Corrosion Protection of Electrically Conductive Surfaces
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Scientific and Technical Report 2001 Volume VI Large Research Facilities
PAUL SCHERRER INSTITUT ISSN 1423-7350 March 2002 Scientific and Technical Report 2001 Volume VI Large Research Facilities ed. by: Renate Bercher, Carmen Büchli, Lotty Zumkeller CH-5232 Villigen PSI Switzerland Phone: 056/310 21 11 Telefax: 056/31021 99 http://www.psi.ch I TABLE OF CONTENTS Foreword l Accelerator Physics and Development Operation of the PSI-accelerator facility in 2001 5 Progress in the production of the new ring cyclotron cavity 7 Coupled field analysis of the new ring cyclotron cavity 9 Experimental upgrade of the injector II150 MHz RF system 11 Replacement of magnet power supplies, control and field-bus for the PSI cyclotron accelerators 13 Investigations on discharges of high voltage devices based on a transient recorder program 15 Test of a radio-frequency-driven mulitcusp proton source 16 Emittance measurements at the PSI ECR heavy ion source 17 Profile measurement of scanning proton beam for LiSoR using carbon fibre harps 18 A fast dégrader to set the energies for the application of the depth dose in proton therapy 20 MAD9P a parallel 3D particle tracker with space charge 22 Behaviour of the different poisson solvers in the light of beam dynamics simulations 24 Computational electrodynamics on the LINUX-cluster 26 Particle ray-tracing program TRACK applied to accelerators 27 Experimental Facilities Rebuilt beam line section between the targets M and E 31 Disposal preparation for meson production targets 33 A novel method to improve the safety of the planned MEGAPIE target at SINQ 34 Beamline adaptation for the MEGAPIE-target -
CHEMICAL POLISHING of NICKEL - SILVER ORNAMENTS MRS MALATHY PUSHPA VANAM, S JOHN and B a SHENOI Central Electrochemical Research Institute, Karaikudi - 623 006
Bulletm of ledr roc hem is try 1 (4) July-August 1985, pp. 381-383 CHEMICAL POLISHING OF NICKEL - SILVER ORNAMENTS MRS MALATHY PUSHPA VANAM, S JOHN AND B A SHENOI Central Electrochemical Research Institute, Karaikudi - 623 006 ABSTRACT A bath composition has been selected for descaling and chemical polishmg of n~ckel-s~lver artcles and the effect of each constituent of the bath on its polishing abllity has been studied. Key words: Chemical polishing, Ni-Ag alloy INTRODUCTION The polished specimens were immediately washed and rinsed. A thin film of the white metal hydroxides still adhering he alloys usually called nickel - silver, white metal or to the surface was removed in order to get a clear brilliant German silver are copper --nickel- zinc alloys or nickel T surface and also to obtain adherent silver coating in the subse- brasses [I]. The three most common Cu - Ni - Zn alloys quent step. Wasing in water alone or brushing did not solve contain 72%, 65% and 55 % copper, 18% nickel and the this problem. Treatment in any mineral acid, however dilute it remainder zinc. They are used in spring applications, gift and be, reduced the lustre of the initial surface. Hence, treatmen' tableware-usually silver plated, in musical and dental in a dilute solution of a complexing agent like EDTA, citric instruments, slide fastenen and as a base metal for moderate acid, tartaric acid etc. capable of complexing nickel and prized jewellery with or without plated coatings [2]. copper salts were tried. The articles after thorough washing Because of the lack of ductility at rqom temperature, this were rinsed and transferred to the silver plating solution. -
Metals and Metal Products Tariff Schedules of the United States
251 SCHEDULE 6. - METALS AND METAL PRODUCTS TARIFF SCHEDULES OF THE UNITED STATES SCHEDULE 6. - METALS AND METAL PRODUCTS 252 Part 1 - Metal-Bearing Ores and Other Metal-Bearing Schedule 6 headnotes: Materials 1, This schedule does not cover — Part 2 Metals, Their Alloys, and Their Basic Shapes and Forms (II chemical elements (except thorium and uranium) and isotopes which are usefully radioactive (see A. Precious Metals part I3B of schedule 4); B. Iron or Steel (II) the alkali metals. I.e., cesium, lithium, potas C. Copper sium, rubidium, and sodium (see part 2A of sched D. Aluminum ule 4); or E. Nickel (lii) certain articles and parts thereof, of metal, F. Tin provided for in schedule 7 and elsewhere. G. Lead 2. For the purposes of the tariff schedules, unless the H. Zinc context requires otherwise — J. Beryllium, Columbium, Germanium, Hafnium, (a) the term "precious metal" embraces gold, silver, Indium, Magnesium, Molybdenum, Rhenium, platinum and other metals of the platinum group (iridium, Tantalum, Titanium, Tungsten, Uranium, osmium, palladium, rhodium, and ruthenium), and precious- and Zirconium metaI a Iloys; K, Other Base Metals (b) the term "base metal" embraces aluminum, antimony, arsenic, barium, beryllium, bismuth, boron, cadmium, calcium, chromium, cobalt, columbium, copper, gallium, germanium, Part 3 Metal Products hafnium, indium, iron, lead, magnesium, manganese, mercury, A. Metallic Containers molybdenum, nickel, rhenium, the rare-earth metals (Including B. Wire Cordage; Wire Screen, Netting and scandium and yttrium), selenium, silicon, strontium, tantalum, Fencing; Bale Ties tellurium, thallium, thorium, tin, titanium, tungsten, urani C. Metal Leaf and FoU; Metallics um, vanadium, zinc, and zirconium, and base-metal alloys; D, Nails, Screws, Bolts, and Other Fasteners; (c) the term "meta I" embraces precious metals, base Locks, Builders' Hardware; Furniture, metals, and their alloys; and Luggage, and Saddlery Hardware (d) in determining which of two or more equally specific provisions for articles "of iron or steel", "of copper", E. -
Footnotes for ATOMIC ADVENTURES
Footnotes for ATOMIC ADVENTURES Secret Islands, Forgotten N-Rays, and Isotopic Murder - A Journey into the Wild World of Nuclear Science By James Mahaffey While writing ATOMIC ADVENTURES, I tried to be careful not to venture off into subplots, however interesting they seemed to me, and keep the story flowing and progressing at the right tempo. Some subjects were too fascinating to leave alone, and there were bits of further information that I just could not abandon. The result is many footnotes at the bottom of pages, available to the reader to absorb at his or her discretion. To get the full load of information from this book, one needs to read the footnotes. Some may seem trivia, but some are clarifying and instructive. This scheme works adequately for a printed book, but not so well with an otherwise expertly read audio version. Some footnotes are short enough to be inserted into the audio stream, but some are a rambling half page of dense information. I was very pleased when Blackstone Audio agreed wholeheartedly that we needed to include all of my footnotes in this version of ATOMIC ADVENTURES, and we came up with this added feature: All 231 footnotes in this included text, plus all the photos and explanatory diagrams that were included in the text. I hope you enjoy reading some footnotes while listening to Keith Sellon-Wright tell the stories in ATOMIC ADVENTURES. James Mahaffey April 2017 2 Author’s Note Stories Told at Night around the Glow of the Reactor Always striving to beat the Atlanta Theater over on Edgewood Avenue, the Forsyth Theater was pleased to snag a one-week engagement of the world famous Harry Houdini, extraordinary magician and escape artist, starting April 19, 1915.1 It was issued an operating license, no. -
Gold Embrittlement of Solder Joints 2018.Pages
Gold Embrittlement of Solder Joints Ed Hare, PhD - SEM Lab, Inc 425.335.4400 [email protected] Introduction Gold embrittlement of solder joints has been written about for at least four decades [1 – 3]. Nevertheless, gold embrittlement related solder joint failures have been analyzed in this laboratory as recently as July 2009. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of material and process parameters that can lead to gold embrittlement in electronic assemblies. There are a variety of reasons that designers might want to solder to gold or gold plating. One reason is that some designs involve wire bonding and soldering operations on the same assembly. Another reason would be to include gold contact pads (e.g. for dome keypad contacts) or card edge contacts (e.g. PC cards). The wire bond pads or contact pads can be selectively gold plated, but the selective plating process can be expensive. The electronics industry currently recognizes a threshold level for gold that can be dissolved into eutectic tin-lead solder above which the solder is likely to become embrittled. This threshold is ~ 3 wt% gold. It will be shown in the paragraphs below that embrittlement of solder joints can develop at significantly lower bulk gold concentrations. Metallurgical Description of Gold Embrittlement The most important soldering alloy in the electronics industry is the eutectic tin-lead alloy, 63%Sn – 37%Pb. This may change in the near future as lead-free soldering takes its hold on the industry. -
The Nickel Silvers
Copper Development Association The Nickel Silvers Design Data and Applications 1965 Please note this publication is provided as an archive copy. The information given may therefore not be current. The Nickel Silvers Design Data and Applications 1965 Copper Development Association Copper Development Association is a non-trading organisation sponsored by the copper producers and fabricators to encourage the use of copper and copper alloys and to promote their correct and efficient application. Its services, which include the provision of technical advice and information, are available to those interested in the utilisation of copper in all its aspects. The Association also provides a link between research and user industries and maintains close contact with other copper development associations throughout the world. Website: www.copperinfo.co.uk Email: [email protected] Copyright: All information in this document is the copyright of Copper Development Association Disclaimer: Whilst this document has been prepared with care, Copper Development Association can give no warranty regarding the contents and shall not be liable for any direct, indirect or consequential loss arising out of its use Contents Contents ...............................................................................................................................................................1 Introduction .........................................................................................................................................................2 -
Copper Alloys
THE COPPER ADVANTAGE A Guide to Working With Copper and Copper Alloys www.antimicrobialcopper.com CONTENTS I. Introduction ............................. 3 PREFACE Conductivity .....................................4 Strength ..........................................4 The information in this guide includes an overview of the well- Formability ......................................4 known physical, mechanical and chemical properties of copper, Joining ...........................................4 as well as more recent scientific findings that show copper has Corrosion ........................................4 an intrinsic antimicrobial property. Working and finishing Copper is Antimicrobial ....................... 4 techniques, alloy families, coloration and other attributes are addressed, illustrating that copper and its alloys are so Color ..............................................5 adaptable that they can be used in a multitude of applications Copper Alloy Families .......................... 5 in almost every industry, from door handles to electrical circuitry to heat exchangers. II. Physical Properties ..................... 8 Copper’s malleability, machinability and conductivity have Properties ....................................... 8 made it a longtime favorite metal of manufacturers and Electrical & Thermal Conductivity ........... 8 engineers, but it is its antimicrobial property that will extend that popularity into the future. This guide describes that property and illustrates how it can benefit everything from III. Mechanical -
FTC Guideline - Title 16, Commercial Practices Part 23 for Gold Plating Over Sterling Silver Jewelery
Reference: FTC guideline - Title 16, commercial practices part 23 for gold plating over sterling silver Jewelery Dear Sir, My concern is on low K gold plating (10/14/18) over sterling silver. As per me, gold plating on silver Jewellery should be done only with > 23K. Following are the reasons to support my recommendation: REASONS TO AVOID LOW K GOLD PLATING • In low karat gold micron electroplating, we have to use either Au/Cu or Au/Ag chemistry. Au/Cu chemistry plating color for 14K is too pink (5N) & Au/Ag chemistry plating color is too green. We have to give top coat of 0.1 micron of high karat gold (>23K) to achieve Hamilton color (1N/2N) over low karat gold plating. • Doing low karat gold plating & cover it with nominal high karat gold for color, deficit the purpose of gold plated Jewellery. If the top flash gold will wear out then actual gold alloy color (pink/green) will expose (pink/green) which will tarnish too fast. • Achieving exact K (10/14/18) in low K electroplating is practically not possible. • We cannot identify gold purity of plating thickness on sterling silver by XRF because there are common elements present in plating thickness & base (e.g. Ag,Cu..). • Gold alloy (10/14/18) thickness testing is not possible by XRF because standards available for thickness calibration are in 24K. It is impossible to make 10/14/18 K standards as per plating compositions (Au/Cu & Au/Ag) because it cannot be fabricated. Thickness measurement of low K on XRF is manipulated method, where instrument detects pure gold ions throughout the plating layer & then by density calculation it will be converted into low K plating thickness(e.g.- 14 K density is 13 g/cc & pure gold is 19.3 g/cc. -
Understanding Gold Plating
Understanding Gold Plating Peter Wilkinson Engelhard Limited, Cinderford, Gloucestershire, United Kingdom For effective operation, gold plating baths must require the mini- mum of attention in respect of replenishment and replacement, and must produce as little sub-standard or reject work as possible. To achieve this, an understanding of the processes involved and the factors affecting them is advantageous. This article attempts to provide such an understanding in a simple manner. Special atten- tion is given to the plating of gold from acid baths containing monovalent gold complexes. The use of gold as a contact material on connectors, Other gold(I) complexes, such as those with thiomalate and switches and printed circuit boards (PCB's) is now well estab- thiosulphate have been considered, but it is doubtful if they lished. There is also an awareness that only gold deposits from will ever find commercial application. acid (pH 3.5-5.0) gold(I) cyanide baths containing cobalt, In terms of electricity consumed, gold(I) baths are more nickel or iron as brightening agents have the appropriate efficient than gold(III) baths. Thus, assuming 100 per cent properties for a contact material. Gold deposits from: pure efficiency, 100 amp-min will deposit 12.25 g of gold from a gold(I) cyanide baths; from such baths containing organic monovalent gold complex, but only 4.07 g from a trivalent gold materials as brightening agents; or from electrolytes containing complex. gold in the form of the gold(I) sulphite complex, do not have Nevertheless, deposition from acid gold(III) cyanide baths the sliding wear resistance which is necessary for make and has merit in the plating of acid resistant substrates such as stain- break connections (1). -
Handbook : Brass, Bronze, Copper, Nickel Silver
•ui#:.r fc ::* £ \ ' TONKt* * i i "t ' 1 .'.'. i HANDBOOK tt BRASS • BRONZE • COPPER NICKEL SILVER I fc Anacon dA from mine to consumer • IftUitilHlli'l J July 1, 1935 3 h * THE AMERICAN BRASS COMPANY 3 * *.. Copyright, 1935 The American Brass Company Printed in U. S. A. C THE AMERICAN BRASS COMPANY General Offices WATERBURY, CONNECTICUT, U.S.A. Manufacturing Plants ANSONIA, CONN. TORRINGTON, CONN. WATERBURY, CONN. BUFFALO, N. Y. DETROIT, MICH. KENOSHA, WIS. Offices and Agencies BOSTON, MASS. 140 Federal Street PROVIDENCE, R. I. 131 Dorrance Strei 1 NEW YORK, N. Y. 25 Broadway SYRACUSE, N. Y. 207 East Genesee Street Place NEWARK, N. J. 20 Branford WASHINGTON, D. C. 1511 K Street, N. W. PHILADELPHIA, PA. 117 South Seventeenth Strei t PITTSBURGH, PA. 535 Smithfield Street CLEVELAND. OHIO 925 Euclid Avenue DAYTON, OHIO 52 North Main Street CINCINNATI, OHIO 101 West Fourth Street CHICAGO, ILL. 1326 West Washington Boulevard ST. LOUIS, MO. 408 Pine Street ATLANTA. GA. 10 Forsyth Street HOUSTON, TEXAS 609 Fannin Street DENVER, COLO. 818 Seventeenth Street LOS ANGELES, CALIF. 411 Weai Fifth Street SAN FRANCISCO, CALIF. 235 Montgomery Street SEATTLE, WASH. 1358 Fourth Avenue THE AMERICAN BRASS COMPANY OF ILLINOIS 1326 West Washington Boulevard, Chicago, 111. In Canada ANACONDA AMERICAN BRASS LIMITED Main Office and Mill NEW TORONTO, ONTARIO Montreal Agency: 1010 St. Catherine Street, W. * 3 CABLE ADDRESSES "AMBRAC" Waterbury, Conn. "AMBRAC" 25 Broadway, New York Codes Used All Standard Cable and Telegraph THE AMERICAN BRASS COMPANY - Tl ANACONDA -
Challenges on ENEPIG Finished Pcbs: Gold Ball Bonding and Pad Metal Lift
As originally published in the IPC APEX EXPO Proceedings. Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva Teledyne DALSA Inc. Waterloo, ON, Canada Abstract As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized. Gold ball bonding with 25um diameter wire was performed. Printed circuit boards (PCBs) were surface mounted prior to the wire bonding process with Pb-free solder paste with water soluble organic acid (OA) flux. The standard gold ball bonding process (ball / stitch bonds) was attempted during process development and pre-production stages, but this process was not stable enough for volume production due to variation in bondability within one batch and between PCB batches. This resulted in the standard gold ball bonding process being changed to stand-off-stitch bonding (SSB) or the ball-stitch-on-ball (BSOB) bonding process, in order to achieve gold ball bonding successfully on PCBs with an ENEPIG finish for volume production. Another area of concern was pad metal lifting (PML) experienced on some PCBs, and PCB batches, where the palladium (Pd) layer was completely separated from nickel (Ni) either during wire bonding or during sample destructive wire pull tests, indicating potential failures in the remainder of the batch. -
The Early History of Gold Plating
The Early History of Gold Plating A TANGLED TALE OF DISPUTED PRIORITIES L. B. Hunt Johnson Matthey & Co Limited, London "The gilding of metals is, of all the processes whose object is to obtain an adhering deposit, the one which has exercised in the greatest degree the sagacity of inventors " PROFESSOR AUGUSTE DE LA RIVE, GENEVA, 1840 Many of the scientfic discoveries and technical President of the Royal Society, Sir Joseph Banks. developments that were so characteristic of the Because the letter would have to pass through nineteenth century rapidly became the subject of France, then engaged in the Napoleonic wars with controversy and of heated arguments about priorities. England, Volta sent only the first part of the letter, Of all these, none was probably more sorely beset by the second part following three months later, so that polemics and acrimonious debate—or for a longer it was not read to the Royal Society until the end period of time—than the birth of a commercially of June of that year. None the less, the receipt of satisfactory process for the electrodeposition of gold the earlier part of the letter was enough to cause (and of silver with which it was naturally associated) considerable excitement among the scientists of the on to base metals. It must also come close to world period, since it now made available for the first time record standards for the number and the diversity of a low voltage continuous current as opposed to the the scientists and dilettante whose contributions high voltage discharges, lasting only a fraction of a eventually led to success; not only were there second, from the static electrical machines.