Xeon Replaces Pentium Pro: 7/13/98
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Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Pentium II Processor Performance Brief
PentiumÒ II Processor Performance Brief January 1998 Order Number: 243336-004 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium® II processor may contain design defects or errors known as errata. Current characterized errata are available on request. MPEG is an international standard for video compression/decompression promoted by ISO. Implementations of MPEG CODECs, or MPEG enabled platforms may require licenses from various entities, including Intel Corporation. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from by calling 1-800-548-4725 or by visiting Intel’s website at http://www.intel.com. -
Super 7™ Motherboard
SY-5EH5/5EHM V1.0 Super 7Ô Motherboard ************************************************ Pentium® Class CPU supported ETEQ82C663 PCI/AGP Motherboard AT Form Factor ************************************************ User's Guide & Technical Reference NSTL “Year 2000 Test” Certification Letter September 23, 1998 Testing Date: September 23, 1998 Certification Date: September 23, 1998 Certification Number: NCY2000-980923-004 To Whom It May Concern: We are please to inform you that the “SY-5EHM/5EH5” system has passed NSTL Year 2000 certification test program. The Year 2000 test program tests a personal computer for its ability to support the year 2000. The “SY-5EHM/5EH5: system is eligible to carry the NSTL :Year 2000 Certification” seal. The Year 2000 certification test has been done under the following system configuration: Company Name : SOYO COMPUTER INC. System Model Name : SY-5EHM/5EH5 Hardware Revision : N/A CPU Model : Intel Pentium 200/66Mhz On Board Memory/L2 Cache : PC100 SDRAM DIMM 32MBx1 /1MB System BIOS : Award Modular BIOS V4.51PG, An Energy Star Ally Copyright © 1984—98, EH-1A6,07/15/1998-VP3-586B- 8669-2A5LES2AC-00 Best regards, SPORTON INTERNATIONAL INC. Declaration of Conformity According to 47 CFR, Part 2 and 15 of the FCC Rules Declaration No.: D872907 July.10 1998 The following designated product EQUIPMENT: Main Board MODEL NO.: SY-5EH Which is the Class B digital device complies with 47 CFR Parts 2 and 15 of the FCC rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
Dual-Core Intel® Xeon® Processor 3100 Series Specification Update
Dual-Core Intel® Xeon® Processor 3100 Series Specification Update — on 45 nm Process in the 775-land LGA Package December 2010 Notice: Dual-Core Intel® Xeon® Processor 3100 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update. Document Number: 319006-009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. -
50X50x41mm Socket 7/370 CPU Cooler Fan W/ Heatsink and TX3 and LP4 Startech ID: FANP1003LD
50x50x41mm Socket 7/370 CPU Cooler Fan w/ Heatsink and TX3 and LP4 StarTech ID: FANP1003LD StarTech.com's Socket 7/Socket 730 CPU cooler fan optimizes heat dissipation and removal by combining a large aluminum heatsink and 5cm brushless ball-bearing fan, helping to ensure ideal operating conditions for your hard working CPU. A broadly compatible CPU cooling solution, the Socket 7/Socket 730 CPU cooler fan provides quiet cooling for Socket 370(PPGA) Celerons, Socket 7 Pentiums, AMD K6, K6-2 and Cyrix chips and is powered using a TX3 (3-lead) connection to either the computer power supply or the motherboard (direct). When powered directly from the motherboard, the fan speed and operating status can be monitored for ideal performance. Capable of moving up to 8.84 CFM of air away from the CPU, the Socket 7/Socket 730 CPU cooler fan features a high-efficiency fan blade design and is backed by StarTech.com's 2-year warranty and free lifetime technical support. Applications Socket Type: Socket 7 & Socket 370 VIA : C3, Cyrix III & Cyrix MII up to 500 MHz Intel : Celeron up to 500 MHz AMD : K-6 series up to 500 MHz Replace the stock OEM cooler or a failed Socket 7/370 heatsink fan assembly www.startech.com 1 800 265 1844 Features Aluminum heatsink 50mm ball bearing fan Solid metal retention clip Technical Specifications Warranty 2 Years Fan Bearing Type Ball Bearing Fan Dimensions 50 x 50 x 12.7mm 2 x 2 x 0.5in Heatsink Dimensions 50 x 50 x 22mm 2 x 2 x 0.85in Heatsink Type Aluminum Air Flow Rate 8.84 CFM Fan RPM 4500 Noise Level 28 dBA Connector Type(s) 1 - Molex Fan (3 pin; TX3) Female Color Black Product Height 1.9 in [49 mm] Product Length 1.9 in [49 mm] Product Weight 2.9 oz [81 g] Product Width 1.6 in [40 mm] Input Voltage 12 DC Shipping (Package) Weight 0.3 lb [0.1 kg] Included in Package 1 - Pentium/K6/Celeron 3-Lead CPU Fan Included in Package 1 - 3-pin to dual LP4 Molex Adapter Cable Included in Package 1 - Packet of Thermal Compound Certifications, Reports and Compatibility www.startech.com 1 800 265 1844. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
Intel® Server Board S3420GP
Intel® Server Board S3420GP Technical Product Specification Intel order number E65697-010 Revision 2.4 January, 2011 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server Board S3420GP TPS Revision History Date Revision Modifications Number Feb. 2009 0.3 Initial release. May 2009 0.5 Update block diagram. July. 2009 0.9 Updated POST error code and diagram. Aug. 2009 1.0 Updated MTBF. Nov. 2009 1.1 Additional details for memory configuration. Dec. 2009 1.2 Added Intel® Server Board S3420GPV details. Dec. 2009 2.0 Updated processor name. Jan. 2010 2.1 Corrected the typo. Apr. 2010 2.2 Corrected the typo, updated processor name and remove CCC certification marking information. July. 2010 2.3 Corrected the typo. Jan.2011 2.4 Corrected the typo. Added RDIMM support on S3420GPV. Updated Table 45. Add USB device readiness beep code information. ii Revision 2.4 Intel order number E65697-010 Intel® Server Board S3420GP TPS Disclaimers Disclaimers Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. -
Intel Architecture Optimization Manual
Intel Architecture Optimization Manual Order Number 242816-003 1997 5/5/97 11:38 AM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Pentium®, Pentium Pro and Pentium II processors may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Such errata are not covered by Intel’s warranty. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. -
Sgxometer: Open and Modular Benchmarking for Intel SGX
SGXoMeter: Open and Modular Benchmarking for Intel SGX Mohammad Mahhouk Nico Weichbrodt Rüdiger Kapitza TU Braunschweig, Germany TU Braunschweig, Germany TU Braunschweig, Germany ABSTRACT mobile devices like phones and tablets. Also, personal computers, Intel’s Software Guard Extensions (SGX) are currently the most laptops and servers can be secured using AMD Secure Encrypted wide-spread commodity trusted execution environment, which Virtualisation [22, 23], and Intel SGX [24, 27]. provides integrity and confidentiality of sensitive code and data. Intel SGX promises with its isolated memory regions, so called Thereby, it offers protection even against privileged attackers and enclaves, both confidentiality and integrity protection of the sen- various forms of physical attacks. As a technology that only be- sitive data and code running inside them against malicious and came available in late 2015, it has received massive interest and privileged software. It also provides local and remote attestation undergone a rapid evolution. Despite first ad-hoc attempts, there is mechanisms [21] to ensure the authenticity and integrity of the so far no standardised approach to benchmark the SGX hardware, running enclaves, adding protection against forging attempts. Thus, its associated environment, and techniques that were designed to the utilisation of SGX in cloud services can considerably reduce harden SGX-based applications. the customers’ reluctance of using them. Furthermore, Intel has re- In this paper, we present SGXoMeter, an open and modular leased a Software Development Kit (SDK)[18] to ease programming framework designed to benchmark different SGX-aware CPUs, with SGX. It introduces wrappers for low-level instructions and `code revisions, SDK versions and extensions to mitigate side- provides a high-level interface that offers multiple functionalities, channel attacks. -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components the FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED in THIS CHAPTER
SAMPLE CHAPTER 1 Chapter Personal Computer 1 System Components THE FOLLOWING COMPTIA A+ ESSENTIALS EXAM OBJECTIVES ARE COVERED IN THIS CHAPTER: Ûß1.2 Explain motherboard components, types and features Nß Form Factor Nß ATX / BTX, Nß micro ATX Nß NLX Nß I/O interfaces Material Nß Sound Nß Video Nß USB 1.1 and 2.0 Nß Serial Nß IEEE 1394 / FireWire Nß Parallel Nß NIC Nß Modem Nß PS/2 Nß Memory slots Nß RIMM Nß DIMM Nß SODIMM CopyrightedNß SIMM Nß Processor sockets Nß Bus architecture 86498book.indb 1 7/22/09 5:37:17 AM Nß Bus slots Nß PCI Nß AGP Nß PCIe Nß AMR Nß CNR Nß PCMCIA Chipsets Nß BIOS / CMOS / Firmware Nß POST Nß CMOS battery Nß Riser card / daughterboard Nß [Additional subobjectives covered in chapter 2] Ûß1.4 Explain the purpose and characteristics of CPUs and their features Nß Identify CPU types Nß AMD Nß Intel Nß Hyper threading Nß Multi core Nß Dual core Nß Triple core Nß Quad core Nß Onchip cache Nß L1 Nß L2 Nß Speed (real vs. actual) Nß 32 bit vs. 64 bit Ûß1.5 Explain cooling methods and devices Nß Heat sinks Nß CPU and case fans 86498book.indb 2 7/22/09 5:37:18 AM Nß Liquid cooling systems Nß Thermal compound Ûß1.6 Compare and contrast memory types, characteristics and their purpose Nß Types Nß DRAM Nß SRAM Nß SDRAM Nß DDR / DDR2 / DDR3 Nß RAMBUS Nß Parity vs. Non-parity Nß ECC vs. non-ECC Nß Single sided vs. double sided Nß Single channel vs. -
AF IC05 Motherboards Unit 1
AF_IC05_ Motherboards Unit 1 Contents Introduction..................................................................................................................................2 Glossary.......................................................................................................................................3 Form factors.................................................................................................................................4 Common standards:...........................................................................................................5 ATX...........................................................................................................................6 Micro-ATX.................................................................................................................6 Mini-ITX.....................................................................................................................7 Motherboard components............................................................................................................8 CPU socket................................................................................................................9 Memory slots....................................................................................................................11 Chipset.............................................................................................................................12 Traditional chipset...................................................................................................13