in the public portal If you believe that this document breaches copyright please contact us providing details, and we will remove access to the work immediately and investigate your claim. 1 Coupled Transmission Lines as Impedance Transformer Thomas Jensen, Vitaliy Zhurbenko, Viktor Krozer, Peter Meincke Technical University of Denmark, Ørsted•DTU, ElectroScience, Ørsteds Plads, Building 348, 2800 Kgs. Lyngby, Denmark, Phone:+45-45253861, Fax: +45-45931634, E-mail: [email protected] Abstract— A theoretical investigation of the use of a coupled line transformer. -
Deliverable D3.1 Virtual Coupling Communication Solutions Analysis
Ref. Ares(2020)7880497 - 22/12/2020 Deliverable D3.1 Virtual Coupling Communication Solutions Analysis Project Acronym: MOVINGRAIL Starting Date: 01/12/2018 Duration (Months): 25 Call (part) Identifier: H2020-S2R-OC-IP2-2018 Grant Agreement No.: 826347 Due Date of Deliverable: Month 10 Actual Submission Date: 25-09-2020 Responsible/Author: Bill Redfern (PARK) Dissemination Level: Public Status: Issued Reviewed: No G A 8 2 6 3 4 7 P a g e 1 | 63 Document history Revision Date Description 0.1 03-07-2020 First draft for comments and internal review 0.2 24-09-2020 Second draft 1.0 25-09-2020 Issued 1.1 22-12-2020 Update following comments from the Commission, added new section 4.2.1 Report contributors Name Beneficiary Details of contribution Short Name John Chaddock PARK Primary Curation. Identification and collation of source documentation. Document review. Bill Redfern PARK Literature review and solutions research. Requirements identification. Analysis of requirements and potential solutions. Descriptions and conclusions. John Marsden PARK Literature review and solutions research. Michael Duffy PARK Literature review and solutions research. Mark Cooper PARK Literature review and solutions research. Analysis. Format/editing. Andrew Wright PARK Document review. Lei Chen UoB Document review. Mohamed Samra UoB Document review. Paul van Koningsbruggen Technolution Document review. Rob Goverde TUD Document review, quality check and final editing. Funding This project has received funding from the Shift2Rail Joint Undertaking (JU) under grant agreement No 826347. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and the Shift2Rail JU members other than the Union. -
Tantalum Hybrid® Capacitors
7DQWDOXP+\EULG&DSDFLWRUV- The Capacitors with the Highest Available Power Density in Medium Voltage Range 'DYLGýHVSLYD Czech Technical University in Prague 7HFKQLFNi6W Prague - 6, 166 27, Czech Republic David A. Evans, president Evans Capacitor Company 72 Boyd Avenue East Providence, RI 02914 401-435-3555 [email protected] =X]DQD.HMtNRYi Czech Technical University in Prague Dept. Of El. Power Engineering 7HFKQLFNi6W Prague - 6, 166 27, Czech Republic Abstract Tantalum Hybrid electrolytic/electrochemical capacitors are very versatile compo- nents, used in a wide variety of applications. This paper deals with pulse discharge characte- ristics measurement and specific power determination of these capacitors. Capacitors ZLWK 100 V rated voltage were chosen for the measurement. The capacitors were repetitively dis- charged into a low resistance load. More than 140 surge discharges were made with each component. The results were statistically processed and are presented. Equivalent series resis- tance of Hybrid capacitors is calculated from these measurements and based on its magnitude the specific power of the components is determined. Simultaneously with tantalum Hybrid capacitors some aluminum electrolytic capacitors were measured and the results are presented as well. Based on these results the capacitors are then compared. Tantalum Hybrid capacitors have the highest volumetric specific power (related to its dimensions) in medium voltage range. Introduction Tantalum Hybrid capacitors take advantage of the best features of electrolytic and electrochemical capacitors. They combine an anode from an electrolytic capacitor, a cathode from an electrochemical capacitor and compatible electrolyte. The tantalum Hybrid capacitor is a series combination of an anodic dielectric oxide film capacitance, Ta2O5, and a high elec- trochemical capacitance, a film of the conductive metal oxide, RuO2. -
AN-937 Designing Amplifier Circuits
AN-937 APPLICATION NOTE One Technology Way • P. O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Designing Amplifier Circuits: How to Avoid Common Problems by Charles Kitchin INTRODUCTION down toward the negative supply. The bias voltage is amplified When compared to assemblies of discrete semiconductors, by the closed-loop dc gain of the amplifier. modern operational amplifiers (op amps) and instrumenta- This process can be lengthy. For example, an amplifier with a tion amplifiers (in-amps) provide great benefits to designers. field effect transistor (FET) input, having a 1 pA bias current, Although there are many published articles on circuit coupled via a 0.1-μF capacitor, has an IC charging rate, I/C, of applications, all too often, in the haste to assemble a circuit, 10–12/10–7 = 10 μV per sec basic issues are overlooked leading to a circuit that does not function as expected. This application note discusses the most or 600 μV per minute. If the gain is 100, the output drifts at common design problems and offers practical solutions. 0.06 V per minute. Therefore, a casual lab test, using an ac- coupled scope, may not detect this problem, and the circuit MISSING DC BIAS CURRENT RETURN PATH may not fail until hours later. It is important to avoid this One of the most common application problems encountered is problem altogether. the failure to provide a dc return path for bias current in ac- +VS coupled op amp or in-amp circuits. -
Design of Bidirectional Coupling Circuit for Broadband Power-Line Communications
Journal of Electromagnetic Analysis and Applications, 2012, 4, 162-166 http://dx.doi.org/10.4236/jemaa.2012.44021 Published Online April 2012 (http://www.SciRP.org/journal/jemaa) Design of Bidirectional Coupling Circuit for Broadband Power-Line Communications Syed Samser Ali1, Amitabha Bhattacharya2, Dipak Ranjan Poddar3 1Department of Electronics and Communication Engineering, Durgapur Institute of Advanced Technology & Management, Durgapur, India; 2Department of Electronics & Electrical Communication Engineering, Indian Institute of Technology Kharagpur, Kharagpur, India; 3Department of Electronics and Telecommunication Engineering, Jadavpur University, Kolkata, India. Email: [email protected] Received February 14th, 2012; revised March 12th, 2012; accepted March 24th, 2012 ABSTRACT This paper deals with the design of bidirectional coupler for broadband power line communication and the impedance matching technique with the power line. This coupler can be used for both transmitting and receiving the data, acting as transceiver. The impedance mismatching problem is also solved here using line trap circuit. The coupler circuit is capa- ble of transmitting or receiving modulated signals with carrier frequency of 15 MHz which can be used for domestic as well as distribution power networks. Laboratory prototype tested using power line network consists of electrical house- hold appliances and results show that the circuit is able to facilitate bidirectional band pass transmission. Keywords: Coupling Circuits; Line Trap Circuit; Broadband 1. Introduction here can facilitate bidirectional communication. Power lines may be a cheap and good networking option 2. PLC System in the sense that they are almost a universally present infrastructure. The conventional power line can be effec- A typical PLC system is made up of traditional power tively utilized for broadband communication.