DOCSLIB.ORG
Explore
Sign Up
Log In
Upload
Search
Home
» Tags
» Reactive bonding
Reactive bonding
Localized Parylene-C Bonding with Reactive Multilayer Foils
Reactive Multilayer Foils and Their Applications in Joining Xiaotun Qiu Louisiana State University and Agricultural and Mechanical College,
[email protected]
Packaging and Integration
Efficient Joining Using Reactive Multilayer Systems
System Packaging 1 2 3 4 5
V64N5 Title Copyright.Indd
1979 International Microelectronics Symposium
Development of a Bonding Concept for MOEMS Packaging: Reactive Nanocomposites
Reliable Fine-Pitch Chip-To-Substrate Copper Interconnections with High-Throughput Assembly and High Power-Handling
United States Patent (10) Patent N0.: US 7,335,572 B2 Tong Et A]
(12) United States Patent (10) Patent No.: US 7,041,178 B2 Tong Et Al
Plasma-Activated Fusion Bonding for Vacuum Encapsulation of Microdevices Joel Soman Louisiana Tech University
Novel Approach for Reactive Bonding in Microsystems Technology
Low Temperature Wafer Bonding Based on Copper Nanoparticle Sintering for 3D Interconnect Fabrication
Joining with Reactive Nano-Multilayers: Influence of Thermal Properties of Components on Joint Microstructure and Mechanical Performance
Corrosion of Glass Bonded Silver Electrodes on Lead Zirconate Titanate in Aqueous Media
Wafer Bonding Application Note
Gold in Thick-Film Conductors
Top View
Bonding Silicon Wafers with Reactive Multilayer Foils X