A Class of Compatible Cache Consistency Protocols and Their Support by the IEEE Futurebus
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System Buses EE2222 Computer Interfacing and Microprocessors
System Buses EE2222 Computer Interfacing and Microprocessors Partially based on Computer Organization and Architecture by William Stallings Computer Electronics by Thomas Blum 2020 EE2222 1 Connecting • All the units must be connected • Different type of connection for different type of unit • CPU • Memory • Input/Output 2020 EE2222 2 CPU Connection • Reads instruction and data • Writes out data (after processing) • Sends control signals to other units • Receives (& acts on) interrupts 2020 EE2222 3 Memory Connection • Receives and sends data • Receives addresses (of locations) • Receives control signals • Read • Write • Timing 2020 EE2222 4 Input/Output Connection(1) • Similar to memory from computer’s viewpoint • Output • Receive data from computer • Send data to peripheral • Input • Receive data from peripheral • Send data to computer 2020 EE2222 5 Input/Output Connection(2) • Receive control signals from computer • Send control signals to peripherals • e.g. spin disk • Receive addresses from computer • e.g. port number to identify peripheral • Send interrupt signals (control) 2020 EE2222 6 What is a Bus? • A communication pathway connecting two or more devices • Usually broadcast (all components see signal) • Often grouped • A number of channels in one bus • e.g. 32 bit data bus is 32 separate single bit channels • Power lines may not be shown 2020 EE2222 7 Bus Interconnection Scheme 2020 EE2222 8 Data bus • Carries data • Remember that there is no difference between “data” and “instruction” at this level • Width is a key determinant of performance • 8, 16, 32, 64 bit 2020 EE2222 9 Address bus • Identify the source or destination of data • e.g. CPU needs to read an instruction (data) from a given location in memory • Bus width determines maximum memory capacity of system • e.g. -
Input/Output
Lectures 24: Input/Output I. External devices A. External devices are not connected directly to the system bus because they have a wide range of control logics, as well as data transfer speeds and formats. B. Virtually all external devices have buffers, control signals, status signals, and data bits. C. Those that deal with other forms of energy have transducers that converts from non-electrical data to electrical data, (e.g. key press to ASCII in a keyboard), or electrical data to non-electrical data (e.g. bytes to light in a monitor). D. In the past, intra-system (less than 1 meter) connections were usually parallel, and inter-system were serial. Now almost all are serial. 1. To convert from parallel to serial use a shift register. 2. USB (universal serial bus) is a common standard for serial transmission with USB 3.0 transferring at 5Gb/s. II. I/O Modules (south bridge and north bridge on a PC) on the motherboard provide the logic, buffers, error detection, and ports to communicate with the external devices on one side, and a system-type bus on the other. For external device interfaces, the modules have data, status, and control lines. For the system bus they have data, address, and control lines. The south bridge handles slower I/O devices and is connected to the north bridge rather than the system bus directly. III. Programmed I/O A. Overview of Programmed I/O waits for the processor to query it. B. Four types of I/O commands: 1) control (e.g. -
Interconnect Solutions Short Form Catalog
Interconnect Solutions Short Form Catalog How to Search this Catalog This digital catalog provides you with three quick ways to find the products and information you are looking for. Just point and click on the bookmarks to the left, the linked images on the next page or the labeled sections of the table of contents. You can also use the “search” function built into Adobe Acrobat to jump directly to any text reference in this document. Acrobat “Search” function instructions: 1. Press CONTROL + F 2. When the dialog box appears, type in the word or words you are looking for and press ENTER. 3. Depending on your version of Acrobat, it will either take you directly to the first instance found, or display a list of pages where the text can be found. In the latter, click on the link to the pages provided. Interconnect Solutions Short Form Catalog Complete Solutions for the Electronics Industry 3M Electronics offers a comprehensive range of Interconnect Solutions for the electronics industry with a product portfolio that includes connectors, cables, cable assemblies and assembly tooling for a wide variety of applications. 3M is dedicated to innovation, continually developing new products that become an important part of everyday life across many diverse markets. A number of 3M solution categories are based on custom-designed products for specialized applications. 3M Electronics can help you design, modify and customize your product as well as help you to seamlessly integrate our products into your manufacturing process on a global basis. RoHS Compliant Statement “RoHS compliant” means that the product or part does not contain any of the following substances in excess of the following maximum concentration values in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. -
Publication Title 1-1962
publication_title print_identifier online_identifier publisher_name date_monograph_published_print 1-1962 - AIEE General Principles Upon Which Temperature 978-1-5044-0149-4 IEEE 1962 Limits Are Based in the rating of Electric Equipment 1-1969 - IEEE General Priniciples for Temperature Limits in the 978-1-5044-0150-0 IEEE 1968 Rating of Electric Equipment 1-1986 - IEEE Standard General Principles for Temperature Limits in the Rating of Electric Equipment and for the 978-0-7381-2985-3 IEEE 1986 Evaluation of Electrical Insulation 1-2000 - IEEE Recommended Practice - General Principles for Temperature Limits in the Rating of Electrical Equipment and 978-0-7381-2717-0 IEEE 2001 for the Evaluation of Electrical Insulation 100-2000 - The Authoritative Dictionary of IEEE Standards 978-0-7381-2601-2 IEEE 2000 Terms, Seventh Edition 1000-1987 - An American National Standard IEEE Standard for 0-7381-4593-9 IEEE 1988 Mechanical Core Specifications for Microcomputers 1000-1987 - IEEE Standard for an 8-Bit Backplane Interface: 978-0-7381-2756-9 IEEE 1988 STEbus 1001-1988 - IEEE Guide for Interfacing Dispersed Storage and 0-7381-4134-8 IEEE 1989 Generation Facilities With Electric Utility Systems 1002-1987 - IEEE Standard Taxonomy for Software Engineering 0-7381-0399-3 IEEE 1987 Standards 1003.0-1995 - Guide to the POSIX(R) Open System 978-0-7381-3138-2 IEEE 1994 Environment (OSE) 1003.1, 2004 Edition - IEEE Standard for Information Technology - Portable Operating System Interface (POSIX(R)) - 978-0-7381-4040-7 IEEE 2004 Base Definitions 1003.1, 2013 -
Opening Plenary March 2021
Opening Plenary March 2021 Glenn Parsons – IEEE 802.1 WG Chair [email protected] 802.1 plenary agenda Monday, March 8th opening Tuesday, March 16th closing • Copyright Policy • Copyright Policy • Call for Patents • Call for Patents • Participant behavior • Participant behavior • Administrative • Membership status • Membership status • Future Sessions • Future Sessions • Sanity check – current projects • 802 EC report • TG reports • Sanity check – current projects • Outgoing Liaisons • Incoming Liaisons • Motions for EC • TG agendas • Motions for 802.1 • Any other business • Any other business 2 INSTRUCTIONS FOR CHAIRS OF STANDARDS DEVELOPMENT ACTIVITIES At the beginning of each standards development meeting the chair or a designee is to: .Show the following slides (or provide them beforehand) .Advise the standards development group participants that: .IEEE SA’s copyright policy is described in Clause 7 of the IEEE SA Standards Board Bylaws and Clause 6.1 of the IEEE SA Standards Board Operations Manual; .Any material submitted during standards development, whether verbal, recorded, or in written form, is a Contribution and shall comply with the IEEE SA Copyright Policy; .Instruct the Secretary to record in the minutes of the relevant meeting: .That the foregoing information was provided and that the copyright slides were shown (or provided beforehand). .Ask participants to register attendance in IMAT: https://imat.ieee.org 3 IEEE SA COPYRIGHT POLICY By participating in this activity, you agree to comply with the IEEE Code of Ethics, all applicable laws, and all IEEE policies and procedures including, but not limited to, the IEEE SA Copyright Policy. .Previously Published material (copyright assertion indicated) shall not be presented/submitted to the Working Group nor incorporated into a Working Group draft unless permission is granted. -
FLEXBUS: a High-Performance System-On-Chip Communication
34.4 FLEXBUS: A High-Performance System-on-Chip Communication Architecture with a Dynamically Configurable Topology ∗ Krishna Sekar Kanishka Lahiri Anand Raghunathan Sujit Dey Dept. of ECE NEC Laboratories America NEC Laboratories America Dept. of ECE UC San Diego, CA 92093 Princeton, NJ 08540 Princeton, NJ 08540 UC San Diego, CA 92093 [email protected] [email protected] [email protected] [email protected] ABSTRACT portunities for dynamically controlling the spatial allocation of com- munication architecture resources among different SoC components, In this paper, we describe FLEXBUS, a flexible, high-performance on- chip communication architecture featuring a dynamically configurable a capability, which if properly exploited, can yield substantial per- formance gains. We also describe techniques for choosing optimized topology. FLEXBUS is designed to detect run-time variations in com- munication traffic characteristics, and efficiently adapt the topology of FLEXBUS configurations under time-varying traffic profiles. We have the communication architecture, both at the system-level, through dy- conducted detailed experiments on FLEXBUS using a commercial de- namic bridge by-pass, as well as at the component-level, using compo- sign flow to analyze its area and performance under a wide variety of system-level traffic profiles, and applied it to an IEEE 802.11 MAC nent re-mapping. We describe the FLEXBUS architecture in detail and present techniques for its run-time configuration based on the char- processor design. The results demonstrate that FLEXBUS provides up acteristics of the on-chip communication traffic. The techniques un- to 31.5% performance gains compared to conventional architectures, with negligible hardware overhead. -
PDP-11 Bus Handbook (1979)
The material in this document is for informational purposes only and is subject to change without notice. Digital Equipment Corpo ration assumes no liability or responsibility for any errors which appear in, this document or for any use made as a result thereof. By publication of this document, no licenses or other rights are granted by Digital Equipment Corporation by implication, estoppel or otherwise, under any patent, trademark or copyright. Copyright © 1979, Digital Equipment Corporation The following are trademarks of Digital Equipment Corporation: DIGITAL PDP UNIBUS DEC DECUS MASSBUS DECtape DDT FLIP CHIP DECdataway ii CONTENTS PART 1, UNIBUS SPECIFICATION INTRODUCTION ...................................... 1 Scope ............................................. 1 Content ............................................ 1 UNIBUS DESCRIPTION ................................................................ 1 Architecture ........................................ 2 Unibus Transmission Medium ........................ 2 Bus Terminator ..................................... 2 Bus Segment ....................................... 3 Bus Repeater ....................................... 3 Bus Master ........................................ 3 Bus Slave .......................................... 3 Bus Arbitrator ...................................... 3 Bus Request ....................................... 3 Bus Grant ......................................... 3 Processor .......................................... 4 Interrupt Fielding Processor ......................... -
Architectural Support for Real-Time Computing Using Generalized Rate Monotonic Theory
744 計 測 と 制 御 シ テ ア Vol.31, No.7 集 ル タ イ ム 分 ス ム 特 リ 散 (1992年7月) ≪展 望 ≫ Architectural Support for Real-Time Computing using Generalized Rate Monotonic Theory Lui SHA* and Shirish S. SATHAYE** Abstract The rate monotonic theory and its generalizations have been adopted by national high tech- nology projects such as the Space Station and has recently been supported by major open stand- ards such as the IEEE Futurebus+ and POSIX. 4. In this paper, we focus on the architectural support necessary for scheduling activities using the generalized rate monotonic theory. We briefly review the theory and provide an application example. Finally we describe the architec- tural requirements for the use of the theory. Key Words: Real-Time Scheduling, Distributed Real-Time System, Rate Monotonic scheduling ● Stability under transient overload. When the 1. Introduction system is overloaded by events and it is im- Real-time computing systems are critical to an possible to meet all the deadlines, we must industrialized nation's technological infrastructure. still guarantee the deadines of selected critical Modern telecommunication systems, factories, de- tasks. fense systems, aircrafts and airports, space stations Generalized rate monotonic scheduling (GRMS) and high energy physics experiments cannot op- theory allows system developers to meet the erate .without them. In real-time applications, above requirements by managing system concur- the correctness of computation depends upon not rency and timing constraints at the level of task- only its results but also the time at which outputs ing and message passing. In essence, this theory are generated. -
Upgrading and Repairing Pcs, 21St Edition Editor-In-Chief Greg Wiegand Copyright © 2013 by Pearson Education, Inc
Contents at a Glance Introduction 1 1 Development of the PC 5 2 PC Components, Features, and System Design 19 3 Processor Types and Specifications 29 4 Motherboards and Buses 155 5 BIOS 263 UPGRADING 6 Memory 325 7 The ATA/IDE Interface 377 AND 8 Magnetic Storage Principles 439 9 Hard Disk Storage 461 REPAIRING PCs 10 Flash and Removable Storage 507 21st Edition 11 Optical Storage 525 12 Video Hardware 609 13 Audio Hardware 679 14 External I/O Interfaces 703 15 Input Devices 739 16 Internet Connectivity 775 17 Local Area Networking 799 18 Power Supplies 845 19 Building or Upgrading Systems 929 20 PC Diagnostics, Testing, and Maintenance 975 Index 1035 Scott Mueller 800 East 96th Street, Indianapolis, Indiana 46240 Upgrading.indb i 2/15/13 10:33 AM Upgrading and Repairing PCs, 21st Edition Editor-in-Chief Greg Wiegand Copyright © 2013 by Pearson Education, Inc. Acquisitions Editor All rights reserved. No part of this book shall be reproduced, stored in a retrieval Rick Kughen system, or transmitted by any means, electronic, mechanical, photocopying, Development Editor recording, or otherwise, without written permission from the publisher. No patent Todd Brakke liability is assumed with respect to the use of the information contained herein. Managing Editor Although every precaution has been taken in the preparation of this book, the Sandra Schroeder publisher and author assume no responsibility for errors or omissions. Nor is any Project Editor liability assumed for damages resulting from the use of the information contained Mandie Frank herein. Copy Editor ISBN-13: 978-0-7897-5000-6 Sheri Cain ISBN-10: 0-7897-5000-7 Indexer Library of Congress Cataloging-in-Publication Data in on file. -
Bi-Directional Optical Backplane Bus for General Purpose Multi-Processor B Oard-To-B Oard Optoelectronic Interconnects
JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 13, NO. 6, JUNE 1995 1031 Bi-Directional Optical Backplane Bus for General Purpose Multi-Processor B oard-to-B oard Optoelectronic Interconnects Srikanth Natarajan, Chunhe Zhao, and Ray. T. Chen Absfract- We report for the first time a bidirectional opti- cal backplane bus for a high performance system containing nine multi-chip module (MCM) boards, operating at 632.8 and 1300 nm. The backplane bus reported here employs arrays of multiplexed polymer-based waveguide holograms in conjunction with a waveguiding plate, within which 16 substrate guided waves for 72 (8 x 9) cascaded fanouts, are generated. Data transfer of 1.2 GbUs at 1.3-pm wavelength is demonstrated for a single bus line with 72 cascaded fanouts. Packaging-related issues such as Waveguiding Plate transceiver size and misalignment are embarked upon to provide n a reliable system with a wide bandwidth coverage. Theoretical U hocessor/Memory Board treatment to minimize intensity fluctuations among the nine modules in both directions is further presented and an optimum I High-speed Optoelectronic Transceiver design rule is provided. The backplane bus demonstrated, is for general-purpose and therefore compatible with such IEEE stan- - Waveguide Hologram For Bi-Directional Coupling dardized buses as VMEbus, Futurebus and FASTBUS, and can Fig. 1. Optical equivalent of a section of a single bidirectional electronic function as a backplane bus in existing computing environments. bus line. I. INTRODUCTION needed to preserve the rising and falling edges of the signals HE LIMITATIONS of current computer backplane buses increases. This makes using bulky, expensive, terminated Tstem from their purely electronic interconnects. -
BUS and CACHE MEMORY ORGANIZATIONS for MULTIPROCESSORS By
BUS AND CACHE MEMORY ORGANIZATIONS FOR MULTIPROCESSORS by Donald Charles Winsor A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy (Electrical Engineering) in The University of Michigan 1989 Doctoral Committee: Associate Professor Trevor N. Mudge, Chairman Professor Daniel E. Atkins Professor John P. Hayes Professor James O. Wilkes ABSTRACT BUS AND CACHE MEMORY ORGANIZATIONS FOR MULTIPROCESSORS by Donald Charles Winsor Chairman: Trevor Mudge The single shared bus multiprocessor has been the most commercially successful multiprocessor system design up to this time, largely because it permits the implementation of efficient hardware mechanisms to enforce cache consistency. Electrical loading problems and restricted bandwidth of the shared bus have been the most limiting factors in these systems. This dissertation presents designs for logical buses constructed from a hierarchy of physical buses that will allow snooping cache protocols to be used without the electrical loading problems that result from attaching all processors to a single bus. A new bus bandwidth model is developed that considers the effects of electrical loading of the bus as a function of the number of processors, allowing optimal bus configurations to be determined. Trace driven simulations show that the performance estimates obtained from this bus model agree closely with the performance that can be expected when running a realistic multiprogramming workload in which each processor runs an independent task. The model is also used with a parallel program workload to investigate its accuracy when the processors do not operate independently. This is found to produce large errors in the mean service time estimate, but still gives reasonably accurate estimates for the bus utilization. -
The System Bus
ELEC 379 : DESIGN OF DIGITAL AND MICROCOMPUTER SYSTEMS 1998/99 WINTER SESSION, TERM 1 The System Bus This lecture describes system buses. These are buses used to interface the CPU with memory and peripherals on separate PC cards. The ISA and PCI buses are used as examples. Introduction characteristics. We will look briefly at two examples of system To increase their flexibility, most general-purpose buses. The ISA (Industrial Standard Architecture) microcomputers include a system bus that allows bus is commonly used in IBM-PC compatibles and printed circuit boards (PCBs) containing memory or is one of the most widely-used system busses. The I/O devices to be connected to the CPU. This allows PCI (Peripheral Component Interconnect) bus is a microcomputer systems to be customized for differ- flexible high-performance peripheral bus that can ef- ent applications. The use of a standard bus also al- ficiently interconnect peripherals and processors of lows manufacturers to produce peripherals that will widely different speeds. work properly with other manufacturers’ computer systems. The system bus consists of a number of parallel Mechanical Characteristics conductors on a backplane or motherboard. There are a number of connectors or “slots” into which Low-cost consumer-grade buses use card-edge con- other PCBs containing memory and I/O devices can nectors to minimize the cost of the peripheral. The be plugged in. plug-in card has contact pads along the edges of the PCB. The motherboard has connectors on the moth- In most cases the system bus is very similar to the erboard that contact these pads.