The Intel X86 Microarchitectures Map Version 1.0
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Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
"PCOM-B216VG-ECC.Pdf" (581 Kib)
Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
Announcing Today
Mobile Internet Devices: The Innovation Platform Anand Chandrasekher Intel Corporation PC Internet Growth Traffic 100000 10000 100TB/Month 1000 100 10 2008 1 Time SOURCE: Cisco Monthly Internet Traffic Worldwide But Internet Usage is Changing: Social Networking EBSCO Advertising Age Alexa Global Internet Traffic Rankings 1999 20051 20082 Rank Web Site Rank Web Site Rank Web Site 1 AOL 1 yahoo.com 1 yahoo.com 2 yahoo.com 2 msn.com 2 youtube.com 3 Microsoft/msn.com 3 google.com 3 live.com 4 lycos.com 4 ebay.com 4 google.com 5 go.com 5 amazon.com 5 myspace.com 6 realnetworks.com 6 microsoft.com 6 facebook.com 7 excite@home 7 myspace.com 7 msn.com 8 ebay.com 8 google.co.uk 8 hi5.com 9 altavista.com 9 aol.com 9 wikipedia.org 10 timewarner.com 10 go.com 10 orkut.com Traffic rank is based on three months of aggregated historical traffic data from Alexa Toolbar users and is a combined measure of page views / users (geometric mean of the two quantities averaged over time). (1) Rankings as of 12/31/05, excludes Microsoft Passport; (2) Rankings as of 11/06/07 Source: Alexa Global Traffic Rankings, Morgan Stanley Research Internet Unabated Social Networking User Generated Content Location: $4,000 50 Users 45 Revenues $3,500 40 $3,000 35 30 $2,500 25 $2,000 Millions 20 $1,500 15 >300M Unique Global Visitors $1,000 Facebook: 10 84% Y-on-Y Growth 5 $500 June ’07: 52M unique visitors, 28B Minutes 0 $0 June ’08: 132M unique visitors 200820092010201120122013 Source: ComScore World Metrics Users Want to Take These Experience with Them Users Want to Take These Experience with Them 2 to 1 Preference for Full Internet vs. -
The Intel X86 Microarchitectures Map Version 2.0
The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
EU Energy Star Database | Laptop PC Archive 2006-2007 | 2007.07.20
LAPTOP PC - archive 2006-2007 ) BRAND MODEL Watts in Sleep in On / Idle Watts CPU (MHz) speed Rated RAM (MB) Hard disk (GB) Cache (kB) Video RAM (MB) Power supply (W) System Operating storage Optical Year EU (2006/2007 Current PD_ID Acer Aspire 1200 Series 2.66 Celeron 1300 256 20 256 60 CDr 2002 10120 Acer Aspire 1200X 2.72 Celeron 1000 128 10 60 XP Pro CDr 2002 10108 Acer Aspire 1200XV (10GB) 2.72 Celeron 1000 128 10 60 XP Pro CDr 2002 10106 Acer Aspire 1200XV (20 GB) 2.72 Celeron 1000 256 20 60 XP Pro CDr 2002 10107 Acer Aspire 1202XC (10 GB) 2.76 Celeron 1200 256 10 256 60 XP Pro CDr 2002 10104 Acer Aspire 1202XC (20 GB) 2.74 Celeron 1200 256 20 256 60 XP Pro CDr 2002 10105 Acer Aspire 1310 (also in 14.1", 2.9 kg version) 0.80 AMD 2000 60 512 32 75 XP DVDr/CDrw 2003 1003531 Acer Aspire 1400 Series 1.63 P4 2000 256 30 512 90 DVDr/CDrw 2002 10118 Acer Aspire 1410 series 0.97 Celeron 1500 512 80 1024 64 65 XP 2004 x 1022450 Acer Aspire 1450 series 1.20 Athlon 1860 512 60 512 64 90 XP DVDrw 2003 1013067 Acer Aspire 1640Z series 0.95 12.00 PM 2000 512 80 2048 128 65 XP DVDrw 2006 x 1035428 Acer Aspire 1650Z series 0.95 12.00 PM 2000 512 80 2048 128 65 XP DVDrw 2006 x 1035429 Acer Aspire 1680 series 0.97 PM 2000 512 80 2048 64 65 XP 2004 x 1022449 Acer Aspire 1690 series 0.95 15.30 PM 2130 2048 80 2048 128 65 XP DVDrw 2005 x 1025226 Acer Aspire 1800 2.10 P4 3800 2048 80 1024 128 150 XP DVDrw 2004 x 1022660 Acer Aspire 2000 series 2.30 PM 1700 512 80 100 65 XP DVDr 2003 1012901 Acer Aspire 2010 series 2.61 P4 1800 1024 80 1000 65 65 XP CDr -
Lecture Note 7. IA: History and Features
System Programming Lecture Note 7. IA: History and Features October 30, 2020 Jongmoo Choi Dept. of Software Dankook University http://embedded.dankook.ac.kr/~choijm (Copyright © 2020 by Jongmoo Choi, All Rights Reserved. Distribution requires permission) Objectives Discuss Issues on ISA (Instruction Set Architecture) ü Opcode and operand addressing modes Apprehend how ISA affects system program ü Context switch, memory alignment, stack overflow protection Describe the history of IA (Intel Architecture) Grasp the key technologies in recent IA ü Pipeline and Moore’s law Refer to Chapter 3, 4 in the CSAPP and Intel SW Developer Manual 2 Issues on ISA (1/2) Consideration on ISA (Instruction Set Architecture) asm_sum: addl $1, %ecx movl -4(%ebx, %ebp, 4), %eax call func1 leave ü opcode issues § how many? (add vs. inc è RISC vs. CISC) § multi functions? (SISD vs. SIMD vs. MIMD …) ü operand issues § fixed vs. variable operands f bits n bits n bits n bits § fixed: how many? opcode operand 1 operand 2 operand 3 § operand addressing modes f bits n bits n bits ü performance issues opcode operand 1 operand 2 § pipeline f bits n bits § superscalar opcode operand 1 § multicore 3 Issues on ISA (2/2) Features of IA (Intel Architecture) ü Basically CISC (Complex Instruction Set Computing) § Variable length instruction § Variable number of operands (0~3) § Diverse operand addressing modes § Stack based function call § Supporting SIMD (Single Instruction Multiple Data) ü Try to take advantage of RISC (Reduced Instruction Set Computing) § Micro-operations -
M39 Sandy Bridge-PDF
SANDY BRIDGE SPANS GENERATIONS Intel Focuses on Graphics, Multimedia in New Processor Design By Linley Gwennap {9/27/10-01} ................................................................................................................... Intel’s processor clock has tocked, delivering a next- periods. For notebook computers, these improvements can generation architecture for PCs and servers. At the recent significantly extend battery life by completing tasks more Intel Developer’s Forum (IDF), the company unveiled its quickly and allowing the system to revert to a sleep state. Sandy Bridge processor architecture, the next tock in its tick-tock roadmap. The new CPU is an evolutionary im- Integration Boosts Graphics Performance provement over its predecessor, Nehalem, tweaking the Intel had a false start with integrated graphics: the ill-fated branch predictor, register renaming, and instruction de- Timna project, which was canceled in 2000. More recently, coding. These changes will slightly improve performance Nehalem-class processors known as Arrandale and Clark- on traditional integer applications, but we may be reaching dale “integrated” graphics into the processor, but these the point where the CPU microarchitecture is so efficient, products actually used two chips in one package, as Figure few ways remain to improve performance. 1 shows. By contrast, Sandy Bridge includes the GPU on The big changes in Sandy Bridge target multimedia the processor chip, providing several benefits. The GPU is applications such as 3D graphics, image processing, and now built in the same leading-edge manufacturing process video processing. The chip is Intel’s first to integrate the as the CPU, rather than an older process, as in earlier graphics processing unit (GPU) on the processor itself. -
The Intel X86 Microarchitectures Map Version 2.2
The Intel x86 Microarchitectures Map Version 2.2 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • New instructions: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
Microcode Revision Guidance April2 2018 MCU Recommendations the Following Table Provides Details of Availability for Microcode Updates Currently Planned by Intel
microcode revision guidance april2 2018 MCU Recommendations The following table provides details of availability for microcode updates currently planned by Intel. Changes since the previous version are highlighted in yellow. LEGEND: Production Status: • Planning – Intel has not yet determined a schedule for this MCU. • Pre-beta – Intel is performing early validation for this MCU. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. • Stopped – After a comprehensive investigation of the microarchitectures and microcode capabilities for these products, Intel has determined to not release microcode updates for these products for one or more reasons including, but not limited to the following: • Micro-architectural characteristics that preclude a practical implementation of features mitigating Variant 2 (CVE-2017-5715) • Limited Commercially Available System Software support • Based on customer inputs, most of these products are implemented as “closed systems” and therefore are expected to have a lower likelihood of exposure to these vulnerabilities. Pre-Mitigation Production MCU: • For products that do not have a Production MCU with mitigations for Variant 2 (Spectre), Intel recommends using this version of MCU. This does not impact mitigations for Variant 1 (Spectre) and Variant 3 (Meltdown). STOP deploying these MCU revs: • Intel recommends to discontinue using these select versions of MCU that were previously released with mitigations for Variant 2 (Spectre) due to system stability issues. • Lines with “***” were previously recommended to discontinue use. Subsequent testing by Intel has determined that these were unaffected by the stability issues and have been re-released without modification. -
Intel I7 Core Processor – a New Order Processor Level
© 2014 IJIRT | Volume 1 Issue 6 | ISSN : 2349-6002 Intel i7 core processor – A new order processor level Arpit Yadav ; Anurag Parmar; Abhishek Sharma Electronics and Communication Engineering ABSTRACT: The paper bestowed up here may be a higher and economical compactibility , advanced complete exposure to the exactly used technologies in response towards the users demand. Now, the Intel i7 core processor.Intel i7 processor may be a fresh question arise why solely Intel core? .. Intel on the market and latest core processor gift within the Penrynmicroarchitecture includes Core a pair of market. It uses all the new technologies gift with within family of the processors that was the primary thought the corporative world. it's redesigned by a high repetitive quality of software package technocrats so it's . Intel microarchitecture isbased on the 45nm subtle style of all of the core processors gift.Intel Core i7 fabrication method. this enables Intel to create the sometimes applies to any or all families of desktop and next performance vary of processorsthat apace portable computer 64-bit x86-64processors that uses the consumes similar or less power than the antecedently Westmere , Nehalaem , Ivy , Sandy Bridge and also the generation processors. Intel Core primarily may be a Haswell microarchitectures. The Core i7 complete brand that Intel uses for the assorted vary of middle principally targets all the business and high-end to high-end customers and business based mostly shopper markets for each desktop and portable microprocessors. Generally, processors computer computers, and is distinguished from the oversubscribed within the name of Core square (entry-level consumer)Core i3, (mainstream consumer) Core i5, and (server and workstation) Xeon brands. -
[Procesadores]
VIERNES 29 de noviembre de 2013 SENA ERICK DE LA HOZ ANDERSSON PALMA ALEXIS GUERRERO FREDER TORRES MARCOS MONTENEGRO [PROCESADORES] El cerebro de las micro computadoras es el microprocesador, éste maneja las necesidades aritméticas, lógicas y de control de la computadora, todo trabajo que se ejecute en una computadora es realizado directa o indirectamente por el microprocesador INTRODUCCIÓN Se le conoce por sus siglas en inglés CPU (Unidad Central de Proceso). El microprocesador tiene su origen en la década de los sesenta, cuando se diseñó el circuito integrado (CI) al combinar varios componentes electrónicos en un solo componente sobre un “Chip” de silicio. El microprocesador es un tipo de componente electrónico en cuyo interior existen miles (o millones) de elementos llamados transistores, cuya combinación permite realizar el trabajo que tenga encomendado el chip. El microprocesador hizo a la computadora personal (PC) posible. En nuestros días uno o más de estos milagros modernos sirven como cerebro no sólo a computadoras personales, sino también a muchos otros dispositivos, como juguetes, aparatos electrodomésticos, automóviles, etc. Después del surgimiento de la PC (computadora personal), la investigación y desarrollo de los microprocesadores se convirtió en un gran negocio. El más exitoso productor de microprocesadores, la corporación Intel, convirtió al microprocesador en su producto más lucrativo en el mercado de la PC. A pesar de esta fuerte relación entre PC y microprocesador, las PC's son sólo una de las aplicaciones más visibles de la tecnología de los microprocesadores, y representan una fracción del total de microprocesadores producidos y comercializados. Los microprocesadores son tan comunes que probablemente no nos damos cuenta de su valor, nunca pensamos en ellos tal vez porque la gran mayoría de éstos siempre se encuentran ocultos en los dispositivos.