Detailed Day-by-day Presentation Schedule of 3D PEIM 2021
CEST - Session # US EDT - US JST - Japan Central & Topic Eastern Presentation Standard European and Name Affiliation Title Daylight Type Time Summer Speaker Time Time Code
Day 1 S1: Plenary I
June 21st June 20th June 21st Tsuyoshi Osaka Chair Monday Sunday Monday Funaki University Symposium Tohoku 9:00 AM 8:00 PM 2:00 AM Yoshikazu Optimal modularization technology for the latest WBG S1.P1.J Plenary Speaker University, (Tokyo) (US EST) (Berlin) Takahashi devices 1 Japan Symposium Electrification of Automobile 9:40 AM 8:40 PM 2:40 AM S1.P2.J Plenary Speaker Keiji Toda Toyota and Activities of TOYOTA for Future Mobility 2
Coffee 10:20 AM 9:20 PM 3:20 AM Break
Day 1 S2: System Integration & Thermal Management Christina ` Chair Virginia Tech DiMarino Courtney Semiconductor Inevitability of Near Chip-Scale High Power GaN & SiC 10:35 AM 9:35 PM 3:35 AM Furnival & Packaging S2.I1.U Invited 1 Packages Replacing Even Newer WBG Traditional (Tokyo) (US EST) (Berlin) Arnold Solutions & Modules Alderman Anagensis Alberto Kyoto Opportunities and challenges of integrated WBG power 11:00 AM 10:00 PM 4:00 AM S2.I2.J Invited 2 Castellazzi University electronics development Tetsuro Lotus Thermal Thermal Solution for Cooling of Electronic Equipment 11:25 AM 10:25 PM 4:25 AM S2.I3.J Invited 3 Ogushi Solution Using Lotus-type Porous Copper Heat Sink Michihiro Measurement of Threshold Voltage Shift for Power 11:50 AM 10:50 PM 4:50 PM S2.I4.J Invited 4 NAIST Shintani MOSFETs under Actual Switching Operation
Lunch 12:15 PM 11:15 PM 5:15 AM Break
Day 1 S3: Multiphysics Design & Tools Nara Institute Michihiro Chair of Science Shintani and Tech Mentor Thermal Fluid Simulation Modeling and Structural 1:30 PM 12:30 AM 6:30 AM S3.K.J Session Keynote Tom Hara Graphics Analysis of Double-sided Cooling Power Module Based on (Siemens) Thermal Transient Test Tsubasa Kanazawa 2:00 PM 1:00 AM 7:00 AM S3.I1.J Invited 1 Diamond MOSFET for Next-Generation Power Devices Matumoto University Lifetime prediction simulation system for the next 2:25 PM 1:25 AM 7:25 AM S3.I2.J Invited 2 Kenihi Oura Astom generation power semiconductor module using silver sintering die attach
2:50 PM 1:50 AM 7:50 AM Grenoble TAPIR (compacT and modulAr Power modules with S3.I3.E Invited 3 Yvan Avenas (Tokyo) (US EST) (Berlin) University IntegRated cooling) technology: goals and challenges
Coffee 3:15 PM 2:15 AM 8:15 AM Break
Day 1 S4: Additive Manufacturing Patrick University of Chair McCluskey Maryland Douglas Chair NC-State Hopkins Development of high power blue diode laser systems for 3:30 PM 2:30 AM 8:30 AM Session Masahiro Osaka S4.K.J laser metal deposition and selective laser melting in (Tokyo) (US EST) (Berlin) Keynote Tsukamoto University additive manufacturing Novel sintering process technology to achieve highest 4:00 PM 3:00 AM 9:00 AM S4.I1.E Invited 1 Dirk Busse Budatec yield and quality
A low inductive power system in package with multilayer 4:25 PM 3:25 AM 9:25 AM S4.I2.E Invited 2 Olivier Mathieu Rogers ceramic substrate and integrated active cooling
Dragan Dinulovic, Würth 4:50 PM 3:50 AM 9:50 AM S4.I3.E Invited 3 Leon Haase, Elektronik eiSos Power Microtransformer on Silicon Embedded into PCB Martin Haug, GmbH Juergen Wolf
Symposium Hans-Juergen Dresden 5:15 PM 4:15 AM 10:15 AM S1.P3.E Plenary Speaker Materials and Technologies for Power Electronic Module Albrecht University 3 Detailed Day-by-day Presentation Schedule of 3D PEIM 2021 Day 2 Day 2 S5: Plenary II June 21st June 20th June 21st Katsuaki Osaka Chair Monday Sunday Monday Suganuma University Symposium 9:00 AM 8:00 PM 2:00 AM Toshiharu S5.P1.J Plenary Speaker AIST Diamond devices based on unique material properties (Tokyo) (US EST) (Berlin) Makino 1 Symposium Yasutaka Mitsubishi 9:40 AM 8:40 PM 2:40 AM S5.P2.J Plenary Speaker Applications with SiC Power Devices for Railcar Imamura Electric 2
Coffee 10:20 AM 9:20 PM 3:20 AM Break
Day 2 S6: Manufacturing Technologies John Chair Kemet Bultitude
10:35 AM 9:35 PM (US 3:35 AM Advanced Photonic Curing: High-Speed Printing and S6.I1.U Invited 3 Kurt Schroder NovaCentrix (Tokyo) EST) (Berlin) soldering with light
Akiko Kumada, Masahiro Sato, Tokyo Cavity Propagation under Pulse Voltages in Silicone Gel 11:00 AM 10:00 PM 4:00 AM S6.I2.J Invited 1 & Shin University for Encapsulation of Power Modules Nakamura 11:25 AM 10:25 PM 4:25 AM S6.I3.J Invited 2 Thomas Lei Nio Electric Car Lost-foam technology for power electronics packaging Session Hiroshi 11:50 AM 10:50 PM 4:50 AM S6.K.J AIST Development of High Performance SiC Power Module Keynote Yamaguchi
Lunch 12:20 PM 11:20 PM 5:20 AM Break
Day 2 S7: Materials Chair Jason Rouse
Space Charge Accumulation Properties in Various Tokyo City 1:30 AM 12:30 AM 6:30 AM S7.I1.J Invited 1 Hiroake Miyake Insulating Materials for Power Electronics under DC High University Electric Field at High Temperature Compatibility Assessment of Soft magnetic Metal-flake 1:55 AM 12:55 AM 6:55 AM S7.I2.J Invited 2 Keitaro Tanno Tokin Composite Material for PCB embedding RISHO Kogyo Co.,Ltd.; NC Kenji Characterization and Testing of Organic Substrates to 2:20 AM 1:20 AM 7:20 AM S7.I3.J Invited 3 State; and Nishiguchi Replace DBC in 1200V Modules TechDream, Inc., USA Superior reliability of power electronic packages with Die 2:45 PM 1:45 AM 7:45 AM Session Michael S7.K.E Heraeus Top Systems (DTS®). Why a wire based technology (Tokyo) (US EST) (Berlin) Keynote Joerger solution outperforms clip based interconnections
Coffee 3:15 PM 2:15 AM 8:15 AM Break
Day 2 S8: Heterogeneous Integration Laboratoire Chair Cyril Buttay Ampère, Lyon, France
3:30 PM 2:30 AM (US 8:30 AM Session Rainer The Technology Race in Power Electronics Packaging: A S8.K.E AT&S (Tokyo) EST); (Berlin) keynote Frauwallner Rolling Start?
Fraunhofer IZM 3D Power Electronics by Embedding of Components into 4:00 PM 3:00 AM 9:00 AM S8.I1.E Invited 1 Thomas Löher Berlin the Build-up of Printed Circuit Boards: 2 Case Studies Jean-Marc Flexible Integration of High Power Modules By Means Of 4:25 PM 3:25 AM 9:25 AM S8.I2.E Invited 2 ASE Yannou IC Embedded Sub Modules Resumption of contacts by metallic foam Electrical, 4:50 AM 3:50 AM 9:50 AM S8.I3.E Invited 3 Mickaël Petit SATIE thermal and reliability performance
Josef Lutz, Symposium Christian 5:15 PM 4:15 AM 10:15 AM S5.P3.E Plenary Speaker TU Chemnitz Reliability aspects of 3D integrated power device Baumler, 3 Jōrg Franke Detailed Day-by-day Presentation Schedule of 3D PEIM 2021 Day 2 Day 3: S9: Quality & Reliability June 21st June 20th June 21st Steven Nordson Chair Monday Sunday Monday Martell Sonoscan
Yokohama Thermal Performance and Reliability Study on Major 9:00 AM 8:00 PM 2:00 AM S9.I1.J Invited 1 Yu Qiang National Designs and Packaging Process of Automobile Power (Tokyo) (US EST) (Berlin) University Module Nordson Quality Assurance of 3D Power Device Structures with 9:25 AM 8:25 PM 2:25 AM S9.I2.U Invited 2 Steven Martell Sonoscan Non-Destructive Imaging Techniques S9.I3.E Quality and reliability assurance of vacuum conduction 9:50 AM 8:50 PM 2:50 AM Invited 3 Aaron Hutzer Bond Plus soldering processes with big data approaches
Day 3 S10: Partners Session Minora Chair Daicel Ueshima
S10.S1.J 10:15 AM 9:15 PM 3:15 AM Sponsor 1 (P) S10.S2.J 10:25 AM 9:25 PM 3:25 AM Sponsor 2 (P) S10.S3.J 10:35 AM 9:35 PM 3:35 AM Sponsor 3 (P) S10.S4.J 10:45 AM 9:45 PM 3:45 AM Sponsor 4 (P) S10.S5.J 10:55 AM 9:55 PM 3:55 AM Sponsor 5 (G) S10.S6.J 11:00 AM 10:00 PM 4:00 AM Sponsor 6 (G) S10.S7.J 11:05 AM 10:05 PM 4:05 AM Sponsor 7 (G) S10.S8.J 11:10 AM 10:10 PM 4:10 AM Sponsor 8 (G)
Day 3 Lab Tour Tsuyoshi Osaka Chair Funaki University
11:15:00 AM 12:00 PM Chentoung Osaka Until Helper 1 (Tokyo) (Tokyo) Chen University Osaka Helper 2 Zheng Zhang University