Xing Sheng, EE@Tsinghua Principles of Micro- and Nanofabrication for Electronic and Photonic Devices
Packaging and Integration
Xing Sheng 盛 兴
Department of Electronic Engineering Tsinghua University [email protected] 1 Xing Sheng, EE@Tsinghua Packaging
Si wafers IC chips Video 3 Xing Sheng, EE@Tsinghua Packaging
Si wafers IC chips
test, wafer thinning, dicing, bonding, ... 4 Xing Sheng, EE@Tsinghua Probe Test
5 Xing Sheng, EE@Tsinghua Wafer Thinning
typically, ~100 m can be as thin as 20 m
6 Xing Sheng, EE@Tsinghua Wafer Thinning
7 Xing Sheng, EE@Tsinghua Dicing
laser saw plasma ...
8 Xing Sheng, EE@Tsinghua Wire Bonding
9 Xing Sheng, EE@Tsinghua 'Flip-Chip' Die Bonding
Metals alloys: Pb, Cu, Ag, Sn, ... low melting point
10 Xing Sheng, EE@Tsinghua Eutectic Bonding
Au Si 11 Xing Sheng, EE@Tsinghua Infrared Imaging
Si is transparent at near-infrared (> 1100 nm)
12 Xing Sheng, EE@Tsinghua Through-Silicon Via (TSV)
Conductive channels through the silicon wafer
13 Xing Sheng, EE@Tsinghua Through-Silicon Via (TSV)
Conductive channels through the silicon wafer
14 Xing Sheng, EE@Tsinghua Silicon Interposer
A conductive interface between chips and substrates
interposer
Q: Why shall we use Si? 15 Xing Sheng, EE@Tsinghua Memory Chips
. Increase the memory volume by 3D chip stacks
16 Xing Sheng, EE@Tsinghua 2D -> 2.5D - 3D reduced size, faster speed, higher performance, ...
Video 17 Xing Sheng, EE@Tsinghua 3D IC
. Logic + Memory + Sensing + ...
conventional 3D IC
M. M. Shulaker, et al., Nature 547, 74 (2017) 18 Xing Sheng, EE@Tsinghua Chip Packaging
Q: Why is the package black? 19 Xing Sheng, EE@Tsinghua X-ray Inspection of Circuit
X-ray image 20 Xing Sheng, EE@Tsinghua X-ray Inspection of Circuit
M. Holler. et al., Nature 543, 402 (2017) 21 Xing Sheng, EE@Tsinghua Wafer Bonding when direct growth is difficult ...
Si
SiO2
Si
22 Xing Sheng, EE@Tsinghua Wafer Bonding
. Direct wafer-wafer bonding
very clean and smooth surface o high temperature (> 1000 C) for atom diffusion
Si
SiO2
Si
23 Xing Sheng, EE@Tsinghua Wafer Bonding
. Direct bonding . Surface activated bonding . Plasma activated bonding . Anodic bonding . Eutectic bonding . Glass frit bonding . Adhesive bonding . Thermocompression bonding . Reactive bonding . Transient liquid phase diffusion bonding . ... https://en.wikipedia.org/wiki/Wafer_bonding 24 Xing Sheng, EE@Tsinghua Wafer Bonding: Applications
25 Xing Sheng, EE@Tsinghua Make Silicon-on-Insulator (SOI)
Bonding + Etch back
26 Xing Sheng, EE@Tsinghua Make Silicon-on-Insulator (SOI)
'Smart-Cut'
27 Xing Sheng, EE@Tsinghua MEMS
. Micro-Electro-Mechanical Systems (MEMS)
Digital Micromirror Device (DMD)
Video 28 Xing Sheng, EE@Tsinghua MEMS
29 Xing Sheng, EE@Tsinghua III-V Lasers on Si
30 Xing Sheng, EE@Tsinghua Multijunction (MJ) Solar Cells
Eg1 Eg2 Eg3
solar spectrum e- 1.5 (AM1.5G) e- /nm) 2 1.0
0.5 h+ h+ h+
Power Power (W/m 1J: = 37% 0.0 500 1000 1500 2000 2J: = 50% Wavelength (nm) 3J: = 56% ASTM G173-03 infinite J: = 72%
Use the entire solar spectrum W. Shockley and H. A. Queisser, J. Appl. Phys. 32, 510 (1961) C. H. Henry, J. Appl. Phys. 51, 4494 (1980) 31 Xing Sheng, EE@Tsinghua Stacked MJ Solar Cells
bonded AlGaInP/GaAs // GaInAsP/GaInAs solar cells
GaAs GaInAs AlGaInP GaInAsP
World record efficiency: 46%
F. Dimroth, et al., IEEE J. Photovolt. 6, 343 (2016) 32 Xing Sheng, EE@Tsinghua UV and IR Imaging Sensors
. Silicon only absorbs well from 400 nm to 1100 nm . IR sensors: InGaAs, HgCdTe, ... . UV sensors: GaN, ... . sensor arrays bonded with Si circuits
infrared imaging T. Shuto, et al., Jpn. J. App. Phys. 53, 04EB01 (2014) 33 Xing Sheng, EE@Tsinghua Red LEDs
. AlGaInP red LEDs grown on GaAs substrates . GaAs strongly absorbs red light . GaP is transparent in red, but not lattice matched . bond LEDs on GaP, and remove GaAs
F. A. Kish, et al., App. Phys. Lett. 64, 2839 (1994) 34 Xing Sheng, EE@Tsinghua Blue LEDs
. GaN blue LEDs grown on sapphire substrates . Sapphire is electrically and thermally insulating . bonded onto a thermally conductive substrate
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