Semiconductor Packing Methodology

Application Report SZZA021C − September 2005

Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic

ABSTRACT

The Texas Instruments Semiconductor Group uses three packing methodologies to prepare semiconductor devices for shipment to end users. The methods employed are linked to the device level for shipping configuration keys. End users of the devices often need to peruse many TI and industry publications to understand the shipping configurations. This application report documents TI’s three main shipping methods and typical dimensions for end users to review.

Contents Introduction ...... 3 Background ...... 3 Typical Applications of Each Packing Method...... 5 Stick Magazine (Shipping Tube) − Primary Component Container...... 5 Tray − Primary Component Container...... 8 Tape and Reel − Primary Component Container...... 10 Moisture Sensitivity ...... 20 Testing for Moisture Sensitivity...... 20 Dry-Packing Process ...... 21 Dry Packing ...... 21 Typical Packing Method...... 21 Conclusion ...... 26 Glossary ...... 27 Acknowledgment ...... 28 References ...... 28

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List of Figures 1 Single-Stick-Magazine Shipping Tube...... 3 2 JEDEC Tray ...... 3 3 Reel With Carrier Tape ...... 4 4 Intermediate Packing for PDIP Packages...... 5 5 Example of Trays Stacked and Bound...... 8 6 JEDEC Tray With Properly Arranged Units...... 9 7 Tape-and-Reel Packing...... 10 8 Carrier-Tape Dimensions...... 11 9 Carrier Tape Pocket Quadrant Definition...... 14 10 Rectangular QFP Package Properly Oriented in Carrier Tape...... 15 11 EIA-783 Guideline, Rules 1 and 2...... 16 12 EIA-783 Guideline, Rule 3...... 16 13 Typical TI Component Orientations for Tape-and-Reel Packing...... 17 14 Typical Reel Outline as Defined by EIA-481-x...... 18 15 Loaded Reel (Not Moisture Sensitive)...... 19 16 Standard Box Containing Loaded Reel...... 19 17 Tray Box and Sealed Moisture-Barrier Bag (Top), Opened Bag and Tray Stack (Bottom)...... 22 18 Dry-Packed Tape-and-Reel Configuration...... 23 19 Moisture-Sensitive Identification (MSID) Label...... 24 20 Moisture-Sensitivity Caution Label (Levels 2a Through 5a)...... 24 21 Humidity-Indicator Card...... 25

List of Tables 1 Stick Magazine ...... 6 2 SLL Packages and Standard Quantities...... 9 3 Tape-and-Reel Packing Configurations...... 12 4 Floor Life for Different Package Moisture-Sensitivity Levels...... 21 5 Packing-Material Environmental Coding...... 25

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Introduction This application report describes in detail the methods used by the TI Standard Linear & Logic (SLL) business unit to pack semiconductor devices (components). This application report provides customers answers to the most frequently asked questions and allows them to review the different methods used to pack our products.

Background TI ships product in three basic configurations: stick magazine, tray, and tape and reel. The following paragraphs define each packing configuration. • Stick magazine − The stick magazine (also called shipping tube) was developed in the early days of the integrated circuit (IC) industry. The magazine is used to transport and store electronic components between the manufacturer and the customer and for use in the manufacturing plant. Magazines also are used to feed components to automatic-placement machines for surface and through-hole board mounting. Multiple stick magazines are placed in next-level intermediate containers (boxes and bags) in standard packing quantities. A typical stick magazine is shown in Figure 1.

Figure 1. Stick Magazine • Tray − The IC shipping tray contains the components during component-assembly operations, during transport and storage from the component manufacturing plant to the customer’s board-assembly site, and when feeding components to automatic-placement machines for surface mounting on board assemblies. The tray is designed for components that have leads on four sides (QFP and TQFP packages) and require component lead isolation during shipping, handling, or processing. Trays are stacked and bound together to form standard packing configurations. SLL uses only standard JEDEC tray configurations. A typical JEDEC tray is shown in Figure 2.

Figure 2. JEDEC Tray

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• Tape and reel − The tape-and-reel configuration is used for transport and storage from the manufacturer of the electronic components to the customer, and for use in the customer manufacturing plant. The configuration is designed for feeding components to automatic-placement machines for surface mounting on board assemblies. The configuration can be used for all SMT packages and provides component lead isolation during shipping, handling, and processing. The complete configuration consists of a carrier tape with sequential individual cavities that hold individual components, and a cover tape that seals the carrier tape to retain the components in the cavities. In most cases, single reels of components are inserted into intermediate boxes before shipping. A typical loaded reel is shown in Figure 3.

Figure 3. Reel With Carrier Tape

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Typical Applications of Each Packing Method

Stick Magazine (Shipping Tube) − Primary Component Container Stick magazines are constructed of rigid clear or translucent polyvinylchloride (PVC) material. Stick magazines are extruded in applicable standard outlines that meet current industry standards, and protect components during shipping and handling. The stick-magazine dimensions provide proper component location and orientation for industry-standard automated-assembly equipment. Stick magazines are packed and shipped in multiples of single magazines. Multiple stick magazines are loaded into intermediate containers (bags and boxes) to form standard quantities, for ease of handling and order simplification. Typical intermediate-level packing quantities for magazines vary by pin count and package type. Figure 4 shows intermediate-level packing for PDIP packages. Stick magazine packing quantities are included in Table 1.

Figure 4. Intermediate Packing for PDIP Packages

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Table 1. Stick Magazine

Pin-Count Quantity Container Magazine Wall Pin or Plug Package Sectional Shape Package Per Standard Length Thickness Shape and Dimensions Type (mm) Designator Magazine Quantity (mm) (mm) (mm)

8 P 50 1000 14 N 25 1000 PDIP 16 N 25 1000 506.1 0.58 (300 mil) 20 N 20 1000 24 NT 15 750 28 NT 10 500

PDIP 24 N 15 750 507.0 0.56 (600 mil)

SOP 8 D 75 1500 (JEDEC, 14 D 50 1000 507.0 0.55 narrow body) 16 D 40 1000

16 DW 40 1000 SOP 20 DW 25 1000 (JEDEC, 507.0 0.76 24 DW 25 1000 wide body) 28 DW 20 1000

8 PS 80 1040 14 NS 50 1000 SOP 16 NS 50 1000 (EIAJ) 20 NS 40 1000 24NS 34 1020 530.0 0.55

SSOP 28 DB 50 1000 (narrow body, 30 DB 50 1000 pitch ≤1 mm) 38 DB 40 1000

SSOP 28 DL 40 1000 (wide body, 48 DL 25 1000 473.7 0.64 pitch ≤1 mm) 56 DL 20 1000

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Table 1. Magazine (Continued)

Pin-Count Quantity Container Magazine Wall Pin or Plug Package Sectional Shape Package Per Standard Length Thickness Shape and Dimensions Type (mm) Designator Magazine Quantity (mm) (mm) (mm)

TSSOP 8 PW 150 1500 (narrow body, 14 PW 90 1080 pitch ≤1 mm, 16 PW 90 1080 max height 20 PW 70 1050 ≤1.20 mm) 24 PW 60 1200

530.0 0.60 TSSOP (wide body, 48 DGG 40 1000 pitch ≤1 mm, 56 DGG 35 1015 max height 64 DGG 25 1000 ≤1.20 mm)

20 FN 46 2760 PLCC 28 FN 37 2035 497.3 0.64 (square) 44 FN 26 960

20 Pin 28 Pin 44 Pin

A 10.69 12.95 18.42 20 Pin 28 Pin 44 Pin B 5.08 5.08 5.13 A 8.00 12.07 17.15

Semiconductor Packing Methodology 7 SZZA021C

Tray − Primary Component Container Trays are constructed of carbon-powder or fiber materials that are selected according to the maximum temperature rating of the specific tray. TI trays designed for use on components requiring exposure to high temperatures (moisture-sensitive components) have temperature ratings of 150°C or more. Trays are molded into rectangular JEDEC standard outlines, containing matrices of uniformly spaced pockets. The pocket protects the component during shipping and handling. The spacing provides exact component locations for standard industry automated-assembly equipment used for pick-and-place in board-assembly processes. Trays are packed and shipped in multiples of single trays. Trays are stacked and bound together for rigidity. An empty cover tray is added to the top of the loaded and stacked trays. Typical tray stack configurations are five full trays and one cover tray (5 + 1), and ten full trays and one cover tray (10 + 1) (see Figure 5). Customers can receive units in single or multiple stacks, depending on individual requirements.

Figure 5. Example of Trays Stacked and Bound

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Components are arranged in the trays to match industry standards. TI standard orientation is to place pin 1 at the tray chamfered corner (see Figure 6).

Figure 6. JEDEC Tray With Properly Arranged Units

Standard packing quantities vary by package size. Table 2 lists SLL packages and their standard quantities.

Table 2. SLL Packages and Standard Quantities

CONTAINER PACKAGE QUANTITY PACKAGE PINS MATRIX STANDARD TYPE PER TRAY QUANTITY PM 64 160 8 × 20 800 PN 80 119 7 × 17 495 TQFP PCA 100 90 6 × 15 450 PZ 100 90 6 × 15 450 QFP RC 52 96 6 × 16 480

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Tape and Reel − Primary Component Container The tape-and-reel configuration, as shipped by TI, meets current industry standards. EIA-481-1, EIA-481-2, and EIA-481-3 apply to the embossed configurations. EIA-468-B applies to the radial-lead-device configurations.

Embossed Tape and Reel Most components ordered by customers are delivered in the embossed tape-and-reel configuration. This configuration consists of a carrier tape with a cover tape sealed to it (see Figure 7). This composite tape, loaded with the components, is wound on a reel. The reel is placed in a corrugated shipping box for transport and delivery. The three components of this packing configuration are the carrier tape, the cover tape, and the reel. A description of each component is provided in the following paragraphs.

Cover Tape

Carrier Tape

Embossed Cavity Bar-Code Label Area

Figure 7. Tape-and-Reel Packing

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Carrier Tape Figure 8 shows the basic outline and dimension labels of the carrier tape. Typically, the carrier tape is constructed from a polystyrene (PS) or PS-laminate film. The uniform film thickness is 0.2 mm to 0.4 mm, depending on the size and weight of the component carried by the tape.

ÏÏ

ÏÏ Ï

ÏÏ Ï ÏÏ P1 Cavity K0

Figure 8. Carrier-Tape Dimensions

Carrier tape design is defined largely by the component length, width, and thickness. The following component dimensions are the basis for common industry dimension variables for carrier tape:

A0 = Dimension designed to accommodate the component width B0 = Dimension designed to accommodate the component length K0 = Dimension designed to accommodate the component thickness. For cavities with bottom pedestals, a K1 dimension is specified to identify the required pedestal height. W = Overall width of the carrier tape. This must conform to accepted industry standards (8/12/16/24/32/44/56 mm).

P1 = Pitch between successive cavity centers. This dimension must conform to industry standards (4-mm increments). Table 3 gives the basic dimensions for SLL packages shipped in the tape-and-reel configuration. The table also shows shipping quantities and pin 1 location of the package relative to carrier tape sprocket holes location.

Semiconductor Packing Methodology 11 SZZA021C

Table 3. Tape-and-Reel Packing Configurations

REEL A B K K P W PIN 1 FAMILY PACKAGE PINS QUANTITY DIAMETER 0 0 0 1 1 (mm) (mm) (mm) (mm) (mm) (mm) QUADRANT (mm) ZRDR/GRDR 54 1000 330 5.8 8.3 1.55 0.83 8 16 MicroStar BGAt ZKER\GKER 96 1000 330 5.7 13.7 2 1.2 8 24 1 ZDFR\GKFR 114 1000 330 5.7 16.2 2 1.2 8 24

ZQNR/GQNR 20 1000 330 3.3 4.3 1.6 N/A 8 12 MicroStar Jr. ZQLR/GQLR 56 1000 330 4.8 7.3 1.5 N/A 8 16 1 BGAt ZRGR/GRGR 83 1000 330 4.8 10.3 1.8 1 8 24

YEAR/YZAR 5,6 3000 178 1.1 1.6 0.56 – 4 8 NanoStart 1 YEPR/YZPR 8 3000 178 1.1 2.1 0.56 – 4 8

20 1000 330 10.3 10.3 4.9 3.8 12 16 Midpoint of 1 PLCC FNR 28 750 330 13 13 4.9 3.7 16 24 and 2 44 500 330 18 18 5.7 4.1 24 32

KTPR 2 3000 330 6.5 10 2.45 2.2 8 16 PowerFLEX KTER 3 2000 330 9.8 11 2.45 2.2 12 24 2 KTGR 5 2000 330 9.8 11 2.45 2.2 12 24

14 1000 178 3.8 3.8 1.2 – 8 12 16 1000 178 3.8 4.3 1.2 – 8 12 RGYR 1 QFN 20 1000 178 3.8 4.8 1.2 – 8 12 24 1000 178 3.8 5.8 1.2 – 8 12 RGYR 56 2000 330 8.3 8.3 1.1 – 12 16 2

8 2500 330 6.4 5.2 2.1 N/A 8 12 DR 14 2500 330 6.5 9 2.1 N/A 8 16 16 2500 330 6.5 10.3 2.1 N/A 8 16 SOIC 16 2000 330 11.1 10.85 2.65 2.35 12 16 1 20 2000 330 11.1 13.35 2.7 2.35 12 24 DWR 24 2000 330 11.1 15.9 2.7 2.35 12 24 28 1000 330 11.35 18.67 3.1 2.44 16 32

PSR 8 2000 330 8.2 6.6 2.5 2.1 12 16 14 2000 330 8.2 10.5 2.5 2.1 12 16 SOP 16 2000 330 8.2 10.5 2.5 2.1 12 16 1 NSR 20 2000 330 8.2 13 2.5 2.1 12 24 24 2000 330 8.2 15.7 2.5 2.1 12 24

MicroStar BGA, MicroStar Jr. BGA, and PowerFLEX are trademarks of Texas Instruments.

12 Semiconductor Packing Methodology SZZA021C

Table 3. Tape-and-Reel Packing Configurations (Continued)

REEL A B K K P W PIN 1 FAMILY PACKAGE PINS QUANTITY DIAMETER 0 0 0 1 1 (mm) (mm) (mm) (mm) (mm) (mm) QUADRANT (mm)

DCTR 8 3000 178 3.15 4.35 1.55 1.25 4 12 3 14 2000 330 8.2 6.6 2.5 2.1 12 16 16 2000 330 8.2 6.6 2.5 2.1 12 16 20 2000 330 8.2 7.5 2.5 2.1 12 16 DBR 24 2000 330 8.2 8.8 2.5 2.1 12 16 28 2000 330 8.2 10.5 2.5 2.1 12 16 30 2000 330 8.2 10.5 2.5 2.1 12 16 SSOP 38 2000 330 8.2 13 2.5 2.1 12 24 1 28 1000 330 11.35 9.78 3.1 2.44 12 24 DL 48 1000 330 11.35 16.2 3.1 2.44 16 32 56 1000 330 11.35 18.67 3.1 2.44 16 32 16 2500 330 6.4 5.2 2.1 N/A 8 16 DBQR 20 2500 330 6.5 10.3 2.1 N/A 8 16 24 2500 330 6.5 10.3 2.1 N/A 8 16

PKR 3 1000 330 4.85 4.52 2.3 1.85 8 12 DCYR 4 2500 178 6.9 7.5 2.1 – 8 12 3 DCKR/DCK3 5,6 3000 178 2.24 2.34 1.22 N/A 4 8 SOT DCK2/DCK4 5,6 3000 178 2.24 2.34 1.22 N/A 4 8 2 DBV2/DBV4 5,6 3000 178 2.24 2.34 1.22 N/A 4 8 DBVR/DBV3 5,6 3000 178 3.15 3.2 1.4 N/A 4 8 3 DBZ 3 3000 178 3.15 2.95 1.22 N/A 4 8 3

TQFP PMR 64 1000 330 12.5 12.5 1.9 1.6 16 24 2

8 2000 330 7 3.6 1.6 1.2 8 12 14 2000 330 7 5.6 1.6 1.2 8 12 PWR/PWPR 16 2000 330 7 5.6 1.6 1.2 8 12 20 2000 330 6.95 7.1 1.6 1.2 8 16 TSSOP 1 24 2000 330 6.95 8.3 1.6 1.2 8 16 48 2000 330 8.6 15.8 1.8 1.3 12 24 DGGR 56 2000 330 8.6 15.8 1.8 1.3 12 24 64 2000 330 8.4 17.3 1.7 1.2 12 24

LPR 3 2000 360 N/A N/A N/A N/A 13 18 – TO KTTR 5 1000 330 10.4 16.2 4.95 – 12 24 2

Semiconductor Packing Methodology 13 SZZA021C

Table 3. Tape-and-Reel Packing Configurations (Continued)

REEL A B K K P W PIN 1 FAMILY PACKAGE PINS QUANTITY DIAMETER 0 0 0 1 1 (mm) (mm) (mm) (mm) (mm) (mm) QUADRANT (mm) 14 2000 330 6.8 4 1.6 1.2 8 12 16 2000 330 6.8 4 1.6 1.2 8 12 20 2000 330 7 5.6 1.6 1.2 8 12 DGVR TVSOP 24 2000 330 7 5.6 1.6 1.2 8 12 1 48 2000 330 6..8 10.1 1.6 1.2 12 24 56 2000 330 6.8 11.7 1.6 1.2 12 24 DBBR 80 2000 330 8.4 17.3 1.7 1.2 12 24

DCUR 8 3000 178 2.25 3.35 1.05 – 4 8 3 DDUR 8 3000 178 2.25 3.35 1.05 – 4 8 VSSOP DGKR 8 2500 330 5.3 3.4 1.4 – 8 12 1 DGSR 10 2500 330 5.3 3.4 1.4 – 8 12

Sprocket Holes

34 Pocket Quadrants

Figure 9. Carrier Tape Pocket Quadrant Definition

MicroStar BGA, MicroStar Jr. BGA, and PowerFLEX are trademarks of Texas Instruments.

14 Semiconductor Packing Methodology SZZA021C

Cover Tape Typically, the cover tape is a PET film or film laminate, with adhesive applied to the underside of the film. Most applications use a heat- and pressure-sensitive adhesive to ensure a positive, consistent seal to the carrier tape. The film thickness, including adhesive, is 50 mm to 65 mm. A typical rectangular QFP package in the carrier tape pocket with the cover tape sealed, but partially peeled back, is shown in Figure 10. The package is properly oriented in the tape cavity.

Figure 10. Rectangular QFP Package Properly Oriented in Carrier Tape

Component orientation in the carrier-tape pocket is governed by EIA-783, which states that the following orientation rules shall be followed, sequentially, until no other variation is possible (see Figure 11): 1. The largest axis of the component outline shall be perpendicular to the tape length. 2. The edge of the package containing termination 1 shall be oriented toward the round sprocket holes. 3. For the components where rule 1 and rule 2 do not establish a unique orientation, termination 1 shall be in quadrant 1 (see Figure 12). Typical TI component orientation is shown in Figure 13.

Semiconductor Packing Methodology 15 SZZA021C

Round Sprocket Holes

ÎÎÎÎÎÎ ÎÎÎÎÎÎ

ÎÎÎÎÎÎUser Direction of Feed

B ÎÎÎÎÎÎ

0 B0 > A0

ÎÎÎÎÎÎ ÎÎÎÎÎÎ

ÎÎÎÎÎÎ Elongated Sprocket Holes

ÎÎÎÎÎÎ (32-mm Tape and Wider) A0

Figure 11. EIA-783 Guideline, Rules 1 and 2

Round Sprocket Holes

User Direction of Feed 12

Quadrant Designations 1 = Upper Left 2 = Upper Right 343 = Lower Left 4 = Lower Right Elongated Sprocket Holes (32-mm Tape and Wider)

Figure 12. EIA-783 Guideline, Rule 3

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TSOP/SOP/SOIC/SSOP/TSSOP/TVSOP/BGA/Rectangular QFP Square QFP/TQFP/LQFP

User Direction of Feed User Direction of Feed

SOT-23 TO-220

User Direction of Feed User Direction of Feed

TO-92 TO-89

Style

Adhesive

User Direction of Unreel Flat Side of Transistor and Adhesive Tape Visible User Direction of Feed

Figure 13. Typical TI Component Orientations for Tape-and-Reel Packing

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Reel Reels that contain the sealed carrier tape are polystyrene (PS). Reels can have one, two, or three parts. Typically, it is blue, but other colors are acceptable. The reels are recyclable, and TI participates in environmentally responsible recycling programs. Customers can receive new or recycled reels. In all cases, recycled reels are required to conform to drawing specifications. Reel dimensions are within the EIA-481-1, EIA-481-2, and EIA-481-3 standards (see Figure 14).

W3 Access Hole at Slot Location

Full Radius W2

D N

C Arbor Hole B Diameter

W1 Tape Slot in Core for Tape Start

Figure 14. Typical Reel Outline as Defined by EIA-481-x

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Examples of tape-and-reel intermediate-level packing are shown in Figures 15 and 16.

Figure 15. Loaded Reel (Not Moisture Sensitive)

Figure 16. Standard Box Containing Loaded Reel

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Moisture Sensitivity Plastic IC packages absorb moisture from the surrounding environment. This is a typical characteristic of the materials (mold compound and die attach) used in the construction of plastic packages. The moisture inside the package increases or decreases to reach the relative humidity (RH) of the surrounding environment. Weight gain/loss analysis is used to determine the time it takes for a package to reach moisture saturation or the time required for removing it. This information is used to specify maximum exposure times and minimum dry-baking times for a particular package. Moisture inside the package turns into steam when the package is exposed to the vapor phase/infrared reflow and/or wave-soldering processes that are common in the fabrication of printed circuit boards (PCBs). The resulting steam and vapor pressure can cause cracking of the package, a phenomenon called popcorning.

Testing for Moisture Sensitivity The sensitivity of a package to moisture-induced damage depends on many factors, including room temperature, relative humidity, and construction of the package. Surface-mount packages are more susceptible to moisture-induced damage than their through-hole counterparts, because surface-mount packages normally are exposed to higher solder temperatures. Through-hole parts usually are larger and, therefore, mechanically stronger. TI surface-mount products are tested for moisture sensitivity using the procedures outlined in EIA/JEDEC A112-A and EIA/JEDEC A113-B. JEDEC levels 1 through 6 define relative levels of moisture sensitivity. Level 1 denotes a package that is not moisture sensitive. Any package denoted level 2, or higher, requires removal of moisture by baking or under vacuum, followed by dry packing to protect it during shipment. Shipping containers are labeled according to the product moisture-sensitivity classification (see Moisture-Sensitivity Labeling). Dry packing and labeling procedures are discussed in the following sections. SLL packages have been tested and classified according to their sensitivity to moisture-induced damage. The moisture sensitivity classification can be found at the following TI external web link. Just input the product of interest. http://focus.ti.com/quality/docs/partnumsearch.tsp?templateId=5909&navigationId=11214&ms1T ype=true TI through-hole packages have not been tested according to JESD 22-A112-A or JESD 22-A113-A standards. Due to the nature of the through-hole PCB soldering process, the component package is shielded from the solder wave by the PCB and is not subjected to the higher reflow temperatures experienced by surface-mount components. TI through-hole packages are not classified as moisture sensitive.

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Dry-Packing Process If a package is moisture sensitive (level 2 or higher), it must be dry packaged. Normally, in this process, packages are baked for 24 hours at 125°C ± 5°C. Baking time could vary depending on the package type.

Dry Packing Dry packing consists of baking the packages to reduce moisture to a level not to exceed 0.05% by weight. Then, the units are placed in a moisture-barrier bag, along with desiccant, to keep the moisture inside the bag to a level <20% RH. Each product is labeled as moisture sensitive, outlining the necessary precautions for handling the product. Table 4 shows the floor life for the different package moisture-sensitivity levels.

Table 4. Floor Life for Different Package Moisture-Sensitivity Levels

FLOOR LIFE SOAK TIME CONDITIONS CONDITIONS LEVEL TIME TEMPERATURE RH TIME TEMPERATURE RH (HOURS) (°C) (%) (°C) (%) 1 ≤30 90 Unlimited 168 85 85 2 ≤30 60 1 year 168 85 60 X + Y = Z (see Note) 3 ≤30 60 168 hours 24 + 168 = 192 30 60 4 ≤30 60 72 hours 24 + 72 = 96 30 60 5 ≤30 60 24 hours 24 + 24 = 48 30 60 6 ≤30 60 6 hours 0 + 6 = 6 30 60 NOTE: X = time between bake and dry bake at the manufacturing site Y = floor life of package after removal from dry-pack bag Z = total soak time The X values are default values. If the actual time exceeds this value, use the actual time and adjust the soak time.

Typical Packing Method The typical packing method requires the following materials: • Stick magazines (shipping tubes), trays, tape and reel • Desiccant • Moisture-barrier bag • Labels [moisture-sensitive identification (MSID) label, dry-pack caution label] • Humidity-indicator card

Semiconductor Packing Methodology 21 SZZA021C

Examples of tray and tape-and-reel dry pack are shown in Figures 17 and 18.

Figure 17. Tray Box and Sealed Moisture-Barrier Bag (Top), Opened Bag and Tray Stack (Bottom)

22 Semiconductor Packing Methodology SZZA021C

Figure 18. Dry-Packed Tape-and-Reel Configuration

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Moisture-Sensitivity Labeling Primary and intermediate containers containing moisture-sensitive packages are labeled as shown in Figures 19 and 20.

Figure 19. Moisture-Sensitive Identification (MSID) Label

The MSID label is applied to the outside of the intermediate container near the TI barcode label. This label indicates that moisture-sensitive packages are inside. The moisture-sensitivity caution label (see Figure 20) is applied to the reel (for tape-and-reel configurations) and to the outside of the sealed moisture-barrier bag. This label contains detailed information specific to the device (moisture-sensitivity level, floor life, etc.).

Figure 20. Moisture-Sensitivity Caution Label (Levels 2a Through 5a)

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The humidity-indicator card (see Figure 21) is placed inside the sealed moisture-barrier bag. This card verifies that the product has been stored and shipped in a low-humidity environment.

Figure 21. Humidity-Indicator Card

Environmental Issues TI optimizes the packing density of each configuration to minimize the volume of packing material entering the industrial waste stream. Where possible, TI uses pure materials such as PS/PVC for ease of disposal. Cellulose-material suppliers are encouraged to incorporate recycled material to reduce their consumption of virgin material. Typical packing materials used, and their respective recycling code assignments, are listed in Table 5.

Table 5. Packing-Material Environmental Coding

PACKING RECYCLING COMPOSITION MATERIAL CODE Magazines PVC 3 End pins/plugs PVC 3 Trays PAS/ABS/PPE 7 (other) Reel PS 6 Carrier tape PS 6 Cover tape PET laminate 7 (other) Dry-pack bag PET laminate 7 (other) Boxes Kraft corrugated N/A

Semiconductor Packing Methodology 25 SZZA021C

Conclusion TI continually reviews packing configurations to ensure alignment with current industry trends and requirements. TI strives to deliver products to customers that are easily introduced into their customers’ respective assembly processes, while minimizing requirements for storage space, equipment setups/loading, and volume of material entering an industrial waste stream. It is important that TI customers be familiar with available packing configurations. This application report summarizes descriptions of the packing configurations to make this information easier to disseminate.

26 Semiconductor Packing Methodology SZZA021C

Glossary

Carrier tape Continuous, formed, embossed tape that is the primary container for components shipped in the tape-and-reel configuration

Cover tape Clear or transparent tape applied to the carrier tape to seal the components in the individual tape compartments

Desiccant Moisture-adsorbing material placed inside sealed dry-pack bags to adsorb internal bag moisture

Dry-pack bag Moisture-barrier bag with water-vapor transmission rate (WVTR) less than 0.000365 gram per 100 square inches surface area per 24 hours

EIA Electronics Industries Alliance

End pins Pins inserted in holes near each end of a magazine to prevent the components from exiting the magazine

End plugs Similar to end pins, but the plug is inserted in each open end of the magazine

Humidity-indicator card Card that verifies that humidity levels in sealed dry-packed bags have not exceeded specified limits. The card changes color to indicate different humidity levels.

Intermediate container Container(s) that are filled with loaded primary-level containers

JEDEC Joint Electron Device Engineering Council

Magazine Usually, extruded PVC shaped for individual component requirements to transport and store components. Also called stick magazine or shipping tube.

PDIP paper bag Intermediate container used for most PDIP products

Primary container Container used for the first level of packing

Reel Industry-standard reel used to collect and feed the loaded and sealed carrier tape

Reel box (pizza box) Intermediate container for the fully loaded reel, carrier tape, and cover tape

Termination End of the package pins

Tray Primary container used for QFP/TQFP/BGA devices, e.g., standard JEDEC outlines used as defined by package outlines

Tray box Intermediate container for stacked and bound tray packs

Semiconductor Packing Methodology 27 SZZA021C

Acknowledgment The authors would like to thank Beverly Houghton for helping with the images and standard quantity tables and Randy Kirk for helping with the standard packing examples.

References 1. EIA-481 Standards − Excerpts used to assure complete alignment 2. EIA-783 − Component Orientation 3. JEDEC − Moisture Sensitivity Testing Procedures: EIA/JEDEC A112-A, EIA/JEDEC A113-B

28 Semiconductor Packing Methodology IMPORTANT NOTICE

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