DOCSLIB.ORG

1 Fabrication and Characterization of a Silicon Carbide Alpha Detector For

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
1 Fabrication and Characterization of a Silicon Carbide Alpha Detector For Fabrication and Characterization of a Silicon Carbide Alpha Detector for Molten Salt Application Dissertation Presented in Partial Fulfillment of the Requirements for the Degree Doctor of Philosophy in the Graduate School of The Ohio State University By Joshua T. Jarrell, B.S., M.S. Graduate Program in Nuclear Engineering The Ohio State University 2018 Dissertation Committee Dr. Lei R. Cao, Advisor Dr. Thomas Blue Dr. Marat Khafizov 1 Copyrighted by Joshua T. Jarrell 2018 2 Abstract There exists a need for monitoring the actinide concentrations in elevated temperature molten salt environments. Reprocessing of used nuclear fuel through pyroprocessing is being investigated as a viable method to manage the growing stockpile of used nuclear fuel. Idaho National Laboratory has demonstrated the ability to reprocess both breeder and blanket fuel from the Experimental Breeder Reactor II using an electrorefining system. This system uses a molten eutectic salt mixture of lithium chloride and potassium chloride. This electrorefining system can produce high purity uranium ingots and mixed uranium- plutonium ingots. The fundamental electrochemistry used for this process precludes the separation of high purity plutonium when operated within the suggested process limits. However, special nuclear material may be diverted by operating outside of the normal process. Complete draw down of the uranium dissolved into the molten salt would allow for the subsequent removal of high purity plutonium. Monitoring of the operational history of the electrorefiner is therefore essential to address these non-proliferation and safeguard concerns. There is thus a need to monitor the concentrations of individual elements and isotopes present in the electrorefiner salt. Currently, such assays require time on the order of weeks to provide an accurate description of isotopic concentrations within the salt. Thus, a near real-time measurement system for the actinide isotopic concentrations within the salt is needed. All actinide isotopes of interest to non-proliferation and safeguards interests ii emit characteristic alpha particles. Semiconductor radiation detectors have been shown to provide a compact, high energy resolution solution to spectroscopic measurement needs. Silicon carbide, a wide band-gap semiconductor, provides elevated temperature operation capability and corrosion resistance in the molten salt environment that is superior to silicon. As a result, for this work, alpha radiation detectors comprised of 4H-SiC with Schottky barrier contacts have been fabricated and shown to operate above 500oC. Detector contact compositions of nickel-platinum was explored as possible Schottky contact structures. The electrical and diode characteristics of the detectors were measured. Alpha spectra from multiple source isotopes and source geometries were obtained in vacuum with the detector heated from 20oC to 500oC. The resulting detector behavior including alpha spectrum centroid position and detector energy resolution were measured. To avoid energy attenuation in the molten salt, a repeatable method for depositing actinides to the surface of the detector was devised that allows for repeated spectroscopic measurements by a single detector. The resilience of detector performance to submersion in a molten salt was investigated as well as energy resolution during elevated temperature operation. Detectors were characterized prior to being submerged in a 500oC molten LiCl-KCl eutectic salt for increasing time intervals. After submersion, the detectors were again characterized to identify any degradation. Detector packaging capable of withstanding the corrosive 500oC molten salt environment was developed which allows for electrical connections between the detector and spectrometry equipment. The packaging was designed to allow for actinide deposition on the active area of the detector, allowing for accurate calculations of the actinide mass deposited by a known current. Additionally, nuclear forensic applications of iii 4H-SiC alpha detectors in conjunction with electrodeposited source fabrication were explored. A method was determined to calculate the 235U enrichment in the product stream of an enrichment facility through measurement of the 234U and 235U enrichments in an electrodeposited source fabricated from depleted uranium. iv Dedication This is dedicated to my loving wife Jennifer. v Acknowledgments This work would not be possible without the assistance and support of many individuals. Foremost among these are Dr. Raymond Cao and Dr. Thomas Blue. Their guidance, suggestions, and feedback proved indispensable in my development as a graduate student. I would also like to acknowledge Dr. Lei Wang and Sha Xue for their work which contributed to the outcome of this research. Additionally, I would like to acknowledge Dr. Marat Khafizov for serving on my thesis defense committee. I would like to acknowledge Dr. Timothy Garcia, Dr. Benjamin Reinke and the staff of Nanotech West for their assistance with the development of the equipment and processes which were invaluable in the research presented in this work. I would also like to acknowledge the National Academy for Nuclear Training Fellowship and the Nuclear Regulatory Commission Fellowship programs. Their financial support of my stipend made this work possible. Additionally, I would like to thank the Nuclear Energy University Program for their support of the project on which I worked. vi Vita November 7, 1990 ……………… Born – Orange, VA, USA 2013 …………………….…...….. B.S Physics, James Madison University 2015 …………………………..… M.S. Nuclear Engineering, The Ohio State University 2016-Present ……………………. NRC Fellow, The Ohio State University Publications 1. Josh Jarrell, Milan Stika, Michael Simpson, Thomas E. Blue, and Lei R. Cao, “4H-SiC Alpha Spectrometry for Nuclear Forensics with Electrodeposited Sources”, J. of Radioanalytical and Nuclear Chemistry (accepted) 2. Josh Jarrell, Thomas E. Blue, and Lei R. Cao “Development of A Ni-Pt Schottky Diode for High Temperature Alpha Spectroscopy”. IEEE 2017 NSS/MIC/RTSD, 00(2):277– 287, Oct 2017. 3. Josh Jarrell, Milan Stika, Michael Simpson, Thomas E. Blue, Lei R. Cao. “Depleted Uranium and Th-232 Decay Chain Daughter Isotope Identification with 4H-SiC Alpha Spectroscopy”. Transactions of American Nuclear Society, 00(2):277–287, Oct 2017. 4. Lei Wang, Josh Jarrell, Sha Xue, Thomas Blue, Lei R. Cao. “The Fast Neutron Sensitivity of a SiC Detector”. Transactions of American Nuclear Society, 00(2):277– 287, Oct 2017. vii 5. Lei Cao, Josh Jarrell, Andrew Kauffman, Susan White, Kevin Herminghuysen, Douglas E. Hardtmayer, Jeff Sanders, Shelly Li “A Radioactive Tracer Dilution Method to Determine the Mass of Molten Salt”. Journal of Radioanaltyical and Nuclear Chemistry, https://doi.org/10.1007/s10967-017-5417-5, Aug 2017. 6. Lei Cao, Eric Moore, Josh Jarrell “Heteroepitaxial Diamond Growth on 4H-SiC using Microwave Plasma Chemical Vapor Deposition”. Heliyon, Sep 2017. 7. Joshua Jarrell, Eric Moore, Thomas Blue, Lei Cao “Elevated Temperature Alpha Spectroscopy with Nickel-Platinum 4H-SiC Schottky Diodes”. Transactions of American Nuclear Society, 116 (1). 123-125, Jun 2017. 8. M. Stika, S. Padilla, J. Jarrell, T. Blue, L. R. Cao, M. Simpson “Thin-Layer Elec- trodeposition of Thorium Metal from Molten LiCl-KCl”. Journal of Electrochemical Society, vol. 164, no. 8, 2017. 9. Josh Jarrell, Milan Stika, Max Chaiken, Michael Simpson, Thomas E. Blue, Lei R. Cao “Determination of the thickness of an electrodeposited thorium film with SiC alpha detectors”. J. Radioanalytical and Nuclear Chemistry, 1127-1133 Vol. 311, no. 2., Nov 2016. 10. Milan Stika, Max Chaiken, Josh Jarrell, Thomas Blue, Lei Raymond Cao, Michael Simpson “Thin-Layer Electrodeposition of Thorium and Uranium from Molten LiCl- KCl”. ECS Transactions, 603-608 volume 75, issue 15, 2016. 11. Milan Stika, Max Chaiken, Joshua Jarrell, Thomas Blue, Lei R. Cao, Michael Simpson “Electrodeposition of Actinides on a Semiconductor Detector for Concentration Monitoring”. Transactions of American Nuclear Society, 114 (1). 340-344, Jun 2016. 12. Josh Jarell, Benjamin Reinke, Max Chaiken, Brandon Wilson, Wolfgang Windl, Brian Esser, Lei Cao, Thomas Blue “Charge Carrier Diffusion Length Determination in 4H- SiC Schottky Alpha Detectors”. Transactions of American Nuclear Society, 114 (1). 300- 304, Jun 2016. 13. Benjamin Reinke, Joshua Jarrell, Max Chaiken, Brandon A. Wilson, Thomas E. Blue, Wolfgang Windl, Bryan D. Esser, Lei Cao “Long-term 500 C testing of high- temperature 4H-SiC Schottky diode alpha article detectors for pyroprocessing”. Transactions of American Nuclear Society, 113 (1). 489-491, Nov 2015. viii Fields of Study Major Field: Nuclear Engineering ix Table of Contents Abstract ............................................................................................................................... ii Dedication ........................................................................................................................... v Acknowledgments.............................................................................................................. vi Vita .................................................................................................................................... vii List of Tables ................................................................................................................... xiii List of Figures .................................................................................................................
Load more

Recommended publications
  • Sn95/Sb5 – Organic Acid 3% Core
    Technical Data Sheet Sn95/Sb5 – Organic Acid 3% Core NOMINAL COMPOSITION Tin 94% Min Lead 0.1% Max Arsenic 0.01% Max Antimony 4.5% 5.5 Cadmium 0.005% Max Iron 0.04% Max Copper 0.08% Max Aluminum 0.005% Max Zinc 0.005% Max Silver 0.015% Max Bismuth 0.15% Max Flux – 3% Organic Acid Core by weight PHYSICAL PROPERTIES Solder Alloy Color White Melting Point (Solidus) 450°F (233°C) Flow Point (Liquidus) 464°F (240°C) Specific Gravity 7.26 Density (Lbs/in3) 0.263 Bulk Room Temperature Tensile Strength (PSI) 5,900 Flux Type Water Soluble Organic Acid Physical State Solid Melting Point 250°F (120°C) Chloride Content 4% SOLDERING CHARACTERISTICS Sn95/Sb5 is a general-purpose solder used in applications involving soldering of copper and copper alloys and/or ferrous base alloys where use of lead containing solder is not permitted. This soft solder may be used in applications involving higher service temperatures. Typical applications for this alloy include copper components in air conditioning industry. This alloy is also recommended in applications involving food handling or drinking water components where use of lead containing alloys is not permitted. Antimony bearing alloys are not recommended in soldering of brass parts due to formation of a brittle Sb-Zn inter-metallic. This flux-cored solder can be used on difficult to solder materials where rosin based fluxes and electronic grade organic fluxes are not strong enough. It has been used effectively in many non-electronic applications such as lamps, fuses, and jewelry. The flux is active on copper, brass, bronze, steel, nickel, and stainless steel.
    [Show full text]
  • Low Melting Temperature Sn-Bi Solder
    metals Review Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics Hyejun Kang, Sri Harini Rajendran and Jae Pil Jung * Department of Materials Science and Engineering, University of Seoul, 163, Seoulsiripdae-ro, Dongdaemun-gu, Seoul 02504, Korea; [email protected] (H.K.); [email protected] (S.H.R.) * Correspondence: [email protected] Abstract: Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed. Keywords: low-temperature solder; Sn-58wt%Bi; melting temperature; microstructure; mechani- Citation: Kang, H.; Rajendran, S.H.; cal property Jung, J.P. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical 1. Introduction Characteristics. Metals 2021, 11, 364.
    [Show full text]
  • Major Causes of Solder Cracks Applications and Boards That Specially Require Solder Crack Countermeasures Comparison of 2 Soluti
    Solder Crack Countermeasures in MLCCs Outline This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Fig. 1: Appearance of a solder crack Ceramic Chip Capacitors). (cross-section) Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile. TDK offers following MLCC products as solder crack countermeasures. 1) Metal terminals “disperse” thermal shock : 2) Equipped with resin layers that absorb stress applied on solder MEGACAP joints and resistant to dropping: Soft termination Comparison of 2 solutions: Summary of “Solder Crack Countermeasures in MLCCs” Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions Fig. 2: Major causes of solder cracks and their impact after going on the market and during manufacturing processes such as soldering. The following causes can be listed as the major cause of solder cracks. (1) Thermal shock (heat shock), heat fatigue caused by temperature cycle Solder cracks occur when heat stress is applied to a solder joint due to the difference in the thermal coefficients of the MLCC and PCB, in an environment in which changes between high temperatures and low temperatures are repeated. In addition, it can also occur when temperature control is insufficient during the process of soldering. (2) Lead-free solder Lead-free solder, which started to be used due to environmental considerations, has properties of being rigid and fragile, and has a higher risk of solder cracks compared to conventional eutectic solder; therefore, caution is required when using it.
    [Show full text]
  • Soldering to Gold Films
    Soldering to Gold Films THE IMPORTANCE OF LEAD-INDIUM ALLOYS Frederick G. Yost Sandia Laboratories, Albuquerque, New Mexico, U.S.A. Reliable solder joints can be made on gold metallised microcircuits using lead-indium solders providing certain important conditions are understood and carefully controlled. This paper reviews the three fundamental concepts of scavenging, wetting, and ageing, which are relevant when soldering to gold films. Alloys containing indium have been used for solder- sition and a body centred tetragonal space lattice. ing electronic components to thin gold films and wires Although considerable work has been addressed for at least 14 years. Braun (1, 2) investigated the to the question of clustering and phase separation potential of several multicomponent alloys based in the a field below 20°C (7, 8, 9) the practical signifi- upon the lead-tin-indium ternary alloy system. cance of this phenomenon has not yet materialised. More recently, work on lead-indium binary alloys The most commonly used alloy is the 50 weight has been reported by Jackson (3) and Yost, et al per cent indium composition which has a liquidus (4, 5, 6). In this paper we intend to define, to discuss, temperature of approximately 210°C and a solidus and to illustrate three fundamental concepts relevant temperature of approximately 185°C. Alloys in the to soldering to gold films using lead-indium solders. lead rich phase field, a, freeze dendritically by The lead-indium phase diagram, shown in Figure forming lead rich stalks. The formation of these 1, contains a wealth of useful solder alloys having dendrites causes a surface rumpling which gives the solidus temperatures which range from 156.6°C solder surface a somewhat frosty rather than a shiny (pure indium) to 327.5 °C (pure lead).
    [Show full text]
  • 3 Gamma-Ray Detectors
    3 Gamma-Ray Detectors Hastings A Smith,Jr., and Marcia Lucas S.1 INTRODUCTION In order for a gamma ray to be detected, it must interact with matteu that interaction must be recorded. Fortunately, the electromagnetic nature of gamma-ray photons allows them to interact strongly with the charged electrons in the atoms of all matter. The key process by which a gamma ray is detected is ionization, where it gives up part or all of its energy to an electron. The ionized electrons collide with other atoms and liberate many more electrons. The liberated charge is collected, either directly (as with a proportional counter or a solid-state semiconductor detector) or indirectly (as with a scintillation detector), in order to register the presence of the gamma ray and measure its energy. The final result is an electrical pulse whose voltage is proportional to the energy deposited in the detecting medhtm. In this chapter, we will present some general information on types of’ gamma-ray detectors that are used in nondestructive assay (NDA) of nuclear materials. The elec- tronic instrumentation associated with gamma-ray detection is discussed in Chapter 4. More in-depth treatments of the design and operation of gamma-ray detectors can be found in Refs. 1 and 2. 3.2 TYPES OF DETECTORS Many different detectors have been used to register the gamma ray and its eneqgy. In NDA, it is usually necessary to measure not only the amount of radiation emanating from a sample but also its energy spectrum. Thus, the detectors of most use in NDA applications are those whose signal outputs are proportional to the energy deposited by the gamma ray in the sensitive volume of the detector.
    [Show full text]
  • Temperature Cycling and Fatigue in Electronics
    Temperature Cycling and Fatigue in Electronics Gilad Sharon, Ph.D. [email protected] 9000 Virginia Manor Road, Suite 290, Beltsville, Maryland 20705 | Phone: (301) 474-0607 | Fax: (866) 247-9457 | www.dfrsolutions.com ABSTRACT The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials. CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a “board level” CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating. Key words: temperature cycling, thermal cycling, fatigue, reliability, solder joint reliability. INTRODUCTION The excessive difference in coefficients of thermal expansion between the components and the printed board cause a large enough strain in solder and embedded copper structures to induce a fatigue failure mode. This paper discusses the solder fatigue failure mechanism and the associated PTH (plated through hole) fatigue failure. The solder fatigue failure is more complicated due to the many solder materials and different solder shapes. Figure 1 shows an example of a solder fatigue failure in a cross section of a ball grid array (BGA) solder ball with the corresponding finite element model. The predicted location of maximum strain corresponds to the same location of solder fatigue crack initiation. Discussion CTE Mismatch Any time two different materials are connected to one another in electronics assemblies, there is a potential for CTE mismatch to occur.
    [Show full text]
  • 1. Gamma-Ray Detectors for Nondestructive Analysis P
    1. GAMMA-RAY DETECTORS FOR NONDESTRUCTIVE ANALYSIS P. A. Russo and D. T. Vo I. INTRODUCTION AND OVERVIEW Gamma rays are used for nondestructive quantitative analysis of nuclear material. Knowledge of both the energy of the gamma ray and its rate of emission from the unknown mass of nuclear material is required to interpret most measurements of nuclear material quantities. Therefore, detection of gamma rays for nondestructive analysis of nuclear materials requires both spectroscopy capability and knowledge of absolute specific detector response. Some techniques nondestructively quantify attributes other than nuclear material mass, but all rely on the ability to distinguish elements or isotopes and measure the relative or absolute yields of their corresponding radiation signatures. All require spectroscopy and most require high resolution. Therefore, detection of gamma rays for quantitative nondestructive analysis (NDA) of the mass or of other attributes of nuclear materials requires spectroscopy. A previous book on gamma-ray detectors for NDA1 provided generic descriptions of three detector categories: inorganic scintillation detectors, semiconductor detectors, and gas-filled detectors. This report described relevant detector properties, corresponding spectral characteristics, and guidelines for choosing detectors for NDA. The current report focuses on significant new advances in detector technology in these categories. Emphasis here is given to those detectors that have been developed at least to the stage of commercial prototypes. The type of NDA application – fixed installation in a count room, portable measurements, or fixed installation in a processing line or other active facility (storage, shipping/receiving, etc.) – influences the choice of an appropriate detector. Some prototype gamma-ray detection techniques applied to new NDA approaches may revolutionize how nuclear materials are quantified in the future.
    [Show full text]
  • Gold Embrittlement of Solder Joints 2018.Pages
    Gold Embrittlement of Solder Joints Ed Hare, PhD - SEM Lab, Inc 425.335.4400 [email protected] Introduction Gold embrittlement of solder joints has been written about for at least four decades [1 – 3]. Nevertheless, gold embrittlement related solder joint failures have been analyzed in this laboratory as recently as July 2009. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of material and process parameters that can lead to gold embrittlement in electronic assemblies. There are a variety of reasons that designers might want to solder to gold or gold plating. One reason is that some designs involve wire bonding and soldering operations on the same assembly. Another reason would be to include gold contact pads (e.g. for dome keypad contacts) or card edge contacts (e.g. PC cards). The wire bond pads or contact pads can be selectively gold plated, but the selective plating process can be expensive. The electronics industry currently recognizes a threshold level for gold that can be dissolved into eutectic tin-lead solder above which the solder is likely to become embrittled. This threshold is ~ 3 wt% gold. It will be shown in the paragraphs below that embrittlement of solder joints can develop at significantly lower bulk gold concentrations. Metallurgical Description of Gold Embrittlement The most important soldering alloy in the electronics industry is the eutectic tin-lead alloy, 63%Sn – 37%Pb. This may change in the near future as lead-free soldering takes its hold on the industry.
    [Show full text]
  • Here's a Summary of How to Make the Perfect Solder Joint
    Here's a summary of how to make the perfect solder joint. 1. All parts must be clean and free from dirt and grease. 2. Try to secure the work firmly. 3. "Tin" the iron tip with a small amount of solder. Do this immediately, with new tips being used for the first time. 4. Clean the tip of the hot soldering iron on a damp sponge. 5. Many people then add a tiny amount of fresh solder to the cleansed tip. 6. Heat all parts of the joint with the iron for under a second or so. 7. Continue heating, then apply sufficient solder only, to form an adequate joint. 8. Remove and return the iron safely to its stand. 9. It only takes two or three seconds at most, to solder the average p.c.b. joint. 10. Do not move parts until the solder has cooled. Troubleshooting Guide 11. Solder won't "take" - grease or dirt present - desolder and clean up the parts. Or, material may not be suitable for soldering with lead/tin solder (eg aluminium). 12. Joint is crystalline or grainy-looking - has been moved before being allowed to cool, or joint was not heated adequately - too small an iron/ too large a joint. 13. Solder joint forms a "spike" - probably overheated, burning away the flux. First Aid If you are unlucky enough to receive burns which require treatment, here's what to do :- 14. Immediately cool the affected area with cold running water for several minutes. 15. Remove any rings etc. before swelling starts.
    [Show full text]
  • DRC-2016-012921.Pdf
    CLN-SRT-011 R1.0 Page 2 of 33 Introduction ................................................................................................................................ 3 Sources of Radiation .................................................................................................................. 3 Radiation: Particle vs Electromagnetic ....................................................................................... 5 Ionizing and non- ionizing radiation ............................................................................................ 8 Radioactive Decay ....................................................................................................................10 Interaction of Radiation with Matter ...........................................................................................15 Radiation Detection and Measurement .....................................................................................17 Biological Effects of Radiation ...................................................................................................18 Radiation quantities and units ...................................................................................................18 Biological effects .......................................................................................................................20 Effects of Radiation by Biological Organization .........................................................................20 Mechanisms of biological damage ............................................................................................21
    [Show full text]
  • Safe Flo® Silver Lead Free Plumbing Solder
    SAFE FLO ® SILVER LEAD FREE PLUMBING SOLDER TECHNICAL SPECIFICATION: Oatey Safe Flo Silver Lead Free Plumbing Solder is recommended for use on potable water systems for sweating joints in a copper water distribution system. Safe Flo Silver Lead Free Solder is also effective on stainless steel, brass alloys, chrome alloys, galvanized steel and cast iron piping. Safe-Flo Solder complies with CA & VT lead content regulations. PRECAUTIONS Read all cautions and directions carefully before using this product. Apply flux with brush- do not apply with fingers. Wash hands thoroughly after use and before eating. Wear safety glasses with side shields and rubber gloves. EYE AND SKIN IRRITANT. HARMFUL IF SWALLOWED. VAPOR MAY BE HARMFUL. Use only in well ventilated area. Eye or skin contact may cause intense irritation and injury. In case of contact with eyes or skin, flush with water and seek medical attention immediately. If inhaled, get fresh air and seek medical attention if ill feelings persist. KEEP OUT OF REACH OF CHILDREN. Refer to material safety data sheet for more information. For emergency first aid help, call 1-877-740-5015. PHYSICAL/CHEMICAL PROPERTIES COMMON APPLICATIONS Alloy composition Tin, Copper, Bismuth, Silver Oatey Safe Flo Silver Lead Free Plumbing Solder is recommended Appearance Silver Solid Wire for use on potable water systems for sweating joints in a copper Melting Range 420° F to 460° F water distribution system. DIRECTIONS FOR USE Cut the pipe to the exact length required using a tube Consult Oatey Technical Department for applications not cutter. Be sure the pipe is cut square.
    [Show full text]
  • Portable Front-End Readout System for Radiation Detection
    Portable Front-End Readout System for Radiation Detection by Maris Tali THESIS for the degree of MASTER OF SCIENCE (Master in Electronics) Faculty of Mathematics and Natural Sciences University of Oslo June 2015 Det matematisk- naturvitenskapelige fakultet Universitetet i Oslo Portable Front-End Readout System for Radiation Detection Maris Tali Portable Front-End Readout System for Radiation Detection Maris Tali Portable Front-End Readout System for Radiation Detection Acknowledgements First of all, I would like to thank my advisor, Ketil Røed, for giving me the opportunity to write my master thesis on such an interesting and challenging subject as radiation instrumentation and measurement. I would also like to thank him for his insight and guidance during my master thesis and for the exciting opportunities during my studies to work in a real experimental environment. I would also like to thank the Electronic Laboratory of the University of Oslo, specif- ically Halvor Strøm, David Bang and Stein Nielsen who all gave me valuable advice and assistance and without whom this master thesis could not have been finished. Lastly, I would like to thank the co-designer of the system whom I worked together with during my master thesis, Eino J. Oltedal. It is customary to write that half of ones master thesis belongs to ones partner. However, this is actually the case in this instance so I guess 2/3 of my master thesis is yours and I definitely could not have done this without you. So, thank you very much! Oslo, June 2015 Maris Tali I Maris Tali Portable Front-End Readout System for Radiation Detection Contents Acknowledgments I Glossary VI List of Figures X List of Tables X Abstract XI 1 Introduction 1 1.1 Background and motivation .
    [Show full text]