COMP 303 Computer Architecture Lecture 5
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A Comprehensive Review for Central Processing Unit Scheduling Algorithm
IJCSI International Journal of Computer Science Issues, Vol. 10, Issue 1, No 2, January 2013 ISSN (Print): 1694-0784 | ISSN (Online): 1694-0814 www.IJCSI.org 353 A Comprehensive Review for Central Processing Unit Scheduling Algorithm Ryan Richard Guadaña1, Maria Rona Perez2 and Larry Rutaquio Jr.3 1 Computer Studies and System Department, University of the East Caloocan City, 1400, Philippines 2 Computer Studies and System Department, University of the East Caloocan City, 1400, Philippines 3 Computer Studies and System Department, University of the East Caloocan City, 1400, Philippines Abstract when an attempt is made to execute a program, its This paper describe how does CPU facilitates tasks given by a admission to the set of currently executing processes is user through a Scheduling Algorithm. CPU carries out each either authorized or delayed by the long-term scheduler. instruction of the program in sequence then performs the basic Second is the Mid-term Scheduler that temporarily arithmetical, logical, and input/output operations of the system removes processes from main memory and places them on while a scheduling algorithm is used by the CPU to handle every process. The authors also tackled different scheduling disciplines secondary memory (such as a disk drive) or vice versa. and examples were provided in each algorithm in order to know Last is the Short Term Scheduler that decides which of the which algorithm is appropriate for various CPU goals. ready, in-memory processes are to be executed. Keywords: Kernel, Process State, Schedulers, Scheduling Algorithm, Utilization. 2. CPU Utilization 1. Introduction In order for a computer to be able to handle multiple applications simultaneously there must be an effective way The central processing unit (CPU) is a component of a of using the CPU. -
Fill Your Boots: Enhanced Embedded Bootloader Exploits Via Fault Injection and Binary Analysis
IACR Transactions on Cryptographic Hardware and Embedded Systems ISSN 2569-2925, Vol. 2021, No. 1, pp. 56–81. DOI:10.46586/tches.v2021.i1.56-81 Fill your Boots: Enhanced Embedded Bootloader Exploits via Fault Injection and Binary Analysis Jan Van den Herrewegen1, David Oswald1, Flavio D. Garcia1 and Qais Temeiza2 1 School of Computer Science, University of Birmingham, UK, {jxv572,d.f.oswald,f.garcia}@cs.bham.ac.uk 2 Independent Researcher, [email protected] Abstract. The bootloader of an embedded microcontroller is responsible for guarding the device’s internal (flash) memory, enforcing read/write protection mechanisms. Fault injection techniques such as voltage or clock glitching have been proven successful in bypassing such protection for specific microcontrollers, but this often requires expensive equipment and/or exhaustive search of the fault parameters. When multiple glitches are required (e.g., when countermeasures are in place) this search becomes of exponential complexity and thus infeasible. Another challenge which makes embedded bootloaders notoriously hard to analyse is their lack of debugging capabilities. This paper proposes a grey-box approach that leverages binary analysis and advanced software exploitation techniques combined with voltage glitching to develop a powerful attack methodology against embedded bootloaders. We showcase our techniques with three real-world microcontrollers as case studies: 1) we combine static and on-chip dynamic analysis to enable a Return-Oriented Programming exploit on the bootloader of the NXP LPC microcontrollers; 2) we leverage on-chip dynamic analysis on the bootloader of the popular STM8 microcontrollers to constrain the glitch parameter search, achieving the first fully-documented multi-glitch attack on a real-world target; 3) we apply symbolic execution to precisely aim voltage glitches at target instructions based on the execution path in the bootloader of the Renesas 78K0 automotive microcontroller. -
The Different Unix Contexts
The different Unix contexts • User-level • Kernel “top half” - System call, page fault handler, kernel-only process, etc. • Software interrupt • Device interrupt • Timer interrupt (hardclock) • Context switch code Transitions between contexts • User ! top half: syscall, page fault • User/top half ! device/timer interrupt: hardware • Top half ! user/context switch: return • Top half ! context switch: sleep • Context switch ! user/top half Top/bottom half synchronization • Top half kernel procedures can mask interrupts int x = splhigh (); /* ... */ splx (x); • splhigh disables all interrupts, but also splnet, splbio, splsoftnet, . • Masking interrupts in hardware can be expensive - Optimistic implementation – set mask flag on splhigh, check interrupted flag on splx Kernel Synchronization • Need to relinquish CPU when waiting for events - Disk read, network packet arrival, pipe write, signal, etc. • int tsleep(void *ident, int priority, ...); - Switches to another process - ident is arbitrary pointer—e.g., buffer address - priority is priority at which to run when woken up - PCATCH, if ORed into priority, means wake up on signal - Returns 0 if awakened, or ERESTART/EINTR on signal • int wakeup(void *ident); - Awakens all processes sleeping on ident - Restores SPL a time they went to sleep (so fine to sleep at splhigh) Process scheduling • Goal: High throughput - Minimize context switches to avoid wasting CPU, TLB misses, cache misses, even page faults. • Goal: Low latency - People typing at editors want fast response - Network services can be latency-bound, not CPU-bound • BSD time quantum: 1=10 sec (since ∼1980) - Empirically longest tolerable latency - Computers now faster, but job queues also shorter Scheduling algorithms • Round-robin • Priority scheduling • Shortest process next (if you can estimate it) • Fair-Share Schedule (try to be fair at level of users, not processes) Multilevel feeedback queues (BSD) • Every runnable proc. -
IBM Z Systems Introduction May 2017
IBM z Systems Introduction May 2017 IBM z13s and IBM z13 Frequently Asked Questions Worldwide ZSQ03076-USEN-15 Table of Contents z13s Hardware .......................................................................................................................................................................... 3 z13 Hardware ........................................................................................................................................................................... 11 Performance ............................................................................................................................................................................ 19 z13 Warranty ............................................................................................................................................................................ 23 Hardware Management Console (HMC) ..................................................................................................................... 24 Power requirements (including High Voltage DC Power option) ..................................................................... 28 Overhead Cabling and Power ..........................................................................................................................................30 z13 Water cooling option .................................................................................................................................................... 31 Secure Service Container ................................................................................................................................................. -
Chapter 1: Computer Abstractions and Technology 1.6 – 1.7: Performance and Power
Chapter 1: Computer Abstractions and Technology 1.6 – 1.7: Performance and power ITSC 3181 Introduction to Computer Architecture https://passlaB.githuB.io/ITSC3181/ Department of Computer Science Yonghong Yan [email protected] https://passlab.github.io/yanyh/ Lectures for Chapter 1 and C Basics Computer Abstractions and Technology • Lecture 01: Chapter 1 – 1.1 – 1.4: Introduction, great ideas, Moore’s law, aBstraction, computer components, and program execution • Lecture 02: C Basics; Memory and Binary Systems • Lecture 03: Number System, Compilation, Assembly, Linking and Program Execution ☛• Lecture 04: Chapter 1 – 1.6 – 1.7: Performance, power and technology trends • Lecture 05: – 1.8 - 1.9: Multiprocessing and Benchmarking 2 § 1.6 Performance 1.6 Defining Performance • Which airplane has the best performance? Boeing 777 Boeing 777 Boeing 747 Boeing 747 BAC/Sud BAC/Sud Concorde Concorde Douglas Douglas DC- DC-8-50 8-50 0 100 200 300 400 500 0 2000 4000 6000 8000 10000 Passenger Capacity Cruising Range (miles) Boeing 777 Boeing 777 Boeing 747 Boeing 747 BAC/Sud BAC/Sud Concorde Concorde Douglas Douglas DC- DC-8-50 8-50 0 500 1000 1500 0 100000 200000 300000 400000 Cruising Speed (mph) Passengers x mph 3 Response Time and Throughput • Response time çè Latency – How long it takes to do a task • Throughput çè Bandwidth – Total work done per unit time • e.g., tasks/transactions/… per hour • How are response time and throughput affected by – Replacing the processor with a faster version? – Adding more processors? • We’ll focus on response time for now… 4 Relative Performance • Define Performance = 1/Execution Time • “X is n time faster than Y”, i.e. -
Computer Organization and Architecture Designing for Performance Ninth Edition
COMPUTER ORGANIZATION AND ARCHITECTURE DESIGNING FOR PERFORMANCE NINTH EDITION William Stallings Boston Columbus Indianapolis New York San Francisco Upper Saddle River Amsterdam Cape Town Dubai London Madrid Milan Munich Paris Montréal Toronto Delhi Mexico City São Paulo Sydney Hong Kong Seoul Singapore Taipei Tokyo Editorial Director: Marcia Horton Designer: Bruce Kenselaar Executive Editor: Tracy Dunkelberger Manager, Visual Research: Karen Sanatar Associate Editor: Carole Snyder Manager, Rights and Permissions: Mike Joyce Director of Marketing: Patrice Jones Text Permission Coordinator: Jen Roach Marketing Manager: Yez Alayan Cover Art: Charles Bowman/Robert Harding Marketing Coordinator: Kathryn Ferranti Lead Media Project Manager: Daniel Sandin Marketing Assistant: Emma Snider Full-Service Project Management: Shiny Rajesh/ Director of Production: Vince O’Brien Integra Software Services Pvt. Ltd. Managing Editor: Jeff Holcomb Composition: Integra Software Services Pvt. Ltd. Production Project Manager: Kayla Smith-Tarbox Printer/Binder: Edward Brothers Production Editor: Pat Brown Cover Printer: Lehigh-Phoenix Color/Hagerstown Manufacturing Buyer: Pat Brown Text Font: Times Ten-Roman Creative Director: Jayne Conte Credits: Figure 2.14: reprinted with permission from The Computer Language Company, Inc. Figure 17.10: Buyya, Rajkumar, High-Performance Cluster Computing: Architectures and Systems, Vol I, 1st edition, ©1999. Reprinted and Electronically reproduced by permission of Pearson Education, Inc. Upper Saddle River, New Jersey, Figure 17.11: Reprinted with permission from Ethernet Alliance. Credits and acknowledgments borrowed from other sources and reproduced, with permission, in this textbook appear on the appropriate page within text. Copyright © 2013, 2010, 2006 by Pearson Education, Inc., publishing as Prentice Hall. All rights reserved. Manufactured in the United States of America. -
45-Year CPU Evolution: One Law and Two Equations
45-year CPU evolution: one law and two equations Daniel Etiemble LRI-CNRS University Paris Sud Orsay, France [email protected] Abstract— Moore’s law and two equations allow to explain the a) IC is the instruction count. main trends of CPU evolution since MOS technologies have been b) CPI is the clock cycles per instruction and IPC = 1/CPI is the used to implement microprocessors. Instruction count per clock cycle. c) Tc is the clock cycle time and F=1/Tc is the clock frequency. Keywords—Moore’s law, execution time, CM0S power dissipation. The Power dissipation of CMOS circuits is the second I. INTRODUCTION equation (2). CMOS power dissipation is decomposed into static and dynamic powers. For dynamic power, Vdd is the power A new era started when MOS technologies were used to supply, F is the clock frequency, ΣCi is the sum of gate and build microprocessors. After pMOS (Intel 4004 in 1971) and interconnection capacitances and α is the average percentage of nMOS (Intel 8080 in 1974), CMOS became quickly the leading switching capacitances: α is the activity factor of the overall technology, used by Intel since 1985 with 80386 CPU. circuit MOS technologies obey an empirical law, stated in 1965 and 2 Pd = Pdstatic + α x ΣCi x Vdd x F (2) known as Moore’s law: the number of transistors integrated on a chip doubles every N months. Fig. 1 presents the evolution for II. CONSEQUENCES OF MOORE LAW DRAM memories, processors (MPU) and three types of read- only memories [1]. The growth rate decreases with years, from A. -
ARM Instruction Set
4 ARM Instruction Set This chapter describes the ARM instruction set. 4.1 Instruction Set Summary 4-2 4.2 The Condition Field 4-5 4.3 Branch and Exchange (BX) 4-6 4.4 Branch and Branch with Link (B, BL) 4-8 4.5 Data Processing 4-10 4.6 PSR Transfer (MRS, MSR) 4-17 4.7 Multiply and Multiply-Accumulate (MUL, MLA) 4-22 4.8 Multiply Long and Multiply-Accumulate Long (MULL,MLAL) 4-24 4.9 Single Data Transfer (LDR, STR) 4-26 4.10 Halfword and Signed Data Transfer 4-32 4.11 Block Data Transfer (LDM, STM) 4-37 4.12 Single Data Swap (SWP) 4-43 4.13 Software Interrupt (SWI) 4-45 4.14 Coprocessor Data Operations (CDP) 4-47 4.15 Coprocessor Data Transfers (LDC, STC) 4-49 4.16 Coprocessor Register Transfers (MRC, MCR) 4-53 4.17 Undefined Instruction 4-55 4.18 Instruction Set Examples 4-56 ARM7TDMI-S Data Sheet 4-1 ARM DDI 0084D Final - Open Access ARM Instruction Set 4.1 Instruction Set Summary 4.1.1 Format summary The ARM instruction set formats are shown below. 3 3 2 2 2 2 2 2 2 2 2 2 1 1 1 1 1 1 1 1 1 1 9876543210 1 0 9 8 7 6 5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 0 Cond 0 0 I Opcode S Rn Rd Operand 2 Data Processing / PSR Transfer Cond 0 0 0 0 0 0 A S Rd Rn Rs 1 0 0 1 Rm Multiply Cond 0 0 0 0 1 U A S RdHi RdLo Rn 1 0 0 1 Rm Multiply Long Cond 0 0 0 1 0 B 0 0 Rn Rd 0 0 0 0 1 0 0 1 Rm Single Data Swap Cond 0 0 0 1 0 0 1 0 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 1 Rn Branch and Exchange Cond 0 0 0 P U 0 W L Rn Rd 0 0 0 0 1 S H 1 Rm Halfword Data Transfer: register offset Cond 0 0 0 P U 1 W L Rn Rd Offset 1 S H 1 Offset Halfword Data Transfer: immediate offset Cond 0 -
Memory Centric Characterization and Analysis of SPEC CPU2017 Suite
Session 11: Performance Analysis and Simulation ICPE ’19, April 7–11, 2019, Mumbai, India Memory Centric Characterization and Analysis of SPEC CPU2017 Suite Sarabjeet Singh Manu Awasthi [email protected] [email protected] Ashoka University Ashoka University ABSTRACT These benchmarks have become the standard for any researcher or In this paper, we provide a comprehensive, memory-centric charac- commercial entity wishing to benchmark their architecture or for terization of the SPEC CPU2017 benchmark suite, using a number of exploring new designs. mechanisms including dynamic binary instrumentation, measure- The latest offering of SPEC CPU suite, SPEC CPU2017, was re- ments on native hardware using hardware performance counters leased in June 2017 [8]. SPEC CPU2017 retains a number of bench- and operating system based tools. marks from previous iterations but has also added many new ones We present a number of results including working set sizes, mem- to reflect the changing nature of applications. Some recent stud- ory capacity consumption and memory bandwidth utilization of ies [21, 24] have already started characterizing the behavior of various workloads. Our experiments reveal that, on the x86_64 ISA, SPEC CPU2017 applications, looking for potential optimizations to SPEC CPU2017 workloads execute a significant number of mem- system architectures. ory related instructions, with approximately 50% of all dynamic In recent years the memory hierarchy, from the caches, all the instructions requiring memory accesses. We also show that there is way to main memory, has become a first class citizen of computer a large variation in the memory footprint and bandwidth utilization system design. -
Trends in Electrical Efficiency in Computer Performance
ASSESSING TRENDS IN THE ELECTRICAL EFFICIENCY OF COMPUTATION OVER TIME Jonathan G. Koomey*, Stephen Berard†, Marla Sanchez††, Henry Wong** * Lawrence Berkeley National Laboratory and Stanford University †Microsoft Corporation ††Lawrence Berkeley National Laboratory **Intel Corporation Contact: [email protected], http://www.koomey.com Final report to Microsoft Corporation and Intel Corporation Submitted to IEEE Annals of the History of Computing: August 5, 2009 Released on the web: August 17, 2009 EXECUTIVE SUMMARY Information technology (IT) has captured the popular imagination, in part because of the tangible benefits IT brings, but also because the underlying technological trends proceed at easily measurable, remarkably predictable, and unusually rapid rates. The number of transistors on a chip has doubled more or less every two years for decades, a trend that is popularly (but often imprecisely) encapsulated as “Moore’s law”. This article explores the relationship between the performance of computers and the electricity needed to deliver that performance. As shown in Figure ES-1, computations per kWh grew about as fast as performance for desktop computers starting in 1981, doubling every 1.5 years, a pace of change in computational efficiency comparable to that from 1946 to the present. Computations per kWh grew even more rapidly during the vacuum tube computing era and during the transition from tubes to transistors but more slowly during the era of discrete transistors. As expected, the transition from tubes to transistors shows a large jump in computations per kWh. In 1985, the physicist Richard Feynman identified a factor of one hundred billion (1011) possible theoretical improvement in the electricity used per computation. -
Computer Performance Evaluation and Benchmarking
Computer Performance Evaluation and Benchmarking EE 382M Dr. Lizy Kurian John Evolution of Single-Chip Microprocessors 1970’s 1980’s 1990’s 2010s Transistor Count 10K- 100K-1M 1M-100M 100M- 100K 10 B Clock Frequency 0.2- 2-20MHz 20M- 0.1- 2MHz 1GHz 4GHz Instruction/Cycle < 0.1 0.1-0.9 0.9- 2.0 1-100 MIPS/MFLOPS < 0.2 0.2-20 20-2,000 100- 10,000 Hot Chips 2014 (August 2014) AMD KAVERI HOT CHIPS 2014 AMD KAVERI HOTCHIPS 2014 Hotchips 2014 Hotchips 2014 - NVIDIA Power Density in Microprocessors 10000 Sun’s Surface 1000 Rocket Nozzle ) 2 Nuclear Reactor 100 Core 2 8086 10 Hot Plate 8008 Pentium® Power Density (W/cm 8085 4004 386 Processors 286 486 8080 1 1970 1980 1990 2000 2010 Source: Intel Why Performance Evaluation? • For better Processor Designs • For better Code on Existing Designs • For better Compilers • For better OS and Runtimes Design Analysis Lord Kelvin “To measure is to know.” "If you can not measure it, you can not improve it.“ "I often say that when you can measure what you are speaking about, and express it in numbers, you know something about it; but when you cannot measure it, when you cannot express it in numbers, your knowledge is of a meagre and unsatisfactory kind; it may be the beginning of knowledge, but you have scarcely in your thoughts advanced to the state of Science, whatever the matter may be." [PLA, vol. 1, "Electrical Units of Measurement", 1883-05-03] Designs evolve based on Analysis • Good designs are impossible without good analysis • Workload Analysis • Processor Analysis Design Analysis Performance Evaluation -
Cuda C Best Practices Guide
CUDA C BEST PRACTICES GUIDE DG-05603-001_v9.0 | June 2018 Design Guide TABLE OF CONTENTS Preface............................................................................................................ vii What Is This Document?..................................................................................... vii Who Should Read This Guide?...............................................................................vii Assess, Parallelize, Optimize, Deploy.....................................................................viii Assess........................................................................................................ viii Parallelize.................................................................................................... ix Optimize...................................................................................................... ix Deploy.........................................................................................................ix Recommendations and Best Practices.......................................................................x Chapter 1. Assessing Your Application.......................................................................1 Chapter 2. Heterogeneous Computing.......................................................................2 2.1. Differences between Host and Device................................................................ 2 2.2. What Runs on a CUDA-Enabled Device?...............................................................3 Chapter 3. Application Profiling.............................................................................