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EEMBC and the Purposes of Embedded Processor Benchmarking Markus Levy, President
EEMBC and the Purposes of Embedded Processor Benchmarking Markus Levy, President ISPASS 2005 Certified Performance Analysis for Embedded Systems Designers EEMBC: A Historical Perspective • Began as an EDN Magazine project in April 1997 • Replace Dhrystone • Have meaningful measure for explaining processor behavior • Developed business model • Invited worldwide processor vendors • A consortium was born 1 EEMBC Membership • Board Member • Membership Dues: $30,000 (1st year); $16,000 (subsequent years) • Access and Participation on ALL Subcommittees • Full Voting Rights • Subcommittee Member • Membership Dues Are Subcommittee Specific • Access to Specific Benchmarks • Technical Involvement Within Subcommittee • Help Determine Next Generation Benchmarks • Special Academic Membership EEMBC Philosophy: Standardized Benchmarks and Certified Scores • Member derived benchmarks • Determine the standard, the process, and the benchmarks • Open to industry feedback • Ensures all processor/compiler vendors are running the same tests • Certification process ensures credibility • All benchmark scores officially validated before publication • The entire benchmark environment must be disclosed 2 Embedded Industry: Represented by Very Diverse Applications • Networking • Storage, low- and high-end routers, switches • Consumer • Games, set top boxes, car navigation, smartcards • Wireless • Cellular, routers • Office Automation • Printers, copiers, imaging • Automotive • Engine control, Telematics Traditional Division of Embedded Applications Low High Power -
1 Intel CEO Remarks Pat Gelsinger Q2'21 Earnings Webcast July 22
Intel CEO Remarks Pat Gelsinger Q2’21 Earnings Webcast July 22, 2021 Good afternoon, everyone. Thanks for joining our second-quarter earnings call. It’s a thrilling time for both the semiconductor industry and for Intel. We're seeing unprecedented demand as the digitization of everything is accelerated by the superpowers of AI, pervasive connectivity, cloud-to-edge infrastructure and increasingly ubiquitous compute. Our depth and breadth of software, silicon and platforms, and packaging and process, combined with our at-scale manufacturing, uniquely positions Intel to capitalize on this vast growth opportunity. Our Q2 results, which exceeded our top and bottom line expectations, reflect the strength of the industry, the demand for our products, as well as the superb execution of our factory network. As I’ve said before, we are only in the early innings of what is likely to be a decade of sustained growth across the industry. Our momentum is building as once again we beat expectations and raise our full-year revenue and EPS guidance. Since laying out our IDM 2.0 strategy in March, we feel increasingly confident that we're moving the company forward toward our goal of delivering leadership products in every category in which we compete. While we have work to do, we are making strides to renew our execution machine: 7nm is progressing very well. We’ve launched new innovative products, established Intel Foundry Services, and made operational and organizational changes to lay the foundation needed to win in the next phase of our company’s great history. Here at Intel, we’re proud of our past, pragmatic about the work ahead, but, most importantly, confident in our future. -
SIMD Extensions
SIMD Extensions PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 12 May 2012 17:14:46 UTC Contents Articles SIMD 1 MMX (instruction set) 6 3DNow! 8 Streaming SIMD Extensions 12 SSE2 16 SSE3 18 SSSE3 20 SSE4 22 SSE5 26 Advanced Vector Extensions 28 CVT16 instruction set 31 XOP instruction set 31 References Article Sources and Contributors 33 Image Sources, Licenses and Contributors 34 Article Licenses License 35 SIMD 1 SIMD Single instruction Multiple instruction Single data SISD MISD Multiple data SIMD MIMD Single instruction, multiple data (SIMD), is a class of parallel computers in Flynn's taxonomy. It describes computers with multiple processing elements that perform the same operation on multiple data simultaneously. Thus, such machines exploit data level parallelism. History The first use of SIMD instructions was in vector supercomputers of the early 1970s such as the CDC Star-100 and the Texas Instruments ASC, which could operate on a vector of data with a single instruction. Vector processing was especially popularized by Cray in the 1970s and 1980s. Vector-processing architectures are now considered separate from SIMD machines, based on the fact that vector machines processed the vectors one word at a time through pipelined processors (though still based on a single instruction), whereas modern SIMD machines process all elements of the vector simultaneously.[1] The first era of modern SIMD machines was characterized by massively parallel processing-style supercomputers such as the Thinking Machines CM-1 and CM-2. These machines had many limited-functionality processors that would work in parallel. -
Recent International Trade Commission Representations
Recent International Trade Commission Representations Certain Mobile Electronic Devices and Radio Frequency and Processing Components Thereof (II), Inv. No. 337-TA-1093 (ITC 2019). Quinn Emanuel was lead counsel for Qualcomm in a patent infringement action against Apple in the International Trade Commission. Qualcomm alleged that Apple engaged in the unlawful importation and sale of iPhones that infringe one or more claims of five Qualcomm patents covering key technologies that enable important features and function in the iPhones. After a seven day hearing, Administrative Law Judge McNamara issued an Initial Determination finding for Qualcomm on all issues related to claim 1 of U.S. Patent 8,063,674 related to an improved “Power on Control” circuit. ALJ McNamara recommended that the Commission issue a limited exclusion order with respect to the accused iPhone devices. Although the case settled shortly after AJ McNamara recommended the exclusion order, the order would have resulted in the exclusion of all iPhones and iPads without Qualcomm baseband processors from being imported into the United States. Certain Magnetic Tape Cartridges and Components Thereof Inv. No. 337-TA-1058 (ITC 2019): We represented Sony in a multifront battle against Fujifilm arising from Fujifilm’s anticompetitive conduct seeking to exclude Sony from the Linear Tape-Open magnetic tape market. LTO tape products are used to store large quantities of data by companies in a wide range of industries, including health care, education, finance and banking. Sony filed a complaint in the ITC seeking an exclusion order of Fujifilm’s products based on its infringement of three Sony patents covering various aspects of magnetic data storage technology. -
Imagination Technologies Group Plc Annual Report 2006
Imagination Technologies Group plc Annual Report 2006 The data and projections shown on pages 1-24 are the product of consolidated partner data, analyst information and Imagination Technologies research. Imagination Technologies, the Imagination Technologies logo, PowerVR, the PowerVR logo, Metagence, the Metagence logo, Ensigma, the Ensigma logo, PURE Digital, IMGworks, CodeScape, META, MTX, MBX, MBX Lite, SGX, UCC, MiniEngine, PocketDAB, ReVu, the Bug, the Bug logo, Legato, EVOKE-1, TEMPUS, CHRONOS, OASIS, PURE ONE, SONUS-1XT and Élan are trademarks or registered trademarks of Imagination Technologies Limited. All other logos, products, trademarks and registered trademarks are the property of their respective owners. Copyright © 2006 Imagination Technologies Limited, an Imagination Technologies Group plc company. 4 colour print + matt lamination on 1 side, 215x280mm (h) trim size with 4mm spin, 300gsm board fold, gather and perfect bind 19/06/2006 Contact Oscar Tse / IMG Publications / 01923 260511 / [email protected] Introduction Improvements in technology mean that more and more functions can be integrated onto just one silicon chip. Whilst in the past, half a dozen companies might each have made a specialised chip to go into an advanced product like a TV or mobile phone, now it is more likely that one large semiconductor company will make a single chip that contains most, if not all, of that specialised knowledge. That’s where silicon IP, or ‘intellectual property’ comes in. Semiconductor companies can licence parts of a chip design from companies that specialise in those advanced technologies, instead of developing the technology themselves. They are especially likely to do this in new market areas. -
Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
The Opengl ES Shading Language
The OpenGL ES® Shading Language Language Version: 3.20 Document Revision: 12 246 JuneAugust 2015 Editor: Robert J. Simpson, Qualcomm OpenGL GLSL editor: John Kessenich, LunarG GLSL version 1.1 Authors: John Kessenich, Dave Baldwin, Randi Rost 1 Copyright (c) 2013-2015 The Khronos Group Inc. All Rights Reserved. This specification is protected by copyright laws and contains material proprietary to the Khronos Group, Inc. It or any components may not be reproduced, republished, distributed, transmitted, displayed, broadcast, or otherwise exploited in any manner without the express prior written permission of Khronos Group. You may use this specification for implementing the functionality therein, without altering or removing any trademark, copyright or other notice from the specification, but the receipt or possession of this specification does not convey any rights to reproduce, disclose, or distribute its contents, or to manufacture, use, or sell anything that it may describe, in whole or in part. Khronos Group grants express permission to any current Promoter, Contributor or Adopter member of Khronos to copy and redistribute UNMODIFIED versions of this specification in any fashion, provided that NO CHARGE is made for the specification and the latest available update of the specification for any version of the API is used whenever possible. Such distributed specification may be reformatted AS LONG AS the contents of the specification are not changed in any way. The specification may be incorporated into a product that is sold as long as such product includes significant independent work developed by the seller. A link to the current version of this specification on the Khronos Group website should be included whenever possible with specification distributions. -
The Opengl ES Shading Language
The OpenGL ES® Shading Language Language Version: 3.00 Document Revision: 6 29 January 2016 Editor: Robert J. Simpson, Qualcomm OpenGL GLSL editor: John Kessenich, LunarG GLSL version 1.1 Authors: John Kessenich, Dave Baldwin, Randi Rost Copyright © 2008-2016 The Khronos Group Inc. All Rights Reserved. This specification is protected by copyright laws and contains material proprietary to the Khronos Group, Inc. It or any components may not be reproduced, republished, distributed, transmitted, displayed, broadcast, or otherwise exploited in any manner without the express prior written permission of Khronos Group. You may use this specification for implementing the functionality therein, without altering or removing any trademark, copyright or other notice from the specification, but the receipt or possession of this specification does not convey any rights to reproduce, disclose, or distribute its contents, or to manufacture, use, or sell anything that it may describe, in whole or in part. Khronos Group grants express permission to any current Promoter, Contributor or Adopter member of Khronos to copy and redistribute UNMODIFIED versions of this specification in any fashion, provided that NO CHARGE is made for the specification and the latest available update of the specification for any version of the API is used whenever possible. Such distributed specification may be reformatted AS LONG AS the contents of the specification are not changed in any way. The specification may be incorporated into a product that is sold as long as such product includes significant independent work developed by the seller. A link to the current version of this specification on the Khronos Group website should be included whenever possible with specification distributions. -
Semiconductor Industry Merger and Acquisition Activity from an Intellectual Property and Technology Maturity Perspective
Semiconductor Industry Merger and Acquisition Activity from an Intellectual Property and Technology Maturity Perspective by James T. Pennington B.S. Mechanical Engineering (2011) University of Pittsburgh Submitted to the System Design and Management Program in Partial Fulfillment of the Requirements for the Degree of Master of Science in Engineering and Management at the Massachusetts Institute of Technology September 2020 © 2020 James T. Pennington All rights reserved The author hereby grants to MIT permission to reproduce and to distribute publicly paper and electronic copies of this thesis document in whole or in part in any medium now known or hereafter created. Signature of Author ____________________________________________________________________ System Design and Management Program August 7, 2020 Certified by __________________________________________________________________________ Bruce G. Cameron Thesis Supervisor System Architecture Group Director in System Design and Management Accepted by __________________________________________________________________________ Joan Rubin Executive Director, System Design & Management Program THIS PAGE INTENTIALLY LEFT BLANK 2 Semiconductor Industry Merger and Acquisition Activity from an Intellectual Property and Technology Maturity Perspective by James T. Pennington Submitted to the System Design and Management Program on August 7, 2020 in Partial Fulfillment of the Requirements for the Degree of Master of Science in System Design and Management ABSTRACT A major method of acquiring the rights to technology is through the procurement of intellectual property (IP), which allow companies to both extend their technological advantage while denying it to others. Public databases such as the United States Patent and Trademark Office (USPTO) track this exchange of technology rights. Thus, IP can be used as a public measure of value accumulation in the form of technology rights. -
PC Technician Essentials PC Anatomy
Motherboards Prepared & Presented by Professor Gupta Motherboard The primary component of a computer is the motherboard (sometimes called the "mainboard"). The motherboard is the hub which is used to connect all of the computer's essential components. Motherboards ■ Everything that makes a computer a computer must be attached to the motherboard. From the CPU to storage devices, from RAM to printer ports, the motherboard provides the connections that help them work together. ■ The motherboard is essential to computer operation in large part because of the two major buses it contains: the system bus and the I/O bus. Together, these buses carry all the information between the different parts of the computer. ■ Components: Socket 775 processor; Dual-channel DDR2 memory slots; Heat sink over North Bridge; 24-pin ATX v2.0 power connector; South Bridge chip; PCI slots; PCI Express x16 slot; PCI Express x1 slot; CMOS battery; Port cluster; SATA host adapter; Floppy drive controller; PATA host adapter; 4-pix ATX12 power connector; Mounting holes. Prepared & Presented by Professor Gupta 301-802- 9066 AT & ATX Motherboard form factor The term "form factor" is normally used to refer to the motherboard's geometry, dimensions, arrangement, and electrical requirements. In order to build motherboards which can be used in different brands of cases, a few standards have been developed: • AT baby/AT full format is a format used in the earliest 386 and 486 PCs. This format was replaced by the ATX format, which shape allowed for better air circulation and made it easier to access the components; • ATX: The ATX format is an upgrade to Baby-AT. -
Power Aware Tactical Computing
Power Aware Tactical Computing Song J Park1, Dale R Shires1, Brian J Henz1, James A Ross2, David A Richie3, and Jordan J Ruloff2 1U.S. Army Research Laboratory, APG, MD 2Dynamic Research Corp., Andover, MA 3Brown Deer Technology, Forest Hill, MD Abstract - Power consumption has become a chief supports and maintains high performance computing (HPC) impediment in the advancement of digital computing. To resources. The ARL DSRC provides state-of-the-art improve performance amid power limitations, accelerators computational solutions for the DoD research and are being applied to everyday systems. In particular, due to development community. Among the systems available at the mix of popularity and raw computational power, ARL is Harold system, which consists of 10,752 cores with graphics processing units (GPUs) have extended the the processing capability of 120 trillion floating-point applicability of digital computing in a multitude of sectors operations per second (TFLOPS). A predecessor, JVN from ubiquitous smartphones to environmentally responsible system, decommissioned in 2009, had 2048 cores with the supercomputing. Operating within the mobile power theoretical peak of 14.7 TFLOPS. Shifting the focus to constraint, the usefulness of a high performance graphics single-precision, the peak processing power for the Harold processor system in a tactical environment is explored in this system is 240 TFLOPS and 29.5 TFLOPS for the JVN study. A line-of-sight optimization algorithm serves as a system. Given that a single graphics card, Radeon HD 6990, compute-intensive application with characteristics relating is rated at 5.1 TFLOPS for peak single-precision arithmetic, to a tactical scenario. -
IMG PPT Template
Imagination Technologies Group Overview May 2010 Company Overview . Leading Semiconductor IP Supplier . POWERVR™ graphics, video, display processing . ENSIGMA™ receivers and communications processors . META™ processors – SoC centric real-time, DSP, Linux . Licensees: Leading Semis and OEMs . #3 Silicon Design IP provider * . Innovative Consumer Product Manufacturer . PURE digital radio, internet connected audio . Established technology powerhouse . Founded:1985 . Listed:1994-London Stock Exchange:IMG . Employees: more than 650 worldwide * Source: Gartner IP Suppliers Report, March 2010 UK Headquarters R&D Sales 2.2 © Imagination Technologies Ltd. Group Revenues £m 65 60 PURE 55 Technology 50 45 40 35 30 25 20 15 10 5 0 04/05 05/06 06/07 07/08** 08/09 * 13 months to April ‘08 3 © Imagination Technologies Ltd. Everything, Everywhere The connected “four screens”: TV, PC, Mobile & In-Car The Cloud Mobile devices have to deliver the internet, PC capabilities, TV, music, navigation and more… 4 © Imagination Technologies Ltd. Our Technology Business SoC Technologies & Solutions Markets Mobile IMGworks Phone Customer’s 3rd Party IP Internal IP Customised IP Multimedia ENSIGMA META POWERVR Communications Hand-held Processor/DSP Graphics Multimedia POWERVR Display META POWERVR Audio Video SoC Home Consumer & Entertainment Display Audio Mobile Computing OpenGL MeOS Radio OpenGL-ES De-interlace Nucleus TV OpenVG Linux Frame rate In-Car Mobile TV DirectX conversion Android Electronics WiFi etc Audio Bluetooth Noise SW Stacks reduction etc MPEG1/2/4 etc H264 etc Emerging VC1 Markets etc 5 © Imagination Technologies Ltd. The Virtuous Technology Cycle… Semiconductor Partners Creates SoCs & Sells Chips SUNPLUS Makes products Creates & & sells them to Licenses IP consumers… OEMs Emerging trend with OEM partners Consumers demand more, better, cheaper…everywhere Consumers …which drives demand for more advanced & efficient IP … 6 © Imagination Technologies Ltd.