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Tape & Reel Packaging Standards BRD8011/D Rev. 29, Jul-2021 Tape & Reel Packaging Standards Pushing innovation to create intelligent power and sensing technologies that solve the most challenging customer problems. onsemi.com Tape and Reel Packaging Standards BRD8011/D Rev. 29, June−2021 © SCILLC, 2020 Previous Edition © August, 2020 “All Rights Reserved’’ www.onsemi.com PowerFLEX is a trademark of Texas Instruments Incorporated. POWERMITE is registered trademark of and used under a license from Microsemi Corporation. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: TECHNICAL SUPPORT Email Requests to: [email protected] North American Technical Support: Europe, Middle East and Africa Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910 ON Semiconductor Website: www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative ◊ www.onsemi.com 2 ON Semiconductor Tape and Reel Packaging Standards In Brief . Page Surface Mount This booklet has been offered to assist those looking Packaging Standards........................ 4 to coordinate packaging specifications with assembly Ordering Information........................ 9 Former CMD Tape and Reel Standards....... 11 line requirements. Additionally, dimensional and Former Fairchild Tape and Reel Standards.... 14 ordering information is supplied for those discrete Product Orientation........................ 21 devices that take the form of axial−leaded parts. Dimension Standards...................... 30 Thru Hole TO−92 Radial Tape Specifications............ 36 (Fan Fold Box and on Reel) Axial−Leaded Lead Tape Standards for Axial−Lead Components............................. 41 Information for Using Surface Mount Packages..................... 42 Humidity Indicator Card....................... 47 www.onsemi.com 3 Tape and Reel Packaging Standards Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the “peel−back” cover tape. • Two Plastic(*) Reel Sizes Available (7″ and 13″) (*)Except for Axial devices • Used for Automatic Pick and Place Feed Systems • Minimizes Product Handling • EIA 481, −1, −2 Series • DFN/QFN covers all other Thickness Designators for these packages; i.e. WDFN, UDFN, XDFN, etc.. • 8 mm Tape: 6−Bump, 9−Bump, 10−Bump, MicroLeadlesst, ChipFET, DFN/QFN packages ≤ 3.3x3.3, DSN, Flip−Chip, SOD−123, SC−59, SC−70, SC−74, SC−74A, SC−75, SC−82, SC−82AB, SC−88, SC−88A, SC−89, SOD−123, SOD−323, SOD−523, SOD−723, SOD−923, SOT−143, SOT−23, SOT−23L, SOT−323, SOT−353, SOT−553/563, SOT−723, SOT−883, SOT−1123, TSOP−5, TSOP−6, US8, WLCSP−4, WLCSP−5, XDFN2, X3DFN, XLLGA • 12 mm Tape: DFN/QFN packages > 3.3x3.3 and ≤ 7x7, FCBGA−16, Micro10, Micro8t, PowerFLEXt, POWERMITEt, QSOP−16, SMA, SMB, SO−8 (SOIC 8), SOT−223, SOT−89, SSOP−8, TSSOP−8, TSSOP−10, TSSOP−14, TSSOP−16 • 16 mm Tape: DFN/QFN packages > 7x7, DPAK, FCBGA−16, PLCC−20, QSOP−24, SMC, SO−14 (SOIC 14), SO−16 (SOIC 16), SO−16 Wide (SOIC 16W), SOIC−EIAJ8, SOIC−EIAJ14, SOIC−EIAJ16, SOP−16, SSOP−14 Wide, SSOP36−EP, TQFP−32, TSSOP−20 • 24 mm Tape: D2PAK, FCBGA−81, LQFP−52, LQFP−64, PLCC−28, SO−18 Wide (SOIC 18W), SO−20 Wide (SOIC 20W), SO−24 Wide (SOIC 24W), SOEIAJ−20, SSOP36−EP (Non−standard), TQFP−52, TQFP−64, TSSOP−48 • 32 mm Tape: PLCC−44, PLCC−52, SO−28L Wide (SOIC 28W), SO−28 Wide (SOIC 28W), SO−32 Wide (SOIC 32W), • 44 mm Tape: PLCC−98, PLCC−84 • For Leadless Package Pin 1 Orientation, please see Figure 47 (Effective January 2007). Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. www.onsemi.com 4 Embossed Tape and Reel Ordering Information Tape Pitch mm Devices Per Reel Size Fig Page Package Width (Dimension P ) Reel and Min Tape and Reel Suffix 1 No No mm (inch) (mm) (in) Order Quantity 6−Bump ± ± (1.489x0.989) 8 4.0 0.1 (0.158 0.004) 178 7 3,000 T1 − TMOS 9 22 9−Bump ± ± (1.489x1.489) 8 4.0 0.1 (0.158 0.004) 178 7 3,000 T1 − TMOS 9 22 10−Bump 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 3,000 T1 − Discrete 9 22 Axial Leaded See Axial Leaded package standards beginning on page 36 ChipFET 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 3,000 T1 − TMOS 19 23 CPH3 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 3,000 T1 15 23 CPH4 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 3,000 T1 18 23 CPH5 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 3,000 T1 18 23 CPH6 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 3,000 T1, T2 26 25 CWDFN4 12 8.0 ± 0.1 (0.315 ± 0.004) 330 13 3,000 TR 43 27 ≤ DFN/QFN ± ± 1.2x1.6x0.9 8 4.0 0.1 (0.157 0.004) 330 13 8000 N/A 42 42 ≤ DFN/QFN ± ± 1.4x1.4mm 8 2.0 0.1 (0.079 0.004) 178 7 See Data Sheet Various 42−47 27,28 WDFN/QFN 12 4.0 ± 0.1 (0.158 ± 0.004) 330 13 3,000 TW 2.5x4.5mm 12 8.0 ± 0.1 (0.315 ± 0.004) 330 13 3,000 TW 42 27 DFN/QFN ≤ 8 4.0 ± 0.1 (0.158 ± 0.004) 178 7 See Data Sheet See Data Sheet 3.3x3.3mm 8 4.0 ± 0.1 (0.158 ± 0.004) 330 13 See Data Sheet See Data Sheet 42−47 27,28 DFN/QFN ≥ ± ± ≤ 12 8.0 0.1 (0.315 0.004) 178 7 See Data Sheet See Data Sheet 3.0x3.0mm and 12 8.0 ± 0.1 (0.315 ± 0.004) 330 13 See Data Sheet See Data Sheet 42−47 27,28 7x7mm 12 16.0 ± 0.1 (0.630 ± 0.004) 178 7 See Data Sheet See Data Sheet DFN/QFN 7x7mm 12 16.0 ± 0.1 (0.630 ± 0.004) 330 13 See Data Sheet See Data Sheet 42−47 27,28 16 12.0 ± 0.1 (0.471 ± 0.004) 178 7 See Data Sheet See Data Sheet DFN/QFN 9x9mm 16 12.0 ± 0.1 (0.471 ± 0.004) 330 13 See Data Sheet See Data Sheet 42−47 27,28 DFN/QFN 16 16.0 ± 0.1 (0.630 ± 0.004) 178 7 See Data Sheet See Data Sheet 10x10mm 16 16.0 ± 0.1 (0.630 ± 0.004) 330 13 See Data Sheet See Data Sheet 42−47 27,28 DFN/QFN 16 16.0 ± 0.1 (0.630 ± 0.004) 178 7 See Data Sheet See Data Sheet 10.5x10.5mm 16 16.0 ± 0.1 (0.630 ± 0.004) 330 13 See Data Sheet See Data Sheet 42−47 27,28 DO−41 79 5.08 ± 0.508 356 14 5,000 RL − Discrete N/A 41 2 ± ± R4 Analog D PAK 3 Lead 24 16.0 0.1 (0.630 0.004) 330 13 800 T4 − Discrete 1 21 2 ± ± R4 − Analog D PAK 5 Lead 24 16.0 0.1 (0.630 0.004) 330 13 800 T4 − Discrete 1 21 D2PAK 7 Lead 24 16.0 ± 0.1 (0.630 ± 0.004) 330 13 750 R7 − Analog 1 21 DPAK 16 12.0 ± 0.1 (0.471 ± 0.004) 330 13 1,800 RL − Discrete 4 21 ± ± T4, T5 − Discrete DPAK 16 8.0 0.1 (0.315 0.004) 330 13 2,500 RK, T5 − Analog 2, 3 21 DPAK (TP−FA) 16 8.0 ± 0.1 (0.315 ± 0.004) 178 7 700 T4 3 21 DPAK (Single ± ± Gauge) 16 8.0 0.1 (0.315 0.004) 330 13 3,000 T4 3 21 DSN 8 2.0 ± 0.05 (0.079 ± 0.002) 178 7 5,000 T5 − Discrete 8 22 FCBGA−16 12 8.0 ± 0.1 (0.315 ± 0.004) 330 13 2,500/500 R2 − Clock & Data Mgmt 41 27 FCBGA−49 16 12.0 ± 0.1 (0.471 ± 0.004) 330 13 2,000/500 R2 − Clock & Data Mgmt 41 27 FCBGA−81 24 12.0 ± 0.1 (0.471 ± 0.004)
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