IP-M45A1 Mini-ITX Socket P(Penryn/Merom) Intel Core™ 2 Duo, Celeron Processor Industrial Motherboard with CRT/ LCD/DVI/TV-Out/HDMI, Audio and Dual Gbe LAN

Total Page：16

File Type：pdf, Size：1020Kb

IP-M45A1 Mini-ITX Socket P(Penryn/Merom) Intel Core™ 2 Duo, Celeron Processor Industrial Motherboard with CRT/ LCD/DVI/TV-out/HDMI, Audio and Dual GbE LAN Features • Highest Performance in Intel's Mobile Platforms • Variety Video Interface for Vision Applications • Additional Mini PCI Socket for PCI Expansion • Highly Integrated Communication Interfaces • Extended Operating Temp.: -20 ~ 70°C System Mechanical & Environmental CPU Socket P(Penryn/Merom) Intel Core™ 2 Duo, Celeron processor Power Type ATX 2.0 (ESP type, 20-pin) Recommanded: Operating Temp. -20~70°C (-4~ 158°F) Penryn code processor (T9600/T9400) Operating Humidity 0 ~ 95% (non-condensing) Merom code processor (T7500/T7300/T7100) Celeron processor (575/550/530) Dimensions (L x W) 170 x 170 mm (6.7" x 6.7") Memory 2 x 240-pin DDRII DIMM 667/800MHz up 4GB Dimensions Chipset Intel GM45 + ICH9M 1 1 4 7 1 4 7 9 BIOS AMI Flash BIOS 1 2 3 5 6 2 3 5 6 7 1 4 1 4 7 10 9 2 240 119 120 239 240 119 120 239 10 3 5 6 2 3 5 6 ATA/IDE 4 x Serial ATA ports with 300MB/s HDD transfer rate 2 1 2 AJ mPGA478B 10 9 AE 3 1 255-level reset AA Watchdog Timer 2 3 4 U 5 2 2 6 7 2 1 8 N 1 9 10 1 11 J 12 13 14 E 15 16 17 A62 B62 18 A I/O A61 B61 1 19 20 10 1 29 25 15 5 20 21 22 23 24 25 26 124 123 AE AD AC ABAA Y WVU AF T P N MHL K JR F E D C BG Serial Port 1 x RS-232 port A 103 128 170 102 1 x RS-232/422/485 selectable port 132.08 1 154.94 SPP/EPP/ECP mode 1 11 Parallel Port 1 38 65 USB Port 8 x USB 2.0 ports 64 1 x PS/2 Keyboard and Mouse (by 6-pin wafer) 2 KB/MS 1 15 1 21 1 16 6 3 5 Expansion Bus 1 x 32-bit/33MHz PCI slot 2 1 10 A1 1 20 30 2 A2 B1 B2 121 122 1 2 1 x Mini PCI socket 121 122 1 2 1 29 1 A1 1 13 21 19 22 22 21 20 20 19 10 10 18 18 23 27 27 23 26 14 17 9 917 C1 C5 1 x HDMI Type A connector A1 HDMI A5 32 33 34 35 28 28 24 24 C10 C6 5 1 8 5 33.02 8 A6 A9 C11 C15 1 4 1 4 29 25 22 23 24 25 1 19 29 25 B1 B5 30 26 30 26 1 8 B6 B9 9 16 3 12 4 5 17 DVI 1 x DB24 female connector 24 1 GPIO Onboard 8-bit GPIO 4 in/4 out 10.16 6.33 157.48 169.98 LAN2 LAN1 VGA COM1 Chipset 2 x Realtek RTL8111B GbE LAN Line Out 26 Audio HDVI Unit: mm 9.78 DVI USB USB COM2 Mic Realtek ALC888 Codec, support Mic-in/Line-in/Line-out Codec/Interface (default w/o Line-in) 43.98 74.85 22.07 123.78 24.23 Display 162.16 Intel Gen5.0 integrated graphics engine with 10 fully Graphics Chipset programmable cores Ordering Information Graphics Interface CRT support up to 1920 x 1440 Mini-ITX Socket P(Penryn/Merom) Intel Core™ 2 Duo, LVDS support 24-bit up to 1920 x 1200 IP-M45A1 Celeron processor industrial motherboard with CRT/LCD/ DVI/TV-out/HDMI, Audio and dual GbE LAN DVI support 12-bit up to 1600 x 1200 CK - 06-4500-00 Cable kit TV-out support NTSC/PAL up to 1024 x 768 T9400 Intel Socket P Core™ 2 Duo 2.53G FSB1066MHz 6M Cache Support HDMI up to 1600 x 1200 T7500 Intel Socket P Core™ 2 Duo 2.2G FSB800MHz 4M Cache Dual independent display achievable up to 1600 x 1200 Celeron 575 Intel Socket P Celeron 2.0G FSB667MHz 1M Cache Celeron 550 Intel Socket P Celeron 2.0G FSB533MHz 1M Cache $OOVSHFL¿FDWLRQVDUHVXEMHFWWRFKDQJHZLWKRXWQRWLFH.

Copy Link

Recommended publications

AMD Athlon™ Processor X86 Code Optimization Guide
AMD AthlonTM Processor x86 Code Optimization Guide © 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other applica- tion in which the failure of AMD’s product could create a situation where per- sonal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD logo, AMD Athlon, K6, 3DNow!, and combinations thereof, AMD-751, K86, and Super7 are trademarks, and AMD-K6 is a registered trademark of Advanced Micro Devices, Inc. Microsoft, Windows, and Windows NT are registered trademarks of Microsoft Corporation.
[Show full text]
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems.
[Show full text]
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment.
[Show full text]
Asrock G41C-VS Motherboard, a Reliable Motherboard Produced Under Asrock’S Consistently Stringent Quality Control
G41C-VS User Manual Version 1.0 Published October 2009 Copyright©2009 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
[Show full text]
Toshiba Hardware Portfolio – Microsoft Support by Family
Date created: 6/17/2020 Toshiba Hardware Portfolio – Microsoft Support by Family Windows 10 Windows 10 Windows 10 Toshiba Windows 10 Toshiba IoT IoT Enterprise Intel Platform Machine Intel Processor Model IoT Enterprise Family Enterprise LTSC 2019 Type LTSB 2015 LTSB 2016 Core i3 9100TE 777 TCx™ 700 4900 Core i5 9500T 787 9th Gen Core Core i7 9700T 797 (Coffee Lake Not Supported Refresh) Core i3 9100TE 371 TCx™ 300 4810 Core i5 9500T 381 Core i7 9700T 391 8th Gen Core TCx™ 300 4810 361 Celeron 4900T (Coffee Lake) TCx™ 700 4900 767 107 Available now and Core i7 7600U 117 supported until 137 Not Supported Jan 9, 2029 105 Core i5 7300U 115 7th Gen Core 135 TCx™ 800 6200 Available (Kaby Lake) 103 now and Core i3 7100U 113 supported until 133 Oct 13, 2026 10C Celeron 3965U 11C 13C N/A 4750 AMD GX-218GL D10 SoC Family Basics Celeron J1900 4818 T10 (Bay Trail) Quad Not Supported 6th Gen Core 145 TCxWave™ 6140 Core i5 6300U (Skylake/Q170) 155 Date created: 6/17/2020 14C Celeron 3955U 15C SoC Family Celeron J1900 A3R (Bay Trail) Quad Core i5 4950S 786 Available Core i3 4330 C86 now and TCx™ 700 4900 Celeron G1820 supported until 746 Oct 14, 2025 4th Gen Core Celeron G1820TE (Haswell/Q87) C46 Core i5 4570TE 380 TCx™ 300 4810 Core i3 4330TE 370 Celeron G1820TE 360 3rd Gen Core + TCxWave ™ 6140 Core i3 3217UE 120 2nd Gen PCH SurePOS (IvyBridge CPU + 4852 Core i5 3550S 580 CougarPoint PCH) 500 Toshiba Toshiba Limited TCxWave ™ 6140 Celeron 847E 100 Limited Support SurePOS Celeron G540 785 Support 2nd Gen Core 4900 700 Core i3 2120 C85 (SandyBridge/Q67)
[Show full text]
Class-Action Lawsuit
Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys.
[Show full text]
INTEL Central Processing Units (CPU) This Page of Product Is Rohs Compliant
INTEL Central Processing Units (CPU) This page of product is RoHS compliant. CENTRAL PROCESSING UNITS (CPU) Intel Processor families include the most powerful and flexible Central Processing Units (CPUs) available today. Utilizing industry leading 22nm device fabrication techniques, Intel continues to pack greater processing power into smaller spaces than ever before, providing desktop, mobile, and embedded products with maximum performance per watt across a wide range of applications. Atom Celeron Core Pentium Xeon For quantities greater than listed, call for quote. MCU \ MPU / DSP MPU / MCU \ MOUSER Intel Core Cache Data TDP Price Each Package Processor Family Code Freq. Size No. of Bus Width (Max) STOCK NO. Part No. Series Name (GHz) (MB) Cores (bit) (W) 1 25 50 100 Desktop 607-DF8064101211300Y DF8064101211300S R0VY FCBGA-559 D2550 Atom™ Cedarview 1.86 1 2 64 10 607-CM8063701444901S CM8063701444901S R10K FCLGA-1155 G1610 Celeron® Ivy Bridge 2.6 2 2 64 55 Intel 607-CM8062301046804S CM8062301046804S R05J FCLGA-1155 G540 Celeron® Sandy Bridge 2.5 2 2 64 65 607-AT80571RG0641MLS AT80571RG0641MLS LGTZ LGA-775 E3400 Celeron® Wolfdale 2.6 1 2 64 65 607-HH80557PG0332MS HH80557PG0332MS LA99 LGA-775 E4300 Core™ 2 Conroe 1.8 2 2 64 65 607-AT80570PJ0806MS AT80570PJ0806MS LB9J LGA-775 E8400 Core™ 2 Wolfdale 3.0 6 2 64 65 607-AT80571PH0723MLS AT80571PH0723MLS LGW3 LGA-775 E7400 Core™ 2 Wolfdale 2.8 3 2 64 65 607-AT80580PJ0676MS AT80580PJ0676MS LB6B LGA-775 Q9400 Core™ 2 Yorkfield 2.66 6 4 64 95 607-CM80616003060AES CM80616003060AES LBTD FCLGA-1156
[Show full text]
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs.
[Show full text]
Intel® Core™ Microarchitecture • Wrap Up
EW N IntelIntel®® CoreCore™™ MicroarchitectureMicroarchitecture MarchMarch 8,8, 20062006 Stephen L. Smith Bob Valentine Vice President Architect Digital Enterprise Group Intel Architecture Group Agenda • Multi-core Update and New Microarchitecture Level Set • New Intel® Core™ Microarchitecture • Wrap Up 2 Intel Multi-core Roadmap – Updates since Fall IDF 3 Ramping Multi-core Everywhere 4 All products and dates are preliminary and subject to change without notice. Refresher: What is Multi-Core? Two or more independent execution cores in the same processor Specific implementations will vary over time - driven by product implementation and manufacturing efficiencies • Best mix of product architecture and volume mfg capabilities – Architecture: Shared Caches vs. Independent Caches – Mfg capabilities: volume packaging technology • Designed to deliver performance, OEM and end user experience Single die (Monolithic) based processor Multi-Chip Processor Example: 90nm Pentium® D Example: Intel Core™ Duo Example: 65nm Pentium D Processor (Smithfield) Processor (Yonah) Processor (Presler) Core0 Core1 Core0 Core1 Core0 Core1 Front Side Bus Front Side Bus Front Side Bus *Not representative of actual die photos or relative size 5 Intel® Core™ Micro-architecture *Not representative of actual die photo or relative size 6 Intel Multi-core Roadmap 7 Intel Multi-core Roadmap 8 Intel® Core™ Microarchitecture Based Platforms Platform 2006 20072007 Caneland Platform (2007) MP Servers Tigerton (QC) (2007) Bensley Platform (Q2’06)/ Glidewell Platform (Q2’06) ) DP Servers/ Woodcrest (Q3’06) DP Workstation Clovertown (QC) (Q1’07) Kaylo Platform (Q3’06)/ Wyloway Platform (Q3 ’06) UP Servers/ Conroe (Q3’06) UP Workstation Kentsfield (QC) (Q1’07) Bridge Creek Platform (Mid’06) Desktop -Home Conroe (Q3’06) Kentsfield (QC) (Q1’07) Desktop -Office Averill Platform (Mid’06) Conroe (Q3’06) Mobile Client Napa Platform (Q1’06) Merom (2H’06) All products and dates are preliminary 9 Note: only Intel® Core™ microarchitecture QC refers to Quad-Core and subject to change without notice.
[Show full text]
Intel® Celeron® Processor 900 Series and Ultra Low Voltage 700 Series
Intel® Celeron® Processor 900 Series and Ultra Low Voltage 700 Series Datasheet For platforms based on Mobile Intel® 4 Series Chipset family February 2010 Document Number: 320389-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
[Show full text]
HC19.21.810.45Nm Next Generation Intel® Core™ Microarchitecture
45nm Next Generation Intel® Core™ Microarchitecture (Penryn) HOT CHIPS 2007 Varghese George Principal Engineer, Intel Corp Legal Disclaimer Today’s presentation may contain forward-looking statements. All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Please refer to our most recent Earnings Release and our most recent Form 10-Q or 10-K filing available on our website for more information on the risk factors that could cause actual results to differ. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Core™ Microarchitecture, Intel® Pentium, Intel® Pentium II, Intel® Pentium III, Intel® Pentium 4, Intel® Pentium Pro, Intel® Pentium D, Intel® Pentium M , Itanium®, Xeon® may contain design defects or errors known as errata which may cause the product to deviate from published specifications.
[Show full text]
Nt* and Rtl* INT 2Eh CALL Ntdll!Kifastsystemcall
ȘFĢ: Fųřțįm’ș Đěřįvǻțįvě Bỳ Jǿșěpħ Ŀǻňđřỳ ǻňđ Ųđį Șħǻmįř Țħě Ŀǻbș țěǻm ǻț ȘěňțįňěŀǾňě řěčěňțŀỳ đįșčǿvěřěđ ǻ șǿpħįșțįčǻțěđ mǻŀẅǻřě čǻmpǻįģň șpěčįfįčǻŀŀỳ țǻřģěțįňģ ǻț ŀěǻșț ǿňě Ěųřǿpěǻň ěňěřģỳ čǿmpǻňỳ. Ųpǿň đįșčǿvěřỳ, țħě țěǻm řěvěřșě ěňģįňěěřěđ țħě čǿđě ǻňđ běŀįěvěș țħǻț bǻșěđ ǿň țħě ňǻțųřě, běħǻvįǿř ǻňđ șǿpħįșțįčǻțįǿň ǿf țħě mǻŀẅǻřě ǻňđ țħě ěxțřěmě měǻșųřěș įț țǻķěș țǿ ěvǻđě đěțěčțįǿň, įț ŀįķěŀỳ pǿįňțș țǿ ǻ ňǻțįǿň-șțǻțě șpǿňșǿřěđ įňįțįǻțįvě, pǿțěňțįǻŀŀỳ ǿřįģįňǻțįňģ įň Ěǻșțěřň Ěųřǿpě. Țħě mǻŀẅǻřě įș mǿșț ŀįķěŀỳ ǻ đřǿppěř țǿǿŀ běįňģ ųșěđ țǿ ģǻįň ǻččěșș țǿ čǻřěfųŀŀỳ țǻřģěțěđ ňěțẅǿřķ ųșěřș, ẅħįčħ įș țħěň ųșěđ ěįțħěř țǿ įňțřǿđųčě țħě pǻỳŀǿǻđ, ẅħįčħ čǿųŀđ ěįțħěř ẅǿřķ țǿ ěxțřǻčț đǻțǻ ǿř įňșěřț țħě mǻŀẅǻřě țǿ pǿțěňțįǻŀŀỳ șħųț đǿẅň ǻň ěňěřģỳ ģřįđ. Țħě ěxpŀǿįț ǻffěčțș ǻŀŀ věřșįǿňș ǿf Mįčřǿșǿfț Ẅįňđǿẅș ǻňđ ħǻș běěň đěvěŀǿpěđ țǿ bỳpǻșș țřǻđįțįǿňǻŀ ǻňțįvįřųș șǿŀųțįǿňș, ňěxț-ģěňěřǻțįǿň fįřěẅǻŀŀș, ǻňđ ěvěň mǿřě řěčěňț ěňđpǿįňț șǿŀųțįǿňș țħǻț ųșě șǻňđbǿxįňģ țěčħňįqųěș țǿ đěțěčț ǻđvǻňčěđ mǻŀẅǻřě. (bįǿměțřįč řěǻđěřș ǻřě ňǿň-řěŀěvǻňț țǿ țħě bỳpǻșș / đěțěčțįǿň țěčħňįqųěș, țħě mǻŀẅǻřě ẅįŀŀ șțǿp ěxěčųțįňģ įf įț đěțěčțș țħě přěșěňčě ǿf șpěčįfįč bįǿměțřįč věňđǿř șǿfțẅǻřě). Ẅě běŀįěvě țħě mǻŀẅǻřě ẅǻș řěŀěǻșěđ įň Mǻỳ ǿf țħįș ỳěǻř ǻňđ įș șțįŀŀ ǻčțįvě. İț ěxħįbįțș țřǻįțș șěěň įň přěvįǿųș ňǻțįǿň-șțǻțě Řǿǿțķįțș, ǻňđ ǻppěǻřș țǿ ħǻvě běěň đěșįģňěđ bỳ mųŀțįpŀě đěvěŀǿpěřș ẅįțħ ħįģħ-ŀěvěŀ șķįŀŀș ǻňđ ǻččěșș țǿ čǿňșįđěřǻbŀě řěșǿųřčěș. Ẅě vǻŀįđǻțěđ țħįș mǻŀẅǻřě čǻmpǻįģň ǻģǻįňșț ȘěňțįňěŀǾňě ǻňđ čǿňfįřměđ țħě șțěpș ǿųțŀįňěđ běŀǿẅ ẅěřě đěțěčțěđ bỳ ǿųř Đỳňǻmįč Běħǻvįǿř Țřǻčķįňģ (ĐBȚ) ěňģįňě. Mǻŀẅǻřě Șỳňǿpșįș Țħįș șǻmpŀě ẅǻș ẅřįțțěň įň ǻ mǻňňěř țǿ ěvǻđě șțǻțįč ǻňđ běħǻvįǿřǻŀ đěțěčțįǿň. Mǻňỳ ǻňțį-șǻňđbǿxįňģ țěčħňįqųěș ǻřě ųțįŀįżěđ.
[Show full text]