SOI) Switches for Ultra Wideband Wireless Communication Applications
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Fully Passive Conductive-Bridging Solid State RF Switch Abstract 1
32nd URSI GASS, Montreal, 19-26 August 2017 Fully Passive Conductive-Bridging Solid State RF Switch M.P. Jayakrishnan(1), Arnaud Vena(2), Brice Sorli(2) and Etienne Perret(1,3) (1) Université Grenoble Alpes - LCIS, 50, rue de Laffemas, BP 54, Valence 26902, France. (2) Institut d’Electronique du Sud, Université de Montpellier 2, Montpellier 34095, France. (3) Institut Universitaire de France, Paris 75005, France. Email: [email protected], [email protected] Abstract performance and good repeatability, which makes this concept a promising set forth. This study reports the design and experimental results of a fully-passive solid-state RF switch based on the 2. Background Conductive Bridging Memory Technology, popularly known as CBRAM. The developed device is a shunt The CBRAM RF switch is based on a Metal-Insulator- mode RF switch based on a Metal-Insulator-Metal (MIM) Metal structure as shown in Fig. 1 where the Insulator structure with Copper – Nafion – Aluminum switching layer is a solid electrolyte like common synthetic resin layers on a Coplanar Waveguide (CPW) transmission [6,7]and one of the electrode is an electrochemically line, operational in the DC to 3GHz range. DC pulses in active metal like copper or silver and the other is a the range +12V to –20V are used to operate the switch. relatively inert metal like aluminum or gold. The The design is initially simulated using the FEM based switching action is obtained by applying electric field of CST microwave Studio and then realized and validated on sufficient voltage to establish a metallic link between the a low cost FR4 substrate, and without using any two electrodes through the electrolyte, and by dissolving sophisticated clean room technology. -
CMOS T/R Switch Design : Towards Ultra‑Wideband and Higher Frequency
This document is downloaded from DR‑NTU (https://dr.ntu.edu.sg) Nanyang Technological University, Singapore. CMOS T/R switch design : towards ultra‑wideband and higher frequency Li, Qiang; Zhang, Yue Ping 2007 Li, Q., & Zhang, Y. P. (2007). CMOS T/R switch design : towards ultra‑wideband and higher frequency. IEEE Journal of Solid‑State Circuits, 42(3), 563‑570. https://hdl.handle.net/10356/91145 https://doi.org/10.1109/JSSC.2006.891442 © 2007 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site. Downloaded on 01 Oct 2021 08:29:57 SGT IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 42, NO. 3, MARCH 2007 563 CMOS T/R Switch Design: Towards Ultra-Wideband and Higher Frequency Qiang Li, Member, IEEE, and Y. P. Zhang Abstract—This paper presents the comprehensive consider- point in the transmit mode was obtained. The disad- ations of CMOS transmit/receive (T/R) switch design towards vantages of this approach are the design complexity and large ultra-wideband and over 15-GHz frequencies. -
ELECTRICAL PROPERTIES of SILICON FILMS on SAPPHIRE SUBSTRATES a Thesis Presented for the Degree of Doctor of Philosophy in the U
ELECTRICAL PROPERTIES OF SILICON FILMS ON SAPPHIRE SUBSTRATES A thesis presented for the degree of Doctor of Philosophy in the University of London by ALEXANDER BELL MARR ELLIOT Department of Electrical Engineering, Imperial College of Science and Technology and Post Office Research Centre Martlesham Heath, Ipswich January 1976 To Jan, Karen and Fraser 2 ACKNOWLEDGEMENTS The author is grateful to Mr R E Hines and Mr J W Woodward for assistance in the preparation of the test specimens and to his supervisor, Professor J C Anderson for his advice and encouragement. The work reported in this thesis was carried out at the Post Office Research Department and acknowledgement is made to the Director of Research for permission to publish this work. 3 • ABSTRACT A critical evaluation of published information on the properties of heteroepitaxial silicon layers on sapphire substrates is given, including a detailed comparative study of all the available data on the electrical properties of these layers. This review is followed by an account of an investigation of the electrical properties of thin layers as a function of depth in the film using two independent techniques, both of which employ the progressive penetration of a depletion region to vary the thickness of the layer measured. The first technique uses a deep depletion MIS Hall effect structure to measure the variation in carrier concentration and mobility through the epitaxial layer. Additional information is also obtained on the properties of the silicon-silicon dioxide and the silicon-sapphire interfaces. Because the MIS techniques is not capable of measuring the properties of all the films through to the sapphire interface a second technique, using a junction field-effect structure, is also used to obtain further carrier concentration and mobility information. -
Memoriamin Memoriam
PEOPLE Ashok K. Vijh Elected CRSI Honorary Fellow ASHOK K. VIJH has been the Royal Society of Chemistry (UK), and the Institute elected as one of four new of Physics (UK). Over his long career, his work has been Honorary Fellows of the recognized by over forty major prizes, awards, medals, The Chemical Research decorations, and other distinctions. He has been decorated Society of India (CRSI) this as an Officer of the Order of Canada and as an Officer year. Founded in 1999 as of the National Order of Québec. He has also received a part of celebrations for honorary doctorates from three universities. India’s fiftieth anniversary From 2005-2007, he served as the elected President of of independence, CRSI’s the Academy of Science of the Royal Society of Canada goal is to promote research and as a Vice-President of the Royal Society of Canada. In at the highest level (http://crsi.org.in). To date, there are addition, he has been elected a Foreign/Titular Fellow of 31 Honorary Fellows internationally, including several several other academies including the European Academy Nobel laureates. Dr. Vijh is the first person of Indian of Science, Arts and Humanities (Paris), The Academy origin to be added to this elite group. He has been an of Sciences of the Developing World (TWAS, based in active member of ECS since 1968. Trieste, Italy), and the Indian National Science Academy Dr. Vijh’s research is in several areas of physical (INSA). He also serves on the editorial boards of several electrochemistry and materials science. -
U.S. Integrated Circuit Design and Fabrication Capability Survey Questionnaire Is Included in Appendix E
Defense Industrial Base Assessment: U.S. Integrated Circuit Design and Fabrication Capability U.S. Department of Commerce Bureau of Industry and Security Office of Technology Evaluation March 2009 DEFENSE INDUSTRIAL BASE ASSESSMENT: U.S. INTEGRATED CIRCUIT FABRICATION AND DESIGN CAPABILITY PREPARED BY U.S. DEPARTMENT OF COMMERCE BUREAU OF INDUSTRY AND SECURITY OFFICE OF TECHNOLOGY EVALUATION May 2009 FOR FURTHER INFORMATION ABOUT THIS REPORT, CONTACT: Mark Crawford, Senior Trade & Industry Analyst, (202) 482-8239 Teresa Telesco, Trade & Industry Analyst, (202) 482-4959 Christopher Nelson, Trade & Industry Analyst, (202) 482-4727 Brad Botwin, Director, Industrial Base Studies, (202) 482-4060 Email: [email protected] Fax: (202) 482-5361 For more information about the Bureau of Industry and Security, please visit: http://bis.doc.gov/defenseindustrialbaseprograms/ TABLE OF CONTENTS EXECUTIVE SUMMARY .................................................................................................................... i BACKGROUND................................................................................................................................ iii SURVEY RESPONDENTS............................................................................................................... iv METHODOLOGY ........................................................................................................................... v REPORT FINDINGS......................................................................................................................... -
Extended Models of Silicon on Sapphire Transistors for Analog and Digital Design at Elevated Temperatures
EXTENDED MODELS OF SILICON ON SAPPHIRE TRANSISTORS FOR ANALOG AND DIGITAL DESIGN AT ELEVATED TEMPERATURES (200°C) By NARENDRA BABU KAYATHI Bachelor of Technology in Electrical SriVenkateswara University Tirupati, INDIA 1999 Submitted to the Faculty of the Graduate College of the Oklahoma State University in partial fulfillment of the requirements for the Degree of MASTER OF SCIENCE December, 2005 EXTENDED MODELS OF SILICON ON SAPPHIRE TRANSISTORS FOR ANAL OG AND DIGITAL DESIGN AT ELEVATED TEMPERATURES (200°C) Thesis Approved: Dr. Chris Hutchens Thesis Adviser Dr. Louis G. Johnson Dr. Yumin Zhang A. Gordon Emslie Dean of the Graduate College ii Acknowledgments This thesis is t he result of research I have realized at the MSVLSI group of Oklahoma State University. Given this opportunity, I would like to thank all the people who have helped me directly or indirectly in completion of this work. I would like to thank Drs Chris Hutc hens, Louis Johnson and Yumin Zhang for their guidance as my committee members. Especially I would like to thank Dr. Chris Hutchens for his constant encouragement and mentoring throughout my master’s program. His undying enthusiasm, energy and relentless d edication have always been a source of inspiration to me from the beginning day of my life in US. I am also indebted to Dr. Jerzy Krasinski for providing me with Teaching Assistant ship positions. Working at MSVLSI is something I would always cherish upon. It was a great learning experience made possible by Dr. Hutchens and all the members who are (were) part of this group. I would like to thank Dr. -
A Fully Integrated High Ip1db CMOS SPDT Switch Using Stacked Transistors for 2.4 Ghz TDD Transceiver Applications
Sådhanå (2018) 43:94 Ó Indian Academy of Sciences https://doi.org/10.1007/s12046-018-0913-z Sadhana(0123456789().,-volV)FT3](0123456789().,-volV) A fully integrated high IP1dB CMOS SPDT switch using stacked transistors for 2.4 GHz TDD transceiver applications PAUL SCHMIEDEKE1,2, MOHAMMAD ARIF SOBHAN BHUIYAN2,5,*, MAMUN BIN IBNE REAZ2, TAE GYU CHANG3, MARIA LIZ CRESPO4 and ANDRES CICUTTIN4 1 Fakulta¨tfu¨r Elektrotechnik, Informationstechnik, Physik, Technische Universita¨t Braunschweig, Hans- Sommer-Str. 66, 38106 Brunswick, Germany 2 Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia 3 School of Electrical and Electronics Engineering, Chung-Ang University, Seoul 156-756, Korea 4 The Abdus Salam International Centre for Theoretical Physics, Via Beirut 31, 34100 Trieste, Italy 5 Department of Electrical and Electronics Engineering, Xiamen University Malaysia, Jalan Sunsuria, Bandar Sunsuria, 43900 Sepang, Selangor, Malaysia e-mail: [email protected]; [email protected]; [email protected]; [email protected]; [email protected]; [email protected]; [email protected] MS received 18 February 2016; revised 5 September 2017; accepted 13 September 2017; published online 7 June 2018 Abstract. A transmit/receive (T/R) switch is an essential module of every modern time division duplex (TDD) transceiver circuit. A T/R switch with high power handling capacity in CMOS process is difficult to design due to capacitive coupling of radio frequency signals to the substrate. This paper proposes a single-pole-double- throw (SPDT) T/R switch designed in a standard Silterra 130 nm CMOS process for high-power applications like RFID readers. -
Agilent RF and Microwave Switch Selection Guide
Agilent RF and Microwave Switch Selection Guide Agilent Technologies — Your one-stop switching solution provider Key Features • High reliability and exceptional repeatability ensure excellent measurement accuracy • Excellent RF specifi cations optimize your test system measurement capability • Broad selection of switches provides confi guration fl exibility for various applications Agilent RF and Microwave Switches Agilent has been a leading designer and manufacturer of RF and microwave Agilent RF and microwave switches in the global marketplace for more than 60 years. RF and microwave switches provide: switches are used extensively in microwave test systems for signal routing between instruments and devices under test (DUT). Incorporating a switch into • Superior RF performance to a switch matrix system enables you to route signals from multiple instruments optimize test equipment to single or multiple DUTs. This allows multiple tests to be performed with the performance same setup, eliminating the need for frequent connects and disconnects. The • Unmatched quality and reliability entire testing process can thus be automated, increasing the throughput in to minimize measurement high-volume production environments. uncertainty Agilent designs and manufacturers a comprehensive range of RF and microwave • Ultra broadband to meet the switches to meet your switching requirements. There are two mainstream demands of today’s devices switch technologies in use today: solid state and electromechanical. Agilent’s solid state and electromechanical switches operate across a broad frequency range and come in a variety of confi gurations. Designed with high accuracy and repeatability for automated test and measurement, signal monitoring and routing applications, Agilent switches have a proven track record for high performance, quality and reliability. -
RF Substrate Technologies for Mobile Communications White Paper
RF Substrate Technologies for Mobile Communications White paper V1.1 - May 2011 Stéphane Laurent | Strategic Marketing Engineer [email protected] Eric Desbonnets | Business Development Manager [email protected] Abstract Contents This white paper discusses a Introduction ...................................................... 2 variety of RF materials and RF basics and issues .......................................... 2 substrates capable of meeting RF Front-End module Key functions of RFFE modules ........................... 3 designers’ requirements. Selecting the optimal substrate ........................... 4 You will gain insight into how Gallium arsenide (GaAs) ................................................4 state-of-the-art expertise in Silicon-on-sapphire (SoS) ..............................................5 substrate technology can enable the mobile devices of High-resistive silicon-on-insulator (HR-SOI).....................5 the next decade. Silicon bulk...................................................................5 Conclusion......................................................... 6 References ........................................................ 7 About Soitec ...................................................... 7 Soitec | RF Substrates Technologies, Stéphane Laurent, Éric Desbonnets | Page 1 of 7 Introduction In today’s connected world, the demand for mobile communications and instant access to information, anytime and anywhere, has drastically changed the consumer electronics landscape. Infrastructure, -
1 Silicon-On-Insulator Technology
EE 530, Advances in MOSFETs, Spring 2004 Silicon-on-Insulator Technology Vishwas Jaju Instructor: Dr. Vikram Dalal Abstract - This article explains the issues be reduced, resulting in an increase in quantum related to silicon-on-insulator technology. As the mechanical tunneling in excessively high electric bulk silicon CMOS processes are reaching there fields. Eventually silicon oxide must be replaced limit in terms of device miniaturization and with a high-k material so the physical thickness of fabrication, SOI technology gives a good the material can be increased. As the device alternative to that. SOI technology is considered length is reduced the high doping is required in to take the CMOS processing to its ultimate scalability, and a brief review of work published between the source and drain which in turns by many research groups is presented in this increases the parasitic capacitance between paper. Firstly, technological development on diffused source, drain and substrate. The doping fabrication of silicon–on-insulator wafers is profile of the devices needs to be controlled more presented. After that focusing upon CMOS accurately with each new generation, and the technology, different types of SOI MOSFETs and implantation and annealing technology needs to related physical concepts are evaluated. Finally keep up with the stringent requirements of very double gate MOSFET’s properties, and its pros and sharp doping profiles. Considering all these facts cons over bulk CMOS technology are explained. for a long time search for the breakthrough technology has been undergoing. I. Introduction Silicon-on-insulator (SOI) technology gives CMOS integrated circuits are almost many advantages over bulk silicon CMOS exclusively fabricated on bulk silicon substrates processing. -
RF Switch Design
RF Switch Design Emily Wagner Petro Papi Colin Cunningham Major Qualifying Project submitted to the Faculty of WORCESTER POLYTECHNIC INSTITUTE In partial fulfillment of the requirements for the degree of Bachelor of Science Approved: ______________________________ Professor Reinhold Ludwig ______________________________ Professor John McNeill ______________________________ David Whitefield Table of Contents Table of Figures .......................................................................................................................... 2 Table of Tables ........................................................................................................................... 3 Acknowledgements ..................................................................................................................... 4 Abstract ...................................................................................................................................... 5 1 Introduction ........................................................................................................................ 6 1.1 RF Switch Purpose and Cellular Applications ................................................................. 6 1.2 Design Challenges in Mobile Systems ............................................................................ 8 1.2.1 FET Breakdown Restrictions ..................................................................................... 8 1.2.2 Time Limitation of Finite Element Analysis ............................................................... -
Analogue Switches Made from Boron Nitride Monolayers for Application in 5G and Terahertz Communication Systems
ARTICLES https://doi.org/10.1038/s41928-020-0416-x Analogue switches made from boron nitride monolayers for application in 5G and terahertz communication systems Myungsoo Kim 1, Emiliano Pallecchi 2, Ruijing Ge1, Xiaohan Wu 1, Guillaume Ducournau2, Jack C. Lee1, Henri Happy 2 and Deji Akinwande 1 ✉ Hexagonal boron nitride (hBN) has a large bandgap, high phonon energies and an atomically smooth surface absent of dangling bonds. As a result, it has been widely used as a dielectric to investigate electron physics in two-dimensional heterostructures and as a dielectric in the fabrication of two-dimensional transistors and optoelectronic devices. Here we show that hBN can be used to create analogue switches for applications in communication systems across radio, 5G and terahertz frequencies. Our approach relies on the non-volatile resistive switching capabilities of atomically thin hBN. The switches are composed of mono- layer hBN sandwiched between two gold electrodes and exhibit a cutoff-frequency figure of merit of around 129 THz with a low insertion loss (≤0.5 dB) and high isolation (≥10 dB) from 0.1 to 200 GHz, as well as a high power handling (around 20 dBm) and nanosecond switching speeds, metrics that are superior to those of existing solid-state switches. Furthermore, the switches are 50 times more efficient than other non-volatile switches in terms of a d.c. energy-consumption metric, which is an important consideration for ubiquitous mobile systems. We also illustrate the potential of the hBN switches in a communication system with an 8.5 Gbit s–1 data transmission rate at 100 GHz with a low bit error rate under 10−10.