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Qoriq: High End Industrial and Networking Processing
TM TechDays 2013 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, trademarks of Freescale Semiconductor, Inc. All other product or service names are the BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, TM property of their respective owners. © 2012 Freescale Semiconductor, Inc. 1 Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All . other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. 2013 2011 QorIQ Qonverge QorIQ next-generation platform launch platform based T series 28nm on Layerscape architecture 2008 QorIQ Multicore Platform launch (P series) Accelerating the P series 45nm Network’s IQ 2004 Dual-core -
SEWIP Program Leverages COTS P 36 P 28 an Interview with Deon Viergutz, Vice President of Cyber Solutions at Lockheed Martin Information Systems & Global Solutions
@military_cots John McHale Obsolescence trends 8 Special Report Shipboard displays 44 Mil Tech Trends Predictive analytics 52 Industry Spotlight Aging avionics software 56 MIL-EMBEDDED.COM September 2015 | Volume 11 | Number 6 RESOURCE GUIDE 2015 P 62 Navy SEWIP program leverages COTS P 36 P 28 An interview with Deon Viergutz, Vice President of Cyber Solutions at Lockheed Martin Information Systems & Global Solutions Military electronics market overview P 14 Volume 11 Number 6 www.mil-embedded.com September 2015 COLUMNS BONUS – MARKET OVERVIEW Editor’s Perspective 14 C4ISR funding a bright spot in military 8 Tech mergers & military electronics electronics market obsolescence By John McHale, Editorial Director By John McHale Q&A EXECUTIVE OUTLOOK Field Intelligence 10 Metadata: When target video 28 Defending DoD from cyberattacks, getting to data is not enough the left of the boom By Charlotte Adams 14 An interview with Deon Viergutz, Vice President of Cyber Solutions at Lockheed Martin Information Mil Tech Insider Systems & Global Solutions 12 Broadwell chip boosts GPU performance for COTS SBCs 32 RF and microwave innovation drives military By Aaron Frank radar and electronic warfare applications An interview with Bryan Goldstein, DEPARTMENTS General Manager of the Aerospace and Defense, Analog Devices 22 Defense Tech Wire By Mariana Iriarte SPECIAL REPORT 60 Editor’s Choice Products Shipboard Electronics 112 University Update 36 U.S. Navy’s electronic warfare modernization On DARPA’s cybersecurity radar: 36 effort centers on COTS Algorithmic and side-channel attacks By Sally Cole, Senior Editor By Sally Cole 114 Connecting with Mil Embedded 44 Key to military display technologies: Blog – The fascinating world of System integration By Tom Whinfrey, IEE Inc. -
MEK6800D2 Manual 2Ed 1977.Pdf
MOTOROLA Semiconductor Products Inc. MEK6800D2 MANUAL Circuit diagrams external to Motorola products are included as a means of illustrating typical Microprocessor applications; consequently, complete information sufficient for construction purposes is not necessarily given. The information in this manual has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies. Furthermore, such information does not convey to the purchaser of the semiconductor devices described any license under the patent rights of Motorola Inc. or others. Motorola reserves the right to change specifications without notice. EXORciser, JBUG and MINlbug are trademarks of Motorola Inc. Second Edition © MOTOROLA INC., 1977 First Edition © 1976 "All Rights Reserved" Printed in U.S.A. TABLE OF CONTENTS CHAPTER 1: Introduction 1-1 General Description and Capability . 1-1 1-2 Preparation for Use . 1-4 1-2.1 Construction Hints ..................................................... 1-5 1-3 Start-up Procedure . 1-6 1-4 Operating Procedures . 1-6 1-4.1 Memory Examine and Change ............................................ 1-7 1-4.2 Escape (Abort) ........................................................ 1-7 1-4.3 Register Display ....................................................... 1-7 1-4.4 Go to User Program .................................................... 1-9 1-4.5 Punch from Memory to Tape ............................................. 1-9 1-4.6 Load from Tape to Memory ............................................. -
Freescale.Com
MC9S08QE32 MC9S08QE16 Reference Manual Related Documentation: HCS08 Microcontrollers • MC9S08QE32 (Data Sheet) Contains pin assignments and diagrams, all electrical specifications, and mechanical drawing outlines. Find the most current versions of all documents at: http://www.freescale.com MC9S08QE32RM Rev. 3 9/2011 freescale.com MC9S08QE32 Features Features – ACMPx — Two analog comparators with selectable interrupt • 8-Bit HCS08 Central Processor Unit (CPU) on rising, falling, or either edge of comparator output; – Up to 50.33 MHz HCS08 CPU at 3.6V to 2.4V, 40 MHz CPU compare option to fixed internal bandgap reference voltage; at 2.4 V to 2.1 V and 20 MHz CPU at 2.1 V to 1.8 V across outputs can be optionally routed to TPM module; operation in temperature range of –40 °C to 85 °C stop3 – HC08 instruction set with added BGND instruction – SCIx — Two serial communications interface modules with – Support for up to 32 interrupt/reset sources optional 13-bit break; full duplex non-return to zero (NRZ); •On-Chip Memory LIN master extended break generation; LIN slave extended – Flash read/program/erase over full operating voltage and break detection; wake up on active edge temperature – SPI — One serial peripheral interface; full-duplex or – Random-access memory (RAM) single-wire bidirectional; double-buffered transmit and – Security circuitry to prevent unauthorized access to RAM and receive; master or slave mode; MSB-first or LSB-first shifting flash contents – IIC — One IIC; up to 100 kbps with maximum bus loading; • Power-Saving Modes multi-master -
An Introduction to Openvg™ FTF-AUT-F0465
An Introduction to OpenVG™ FTF-AUT-F0465 Oliver Tian | Auto FAE M A Y . 2 0 1 4 TM External Use Agenda • Trend of Graphics in Vehicle • Roadmap of Cluster • Introduction of Rainbow/Vybrid • OpenVG Scenario • Development Ecosystem • Conclusion TM External Use 1 Trend of Graphics in Vehicle TM External Use 2 The Connected Vehicle Infotainment + Communication + Security • Consumer electronics trends are dictating features in the car • Always connected, applications driven, advanced graphics • Infotainment systems becoming battleground for Auto differentiation • As more connected systems get introduced into the vehicle, the need for security is critical − Increasing external communication features (Bluetooth, TPMS, Ethernet, Wi-Fi, etc). − Future interface for vehicle-to-vehicle and vehicle-to-infrastructure. TM External Use 3 Mobility for Everyone Affordable Solutions for Emerging Markets • 100M vehicles annually forecasted before 2020, on top of motorcycle & e-bike growth • 80% of quantity growth after 2015 happening in emerging markets • Safety and emissions reduction are key for a sustainable development Source: IHS Automotive, February 2014 TM External Use 4 More, More, More for Less, Less, Less More performance, more embedded memory, more safety for less cost, less power and less development effort More • Electronic complexity • ECUs per car (50+) • MCUs per car (100+) • In-car Wi-Fi ® (7.2Mbps and 3.7Bpcs by 2017) iSuppli Less Reuse • Other markets have less critical applications • Some automotive specific challenges TM External Use 5 Today’s Car • Complex computerized control − Millions of lines of code, from multiple vendors − Dozens of distinct ECUs, from multiple vendors • Shared internal networking (e.g., CAN, FlexRay) − Increasing external communications features . -
Dual-Core ARM Cortex-A7 • 2 X ARM Cortex A7 Cpus, up to 1.0Ghz
Технологии QNX и КПДА в России Москва, 13 апреля 2017 Микропроцессоры NXP c с поддержкой технологий QNX для промышленных, сетевых, автомобильных приложений. Семейства QorIQ, i.MX и S32V. Александр Акименко, Группа компаний Симметрон Программа презентации • i.MX 6QuadPlus/6DualPlus – флагман линейки i.MX • i.MX 7 – энергоэффективное решение для IoT • Анонс процессоров i.MX 8 – взгляд в будущее линейки i.MX • LS1012A – самый маленький и самый энергоэффективный 64- битный процессор • LS1020A/21A/22A – двухъядерные процессоры с широким набором периферии для IoT и промышленных приложений • LS1023A/43A – 64-разрядные процессоры с поддержкой 10Gbps Ethernet • S32V – процессоры для реализации функций ADAS в автомобильной электронике 1 i.MX 6QuadPlus/6DualPlus (upgraded i.MX 6Quad/6Dual) QNX SDP 7.0 Specifications: BSP available • CPU: i.MX 6QuadPlus: 4x Cortex-A9 @ 800MHz/852MHz/1GHz/1.2GHz i.MX 6DualPlus: 2x Cortex-A9 @ 800MHz/852MHz/1GHz/1.2GHz • Process: 40nm • Package: 21x21 0.8mm Flip-chip BGA • Temp Range (Tj): • Auto -40 to 125C • Industrial -40 to 105C • Extended Commercial -20 to 105C • Qual Tiers: Commercial, Automotive, Industrial • Pin compatible with i.MX 6Quad and i.MX 6Dual • Up to 10,000 DMIPS 2 i.MX Processor Roadmap 6QuadPlus i.MX 8 family 6Quad Advanced Graphics and Performance ARM ® v8-A (32-bit/ 64-bit) 6DualPlus i.MX 8M family pin Compatible pin 6Dual - Advanced Audio and Video to - ARM ® v8-A 6DualLite (32-bit/ 64-bit) Pin 6Solo i.MX 8X family Safety Critical & Efficient Performance 6SoloX ® ARM v8-A (32-bit/ 64-bit) Software Compatible Software 6SoloLite 6UltraLite i.MX 7 Power Efficiency & BOM Cost Optimizations ® 6ULL ARM v7-A (32-bit) ® ARM v7-A 3 i.MX 7Dual/7Solo QNX SDP 7.0 BSP Specifications: available . -
Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
Freescale Qoriq P4080 DMA-DDR Performance Analysis
TM Wai Chee Wong Sr.Member of Technical Staff Freescale Semiconductor Raghu Binnamangalam Sr.Technical Marketing Engineer Cadence Design Systems Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc. DAC 2013, Austin, TX • Company Overview • Use of emulation at Freescale • Palladium usage for emulation model under test • Performance case studies • Experiences using Palladium system • Summary Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a TM 2 Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc. • Global leader in embedded -
Vybrid Controllers Technical Overview
TM June 2013 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C- Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, Qorivva, SafeAssure, the SafeAssure logo, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, CoreNet, Flexis, Layerscape, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SMARTMOS, Tower, TurboLink, Vybrid and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2013 Freescale Semiconductor, Inc. • Overview of Vybrid Family • Vybrid Tower Board • Vybrid System Modules • QuadSPI Flash • Vybrid Clock System • Vybrid Power System • Vybrid Boot Operation • High Assurance Boot • Vybrid Trusted Execution • LinuxLink and MQX Embedded Software • DS-5 compiler TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C-Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, Qorivva, SafeAssure, the SafeAssure logo, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. 2 Airfast, BeeKit, BeeStack, CoreNet, Flexis, Layerscape, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SMARTMOS, Tower, TurboLink, Vybrid and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2013 Freescale Semiconductor, Inc. TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C- Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, Qorivva, SafeAssure, the SafeAssure logo, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. -
AN5079, Qoriq P1 Series to T1 Series Migration Guide
NXP Semiconductors Document Number: AN5079 Application Note Rev. 0, 07/2017 QorIQ P1 Series to T1 Series Migration Guide Contents 1 About this document 1 About this document............................................... 1 This document provides a summary of the significant 2 Introduction.............................. .............................. 1 differences between QorIQ P1 series and T1 series devices. 3 Feature-set comparison................... ........................2 The QorIQ P1 series devices discussed in this document are P1010, P1020, and P1022. These are compared with QorIQ T1 4 PowerPC e500v2 vs e5500 core..............................4 series devices including T1024, T1014, T1023, T1013, T1040, 5 Ethernet controller...................................................8 T1020, T1042, and T1022. Use this document as a recommended resource for migrating products from P1 series 6 POR sequence....................................................... 14 to T1 series devices. 7 DDR memory controller................ .......................17 8 Local bus - eLBC vs IFC...................................... 18 9 USB.......................................................................20 2 Introduction 10 eSDHC...................................................................21 QorIQ P1 series devices combine single or dual e500v2 Power 11 Related documentation..........................................22 Architecture® core offering excellent combinations of 12 Revision history.................................................... 22 protocol -
Freescale Qoriq Product Family Roadmap
TM April 2013 Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C- Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, CoreNet, Flexis, Layerscape, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, Tower, TurboLink, Vybrid and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2013 Freescale Semiconductor, Inc. • Freescale Differentiation and Roadmap • Power Architecture and ARM® Technology Roadmap • Product Summaries • IP Deep Dive on DDRC, PEX, Ethernet • Application Example TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, ColdFire+, C-Ware, the Energy Efficient Solutions logo, Kinetis, mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony and VortiQa are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, CoreNet, 2 Flexis, Layerscape, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, Tower, TurboLink, Vybrid and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2013 Freescale Semiconductor, -
Qoriq P5020/P5010 Communications Processors
QorIQ Communications Platforms P Series QorIQ P5020 and P5010 communications processors Overview e5500 Core DPAA Hardware Accelerators The QorIQ P5 family delivers scalable 64-bit The P5020 is based on the 64-bit e5500 Frame manager (FMAN) 12 Gb/s classify, parse processing with single-, dual- and quad-core Power Architecture® core. The e5500 and distribute devices. With frequencies scaling up to core uses a seven-stage pipeline for low Buffer manager (BMAN) 64 buffer pools 2.0 GHz, a tightly coupled cache hierarchy latency response to unpredictable code Queue manager (QMAN) Up to 224 queues for low latency and integrated hardware execution paths, boosting its single-threaded Security (SEC) 17 Gb/s: 3 DES, AES acceleration, the P5020 (dual-core) and performance. Key features: Pattern matching engine 10 Gb/s aggregate (PME) P5010 (single-core) devices are ideally suited • Supports up to 2 GHz core frequencies RapidIO® manager Supports Type 9 and for compute intensive, power-conscious Type 11 messaging control plane applications. • Tightly coupled low latency cache RAID5/6 engine Calculates parity for hierarchy: 32 KB I/D (L1), 512 KB L2 network attached storage and direct Target Markets per core attached storage applications and Applications • Up to 2 MB of shared platform cache (L3) The P5020 is designed for high-performance, • 3 DMIPS/MHz per core Data Path Acceleration power-constrained control plane applications and provides an ideal combination of core • Up to 64 GB of addressable memory space Architecture (DPAA) performance, integrated accelerators and The P5020 integrates QorIQ DPAA, an • Hybrid 32-bit mode to support legacy advanced I/O required for the following innovative multicore infrastructure for software and seamless transition to 64-bit compute-intensive applications: scheduling work to cores (physical and virtual), architecture hardware accelerators and network interfaces.