Scientific and Technical Report 2001 Volume VI Large Research Facilities
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THE CANTON OF AARGAU: ECONOMY AND EMPLOYMENT The Canton of Aargau is situated in Switzerland’s strongest economic area. Some 340 000 people are employed here in around 40 000 companies. An above-average proportion of these workers are active in the field of research and development. In fact, this is more than twice the national average. Our economic, tax and financial policies make the Canton of Aargau an attractive place of business for international corporations as well as for small and medium-sized businesses. The innovative Robotec Solutions AG known as a leading enterprise in robot applications. Standard & Poor’s has awarded the Canton of Aargau the rating AA+. And it’s no wonder. After all, we have a low unemployment rate, a moderate taxation rate, a strong economy and a high standard of living. These factors appeal to many well-known companies operating here in a wide range of industries – including ABB, GE, Franke, Syngenta and Roche. Our media landscape is equally diverse. In addition to AZ Medien, the canton boasts numerous other well-positioned local media companies. THE CANTON OF AARGAU: LIFE AND LIVING SINA SINGER The Canton of Aargau is currently home to some 670 000 people. That makes us the fourth-largest canton in Switzerland. Aargau is an urban area, yet also modest in size. The Canton of Aargau is within reasonable distance of anywhere – whether by car or public transport. However, for those who prefer to stay and be part of the local scene, Aargau has well-established communities and a wealth of vibrant traditions. -
Particle Accelerator Activities at the Paul Scherrer Institut
PSI Bericht Nr. 17-07 December 2017 Particle Accelerator Activities at the Paul Scherrer Institut Terence GARVEY Paul Scherrer Institut, Villigen, Switzerland 5232 Division of Large Research Infrastructures Invited paper presented at Les Journées Accélérateurs de la Société Française de Physique, Roscoff, 3rd – 6th October, 2017. Resumé Les Activités Accélérateur à l’Institut Paul Scherrer. L'Institut Paul Scherrer exploite deux complexes d'accélérateurs en tant que ‘centre- serveurs’ pour une grande communauté de chercheurs. Il s'agit de l'Accélérateur de Protons à Haute Intensité (HIPA) et de la Source de Lumière Suisse (SLS). HIPA est un cyclotron à protons de 590 MeV. Il sert à produire des neutrons par spallation pour la recherche en physique de la matière condensée et à produire des muons et d'autres particules secondaires pour la recherche en magnétisme et en physique des particules. Le SLS est un anneau de stockage d’électrons de 2,4 GeV utilisé comme source de rayonnement synchrotron de 3ème génération fournissant des photons pour une large gamme de disciplines scientifiques. En plus de ces deux installations, l'Institut met progressivement en service un laser à électrons libres en rayons X (SwissFEL) qui fournira aux chercheurs des impulsions femto-seconde intenses à partir d’une ligne de rayons X ‘dur’ (ARAMIS) et de rayons X ‘mou’ (ATHOS). L'Institut exploite également un cyclotron supraconductrice à 250 MeV (COMET) aux fins de la thérapie par proton. Le centre de thérapie a récemment été équipé d'un troisième « gantry » rotatif qui est en cours de mise en service. Un « upgrade » du système de radiofréquence de HIPA et des projets pour "SLS-2" seront présentés. -
Footnotes for ATOMIC ADVENTURES
Footnotes for ATOMIC ADVENTURES Secret Islands, Forgotten N-Rays, and Isotopic Murder - A Journey into the Wild World of Nuclear Science By James Mahaffey While writing ATOMIC ADVENTURES, I tried to be careful not to venture off into subplots, however interesting they seemed to me, and keep the story flowing and progressing at the right tempo. Some subjects were too fascinating to leave alone, and there were bits of further information that I just could not abandon. The result is many footnotes at the bottom of pages, available to the reader to absorb at his or her discretion. To get the full load of information from this book, one needs to read the footnotes. Some may seem trivia, but some are clarifying and instructive. This scheme works adequately for a printed book, but not so well with an otherwise expertly read audio version. Some footnotes are short enough to be inserted into the audio stream, but some are a rambling half page of dense information. I was very pleased when Blackstone Audio agreed wholeheartedly that we needed to include all of my footnotes in this version of ATOMIC ADVENTURES, and we came up with this added feature: All 231 footnotes in this included text, plus all the photos and explanatory diagrams that were included in the text. I hope you enjoy reading some footnotes while listening to Keith Sellon-Wright tell the stories in ATOMIC ADVENTURES. James Mahaffey April 2017 2 Author’s Note Stories Told at Night around the Glow of the Reactor Always striving to beat the Atlanta Theater over on Edgewood Avenue, the Forsyth Theater was pleased to snag a one-week engagement of the world famous Harry Houdini, extraordinary magician and escape artist, starting April 19, 1915.1 It was issued an operating license, no. -
Gold Embrittlement of Solder Joints 2018.Pages
Gold Embrittlement of Solder Joints Ed Hare, PhD - SEM Lab, Inc 425.335.4400 [email protected] Introduction Gold embrittlement of solder joints has been written about for at least four decades [1 – 3]. Nevertheless, gold embrittlement related solder joint failures have been analyzed in this laboratory as recently as July 2009. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of material and process parameters that can lead to gold embrittlement in electronic assemblies. There are a variety of reasons that designers might want to solder to gold or gold plating. One reason is that some designs involve wire bonding and soldering operations on the same assembly. Another reason would be to include gold contact pads (e.g. for dome keypad contacts) or card edge contacts (e.g. PC cards). The wire bond pads or contact pads can be selectively gold plated, but the selective plating process can be expensive. The electronics industry currently recognizes a threshold level for gold that can be dissolved into eutectic tin-lead solder above which the solder is likely to become embrittled. This threshold is ~ 3 wt% gold. It will be shown in the paragraphs below that embrittlement of solder joints can develop at significantly lower bulk gold concentrations. Metallurgical Description of Gold Embrittlement The most important soldering alloy in the electronics industry is the eutectic tin-lead alloy, 63%Sn – 37%Pb. This may change in the near future as lead-free soldering takes its hold on the industry. -
Targeted Radiotherapeutics from 'Bench-To-Bedside'
RadiochemistRy in switzeRland CHIMIA 2020, 74, No. 12 939 doi:10.2533/chimia.2020.939 Chimia 74 (2020) 939–945 © C. Müller, M. Béhé, S. Geistlich, N. P. van der Meulen, R. Schibli Targeted Radiotherapeutics from ‘Bench-to-Bedside’ Cristina Müllera, Martin Béhéa, Susanne Geistlicha, Nicholas P. van der Meulenab, and Roger Schibli*ac Abstract: The concept of targeted radionuclide therapy (TRT) is the accurate and efficient delivery of radiation to disseminated cancer lesions while minimizing damage to healthy tissue and organs. Critical aspects for success- ful development of novel radiopharmaceuticals for TRT are: i) the identification and characterization of suitable targets expressed on cancer cells; ii) the selection of chemical or biological molecules which exhibit high affin- ity and selectivity for the cancer cell-associated target; iii) the selection of a radionuclide with decay properties that suit the properties of the targeting molecule and the clinical purpose. The Center for Radiopharmaceutical Sciences (CRS) at the Paul Scherrer Institute in Switzerland is privileged to be situated close to unique infrastruc- ture for radionuclide production (high energy accelerators and a neutron source) and access to C/B-type labora- tories including preclinical, nuclear imaging equipment and Swissmedic-certified laboratories for the preparation of drug samples for human use. These favorable circumstances allow production of non-standard radionuclides, exploring their biochemical and pharmacological features and effects for tumor therapy and diagnosis, while investigating and characterizing new targeting structures and optimizing these aspects for translational research on radiopharmaceuticals. In close collaboration with various clinical partners in Switzerland, the most promising candidates are translated to clinics for ‘first-in-human’ studies. -
FTC Guideline - Title 16, Commercial Practices Part 23 for Gold Plating Over Sterling Silver Jewelery
Reference: FTC guideline - Title 16, commercial practices part 23 for gold plating over sterling silver Jewelery Dear Sir, My concern is on low K gold plating (10/14/18) over sterling silver. As per me, gold plating on silver Jewellery should be done only with > 23K. Following are the reasons to support my recommendation: REASONS TO AVOID LOW K GOLD PLATING • In low karat gold micron electroplating, we have to use either Au/Cu or Au/Ag chemistry. Au/Cu chemistry plating color for 14K is too pink (5N) & Au/Ag chemistry plating color is too green. We have to give top coat of 0.1 micron of high karat gold (>23K) to achieve Hamilton color (1N/2N) over low karat gold plating. • Doing low karat gold plating & cover it with nominal high karat gold for color, deficit the purpose of gold plated Jewellery. If the top flash gold will wear out then actual gold alloy color (pink/green) will expose (pink/green) which will tarnish too fast. • Achieving exact K (10/14/18) in low K electroplating is practically not possible. • We cannot identify gold purity of plating thickness on sterling silver by XRF because there are common elements present in plating thickness & base (e.g. Ag,Cu..). • Gold alloy (10/14/18) thickness testing is not possible by XRF because standards available for thickness calibration are in 24K. It is impossible to make 10/14/18 K standards as per plating compositions (Au/Cu & Au/Ag) because it cannot be fabricated. Thickness measurement of low K on XRF is manipulated method, where instrument detects pure gold ions throughout the plating layer & then by density calculation it will be converted into low K plating thickness(e.g.- 14 K density is 13 g/cc & pure gold is 19.3 g/cc. -
Understanding Gold Plating
Understanding Gold Plating Peter Wilkinson Engelhard Limited, Cinderford, Gloucestershire, United Kingdom For effective operation, gold plating baths must require the mini- mum of attention in respect of replenishment and replacement, and must produce as little sub-standard or reject work as possible. To achieve this, an understanding of the processes involved and the factors affecting them is advantageous. This article attempts to provide such an understanding in a simple manner. Special atten- tion is given to the plating of gold from acid baths containing monovalent gold complexes. The use of gold as a contact material on connectors, Other gold(I) complexes, such as those with thiomalate and switches and printed circuit boards (PCB's) is now well estab- thiosulphate have been considered, but it is doubtful if they lished. There is also an awareness that only gold deposits from will ever find commercial application. acid (pH 3.5-5.0) gold(I) cyanide baths containing cobalt, In terms of electricity consumed, gold(I) baths are more nickel or iron as brightening agents have the appropriate efficient than gold(III) baths. Thus, assuming 100 per cent properties for a contact material. Gold deposits from: pure efficiency, 100 amp-min will deposit 12.25 g of gold from a gold(I) cyanide baths; from such baths containing organic monovalent gold complex, but only 4.07 g from a trivalent gold materials as brightening agents; or from electrolytes containing complex. gold in the form of the gold(I) sulphite complex, do not have Nevertheless, deposition from acid gold(III) cyanide baths the sliding wear resistance which is necessary for make and has merit in the plating of acid resistant substrates such as stain- break connections (1). -
Challenges on ENEPIG Finished Pcbs: Gold Ball Bonding and Pad Metal Lift
As originally published in the IPC APEX EXPO Proceedings. Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva Teledyne DALSA Inc. Waterloo, ON, Canada Abstract As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized. Gold ball bonding with 25um diameter wire was performed. Printed circuit boards (PCBs) were surface mounted prior to the wire bonding process with Pb-free solder paste with water soluble organic acid (OA) flux. The standard gold ball bonding process (ball / stitch bonds) was attempted during process development and pre-production stages, but this process was not stable enough for volume production due to variation in bondability within one batch and between PCB batches. This resulted in the standard gold ball bonding process being changed to stand-off-stitch bonding (SSB) or the ball-stitch-on-ball (BSOB) bonding process, in order to achieve gold ball bonding successfully on PCBs with an ENEPIG finish for volume production. Another area of concern was pad metal lifting (PML) experienced on some PCBs, and PCB batches, where the palladium (Pd) layer was completely separated from nickel (Ni) either during wire bonding or during sample destructive wire pull tests, indicating potential failures in the remainder of the batch. -
The Early History of Gold Plating
The Early History of Gold Plating A TANGLED TALE OF DISPUTED PRIORITIES L. B. Hunt Johnson Matthey & Co Limited, London "The gilding of metals is, of all the processes whose object is to obtain an adhering deposit, the one which has exercised in the greatest degree the sagacity of inventors " PROFESSOR AUGUSTE DE LA RIVE, GENEVA, 1840 Many of the scientfic discoveries and technical President of the Royal Society, Sir Joseph Banks. developments that were so characteristic of the Because the letter would have to pass through nineteenth century rapidly became the subject of France, then engaged in the Napoleonic wars with controversy and of heated arguments about priorities. England, Volta sent only the first part of the letter, Of all these, none was probably more sorely beset by the second part following three months later, so that polemics and acrimonious debate—or for a longer it was not read to the Royal Society until the end period of time—than the birth of a commercially of June of that year. None the less, the receipt of satisfactory process for the electrodeposition of gold the earlier part of the letter was enough to cause (and of silver with which it was naturally associated) considerable excitement among the scientists of the on to base metals. It must also come close to world period, since it now made available for the first time record standards for the number and the diversity of a low voltage continuous current as opposed to the the scientists and dilettante whose contributions high voltage discharges, lasting only a fraction of a eventually led to success; not only were there second, from the static electrical machines. -
Gold Plating of Critical Components for Space Applications: Challenges and Solutions
GOLD PLATING OF CRITICAL COMPONENTS FOR SPACE APPLICATIONS: CHALLENGES AND SOLUTIONS Indira Rajagopal, K.S. Rajam er S.R. Rajagopalan Materials Science Division National Aeronautical Laboratory Bangalore 560017 India Ensuring the maximum reliability of the gold plating on lightweight alloys used in space applications is a difficult and challenging task. In this article, the authors describe the processes that they have found to meet requirements. Aluminium, magnesium, titanium and their alloys oxide film which prevents metal-to-metal bonding, are increasingly used as the lightweight structural thus leading to poor adhesion. materials in aircraft and space applications, where light- For space applications, the reliability of the ness is always at a premium. To meet the end require- plating should be 100 %. This means that the adhe- ments (e.g., for improving corrosion and wear resis- sion should be excellent and high quality deposits tance, for increasing surface conductivity, for thermal should be produced. Defective plating is unaccept- control, etc.) surface coatings are applied to modify able as it seriously affects the launching and/or func- the surface properties. tioning of the spacecraft. Stripping the defective Unfortunately, plating on these lightweight struc- deposits without damaging the sensitive compo- tural materials is difficult. These metals and alloys nents also poses problems. Hence it is mandatory belong to the group of difficult-to-plate materials. The to control deposit characteristics with very high re- basic problem stems from their high electrochemical liability by surface preparation procedures, by potential in aqueous solution and their consequent careful selection and control of bath composition high reactivity in air even at room temperature. -
Corrosion Protection of Electrically Conductive Surfaces
Metals 2012, 2, 450-477; doi:10.3390/met2040450 OPEN ACCESS metals ISSN 2075-4701 www.mdpi.com/journal/metals/ Article Corrosion Protection of Electrically Conductive Surfaces Jian Song *, Liangliang Wang, Andre Zibart, Christian Koch Precision Engineering Laboratory, Ostwestfalen-Lippe University of Applied Sciences, Liebigstrasse 87, 32657 Lemgo, Germany; E-Mails: [email protected] (L.W.); [email protected] (A.Z.); [email protected] (C.K.) * Author to whom correspondence should be addressed; E-Mail: [email protected]; Tel.: +49-177-2131820; Fax: +49-5261-702263. Received: 19 June 2012; in revised form: 10 September 2012 / Accepted: 1 November 2012 / Published: 15 November 2012 Abstract: The basic function of the electrically conductive surface of electrical contacts is electrical conduction. The electrical conductivity of contact materials can be largely reduced by corrosion and in order to avoid corrosion, protective coatings must be used. Another phenomenon that leads to increasing contact resistance is fretting corrosion. Fretting corrosion is the degradation mechanism of surface material, which causes increasing contact resistance. Fretting corrosion occurs when there is a relative movement between electrical contacts with surfaces of ignoble metal. Avoiding fretting corrosion is therefore extremely challenging in electronic devices with pluggable electrical connections. Gold is one of the most commonly used noble plating materials for high performance electrical contacts because of its high corrosion resistance and its good and stable electrical behavior. The authors have investigated different ways to minimize the consumption of gold for electrical contacts and to improve the performance of gold plating. Other plating materials often used for corrosion protection of electrically conductive surfaces are tin, nickel, silver and palladium. -
Research at the Paul Scherrer Institut
390 FR9807042 Research at the Paul Scherrer Institut H. K. Walter Paul Scherrer Institut, PSI - West, CH- 5232 ViUigen, Switzerland Abstract The Paul Scherrer Institut (PSI) is a multidisciplinary research institute for natural sciences and technology. In national and international collaboration with universities, other research institutes and industry, PSI is active in elementary particle physics, life sciences, solid-state physics, material sciences, nuclear and non-nuclear energy research, and energy-related ecology. PSI's priorities lie in research fields which are relevant to sustainable development, serve educational needs and are beyond the possibilities of a single university department. PSI develops and operates complex research installations open to a national and international scientific community. With the upgrade of the 590 MeV Ring accelerator PSI disposes of the world's most powerful cyclotron, allowing to operate high intensity secondary pion and muon beams, a neutron spallation source and various applications in medicine and materials research. A short review on research at PSI is presented, with special concentration on particle physics experiments. Introduction therapy) presently in the construction or planning As a national research center for natural and phase. The facilities are described in the new Users' engineering sciences, PSI is governed by the same Guide [1] and shown in Figure 1. authority as the two technical high schools in Zurich The accelerators and experimental areas and Lausanne. The budget in 1995 was around 160 MSFr, and there are about 1100 employees, including The cyclotron facility was originally built to produce 200 persons paid by non - PSI funds. Research is done intense beams of pions and muons for nuclear and with the Swiss universities, in close collaboration with particle physics experiments.