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1979 International Microelectronics Symposium Electrocomponent Science and Technology, 1980, Vol. 6, pp. 97-118 (C) 1980 Gordon and Breach Science Publishers, Inc. 0305 3091/80/0602-0097 $04.50/0 Printed in Great Britain 1979 INTERNATIONAL MICROELECTRONICS SYMPOSIUM 1979 INTERNATIONAL MICROELECTRONICS SYMPOSIUM 13-15 November The following Abstracts are taken from the Proceedings of the 1979 International Microelectronics Symposium held in Los Angeles, California. These Abstracts are published with the kind permission of the International Society for Hybrid Microelectronics, U.S.A., under whose auspices the Symposium was organised. Copies of the full Proceedings may be obtained from: I.S.H.M. Headquarters PO Box 3255 MONTGOMERY Alabama 36109 U.S.A. Prices: I.S.H.M. Members $25.00 per copy Non-members $3O.OO Bulk orders (over 10 copies) I.S.H.M. member organisations $15.00 per copy Non-member organisations $20.00 per copy All prices quoted include handling and postage by surface carrier to all addresses. List of Papers SESSION 1A SESSION 2A HYBRID MICROCIRCUIT TESTING/ANALYSIS THICK.FILM PROCESSING A Universal Probing Technique for Continuity and A New Approach to Thick-Film Resistors by David F. Isolation Testing of Thick-Film Multilayer Circuits Zarnow, Naval Avionics Center, Indianapolis, IN by Robert L. Schelhorn, RCA, Moorestown, NJ Microstructural Studies of Thick-Film Resistors An Experimentally Verified Heat Transfer Model Using Transmission Electron Microscopy by Terry V. for Integrated Circuit Packages by Dale C. Buhanan Nordstrom and Charles R. Hills, Sandia Labs, and E. A. Wilson, Honeywell, Phoenix, AZ Albuquerque, NM Characterization of Burst Noise in Thick-Film Optical Alignment of Screen Printers for Liquid Resistors by Andrew Norrell, Malcolm Grierson, Crystal Displays by Jeffrey Green and Richard Myers, and Dr. Charles T. M. Chen, Univ. of South Hutchinson Industrial Corp., Hutchinson, MN Florida, Tampa, FL A New Process for Printing Fine Conductor Lines Tracking of Resistance and TCR in Thick-Film and Spacings on Large Area Substrates by Hussein Resistors Distinctions, Definitions, and M. Naguib, K. L. Kavanagh, and L. H. Hobbs, Derivations by Ronald C. Headley and Rene E. Cote, Bell-Northern Research, Ottawa, Ont., Canada Du Pont, Niagara Falls, NY The Formation of Spherical Lump on Gold Thick Electro-Optic Q-Switches for Laser Resistor Trimmers Film by Yoshikazu Nakamura, National Defense by Paul F. Parks and William L. Austin, P/M Academy, Kanagawa, Japan Industries, Portland, OR 97 98 MICROELECTRONICS SYMPOSIUM SESSION 3A SESSION 1B HYBRID MICROCIRCUIT INTERCONNECTIONS THICK-FILM MATERIALS Hybrids with TAB At the Threshold of Production Thick-Film Conductors Without Glass or Oxide by William R. Rodrigues de Miranda, Honeywell, Binders for Improved Wire Bonding in Multilayer St. Petersburg, FL Circuits by Dietrich E. Riemer, Boeing, Seattle, WA Lead Frame Bonder Modifications for More Compatibility of Copper/Dielectric Thick-Film Uniform Production Bonding by Roy J. Blazek and Materials by David E. Pitkanen, J. P. Cummings, William A. Piper, Bendix, Kansas City, MO and Jack A. Sartell, Honeywell, Bloomington, MN Characterizing Fine Wire for Thermocompression Voltage Sensitivity of High Ohmic Value Thick- and Ultrasonic Bonding by Horst P. Thiede and Film Resistors by Diane P. Williams and Dr. Jerry E. Albrecht Bischoff, W. C. Heraeus, Hanau, Sergent, Univ. of South Florida, Tampa, FL W. Germany Thick-Film Capacitors with High Q Factors by Dr. An Approach to Improved Solder Joints for Thick- Sidney J. Stein, Cornelius Y. D. Huang, and Film Hybrid Manufacturing by Donald H. Louis Ugol, Electro-Science Labs, Pennsauken, NJ Daebler, GTE Automatic Electric, Huntsville, AL An Evaluation of Thick-Film Resistors on Dielectrics Influence of Codeposited Impurities on the Thermo. by Jeffrey S. Williams and Dr. Jerry E. Sergent, compression Bonding of Electroplated Gold by Univ. of South Florida, Tampa, FL J. W. Dini and H. R. Johnson, Sandia Labs, Livermore, CA SESSION 2B HYBRID MICROCIRCUIT PACKAGING Fine-Wire Bonding to a Difficult-to-Bond-to Thick- Film Network by Robert P. Noble, Sandia Labs, A New Generation of Hybrid Packages for LSI Livermore, CA Devices by Nand K. Sharma and Dennis H. Klockow, Bell Labs, N. Andover, MA; and N. T. Panousis, and Donald Jaffe, Bell Labs Allentown, PA SESSION 4A THIN-FILM MATERIALS/PROCESSES High Density, Low-Cost Microelectronic Packaging by Dale W. Williams, Texas Instruments, Dallas, TX Laser Trimming Characteristics of Tantalum Nitride Resistors on Silicon by Ami Kestenbaum, Western Increasing Hybrid Yields with Miniblocks by Electric, Princeton, NJ Michael Probstein and Harry F. Liebman, Motorola, Ft. Lauderdale, FL Electrical Overstress Failure in Thin-Film Resistors by Jack S. Smith and William R. Littau, Lockheed, Increase Terminal to Pad-Peel Strength with a Palo Alto, CA Standardized Metallization System by Charles J. Trexler and Ernest T. Nicotera, Berg Electronics, Production of Thin-Film Networks Which Utilize New Cumberland, PA Chrome-Gold Conductors by Don A. Rathburn, Bendix, Kansas City, MO An Approach to a Low-Cost, Custom, Hermetic Hybrid Package by James, R. Sims, Phillip G. Creter, A High-Speed, High-Performance, Scanning, Thin- Joseph W. Soucy, and Saul T. Shapir, GTE Film Thermal Printhead by Edward K. Kanazawa, Sylvania, Needham, MA David M. Gilbert, and Kenneth E. Trueba, Hewlett Packard, Cupertino, CA De-Lidding and Re-Sealing of Large Resistance Seam Weld Sealed Hybrid Package Assemblies by Application of Low-Temperature Photochemical Gene A. DiGennaro and Wyatt F. Luce, Silicon Nitride to Microelectronic Packaging by Westinghouse, Baltimore, MD J. W. Peters, F. L. Gebhart, and T. C. Hall, Hughes Aircraft, Culver City, CA SESSION 3B MICROWAVE HYBRIDS An Investigation of the Solderability of NiCr-Pd-Au Thin-Film Conductor by Susumu Okamoto, MIC Package Using Thick-Film and Direct-Bond Takeshi Nakajima, Yoichi Matsuki, and Yoshishige Copper for 100-Watt L-Band Power Amplifier by Oda, Nippon Electric, Kanagawa, Japan J. Charles Gioia, General Electric, Syracuse, NY MICROELECTRONICS SYMPOSIUM 99 Platinum/Palladium/Gold Thick Films Decrease by Daniel D. Zimmerman, The Johns Hopkins Univ., Microwave Solder Assembly Costs and Improve Laurel, MD Reliability by John F. Graves, Bendix Corp., D. Hybrid Microelectronics Subcommittee of the Baltimore, MD; and M. Kline, Westinghouse, Manufacturing Technology Advisory Group An Baltimore, MD Overview by Joseph L. Ansell, U.S. Army Microwave Applications of Ferfimagnetic Pastes Adelphi, MD by N. B. Chakrabarti, Chinmay K. Maiti, S. Kal, and D. Bhattacharyya, Indian Inst. of Tech., Kharagpur, India SESSION 1C RELIABILITY/FAILURE ANALYSIS Surface Acoustic Wave Resonator Fabrication and Packaging with Emphasis on Contamination Effects Temperature Cycling of HIC Thin-Film Solder by Stephen J. Dolochycki, E. J. Staples, Connections by Dr. Harry N. Keller, Bell Labs, J. S. Schoenwald, and T. C. Lim, Rockwell Int'l, Allentown, PA Thousand Oaks, CA Effect of Surge Voltages on Thick-Film Resistors Epoxy Fabrication Techniques for Microwave by Yutaka Saitoh, Yukio Katsuta, and Keiji Hybrid Circuits by Louis P. Hernandez, Miteq, Suzuki, Nippon Electric, Kanagawa, Japan Hauppauge, NY Materials and Bonding Considerations for Thin- SESSION 4B Film Gold-Beam Hybrids, by Dr. Richard A. Glass, POLYNATIONAL Dr. Robert D. Wales, and Dr. Henry W. Lavendel, Lockheed, Palo Alto, CA Superior Performance of Thick-Film Microwave Circuits in High-Power Applications and Industrial Moisture Effect on Hybrids Containing CMOS Measuring Circuits by Walter Funk and W. Schilz, Circuits by Charles G. Messenger, RADC, Griffiss Philips, Hamburg, W. Germany AFB, NY; Robert E. Sulouff, Microelectronics Engineering Corp., Auburn, AL; and Dennis Greeley, Automatic Assembly and Chip Components for Thin Martin Marietta, Orlando, FL Film Consumer Electronic Products in Japan by Sei-Ichi Denda, Sanken Electric, Saitama, Japan; and Control of Semiconductor Failures Caused by Akira Ikegami, Hitachi, Tokyo, Japan Catering of Bonding Pads by Vidyadhar S. Kale, Teledyne, Los Angeles, CA Progress on Hybrid Technology in Italy by Roberto Dell'Acqua and Franco Forlani, Magneti SESSION 2C Marelli, Pavia, Italy HYBRID MICROCIRCUIT APPLICATIONS The Effect of Nitrogen and Nitrogen-Hydrogen Atmospheres on the Stability of Thick-Film A Large Hybrid Electro-Optical Array by Samuel Resistors by Martin V. Coleman, Standard Tele- Goldfarb, Consultant to Itek, Princeton, NJ, and communication Labs, Harlow, Essex, England Donald Colvin, Itek, Lexington, NJ Effects of Dopants on the Sheet Resistivity of Tarnish Growth on Silver Film Conductors and Its Cadmium Oxide Thick-Film Resistors by Shen-Li Relation to Potential Resistor Failure in Telephone Fu and Gi-Chang Lin, National Cheng Kung Univ., Central Offices by Fred N. Fuss, Richard F. Leach, Tainan, Taiwan and Willis H. Yocom, Bell Labs, Allentown, PA Capabilities and Limits of Ceramic Chip Carder A Hybrid Oscillator Circuit for the 30 kg Non- Computer Model for Thermal and Mechanical Hermetic Environment by Michael P. Hagen, Behavior by Frederic L. Rossi, Thierry E. Vernier, Pei-Luen Li, and Ronald T. Ogan, Honeywell, and Christian M. Val, Thompson CSF, Orsay, St. Petersburg, FL France Hybrid Programmable Driver Circuit for Testing SESSION 5B High-Speed Computer-Printed Circuit Boards by MILITARY HYBRID CONSIDERATIONS Peter L. Moran, Loughborough Univ. of Tech, Loughborough, Leics, U.K.; and G. Catlow, Standardization and Custom Hybrid Microcircuits International Computers,
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