Plastic Component FAILURE ANALYSIS

Total Page:16

File Type:pdf, Size:1020Kb

Plastic Component FAILURE ANALYSIS Plastic Component FAILURE ANALYSIS Several unique analytical techniques to comprehensively analyze plastic parts can provide the information needed to determine the nature and cause of plastic component failures. Jeffrey A. Jansen* Stork Technimet Inc. New Berlin, Wisconsin lthough procedures for failure analysis of metals are well documented, those for plastic parts are not. The final goal of both metallurgical and polymeric failure As plastic materials find further engineering applications, an understanding of the appropriate characterization tech- Ainvestigations remains the same, namely the de- niques will increase in importance. termination of the mode and cause of failure. There- fore, the general steps involved in evaluating a ally contain additives such as reinforcing fillers, failed plastic part parallel those applicable to a plasticizers, colorants, antidegradants, and process metallic component. The first step should include aids. It is this combination of molecular structure a thorough inspection, initially with an optical and complex formulation that requires specialized stereomicroscope, and subsequently with a scan- testing. This leads to the most significant variation ning electron microscope. in the failure investigations, which is the evalua- For both metals and plastics, the purpose of this tion of chemical composition. initial inspection is to characterize the fracture sur- Normally, the chemical composition of metals is face, and to determine the failure mode and crack analyzed by one of several elemental spectroscopic origin location. However, because of inherent phys- techniques, such as Inductively Coupled Plasma ical differences, the fracture surface morphology Spectroscopy (ICP). The analysis is relatively varies significantly between metals and plastics. straightforward, with the results detailing the ele- In subsequent steps, mechanical testing provides mental make-up of the material, thus facilitating evaluation of tensile, impact, and hardness prop- the identification of the alloy. Conversely, failure erties of both types of materials. While procedures analysis of a polymeric material requires several vary, the primary purpose of comparing the mea- different tests to derive comparable data regarding sured results to a specification, or to data generated the material composition. This article reviews the by a known good sample, remains constant. Cross test methods unique to polymeric materials, specif- sections of both types are prepared and inspected, ically those for evaluating composition and molec- but two slightly different aspects of the materials ular structure. are evaluated. In the investigation of a metal, the microstructure is analyzed. With plastics, the de- Fourier transform infrared spectroscopy gree of fusion and the orientation and dispersion Fourier transform infrared spectroscopy (FTIR) is of the filler materials are determined. a nondestructive micro-analytical spectroscopic While many aspects of the investigation are sim- technique that involves the study of molecular vi- ilar, it is important to recognize the distinct differ- brations. A continuous beam of infrared electro- ences that necessitate unique testing programs. The magnetic radiation is passed through a sample, principal difference is based on composition and causing individual molecular bonds and groups of structure. Unlike metals, polymers have a molec- bonds to vibrate at characteristic frequencies, and ular structure, which includes characteristics such as to absorb infrared energy at corresponding wave- molecular weight, crystallinity, and orientation, lengths. Because of this, organic materials having which has a significant impact on the properties of unique molecular structures generate distinct pat- the molded article. Additionally, plastic resins usu- terns of absorption. The resulting FTIR spectrum *Member of ASM International is considered the “fingerprint” of that particular 56 ADVANCED MATERIALS & PROCESSES/MAY2001 Polystyrene 0.1 0.0 Styrene: acrylonitrile copolymer 0.1 0.0 0.5 Polycarbonate material. Results can be manually interpreted or, 1.0 more commonly, searched against a library of ref- Poly (methyl methacrylate) erence spectra. FTIR can identify resins, contami- nants, chemical agents, and molecular degradation. 0.5 • Resin identifcation: FTIR is the principal analyt- ical technique for identification of polymeric ma- 3000 2000 1000 500 terials. Similar to verifying the alloy type in a met- Wave numbers, cm-1 allurgical investigation, FTIR allows a confirmation that the failed plastic part has been produced from Fig. 1 — FTIR spectral comparison showing clear differences between the results obtained on materials which exhibit a similar physical appearance. The absorption the specified resin type. Given the uniqueness of bands arise from distinct functionalities within the polymer structure. polymeric structures and the power of the tech- nique, it is readily apparent if a component has been Cracked component molded from the wrong material. For example, 0.05 several clear thermoplastic resins, such as poly- carbonate, poly(methyl methacrylate), polystyrene, and poly(styrene:acrylonitrile), have similar ap- 1.0 pearances, yet their infrared spectra are distinctly Poly (styrene: acrylonitrile: butadiene) different and identifiable, as illustrated in Fig. 1. 0.5 FTIR is usually the first analytical evaluation in a polymeric failure investigation. 1.0 • Contaminants: FTIR can provide much more Poly (2,6-dimethyl-1, 4-phenylene oxide) + polystyrene insight as a failure analysis tool. If a plastic resin 0.5 has been contaminated, particularly by another resin, the molded part will likely exhibit relatively Addition result brittle properties. FTIR analysis of the failed part 1.0 will reveal the presence of such contaminants. Spec- tral subtraction techniques can then be used to iso- 0.5 late the absorption bands that are attributed to the contaminant material, thus allowing identification. 3000 2000 1000 500 -1 An example of this is illustrated in Fig. 2. Often this Wave numbers, cm identification allows a determination of the source Fig. 2 — A molded part produced from an acrylonitrile:butadiene:styrene (ABS) of the contaminant material. resin produced results indicating the presence of contaminant poly(phenylene oxide) • Chemical agents: FTIR can be a powerful tool (PPO) resin. The presence of the contamination, which originated at the molding fa- for identifying the chemical agents responsible for cility, caused the component to exhibit brittle properties. chemical attack and environmental stress cracking. By analyzing the fracture surface, it is often pos- Thermogravimetric analysis sible to find trace residues of the chemicals that Thermogravimetric analysis (TGA) is a thermal were responsible for the failure. Once character- analysis technique that measures the amount and ized, the source of the chemical agents is frequently rate of change in the weight of a material as a func- apparent. tion of temperature or time in a controlled atmos- • Molecular degradation: Another piece of infor- phere. Weight can decrease due to volatilization mation detected by FTIR analysis is the indication of and decomposition, or increase through gas ab- molecular degradation. During degradation, such sorption or chemical reaction. as oxidation and hydrolysis, the molecular struc- TGA is a valuable analytical method for charac- ture of the polymer is altered. In the case of oxida- terizing the composition of polymeric-based mate- tion, carbonyl bonds are formed as part of the re- rials. TGA provides quantitative details that com- action, creating ketone, aldehyde, ester, and plement the qualitative data from FTIR testing. The carboxylic acid functionalities. Such degradation is relative loading levels of various constituents within most discernible in polyolefins such as polyeth- a plastic compound can be evaluated, as shown in ylene and polypropylene, as shown in Fig. 3. Hy- Fig. 4. These formulation components include poly- drolysis also results in molecular weight reduction, mers, plasticizers, additives, carbon black, mineral and introduces terminal hydroxyl groups that can fillers, and glass reinforcement. Such quantitative be observed within the FTIR spectrum. information is essential in failure analysis to verify ADVANCED MATERIALS & PROCESSES/MAY2001 57 100 0.3 Housing - discolored surface 477oC 67.5% 2.0 0.2 80 (14.7 mg) PP Oxidation products 0.1 1.5 60 1.4% (0.3 mg) carbon 0.2 1.0 Housing - core material 40 black Residue: 0.5 0.1 20 31% (6.7 mg) o glass 674C 0.0 200 400 600 800 1.0 Polypropylene Temperature, oC Fig. 4 — TGA thermogram showing the composition of a 0.5 polypropylene component. The material produced results con- sistent with the material description. -0.1 216oC, 26 J/g 3000 2000 1000 500 -1 Wave numbers, cm -0.3 o Fig. 3 — A polypropylene housing exhibited cracking and localized discoloration. 237C, 32 J/g Analysis of the darkened region showed absorption bands associated with severe ox- idation in addition to the base polypropylene. -0.5 PET that the part was fabricated from the proper mate- PBT o rial. Individual constituents within a formulated -0.7 250C plastic resin are responsible for specific end prop- Individual 224oC constituents erties, and deviations from the designated concen- trations can result in significant changes in me- 50 100 150 200 250 300 o within a chanical, physical, or chemical properties. For Temperature, C formulated example, reduced glass fiber content will result
Recommended publications
  • Fractographic Characterization of Polycarbonate Failure Modes
    FRACTOGRAPHIC CHARACTERIZATION OF POLYCARBONATE FAILURE MODES Jeffrey A. Jansen, Stork Technimet Now with The Madison Group Abstract subsequently conducted in order to understand and Polycarbonate is an important plastic molding resin used to document the resulting fracture surface features. This study fabricate many engineered components. Because of its was conducted to further the understanding of the failure widespread usage, many different types of failures can mechanisms routinely observed with polycarbonate parts. result from various service conditions. Evaluating these failures through a systematic analysis program allows an Experimental assessment of how and why the parts failed. An essential A commercially available medium-viscosity polycarbonate portion of the failure analysis process is the fractographic resin was selected for the investigation. The resin was examination, which provides information about the crack molded into plaques by a custom injection molder and origin location, and the crack initiation and extension subsequently machined to form the required test specimens. modes. The focus of this investigation was to characterize The prepared fracture surfaces were examined using a the surfaces of intentionally cracked laboratory samples in Hitachi S-3500N scanning electron microscope (SEM). order to gain a more thorough understanding of The specimens were blown off and cleaned ultrasonically in polycarbonate fracture mechanisms. This paper will a mixture of isopropanol and deionized water. Prior to the document some of the key fracture features associated with inspection, the samples were gold sputter coated to enhance various polycarbonate failure modes. the imaging. Background Tests and Results Polycarbonate is a key molding resin used to produce Uniaxial Tensile Loading engineered components in numerous applications, including A uniaxial fracture was created through tensile testing using the medical, appliance, and automotive industries.
    [Show full text]
  • PG Courses at the Department of Materials Science & Engineering IIT
    PG Courses at the Department of Materials Science & Engineering IIT Kanpur This document contains following information 1. Details of the compulsory courses for the M.Tech. Programme 2. Details of the courses for each of the three streams a. Structure-Characterization-Property b. Metals Processing c. Functional Materials 3. Details of the courses other than the above three streams Updated on 23rd July 2013 1 1. Details of the compulsory courses for the M.Tech. Programme 2 Department of Materials Science and Engineering Indian Institute of Technology Kanpur Course Name: Structure and Characterization of Materials Credits: 3-0-0-0-4 Course No: MSE 615 Prerequisite: None Category: Compulsory course for all M.Tech. students of MSE Department, to be offered in odd semester Course Contents: Basic crystallography and crystal structures (8 Lectures hours) Lecture Hours Periodic patterns, Lattices, Motif, Unit cells, Crystal structure, Primitive and Non- 1 primitive cells Symmetry elements and point group notations 1 Crystal systems and Bravais lattices 1 Crystallographic directions and planes, Miller indices and Weiss zone law 1 Streographic projections 1 Bonding in materials and atomic packing in metals, co-ordination number concepts 1 Covalent bonding, glasses and polymers 2 Crystal defects and their significance (12 Lectures hours) Lecture Hours Point defects and their role in materials Processing, performance and failure 1 Ionically bonded structures: Pauling’s rules and some examples 2 Point defects: thermodynamics, schottkey and Frenkel
    [Show full text]
  • A Guide to Failure Analysis for the Oil and Gas Industry
    A Guide to Failure Analysis for the Oil and Gas Industry Alber Sadek, Senior Engineer EWI Failure analysis is a mechanical, material, physical involves damage assessments, life predictions, and and chemical engineering approach to determining simulations. This approach is heavily dependent how and why a component or system has failed. To on the cracking susceptibility of the component, understand exactly what is involved, two questions the performance criteria, damage accumulation must be answered: mechanisms, and the magnitude of external • What constitutes a failure? stressors. Understanding the nature of the external stressors allows mitigation of their effects through • What is involved in a failure analysis? design, inspection, residual life assessment, maintenance, and life cycle management. The What Constitutes a Failure? following active stressors can directly or indirectly Generally, a part or system has failed when it cause a failure: no longer complies with its design intent. This may include leaking hydraulic seals, decreased component stiffness, an increased rate of corrosive • Mechanical: Applied stresses, residual decay, a decreased part or system lifetime, stresses, pressures, impacts, and fretting increased operating and maintenance costs, or movement unacceptable aesthetics. Failures are not limited to • Environmental: Exposure to aggressive service as they can also occur during development, environments and material-compatibility production, assembly, or transportation. Failure issues types may include fractures, component or system • Electrochemical: Exposure to corrosive malfunctions, and/or unexpected behavior resulting environments in customer dissatisfaction. Failure analysis can determine the root-cause or causes, the chain of • Thermal Exposure: Elevated temperatures events leading to the failure, fitness for service, leading to material degradation options for repair, and recommended steps to • Radiation: Ultraviolet light, sunlight, and prevent future failures.
    [Show full text]
  • Materials Engineering Laboratories Advanced Solutions for Your Product’S Life Cycle
    Materials Engineering Laboratories Advanced solutions for your product’s life cycle Benefits Raytheon IDS Materials Engineering Laboratories deliver a wide range of technical, engineering and laboratory capabilities and services in g Full range of analytical capabilities across a variety of product lines all phases of the product life cycle. and industries These laboratories fall under the materials science umbrella. Our g Mechanical and nondestructive testing highly experienced and qualified team works with an array of g Part and material failure analysis ceramics, metals, polymers, nanomaterials and composites, as well and testing as organic materials and inorganic coatings. These technical areas are g Electrical testing supported by a full range of analytical capabilities such as chemical, mechanical, electrical and environmental analysis and test. Cost-effective, quick-turn, real-time capabilities are in place at the component, microelectronic device and subassembly levels with particular focus toward electro-mechanical root-cause failure analysis. This document does not contain technology or Technical Data controlled under either the U.S. International Traffic in Arms Regulations or the U.S. Export Administration Regulations. Approved for public release. 09-S-2960 10/6/2009 Materials Engineering Laboratories: advanced solutions for the product life cycle NON DESTRUCTIVE TEST/ MICRO-IMAGING/ANALYSIS OPTICAL SERVICES EVALUATION . Scanning electron microscopy . White light interferometer . X-ray radiology: real time (SEM-EDS/EDX) . Optical microscopy, . Infrared thermal analysis . Scanning electron microscopy: photomicrography (low and . Scanning acoustic imaging electron spectroscopy for chemical high magnification/bright analysis (ESCA) (SEM-BSE) and dark field, Nomarski . Eddy current . Atomic force microscopy (AFM) confocal, image processing) . Ultrasonic flaw detector .
    [Show full text]
  • Physical Failure Analysis SEM-FIB-TEM-AFM
    Physical Failure Analysis SEM-FIB-TEM-AFM Michael Schmidt Apr 2018 EMAF Electron Microscopy and Analysis Facility 0.5 nm layer – 2 atoms thick Trace Analysis - 0.001 % (10ppm) inclusions 11 inclusions - each 300nm diameter - in 1600 µm2 field! 0.001 vol% / 10 ppm 1 : 100,000 Spot the black ball!? 20 nm Ti buried under 13,000 nm Cu 20nm 13μm Correlative Microscopy A single method of characterisation does not answer all analytical questions SEM FIB EDX STEM DF FIB-SEM Serial sectioning/3D reconstruction TEM SAED Complementary analysis techniques on the exact same sample location Cryo SEM for life science Impact • 4000+ analyses • Every group within Tyndall • 20+ industry partners • 40+ publications • 10+ NAP projects • 5 PhDs Contacts • [email protected] – Head of centre/group • [email protected] – SEM/FIB/EDX • [email protected] – TEM/FIB/HREDX • [email protected] – FIB/HRSEM/EDX Every nanometer matters in 3D patterning Scanning Electron Microscope - SEM Electron interaction with sample Comparing Microscopes LIGHT MICROSCOPE ELECTRON MICROSCOPE Electrons are used to “see” – The source of The ambient light source is light is replaced by an electron illumination light for the microscope gun built into the column The lens type Glass lenses Electromagnetic lenses Focal length is charged by Magnification Magnification is changed by changing the current through method moving the lens the lens coil Viewing the Fluorescent screen or Eyepiece (ocular) sample digital camera Entire electron path from Use of vacuum No
    [Show full text]
  • A Short Review on Fracture Mechanisms of Mechanical Components Operated Under Industrial Process Conditions: Fractographic Analysis and Selected Prevention Strategies
    metals Review A Short Review on Fracture Mechanisms of Mechanical Components Operated under Industrial Process Conditions: Fractographic Analysis and Selected Prevention Strategies George A. Pantazopoulos ELKEME Hellenic Research Centre for Metals S.A., 61st km Athens–Lamia National Road, 32011 Oinofyta, Viotias, Greece; [email protected]; Tel.: +30-2262-60-4463 Received: 9 January 2019; Accepted: 27 January 2019; Published: 29 January 2019 Abstract: An insight of the dominant fracture mechanisms occurring in mechanical metallic components during industrial service conditions is offered through this short overview. Emphasis is given on the phenomenological aspects of fracture and their relationships with the emergent fracture mode(s) with respect to the prevailed operating parameters and loading conditions. This presentation is basically fulfilled by embracing and reviewing industrial case histories addressed from a technical expert viewpoint. The referenced case histories reflected mainly the author’s team expertise in failure analysis investigation. As a secondary perspective of the current study, selected failure investigation and prevention methodological approaches are briefly summarized and discussed, aiming to provide a holistic overview of the specific frameworks and systems in place, which could assist the organization of risk minimization and quality enhancement. Keywords: metal components; fracture mechanisms; fractography; fracture mechanics; quality improvement 1. Introduction Failure analysis (FA) is a multidisciplinary, multifaceted scientific field, connecting areas of engineering from diverse backgrounds and bodies of knowledge; from applied mechanics to electrochemistry and corrosion and from numerical modeling, to the understanding of surface science and tribology. The complexity of the nature of the subject requires the embracing of various engineering disciplines, to succeed high process performance and effective root-cause analysis, which is the core and the central objective of the failure investigation process [1].
    [Show full text]
  • Forensic Failure Analysis
    © 2005 ASM International. All Rights Reserved. www.asminternational.org Failure Analysis of Engineering Structures: Methodology and Case Histories (#05127G) CHAPTER 7 Forensic Failure Analysis FORENSIC SCIENCE refers to that part of science that is used is a written warranty or contract about its performance. The second in courts of law for administration of justice. Service failures of aspect of the contract that is implied is that the product should be machines and accidents to engineering structures result in serious, reasonably safe. Failure to perform its intended function satisfac- expensive, and prolonged litigations, affecting the credibility of torily and safely constitutes a breach of warranty and, hence, lia- the manufacturer and the reliability of its products. When defective bility. In courts of law, product liability is extended not only to the consumer products fail to perform their intended functions and manufacturer of the whole product but also to the designer, the thereby cause injuries to personnel or damage to property, the user maker of component parts, the assembler, the person who installs resorts to product liability litigations. Litigations also follow when it, the repairer, and also the distributor and the retail seller. The damages to structures, life, and property are caused by deliberate absence of privity of contract, i.e., direct connection between the acts of sabotage by antisocial elements. plaintiff and the defendant, does not preclude liability in tort. Thus, Investigations of such mishaps are of two kinds, preventive and in a product liability litigation, liability is imposed also on people punitive, i.e., inquisitorial and accusatorial. In the former, attempts behind the scenes.
    [Show full text]
  • Materials Characterization and Analysis: Applications to Microelectronics
    ______________________________________________________ R&DUPDATE HARRY K. CHARLES, JR., JOEL A. WEINER, and NORMAN A. BLUM MATERIALS CHARACTERIZATION AND ANALYSIS: APPLICATIONS TO MICROELECTRONICS The APL Microelectronics Group has been actively engaged in the design, fabrication, packaging, and testing of miniaturized electronic devices, circuits, and systems for use in space, avionics, bio­ medicine, and ocean science. Advanced techniques for the analysis and characterization of materials have significantly aided the production, delivery, and ultimate reliability of the circuitry. In particu­ lar, such inspection and characterization instruments as the scanning electron microscope, the scan­ ning Auger microprobe, and the secondary ion mass spectrometer have allowed the development of new materials and processes applicable to hybrids, surface mounts, and other types of microelectron­ ics and have also provided a way to ensure greater reliability and product safety. Other relevant tools and analyses include X-ray techniques (diffraction and spectroscopy), residual gas analysis, profilometry, atomic absorption, light and electron scattering methods, and a variety of mechanical, electrical, and environmental stress tests. INTRODUCTION development and testing of microelectronic devices and assemblies. Energy dispersive X-ray spectroscopy, 5 in Advanced methods for analyzing, characterizing, conjunction with the scanning electron microscope, and testing materials have been developed to the point has been used to locate and identify impurities and to where they can be applied routinely not only in re­ monitor the relative composition of various microelec­ search and development but also in the day-to-day pro­ tronic coatings, deposited layers, and basic starting duction of hybrid microcircuits and assemblies suitable materials. Residual gas analysis 6 has been used to for use in the fields of space research, avionic systems analyze, for example, gaseous products given off dur­ development, biomedicine, and ocean science.
    [Show full text]
  • Scanning Electron Microscopy in Failure Analysis and Accident Investigations
    National Conference on Scientific Achievements of SC & ST Scientists & Technologists 14–16 April 2009, National Aerospace Laboratories, Bangalore-17 Scanning Electron Microscopy in Failure Analysis and Accident Investigations M.A. Venkataswamy National Aerospace Laboratories, Council of Scientific and Industrial Research (CSIR), Bangalore-560017, INDIA E-mail: [email protected] ABSTRACT Fractography is a science of studying fracture surface characteristics. When engineering structure/component fails it leaves certain signatures on its surface. The study of these signatures with the help of Scanning Electron Microscope (SEM) provides valuable information to (a) understand the failure process i.e. crack initiation and propagation directions (b) existence of loading conditions at the time of failure (c) underpin the causes of failure etc. In this paper, a few failure cases viz., failure of LPTR blade of aero engine, failure of engine of an aircraft, failure of roller shaft and input shaft of power steering, failure of bevel gear and pinion of engine gearbox were presented. The failure case studies amply show that fractographic study is inevitable for conducting successful failure analysis and accident investigation. Further, a typical fractographic features observed in CFRP composite laminates failed under different loading conditions were presented. This fractographic data obtained from laboratory control specimens extends SEM role in the analysis of composite material failures. Keywords: Scanning Electron Microscope, Failure Analysis, Composites, Fatigue, Fracture. 1. INTRODUCTION highly complex three dimensional damage failures under different loading conditions. Study of these Failures in engineering structures/components and not composites failures will help the designers, manu- paying attention to analyse the reasons for failure are factures and users to prevent failures.
    [Show full text]
  • Forensic Engineering: Part B
    A SunCam online continuing education course Forensic Engineering: Part B. Four Classes of Metallurgical and Mechanical Failures By Gerald O. Davis, P.E. Davis Materials & Mechanical Engineering, Inc. Forensic Engineering: Part B. A SunCam online continuing education course Introduction – This is Part B. of a two-part course on forensic engineering that considers the analysis of metallic material failures. Part A. presented an introduction to forensic engineering and the steps in completing root-cause failure analyses (RCFA). Part B. discusses important specific mechanisms of metal failure and provides alternative control methods for each that may be used to prevent a reoccurrence. Among the failure mechanisms reviewed, the several forms of aqueous corrosion are given special attention. Specific Metallic Materials Failure Mechanisms – There is a wide range of potential ways that metallic materials and thus parts and components in various types of equipment and facilities can fail but a smaller list accounts for most. These are as follows: • Static stress overload • Cyclic stress overload, i.e., mechanical fatigue • Various forms of corrosion • Various forms of wear Static stress overload – Typically this is the final stage of a failure that was initiated by another mechanism. Examples include the final stage of a failure that started by fatigue or by a corrosion process after which there is insufficient material remaining to withstand the applied service loads. Less common is stress overload failure caused by conditions that were not anticipated. These might include a service loading that imparts a different form of stress that was not accounted for in the initial design, undetected stress concentration points that were created during the manufacturing process, material mix-up so that a lower strength alloy was mistakenly installed or operation at higher temperatures than planned so that the metal’s strength at that temperature is inadequate.
    [Show full text]
  • Fractographic Analysis of All Ceramic Restorations
    Fractographic Analysis of All Ceramic Restorations George D. Quinn,* Janet B. Quinn,** and S. Scherrer*** * Ceramics Division, Mail Stop 852, National Institute of Standards and Technology, Gaithersburg, MD 20899 ** American Dental Association Paffenbarger Research Center, Mail Stop 8546, National Institute of Standards and Technology, Gaithersburg, MD 20899 *** University of Geneva, Geneva, Switzerland Abstract Why did it break? Where is the origin? Did it break from an unexpected cause? Was there a problem with the material or was the crown or bridge simply overloaded? Was it misused? Was the crown fabricated properly? Was there a fitting problem? These are common practical questions and the fractographer can often give answers. Analysis of ceramic restorations can be difficult, but fractographic analysis is a cumulative learning experience. Our skill level is improving rapidly as we learn to recognize and interpret telltale fracture patterns. Our progress and several representative clinical case studies are presented. Introduction All-ceramic dental crowns are increasingly being used as alternatives to gold or porcelain fused-to-metal restorations. A variety of ceramic materials have been used, including feldspathic or luecite porcelains, glass ceramics, aluminas and zirconias. The fracture resistance and durability of the new ceramic crowns are a primary concern. Fractures occur in spite of the best efforts of researchers, manufacturers, technicians, and dentists. The curse of brittle materials is that they are prone to catastrophic fracture. Brittle fracture takes place with little or no plastic deformation. Nature has partially compensated for this shortcoming by furnishing fracture patterns and fracture surface markings that provide a wealth of interpretable information. Unfortunately, many dental ceramics are very difficult to interpret due to their microstructures.
    [Show full text]
  • Using Semiconductor Failure Analysis Tools for Security Analysis
    Using Semiconductor Failure Analysis Tools for Security Analysis Luther Martin Voltage Security [email protected] Abstract Failure analysis tools like scanning electron microscopes and focused ion beam systems are commonly used in the manufacturing of modern integrated circuits. In addition to the conventional uses of these systems, they provide an adversary many ways to extract protected information from an integrated circuit and to defeat many security mechanisms that can be implemented. Since these systems are also fairly expensive, the number of adversaries with access to them is fairly limited, but it is likely that any facility capable of manufacturing modern integrated circuits also provides the capability to defeat many security features that can be implemented at the integrated circuit level. 1. Introduction Integrated circuits are miracles of modern technology. Their manufacture requires the construction of incredibly small features that are made of ultra-pure materials, and each of the potentially millions of transistors that comprise these devices has to function properly for the device to function properly. The processes that are used to manufacture these devices are exacting, and if the processes are not performed in precisely the right way, the resulting integrated circuits may not perform to their expected specifications. The discipline of failure analysis has evolved to correct the problems that occur in the manufacturing of integrated circuits. The first step in failure analysis is often to understand the failure mode, or the characteristics of the failure. The next step is to understand the failure mechanism, or the conditions that have created the particular failure mode. Finally, corrective action is recommended that will eliminate the failure.
    [Show full text]