Key Engineering Materials Vol. 443 (2010) pp 567-572 Online available since 2010/Jun/02 at www.scientific.net © (2010) Trans Tech Publications, Switzerland doi:10.4028/www.scientific.net/KEM.443.567 Production, Characterization and Application of Silicon-on-sapphire Wafers Alokesh Pramanik a, Mei Liu b and L.C. Zhang c School of Mechanical and Manufacturing Engineering, The University of New South Wales, NSW 2052, Australia
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[email protected] Keywords: Silicon on sapphire; thin film; defects; residual stress Abstract. Silicon-on-sapphire (SOS) thin film systems have had specific electronic applications because they can reduce noise and current leakage in metal oxide semiconductor transistors. However, there are some issues in producing defect-free SOS wafers. Dislocations, misfit, micro twins and residual stresses can emerge during the SOS processing and they will reduce the performance of an SOS product. For some reasons, research publications on SOS in the literature are not extensive, and as a result, the information available in the public domain is fragmentary. This paper aims to review the subject matter in an as complete as possible manner based on the published information about the production, characterization and application of SOS wafers. Introduction SOS is a member of the silicon-on-insulator (SOI) family which uses a hetero-epitaxial process to generate thin films of semiconductor materials. When sapphire is used as a substrate, because of its high insulation property and low parasitic capacitance, it can provide lower power consumption, higher frequency and better linearity and isolation than the bulk silicon.