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3M Interconnect Short Form Catalog 3M Interconnect Products Short Form Catalog Comprehensive Solutions for Reliable Connections Complete Solutions for the Electronics Industry 3M Interconnect Solutions offers a comprehensive range of Interconnect Solutions for the electronics industry, with a product portfolio that includes connectors, cables, cable assemblies and assembly tooling for a wide variety of applications. 3M is dedicated to innovation, continually developing new products that become an important part of everyday life across many diverse markets. A number of 3M solution categories are based on custom-designed products for specialized applications. 3M Interconnect Solutions can help you design, modify and customize your product as well as help you seamlessly integrate our products into your manufacturing process on a global basis. Design, modify and customize your product 2 Contents Backplane Connector Solutions 4 Boardmount Connector Solutions 6 Wiremount Connectors and Assembly Solutions 9 Device-to-Board Connector Solutions 13 Input/Output Connector Solutions 16 Cable Solutions 24 Cable Assembly Solutions — High Speed Assemblies 26 3 3M™ BACKPLANE CONNECTOR SOLUTIONS PRODUCT FEATURES MATERIALS PERFORMANCE • RoHS Compliant Version Available Contact Current Rating: 3.0 A @ 30°C DIN Connectors • DIN 41612 Material: Copper Alloy T-rise Above Ambient • C-Form Plug and Socket Insulation Temperature Rating: -55°C to +125°C • C-Form Wiremount Plugs Material: Engineering Thermoplastic and Sockets Flammability UL 94V-0 • R-Form Plug and Socket Plating • Q-Form Plug and Socket Underplating: 50 µ" [ 1.27 µm ] • B-Form Wiremount Plug Min. Nickel and Socket Interface: 30 µ" [ 0.76 µm ] Gold • Pinless Shrouds or 3 µ" [ 0.08 µm ] Gold over • Solder Tails or Press-Fit 7 µ" [0.18 µm ] PdNi • Inverse Versions • EMLB Contact Loading • PCB Retention Clips • RoHS Compliant Version Available Contact Current Rating: Signal: 1.5 A ® MetPak™ 2-FB Connectors • Futurebus+ Material: Copper Alloy All Contacts Simultaneously • Inverse Version Available Insulation Temperature Rating: -55°C to +125°C • Vertical and Right Angle Material: High Temp LCP • Stacking Versions Flammability UL 94V-0 • Elevated Versions Plating • Guiding Features Underplating: 50 µ" (1.27 µm) Nickel • Pinless Shroud Interface: 10 µ" [ 0.25 µm ] or 30 µ" • Power Header and Socket [ 0.76 µm ] Gold or 3 to 5 µ" [ 0.07 to 0.12 µm ] Gold over 7, 27 or 40 µ" [ 0.18, 0.69, 1.01 µm ] PdNi • RoHS Compliant Version Available Contact Current Rating: 1 A at +70°C ® MetPak™ CP2 Connectors • Compact PCI Material: Copper Alloy­­ Temperature Rating: -55°C to +125°C • Types A, B, AB and C Insulation • Header and Socket Material: Glass Filled Polyester • Grounding Options Flammability UL 94V-0 • EMLB Contact Loading Plating • Coding Keys Underplating: Nickel • Pinless Shroud Wiping Area: 30 µ" [ 0.76 µm ] Gold 4 3M.com/interconnects 3M™ BACKPLANE CONNECTOR SOLUTIONS PRODUCT FEATURES MATERIALS PERFORMANCE • RoHS Compliant Version Available Contact Current Rating: (Fully Loaded): MetPak™ HM Connectors • Hard Metric (HM) Material: Copper Alloy 1 A at 70°C Signal, 8.25 A @ 70°C Power • 5- and 8-Row Versions Insulation Temperature Rating: -55°C to +125°C • Optional Four Integrated 8.25 A Material: High Temperature Power Blades for a Total of 33 A Thermoplastic Power; Saves Space and Press-Fit Flammability UL 94V-0 Operations Plating • Socket and Header Underplating: 50 µ" [ 1.27 µm ] Nickel • Power Options Interface: 30 µ" [ 0.76 µm ] Gold or • Protective Caps 5 µ" [ 0.13 µm ] Gold over 40 µ" • Coding Keys [ 1.01 µm ] PdNi • Shielding Options • RoHS Compliant Version Available Contact Current Rating: (Fully Loaded): ™ MetPak HSHM • Low Crosstalk at High Frequencies Material: Copper Alloy 1 A at 70°C Signal, 8.25 A @ Sockets and Headers • Optional Four Integrated 8.25 A Insulation 70°C Power Power Blades for a Total of 33 A Material: High Temperature Temperature Rating: -55°C to +125°C Power; Saves Space and Press-Fit Thermoplastic Operations Flammability UL 94V-0 • 50/100 (Single-Ended/Differential) Plating Impedance Underplating: 50 µ" [ 1.27 µm ] Nickel • Modular/Scalable Format IEC Interface: 30 µ" [ 0.76 µm ] Gold or 61076-4-101 5 µ" [ 0.13 µm ] Gold over 40 µ" • 63 Mated Lines Per Linear Inch [ 1.01 µm ] PdNi • Press-Fit Headers and Receptacles • End-To-End Stackable with 5 Row 3M™ Metpak™ CP2, HM, and HSHM Headers • High Speed Hard Metric (HSHM) • 8 Gbps Per Second • Orthogonal Design Capable • Differential Pairs in Rows or Columns • Virtual Coax Capable • 5- and 8-Row Versions • Socket and Header • Power Options • Protective Caps for Headers • Coding Keys • Shielding Options • Guide Pin Options • RoHS Compliant Contact Current Rating: 1 A at 70°C Signal ™ MetPak Ultra Hard Metric • Up To 5 Gbps Data Rates When Material: Copper Alloy Temperature Rating: -55°C to +125°C (UHM) Connectors Mated to Standard IEC 61076-4-101 Insulation 2 mm Hard Metric Headers Material: High Temperature • Low Crosstalk at High Frequencies Thermoplastic (LCP) • 50/100 Ω (Single-Ended/Differential) Flammability UL 94V-0 Impedance Plating • Press-Fit Receptacles Fully Underplating: 50 µ" [ 1.27 µm ] Nickel Compatible With IEC 61076-4-101 Interface: 30 µ" [ 0.76 µm ] Gold • Dual Beam Contact Construction for High Reliability • End-To-End Stackable with 5 Row 3M Metpak CP2, HM, UHM and HSHM Sockets • Mates With 3M Metpak CP2, HM, UHM, HSHM Headers and Any Other cPCI® Type Headers 3M.com/interconnects 5 3M™ BOARDMOUNT CONNECTOR SOLUTIONS PRODUCT FEATURES MATERIALS PERFORMANCE Pin Strip Headers • RoHS Compliant Contact Current Rating: 1 A Series 95X • Single and Dual Row Material: Copper Alloy Temperature Rating: -40°C to +105°C • 3 - 80 Positions Insulation • High Temperature Dielectric Material: High Temperature • “ No Lead” Wave and Reflow Solder Thermoplastic Compatible Color: Black • Maximizes Use of PC Board Space Flammability UL 94V-0 • End Stackable Feature Plating • Mates with Boardmount and Underplating: 1.25–2.5 µm Wiremount Products [ 100 µ" ] Nickel • Available in Straight, Right Angle Wiping Area: 0.25 µm [ 10 µ" ] Gold Through-Hole and Surfacemount Solder Tail Area: 1–3 µm Versions [ 40–118 µ’" ] Matte Tin Boardmount Pin Strips • RoHS Compliant Contact Current Rating: 1 A and Sockets • Maximizes Use of PC Board Space Material: Copper Alloy Temperature Rating: -40°C to +105°C • High Temperature Dielectric Insulation 2 mm, Series 95X • “No Lead” Wave and Reflow Solder Material: High Temperature Compatible Thermoplastic • Dual Row Design, 4–80 Pins Color: Black • Minimized PC Board Flammability UL 94V-0 Stacking Heights Plating • Mates With Pin Strip Header Underplating: 1.25–2.5 µm Products [100 µ" ] Nickel • Available in Straight, Right Angle Wiping Area: 0.25 µm [ 10 µ" ] Gold Through-Hole, Through-Board and Solder Tail Area: 1–3 µm Surfacemount Versions [ 40–118 µ" ] Matte Tin Box Headers • RoHS Compliant Contact Current Rating: 1 A • High Temperature Dielectric Material: Square Pin 0.5 mm, Temperature Rating: -40°C to +105°C 2 mm x 2 mm, Solder Tail • “No Lead” Wave and Reflow Solder Copper Alloy Series 957 Compatible Insulation • Maximizes Use of PC Board Space Material: High Temperature • Center Slot Polarization Thermoplastic Prevents Mis-Insertions and Color: Black Reduces Insertion Time Flammability UL 94V-0 • 10 - 68 Positions Plating Underplating: 1.25–2.5 µm [ 100 µ" ] Nickel Wiping Area: 0.25 µm [ 10 µ" ] Gold Solder Tail Area: 1–3 µm [ 40–118 µ" ] Matte Tin Sockets and Pin Strip • RoHS Compliant Version Available Contact Current Rating: 1 A, 2 A or 2.5 A Headers, .100" x .100" • 2-72 Positions Material: Copper Alloy Temperature Rating: -40°C to +105°C • Single- and Dual-Row Options Insulation Series 929 • Through-Hole and Through-Board Material: Glass Filled Polyester Options (PBT) or PCT (RoHS Compliant) • Customizable Stack Heights Flammability UL 94V-0 from .150" to 1.325" Plating • High Temperature Insulator Option Pin Strip Underplating: 50 µ" [ 1.27 µm ] Nickel, Interface: 10 µ" [ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold Socket Underplating: 100 µ" [ 2.54 mm ] Nickel, Interface: 10 µ" [ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold Tin Plated Versions Available Polarized Boardmount • RoHS Compliant Contact Current Rating: 1 A Sockets, .100" x .100" • 10-64 Positions Material: Copper Alloy Temperature Rating: -55°C to +105°C • Vertical and Right Angle Options Insulation Series 5100, 6800, 8500, 9100 • Center Bump Polarization Material: Glass Filled Polyester Flammability UL 94V-0 Plating Underplating: 2 µm [ 79 µ" ] Nickel Wiping Area: 0.3 µm [ 12 µ" ] Gold Sockets and Pin Strip • RoHS Compliant Version Available Contact Current Rating: 1 A Headers, 2 mm x 2 mm • 4-60 Positions Material: Copper Alloy Temperature Rating: -55°C to +105°C • Single and Dual-Row Options Insulation Series 15 • Surfacemount, Through-Hole Material: Glass Filled PCT and Through-Board Options Flammability UL 94V-0 • Customizable Stack Heights Plating from .101" to 1.418" Underplating: 50-150 µ" • High Temperature Insulator [ 1.27-3.81 µm ] Nickel Wiping Area: 30 µ" [ 0.76 µm ] Gold 6 3M.com/interconnects 3M™ BOARDMOUNT CONNECTOR SOLUTIONS PRODUCT FEATURES MATERIALS PERFORMANCE Pak 50 Sockets and Headers • RoHS Compliant Contact Current Rating: 0.5 A • 20-200 Positions Material: Phosphor Bronze Temperature Rating: -55°C to +85°C Series P50 • .050" Pitch Insulation • Reliable Ribbon Contacts Material: Glass Filled Nylon • 7.0 - 30.0 mm Stack Heights Flammability UL 94V-0 • Parallel, Perpendicular and Plating End-to-End Mating Underplating: Nickel • Audible
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