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Pentium® Ii Xeon™ Processor at 400 and 450 Mhz E PENTIUM® II XEON™ PROCESSOR AT 400 AND 450 MHZ Binary compatible with applications Single Edge Contact (S.E.C.) cartridge running on previous members of the packaging technology; the S.E.C. Intel microprocessor family cartridge delivers high performance Optimized for 32-bit applications processing and bus technology in mid running on advanced 32-bit operating range to high end servers and systems workstations Dynamic Execution micro architecture 100 MHz system bus speeds data transfer between the processor and Dual Independent Bus architecture: the system Separate dedicated external 100 MHz System Bus and dedicated internal Integrated high performance 16K cache bus operating at full processor instruction and 16K data, nonblocking, core speed level-one cache Power Management capabilities Available in 512K, 1 M, 2M unified, — System Management mode nonblocking level-two cache — Multiple low-power states Enables systems which are scaleable SMBus interface to advanced up to four processors and 64 GB of manageability features physical memory The Intel® Pentium® II Xeon™ processor is designed for mid-range to high-end servers and workstations, and is binary compatible with previous Intel Architecture processors. The Pentium II Xeon processor provides the best performance available for applications running on advanced operating systems such as Windows* 95, Windows NT, and UNIX*. The Pentium II Xeon processor is scalable to four processors in a multiprocessor system and extends the power of the Pentium Pro processor with new features designed to make this processor the right choice for powerful workstation, advanced server management, and mission-critical applications. Pentium II Xeon processor-based workstations offer the memory architecture required by the most demanding workstation applications and workloads. Specific features of the Pentium II Xeon processor address platform manageability to meet the needs of a robust IT environment, maximize system up time and ensure optimal configuration and operation of servers. The Pentium II Xeon processor enhances the ability of server platforms to monitor, protect, and service the processor and its environment. Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products. Information contained herein supersedes previously published specifications on these devices from Intel. © INTEL CORPORATION 1995 June 1998 Order Number: 243770-003 12/16/98 1:22 PM 24377003.doc PENTIUM® II XEON™ PROCESSOR AT 400 AND 450 MHZ E Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® II Xeon™ processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com Copyright © Intel Corporation 1998. * Third-party brands and names are the property of their respective owners. 2 12/15/98 5:14 PM 24377002.doc E PENTIUM® II XEON™ PROCESSOR AT 400 AND 450 MHZ CONTENTS PAGE PAGE 3.3.1. 2.5 V TOLERANT BUFFER 1.0. INTRODUCTION............................................... 8 OVERSHOOT/UNDERSHOOT 1.1. Terminology.................................................... 8 GUIDELINES........................................37 1.1.1. S.E.C. Cartridge Terminology................. 8 3.3.2. 2.5 V TOLERANT BUFFER RINGBACK 1.2. References..................................................... 9 SPECIFICATION ..................................38 3.3.3. 2.5 V TOLERANT BUFFER SETTLING 2.0. ELECTRICAL SPECIFICATIONS .................... 9 LIMIT GUIDELINE ................................38 2.1. The Pentium® II Xeon™ Processor System 4.0. PROCESSOR FEATURES.............................38 Bus and VREF ............................................... 9 2.2. Power and Ground Pins............................... 10 4.1. Functional Redundancy Checking Mode.....38 2.3. Decoupling Guidelines ................................. 10 4.2. Low Power States and Clock Control ..........39 2.3.1. PENTIUM® II XEON™ PROCESSOR 4.2.1. NORMAL STATE—STATE 1 ...............39 VCCCORE............................................ 11 4.2.2. AUTO HALT POWER DOWN 2.3.2. LEVEL 2 CACHE DECOUPLING ........ 11 STATE—STATE 2................................39 2.3.3. SYSTEM BUS AGTL+ 4.2.3. STOP-GRANT STATE—STATE 3.......40 DECOUPLING...................................... 11 4.2.4. HALT/GRANT SNOOP STATE— 2.4. System Bus Clock and Processor STATE 4 ...............................................40 Clocking ....................................................... 11 4.2.5. SLEEP STATE—STATE 5 ...................41 2.4.1. MIXING PROCESSORS OF 4.2.6. CLOCK CONTROL ..............................41 DIFFERENT FREQUENCIES AND 4.3. System Management Bus (SMBus) CACHE SIZES...................................... 14 Interface .......................................................41 2.5. Voltage Identification .................................... 14 4.3.1. PROCESSOR INFORMATION ROM ..42 2.6. System Bus Unused Pins and Test Pins ..... 16 4.3.2. SCRATCH EEPROM ...........................45 2.7. System Bus Signal Groups.......................... 16 4.3.3. PROCESSOR INFORMATION ROM 2.7.1. ASYNCHRONOUS VS. AND SCRATCH EEPROM SYNCHRONOUS FOR SYSTEM BUS SUPPORTED SMBUS SIGNALS .............................................. 18 TRANSACTIONS .................................45 2.8. Test Access Port (TAP) Connection............ 18 4.3.4. THERMAL SENSOR ............................46 2.9. Maximum Ratings ........................................ 18 4.3.5. THERMAL SENSOR SUPPORTED 2.10. Processor DC Specifications .................. 19 SMBUS TRANSACTIONS ...................47 2.11. AGTL+ System Bus Specifications......... 23 4.3.6. THERMAL SENSORS REGISTERS ...49 2.12. System Bus AC Specifications ............... 24 4.3.6.1. Thermal Reference Registers........49 4.3.6.2. Thermal Limit Registers .................49 3.0. SIGNAL QUALITY .......................................... 33 4.3.6.3. Status Register ..............................49 3.1. System Bus Clock Signal Quality 4.3.6.4. Configuration Register ...................49 Specifications............................................... 34 4.3.6.5. Conversion Rate Register..............50 3.2. AGTL+ Signal Quality Specifications........... 35 4.3.7. SMBUS DEVICE ADDRESSING .........50 3.2.1. AGTL+ RINGBACK TOLERANCE SPECIFICATIONS ............................... 35 5.0. THERMAL SPECIFICATIONS AND DESIGN 3.2.2. AGTL+ OVERSHOOT/UNDERSHOOT CONSIDERATIONS........................................52 GUIDELINES........................................ 36 5.1. Thermal Specifications.................................52 3.3. Non-AGTL+ Signal Quality Specifications... 37 5.1.1. POWER DISSIPATION ........................53 3 12/16/98 1:23 PM 24377003.doc PENTIUM® II XEON™ PROCESSOR AT 400 AND 450 MHZ E 5.1.2. PLATE FLATNESS 8.1.4.4. Signal Note: TCK ...........................83 SPECIFICATION.................................. 54 8.1.5. USING BOUNDARY SCAN TO 5.2. Processor Thermal Analysis........................ 54 COMMUNICATE TO THE 5.2.1. THERMAL SOLUTION PROCESSOR.......................................85 PERFORMANCE ................................. 54 8.2. Integration Tool (Logic Analyzer) 5.2.2. THERMAL PLATE TO COOLING Considerations .............................................85 SOLUTION INTERFACE 8.2.1. INTEGRATION TOOL MECHANICAL MANAGEMENT GUIDE ....................... 55 KEEPOUTS ..........................................85 5.2.3. MEASUREMENTS FOR THERMAL SPECIFICATIONS ............................... 57 9.0. APPENDIX ......................................................86 5.2.3.1. Thermal Plate Temperature 9.1. Alphabetical Signals Reference....................86 Measurement................................. 57 9.1.1. A[35:03]# (I/O) ......................................86 5.2.3.2. Cover Temperature Measurement 9.1.2. A20M# (I) ..............................................86 Guideline........................................ 58 9.1.3. ADS# (I/O) ............................................86
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