Gold Embrittlement of Solder Joints 2018.Pages
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Scientific and Technical Report 2001 Volume VI Large Research Facilities
PAUL SCHERRER INSTITUT ISSN 1423-7350 March 2002 Scientific and Technical Report 2001 Volume VI Large Research Facilities ed. by: Renate Bercher, Carmen Büchli, Lotty Zumkeller CH-5232 Villigen PSI Switzerland Phone: 056/310 21 11 Telefax: 056/31021 99 http://www.psi.ch I TABLE OF CONTENTS Foreword l Accelerator Physics and Development Operation of the PSI-accelerator facility in 2001 5 Progress in the production of the new ring cyclotron cavity 7 Coupled field analysis of the new ring cyclotron cavity 9 Experimental upgrade of the injector II150 MHz RF system 11 Replacement of magnet power supplies, control and field-bus for the PSI cyclotron accelerators 13 Investigations on discharges of high voltage devices based on a transient recorder program 15 Test of a radio-frequency-driven mulitcusp proton source 16 Emittance measurements at the PSI ECR heavy ion source 17 Profile measurement of scanning proton beam for LiSoR using carbon fibre harps 18 A fast dégrader to set the energies for the application of the depth dose in proton therapy 20 MAD9P a parallel 3D particle tracker with space charge 22 Behaviour of the different poisson solvers in the light of beam dynamics simulations 24 Computational electrodynamics on the LINUX-cluster 26 Particle ray-tracing program TRACK applied to accelerators 27 Experimental Facilities Rebuilt beam line section between the targets M and E 31 Disposal preparation for meson production targets 33 A novel method to improve the safety of the planned MEGAPIE target at SINQ 34 Beamline adaptation for the MEGAPIE-target -
Sn95/Sb5 – Organic Acid 3% Core
Technical Data Sheet Sn95/Sb5 – Organic Acid 3% Core NOMINAL COMPOSITION Tin 94% Min Lead 0.1% Max Arsenic 0.01% Max Antimony 4.5% 5.5 Cadmium 0.005% Max Iron 0.04% Max Copper 0.08% Max Aluminum 0.005% Max Zinc 0.005% Max Silver 0.015% Max Bismuth 0.15% Max Flux – 3% Organic Acid Core by weight PHYSICAL PROPERTIES Solder Alloy Color White Melting Point (Solidus) 450°F (233°C) Flow Point (Liquidus) 464°F (240°C) Specific Gravity 7.26 Density (Lbs/in3) 0.263 Bulk Room Temperature Tensile Strength (PSI) 5,900 Flux Type Water Soluble Organic Acid Physical State Solid Melting Point 250°F (120°C) Chloride Content 4% SOLDERING CHARACTERISTICS Sn95/Sb5 is a general-purpose solder used in applications involving soldering of copper and copper alloys and/or ferrous base alloys where use of lead containing solder is not permitted. This soft solder may be used in applications involving higher service temperatures. Typical applications for this alloy include copper components in air conditioning industry. This alloy is also recommended in applications involving food handling or drinking water components where use of lead containing alloys is not permitted. Antimony bearing alloys are not recommended in soldering of brass parts due to formation of a brittle Sb-Zn inter-metallic. This flux-cored solder can be used on difficult to solder materials where rosin based fluxes and electronic grade organic fluxes are not strong enough. It has been used effectively in many non-electronic applications such as lamps, fuses, and jewelry. The flux is active on copper, brass, bronze, steel, nickel, and stainless steel. -
Low Melting Temperature Sn-Bi Solder
metals Review Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics Hyejun Kang, Sri Harini Rajendran and Jae Pil Jung * Department of Materials Science and Engineering, University of Seoul, 163, Seoulsiripdae-ro, Dongdaemun-gu, Seoul 02504, Korea; [email protected] (H.K.); [email protected] (S.H.R.) * Correspondence: [email protected] Abstract: Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed. Keywords: low-temperature solder; Sn-58wt%Bi; melting temperature; microstructure; mechani- Citation: Kang, H.; Rajendran, S.H.; cal property Jung, J.P. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical 1. Introduction Characteristics. Metals 2021, 11, 364. -
Major Causes of Solder Cracks Applications and Boards That Specially Require Solder Crack Countermeasures Comparison of 2 Soluti
Solder Crack Countermeasures in MLCCs Outline This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Fig. 1: Appearance of a solder crack Ceramic Chip Capacitors). (cross-section) Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile. TDK offers following MLCC products as solder crack countermeasures. 1) Metal terminals “disperse” thermal shock : 2) Equipped with resin layers that absorb stress applied on solder MEGACAP joints and resistant to dropping: Soft termination Comparison of 2 solutions: Summary of “Solder Crack Countermeasures in MLCCs” Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions Fig. 2: Major causes of solder cracks and their impact after going on the market and during manufacturing processes such as soldering. The following causes can be listed as the major cause of solder cracks. (1) Thermal shock (heat shock), heat fatigue caused by temperature cycle Solder cracks occur when heat stress is applied to a solder joint due to the difference in the thermal coefficients of the MLCC and PCB, in an environment in which changes between high temperatures and low temperatures are repeated. In addition, it can also occur when temperature control is insufficient during the process of soldering. (2) Lead-free solder Lead-free solder, which started to be used due to environmental considerations, has properties of being rigid and fragile, and has a higher risk of solder cracks compared to conventional eutectic solder; therefore, caution is required when using it. -
Soldering to Gold Films
Soldering to Gold Films THE IMPORTANCE OF LEAD-INDIUM ALLOYS Frederick G. Yost Sandia Laboratories, Albuquerque, New Mexico, U.S.A. Reliable solder joints can be made on gold metallised microcircuits using lead-indium solders providing certain important conditions are understood and carefully controlled. This paper reviews the three fundamental concepts of scavenging, wetting, and ageing, which are relevant when soldering to gold films. Alloys containing indium have been used for solder- sition and a body centred tetragonal space lattice. ing electronic components to thin gold films and wires Although considerable work has been addressed for at least 14 years. Braun (1, 2) investigated the to the question of clustering and phase separation potential of several multicomponent alloys based in the a field below 20°C (7, 8, 9) the practical signifi- upon the lead-tin-indium ternary alloy system. cance of this phenomenon has not yet materialised. More recently, work on lead-indium binary alloys The most commonly used alloy is the 50 weight has been reported by Jackson (3) and Yost, et al per cent indium composition which has a liquidus (4, 5, 6). In this paper we intend to define, to discuss, temperature of approximately 210°C and a solidus and to illustrate three fundamental concepts relevant temperature of approximately 185°C. Alloys in the to soldering to gold films using lead-indium solders. lead rich phase field, a, freeze dendritically by The lead-indium phase diagram, shown in Figure forming lead rich stalks. The formation of these 1, contains a wealth of useful solder alloys having dendrites causes a surface rumpling which gives the solidus temperatures which range from 156.6°C solder surface a somewhat frosty rather than a shiny (pure indium) to 327.5 °C (pure lead). -
Footnotes for ATOMIC ADVENTURES
Footnotes for ATOMIC ADVENTURES Secret Islands, Forgotten N-Rays, and Isotopic Murder - A Journey into the Wild World of Nuclear Science By James Mahaffey While writing ATOMIC ADVENTURES, I tried to be careful not to venture off into subplots, however interesting they seemed to me, and keep the story flowing and progressing at the right tempo. Some subjects were too fascinating to leave alone, and there were bits of further information that I just could not abandon. The result is many footnotes at the bottom of pages, available to the reader to absorb at his or her discretion. To get the full load of information from this book, one needs to read the footnotes. Some may seem trivia, but some are clarifying and instructive. This scheme works adequately for a printed book, but not so well with an otherwise expertly read audio version. Some footnotes are short enough to be inserted into the audio stream, but some are a rambling half page of dense information. I was very pleased when Blackstone Audio agreed wholeheartedly that we needed to include all of my footnotes in this version of ATOMIC ADVENTURES, and we came up with this added feature: All 231 footnotes in this included text, plus all the photos and explanatory diagrams that were included in the text. I hope you enjoy reading some footnotes while listening to Keith Sellon-Wright tell the stories in ATOMIC ADVENTURES. James Mahaffey April 2017 2 Author’s Note Stories Told at Night around the Glow of the Reactor Always striving to beat the Atlanta Theater over on Edgewood Avenue, the Forsyth Theater was pleased to snag a one-week engagement of the world famous Harry Houdini, extraordinary magician and escape artist, starting April 19, 1915.1 It was issued an operating license, no. -
Temperature Cycling and Fatigue in Electronics
Temperature Cycling and Fatigue in Electronics Gilad Sharon, Ph.D. [email protected] 9000 Virginia Manor Road, Suite 290, Beltsville, Maryland 20705 | Phone: (301) 474-0607 | Fax: (866) 247-9457 | www.dfrsolutions.com ABSTRACT The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials. CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a “board level” CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating. Key words: temperature cycling, thermal cycling, fatigue, reliability, solder joint reliability. INTRODUCTION The excessive difference in coefficients of thermal expansion between the components and the printed board cause a large enough strain in solder and embedded copper structures to induce a fatigue failure mode. This paper discusses the solder fatigue failure mechanism and the associated PTH (plated through hole) fatigue failure. The solder fatigue failure is more complicated due to the many solder materials and different solder shapes. Figure 1 shows an example of a solder fatigue failure in a cross section of a ball grid array (BGA) solder ball with the corresponding finite element model. The predicted location of maximum strain corresponds to the same location of solder fatigue crack initiation. Discussion CTE Mismatch Any time two different materials are connected to one another in electronics assemblies, there is a potential for CTE mismatch to occur. -
Here's a Summary of How to Make the Perfect Solder Joint
Here's a summary of how to make the perfect solder joint. 1. All parts must be clean and free from dirt and grease. 2. Try to secure the work firmly. 3. "Tin" the iron tip with a small amount of solder. Do this immediately, with new tips being used for the first time. 4. Clean the tip of the hot soldering iron on a damp sponge. 5. Many people then add a tiny amount of fresh solder to the cleansed tip. 6. Heat all parts of the joint with the iron for under a second or so. 7. Continue heating, then apply sufficient solder only, to form an adequate joint. 8. Remove and return the iron safely to its stand. 9. It only takes two or three seconds at most, to solder the average p.c.b. joint. 10. Do not move parts until the solder has cooled. Troubleshooting Guide 11. Solder won't "take" - grease or dirt present - desolder and clean up the parts. Or, material may not be suitable for soldering with lead/tin solder (eg aluminium). 12. Joint is crystalline or grainy-looking - has been moved before being allowed to cool, or joint was not heated adequately - too small an iron/ too large a joint. 13. Solder joint forms a "spike" - probably overheated, burning away the flux. First Aid If you are unlucky enough to receive burns which require treatment, here's what to do :- 14. Immediately cool the affected area with cold running water for several minutes. 15. Remove any rings etc. before swelling starts. -
FTC Guideline - Title 16, Commercial Practices Part 23 for Gold Plating Over Sterling Silver Jewelery
Reference: FTC guideline - Title 16, commercial practices part 23 for gold plating over sterling silver Jewelery Dear Sir, My concern is on low K gold plating (10/14/18) over sterling silver. As per me, gold plating on silver Jewellery should be done only with > 23K. Following are the reasons to support my recommendation: REASONS TO AVOID LOW K GOLD PLATING • In low karat gold micron electroplating, we have to use either Au/Cu or Au/Ag chemistry. Au/Cu chemistry plating color for 14K is too pink (5N) & Au/Ag chemistry plating color is too green. We have to give top coat of 0.1 micron of high karat gold (>23K) to achieve Hamilton color (1N/2N) over low karat gold plating. • Doing low karat gold plating & cover it with nominal high karat gold for color, deficit the purpose of gold plated Jewellery. If the top flash gold will wear out then actual gold alloy color (pink/green) will expose (pink/green) which will tarnish too fast. • Achieving exact K (10/14/18) in low K electroplating is practically not possible. • We cannot identify gold purity of plating thickness on sterling silver by XRF because there are common elements present in plating thickness & base (e.g. Ag,Cu..). • Gold alloy (10/14/18) thickness testing is not possible by XRF because standards available for thickness calibration are in 24K. It is impossible to make 10/14/18 K standards as per plating compositions (Au/Cu & Au/Ag) because it cannot be fabricated. Thickness measurement of low K on XRF is manipulated method, where instrument detects pure gold ions throughout the plating layer & then by density calculation it will be converted into low K plating thickness(e.g.- 14 K density is 13 g/cc & pure gold is 19.3 g/cc. -
Understanding Gold Plating
Understanding Gold Plating Peter Wilkinson Engelhard Limited, Cinderford, Gloucestershire, United Kingdom For effective operation, gold plating baths must require the mini- mum of attention in respect of replenishment and replacement, and must produce as little sub-standard or reject work as possible. To achieve this, an understanding of the processes involved and the factors affecting them is advantageous. This article attempts to provide such an understanding in a simple manner. Special atten- tion is given to the plating of gold from acid baths containing monovalent gold complexes. The use of gold as a contact material on connectors, Other gold(I) complexes, such as those with thiomalate and switches and printed circuit boards (PCB's) is now well estab- thiosulphate have been considered, but it is doubtful if they lished. There is also an awareness that only gold deposits from will ever find commercial application. acid (pH 3.5-5.0) gold(I) cyanide baths containing cobalt, In terms of electricity consumed, gold(I) baths are more nickel or iron as brightening agents have the appropriate efficient than gold(III) baths. Thus, assuming 100 per cent properties for a contact material. Gold deposits from: pure efficiency, 100 amp-min will deposit 12.25 g of gold from a gold(I) cyanide baths; from such baths containing organic monovalent gold complex, but only 4.07 g from a trivalent gold materials as brightening agents; or from electrolytes containing complex. gold in the form of the gold(I) sulphite complex, do not have Nevertheless, deposition from acid gold(III) cyanide baths the sliding wear resistance which is necessary for make and has merit in the plating of acid resistant substrates such as stain- break connections (1). -
Safe Flo® Silver Lead Free Plumbing Solder
SAFE FLO ® SILVER LEAD FREE PLUMBING SOLDER TECHNICAL SPECIFICATION: Oatey Safe Flo Silver Lead Free Plumbing Solder is recommended for use on potable water systems for sweating joints in a copper water distribution system. Safe Flo Silver Lead Free Solder is also effective on stainless steel, brass alloys, chrome alloys, galvanized steel and cast iron piping. Safe-Flo Solder complies with CA & VT lead content regulations. PRECAUTIONS Read all cautions and directions carefully before using this product. Apply flux with brush- do not apply with fingers. Wash hands thoroughly after use and before eating. Wear safety glasses with side shields and rubber gloves. EYE AND SKIN IRRITANT. HARMFUL IF SWALLOWED. VAPOR MAY BE HARMFUL. Use only in well ventilated area. Eye or skin contact may cause intense irritation and injury. In case of contact with eyes or skin, flush with water and seek medical attention immediately. If inhaled, get fresh air and seek medical attention if ill feelings persist. KEEP OUT OF REACH OF CHILDREN. Refer to material safety data sheet for more information. For emergency first aid help, call 1-877-740-5015. PHYSICAL/CHEMICAL PROPERTIES COMMON APPLICATIONS Alloy composition Tin, Copper, Bismuth, Silver Oatey Safe Flo Silver Lead Free Plumbing Solder is recommended Appearance Silver Solid Wire for use on potable water systems for sweating joints in a copper Melting Range 420° F to 460° F water distribution system. DIRECTIONS FOR USE Cut the pipe to the exact length required using a tube Consult Oatey Technical Department for applications not cutter. Be sure the pipe is cut square. -
Challenges in Supply of Ultralow Alpha Emitting Solder Materials
Indium Corporation Tech Paper Challenges in Supply of Ultralow Alpha Emitting Solder Materials Authored by: Andy C. Mackie, PhD, MSC and Olivier Lauzeral, iRoc Technologies. The names of high-energy subatomic present in the active device layers of a particles such as alpha, beta, gamma, semiconductor chip. DR. ANDY C. MACKIE x-rays and cosmic rays will be well An alpha particle is an ionized heavy known to every high-school student. particle emitted spontaneously from the Table 1 shows some of the most nucleus of a specific isotope of a high common types of particles and a atomic weight (usually >200 Daltons) description of them. atom. Of particular interest and Particle Name Description concern to semiconductor fabricators Alpha Helium (He4) are the elements uranium (U) and nucleus (2 protons thorium (Th), both of which decay to + 2 neutrons) give stable isotopes of lead (Pb), but Beta Electron or positron which, by decaying, give rise to alpha Gamma, X-rays Electromagnetic particles. The potential energy of the Andy C. Mackie, PhD, MSc, Senior (photon) particle depends on the nucleus from Product Manager, Semiconductor and Advanced Assembly Materials for Thermal Neutron Uncharged nuclear which it is emitted. Figure 2 shows Indium Corporation, has over 20 years particle the decay series (only alpha emissions experience in wafer fabrication and semiconductor packaging materials Cosmic rays Mixture of mostly shown) for the isotope Thorium 232. and manufacturing. beta, with alpha, As can be readily seen, the highest Dr. Mackie is an industry expert in gamma and other energies correlate with greater nuclear physical chemistry, rheology and types materials science.