DOCSLIB.ORG

CX28500 Multichannel Synchronous Communications Controller Data Sheet

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
CX28500 Multichannel Synchronous Communications Controller Data Sheet CX28500 Multichannel Synchronous Communications Controller Data Sheet ® 28500-DSH-002-C Mindspeed Technologies October 2006 Mindspeed Proprietary and Confidential Ordering Information Model Number Package Operating Temperature CX28500EBG 35 mm TBGA –40 – 85 °C CX28500G-12* 35 mm TBGA –40 – 85 °C (RoHS compliant) *The G in the part number indicates that this is an RoHS compliant package. Refer to www.mindspeed.com for additional information. Revision History Revision Level Date Description 500052A — July 2001 Created. 500052B — February 2002 Updated to Revision B. 500052C — July 2002 Updated to Revision C. 28500-DSH-002-A — November 2002 Formerly document number 500052D. 28500-DSH-002-B — June 2004 Updated and made various corrections. 28500-DSH-002-C — October 2006 Added RoHS information. Updated format. ® 28500-DSH-002-C Mindspeed Technologies ii Mindspeed Proprietary and Confidential CX28500 Multichannel Synchronous Communications Controller The CX28500 is an advanced Multichannel Synchronous Distinguishing Features Communications Controller. It formats and deformats up to 1024 High- 1024-channel HDLC controller level Data Link Control (HDLC) channels in a CMOS integrated circuit. OSI Layer 2 protocol support CX28500 operates at Layer 2 of the Open Systems Interconnection (OSI) General purpose HDLC (ISO 3309) protocol reference model. It provides a comprehensive, high-density X.25 (LAPB) solution for processing of HDLC channels for internetworking applications Frame relay (LAPF/ANSI T1.618) such as Frame Relay, Integrated Services Digital Network (ISDN), D- ISDN D-channel (LAPD/Q.921) channel signaling, X.25, Signaling System 7 (SS7), Data Exchange ISLP support Interface (DXI), Inter System Link Protocol (ISLP), and LAN/WAN data 32 Independent serial interfaces, which transport. Under minimal Host supervision, CX28500 manages table-like support: data structures of channel data buffers in Host memory by performing Mixed Data Rates (combination of T1/E1/ Direct Memory Access (DMA) of up to 1024 channels. T3/E3, etc.) as long as they do not exceed each port’s respective bandwidth CX28500 interfaces to 32 independent serial data streams, such as T1/E1 limitation and the overall device bandwidth of 390 Mbps per direction signals. It then transfers data across the popular 32-bit or 64-bit Peripheral 32 T1/E1 data streams Component Interface (PCI) bus to system memory at a rate up to 66 MHz. 6 HSSI interfaces (52 Mbps) The CX28500 has an aggregate data throughput of 390 Mbps. Each serial DC to 13.0 Mbps serial interfaces interface can be operated up to 13.0 MHz. Six Serial Interfaces can be 32 x 8.192 MHz TDM busses operated at rates up to 52 MHz. Logical channels can be mapped as any Configurable logical channels combination of Digital Signal Level 0 (DS0) time slots to support ISDN Standard DS0 (56, 64 Kbps) hyperchannels (N x 64 Kbps). Additionally, logical channels can operate in Subchanneling (N x 8 Kbps) subchanneling mode (N x 8 Kbps) by mapping a combination of DS0 time Hyperchannel (N x 64 Kbps) slots and/or the individual bits of a DS0 time slot (8 bits). For example, a Unchannelized mode 56 Kbps channel can be achieved by mapping 7 bits out of 8 possible bits Per-channel protocol mode selection in a time slot (7 x 8 Kbps = 56 Kbps). CX28500 also includes a 32-bit Non-FCS mode expansion port for bridging the PCI bus to local microprocessors or 16-bit FCS mode peripherals. A Joint Test Action Group (JTAG) port enables boundary- 32-bit FCS mode scan testing to replace bed-of-nails board testing. Transparent mode (unformatted data) Hardware Flow Control (CTS) Functional Block Diagram Selectable Endian configuration on data Per-channel DMA buffer management Table-like data structures HOST Variable size transmit/receive FIFO 0 Interface Rx Line Per-channel message length check (PCI) Processor RSLP Select no length checking Device Select from three 14-bit registers to Configuration Registers compare message length RxDMA Serial TSBUS and Interface or Direct PCI bus interface PCI TxDMA Unit PCM 32/64-bit, 33/66 MHz operation Interface (SIU) Highway Bus master and slave operation Tx Line Processor PCI Version 2.1 PCI BUS PCI TSLP Host back-to-back transaction over the PCI Configuration Interface Physical Space HSSI interfaces (52 Mbps) (Function 0) 31 Local expansion bus interface (EBUS) 32-bit multiplexed address/data bus TSBUS Test Support of 64-bit ECC host memory EXP BUS JTAG Access Low power, 3.3 V CMOS operation JTAG boundary scan access port 35 mm x 35 mm 580-pin BGA Local BUS Available in Green (RoHS compliant) as well as standard version ® 28500-DSH-002-C Mindspeed Technologies iii Mindspeed Proprietary and Confidential Table of Contents Table of Contents. .iv List of Figures . .xi List of Tables . xiii 1.0 Introduction . 1 1.1 CX28500’s Operational Modes . .2 1.2 CX28500 Serial Port Throughput Limits . .3 1.3 CX28500’s Bus Interfaces . .5 1.3.1 PCI—Peripheral Components Interface . .5 1.3.2 EBUS—Local Expansion Bus . .5 1.3.3 TSBUS—Time Slot Bus . .5 1.4 CX28500 Layering Model . .6 1.5 CX28500’s Applications. .7 1.6 CX28500 Applications Examples . .8 1.6.1 T1/T3 WAN Access. .8 1.6.2 T3/E3 Frame Relay Switch . .9 1.6.3 128 Port DSL Access Concentrator . .11 1.6.4 SONET/SDH Mapper. .11 1.6.5 Line Card SONET/ATM SAR . .13 1.7 Feature Summary . .14 1.8 System Overview. .16 1.9 Block Diagram. .18 1.10 Receive Data Path . .19 1.11 Transmit Data Path . .19 1.12 Pin Configuration. .21 1.13 CX28500 Hardware Signals Description . .28 2.0 Internal Architecture . 36 2.1 Serial Interface Unit (SIU) . .37 2.2 Serial Line Processor (SLP) . .38 2.3 Direct Memory Access Controller . .39 2.3.1 General Feature List . .39 2.4 Interrupt Controller . .40 3.0 Host Interface . 41 3.1 PCI Interface . .42 ® 28500-DSH-002-C Mindspeed Technologies iv Mindspeed Proprietary and Confidential Table of Contents 3.1.1 PCI Initialization . .42 3.1.2 PCI Bus Operations . .42 3.1.3 Fast Back-to-Back Transactions . .43 3.1.3.1 Operation Mode . .43 3.1.3.2 Example of an Arbitration for Fast Back-to-Back and Non-Fast Back-to-Back Transactions . .43 3.1.4 PCI Configuration Space . .43 3.2 PCI Configuration Registers . .45 3.2.1 PCI Master and Slave . .45 3.2.1.1 Register 0, Address 00h. ..
Load more

Recommended publications
  • Company Vendor ID (Decimal Format) (AVL) Ditest Fahrzeugdiagnose Gmbh 4621 @Pos.Com 3765 0XF8 Limited 10737 1MORE INC
    Vendor ID Company (Decimal Format) (AVL) DiTEST Fahrzeugdiagnose GmbH 4621 @pos.com 3765 0XF8 Limited 10737 1MORE INC. 12048 360fly, Inc. 11161 3C TEK CORP. 9397 3D Imaging & Simulations Corp. (3DISC) 11190 3D Systems Corporation 10632 3DRUDDER 11770 3eYamaichi Electronics Co., Ltd. 8709 3M Cogent, Inc. 7717 3M Scott 8463 3T B.V. 11721 4iiii Innovations Inc. 10009 4Links Limited 10728 4MOD Technology 10244 64seconds, Inc. 12215 77 Elektronika Kft. 11175 89 North, Inc. 12070 Shenzhen 8Bitdo Tech Co., Ltd. 11720 90meter Solutions, Inc. 12086 A‐FOUR TECH CO., LTD. 2522 A‐One Co., Ltd. 10116 A‐Tec Subsystem, Inc. 2164 A‐VEKT K.K. 11459 A. Eberle GmbH & Co. KG 6910 a.tron3d GmbH 9965 A&T Corporation 11849 Aaronia AG 12146 abatec group AG 10371 ABB India Limited 11250 ABILITY ENTERPRISE CO., LTD. 5145 Abionic SA 12412 AbleNet Inc. 8262 Ableton AG 10626 ABOV Semiconductor Co., Ltd. 6697 Absolute USA 10972 AcBel Polytech Inc. 12335 Access Network Technology Limited 10568 ACCUCOMM, INC. 10219 Accumetrics Associates, Inc. 10392 Accusys, Inc. 5055 Ace Karaoke Corp. 8799 ACELLA 8758 Acer, Inc. 1282 Aces Electronics Co., Ltd. 7347 Aclima Inc. 10273 ACON, Advanced‐Connectek, Inc. 1314 Acoustic Arc Technology Holding Limited 12353 ACR Braendli & Voegeli AG 11152 Acromag Inc. 9855 Acroname Inc. 9471 Action Industries (M) SDN BHD 11715 Action Star Technology Co., Ltd. 2101 Actions Microelectronics Co., Ltd. 7649 Actions Semiconductor Co., Ltd. 4310 Active Mind Technology 10505 Qorvo, Inc 11744 Activision 5168 Acute Technology Inc. 10876 Adam Tech 5437 Adapt‐IP Company 10990 Adaptertek Technology Co., Ltd. 11329 ADATA Technology Co., Ltd.
    [Show full text]
  • ETSI – EUROPEAN STANDARDS for GLOBAL USE an Overview of the European Telecommunications Standards Institute
    ETSI – EUROPEAN STANDARDS FOR GLOBAL USE An overview of the European Telecommunications Standards Institute Ultan Mulligan ETSI Workshop, Madrid, 11 April 2012 © ETSI 2012. All rights reserved ETSI A European standards organization Active in all areas of ICT Setting globally-applicable standards for • telecommunications • radiocommunications • broadcasting • related topics Independent, not-for-profit organization, created in 1988 ISO 9001:2008 certified Offering direct participation 740 Member companies and organisations We have almost 30 000 publications - freely available! http://www.etsi.org http://portal.etsi.org © ETSI 2011. All rights reserved Collaboration Strategic collaboration with numerous global and regional standards-making organizations and industry groupings Formally recognized as a European Standards Organization, with a global perspective Contributing technical standards to support regulation Defining radio frequency requirements for the technologies we standardize © ETSI 2012. All rights reserved 3 ETSI is not … a REGULATORY body, but… • we provide technical specifications to support regulation a CERTIFICATION body, but… • we provide specifications and other tools to assist certification a FREQUENCY ALLOCATION body, but… • we collect, co-ordinate and contribute frequency requirements for the ICT community part of the European Commission, nor part of CEPT, but… • we work closely with these and many other organisations © ETSI 2011. All rights reserved Products & services Technical specifications and standards with global
    [Show full text]
  • Summary of Important Announcements at Mobile World Congress a Few “Chip Level” Takeaways from MWC
    February 26, 2013 N. Quinn Bolton, CFA • [email protected] • 212-705-0322 Communication ICs Summary of Important Announcements at Mobile World Congress A few “Chip Level” takeaways from MWC Industry Note – Given the flurry of product announcements ahead, and during Day 1, of Mobile World Congress, we thought it would be appropriate to shed some light on what we see as key developments relating to our Communication IC coverage universe. Companies Under Coverage: ANAD: ProEficient Solution to Power Samsung Galaxy Music Duos and Chat BRCM: 4G LTE-Advanced modem combines two LTE carriers to deliver speeds of 150Mbps BRCM: HTC chooses Broadcom 5G WiFi technology in its newly launched HTC One smartphone BRCM: Broadcom and Radisys collaborate on 4G LTE small cells for multiple markets BRCM: Boosts 4G LTE mobile backhaul capacity by 50% with new microwave SoC solution BRCM: Broadcom expands multi-mode 3G/4G LTE small cell offering CAVM: Huawei selects Cavium’s PureVu CNW6611L for its AirSharing AM02 wireless media adaptor CAVM: LG U selects Cavium's OCTEON Fusion for powering its small cell deployment for LTE INTC: Intel introduces company’s first dual-core application processors for smartphones INTC: Intel announces multi-mode baseband solution, XMM7160, supporting LTE / DC-HSPA+ / EDGE MRVL: Baidu rolls out first commercial deployment of servers based on Marvell’s ARM processors MSPD: Mindspeed announces next generation Transcede SoCs for Metro/Premium Enterprise small cell applications MSPD: Radisys and Mindspeed continue small cell leadership
    [Show full text]
  • Яюw W W . D a T a S H E E T 4 U . C
    www.DataSheet4U.com M28975 ZipWirePlus G.shdsl Transceiver with Embedded Microprocessor Data Sheet 500054D November 2002 www.DataSheet4U.com Ordering Information Marketing Name Description Package Ambient Temperature Range 176-pin LQFP M28945-33 DSP/Framer –40 °C to +85 °C 48-pin ETQFP 13 × 13 mm FPBGA M28945-13 DSP/Framer –40 °C to +85 °C 48-pin ETQFP M28927-29 AFE/Line Driver 6 x 6 mm 48-pin ETQFP –40 °C to +85 °C Revision History Revision Level Date Description A Advance June 2000 Initial release. Advance Added copyright information to footer on front page. No technical B August 2000 information was changed. Advance Updated pin-out and description C January 2001 Major overhaul to reflect M28975 functionality Advance Added marketing number to front page. D January 2001 No technical information was changed. A Preliminary May 2001 New document number 500054A. Formerly known as 101083D. New document number 500054B. Document 500054B was separated into two documents. This document B Preliminary October 2001 contains the hardware information. See M28975 ZipWirePlus G.shdsl Transceiver with Embedded Microprocessor Programmer Reference Manual for the software information. Deleted LGA package information. C Preliminary November 2002 Removed erroneous operation modes. D Preliminary November 2002 Corrected figures and tables. © 2002, Mindspeed Technologies™, A Conexant Business All rights reserved. Information in this document is provided in connection with Mindspeed Technologies (“Mindspeed”) products. These materials are provided by Mindspeed as a service to its customers and may be used for informational purposes only. Mindspeed assumes no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and product descriptions at any time, without notice.
    [Show full text]
  • Market Dynamics Fuel Semiconductor Evolution
    Global Semiconductor Alliance ENABLING THE AUTOMOTIVE DESIGN CHAIN WITH VIRTUALIZATION CLOUD COMPUTING EVOLUTION: DISRUPTING THE IT SUPPLY CHAIN IP INNOVATION: AT THE CORE OF CONSUMER ELECTRONICS DESIGN SHIFT IN CONSUMER FOCUS DRIVES EVOLUTION OF THE SEMICONDUCTOR INDUSTRY ONSHORE SILICON FOR LONG-TERM SUPPLY SECURITY: FOUNDRY SELECTION FOR MILITARY APPLICATIONS Market Dynamics Fuel Semiconductor Evolution Vol.17 No.2 June 2010 Published by GSA $60 (U.S.) 1 The First Truly Global Foundry Congratulations to the new GLOBALFOUNDRIES, the merged operations of GLOBALFOUNDRIES and Chartered. To our continued mutual success from your Global Customers and Partners ARTICLES CONTENTS 2 Enabling the Automotive Design Chain with Virtualization Frank Schirrmeister, Director, Product Marketing, System-level Solutions, Synopsys Inc. ACCELERATE THE Mark Williams, Director, Solutions Marketing, Synopsys Inc. GROWTH AND 6 Cloud Computing Evolution: Disrupting the IT Supply Chain Chris Weitz, Director, Technology Strategy and Architecture, Deloitte Consulting LLP INCREASE THE John La Bouff, Senior Manager, Deloitte Consulting LLP RETURN ON 10 IP Innovation: At the Core of Consumer Electronics Design Frank Ferro, Director, Marketing, Sonics Inc. INVESTED CAPITAL 15 Shift in Consumer Focus Drives Evolution of the Semiconductor Industry OF THE GLOBAL John Brewer, Vice President, Corporate and Business Development, SiGe Semiconductor SEMICONDUCTOR 19 Onshore Silicon for Long-term Supply Security: Foundry Selection for Military Applications INDUSTRY BY Kirk Peterson, CFD Foundry Manager, ON Semiconductor FOSTERING A MORE 24 Integrated Power Management Platforms: The Entry of Fabless Design Houses to Power Management System Design EFFECTIVE FABLESS Dr. Shye Shapira, Director, Research and Development, Power Management Platforms, TowerJazz Todd Mahlen, Director, Marketing, Power Management Platforms, TowerJazz ECOSYSTEM Dr.
    [Show full text]
  • Small Cell Deployments: Recent Advances and Research Challenges
    1 Small Cell Deployments: Recent Advances and Research Challenges Zubin Bharucha, DOCOMO Eurolabs, Germany, Emilio Calvanese, CEA-LETI, France, Jiming Chen, Ranplan Wireless Network Design Ltd, UK Xiaoli Chu, University of Sheffield, UK, Afef Feki, Bell-Labs, France, Antonio De Domenico, CEA-LETI, France, Ana Galindo-Serrano, CTTC, Spain, Weisi Guo, University of Sheffield, UK, Raymond Kwan, Ubiquisys, UK, Jimin Liu, Ranplan Wireless Network Design Ltd, UK, David López-Pérez, King’s College London, UK, Massod Maqbool, SAGEMCOM, France, Ying Peng, Datang Telecom Group, China, Samir Perlaza, Princeton University, USA, Guillaume de la Roche, Mindspeed Technologies, France, Serkan Uygungelen, DOCOMO Eurolabs, Germany, Alvaro Valcarce, Triagnosys, Germany, and Jie Zhang, University of Sheffield, UK increase the cell coverage and capacity. Due to their low cost Abstract—This paper summarizes the outcomes of the 5th and easy deployment, small cells provide a viable and cost- International Workshop on Femtocells held at King’s College effective way to improve cellular coverage, capacity and th th London, UK, on the 13 and 14 of February, 2012. The applications for homes, enterprises, as well as for metropolitan workshop hosted cutting-edge presentations about the latest and rural areas. advances and research challenges in small cell roll-outs and heterogeneous cellular networks. This paper provides some Driven by their attractive features and potential advantages, cutting edge information on the developments of Self-Organizing the development and deployment of small cells have gained Networks (SON) for small cell deployments, as well as related standardization supports on issues such as carrier aggregation tremendous momentum in the wireless industry and research (CA), Multiple-Input-Multiple-Output (MIMO) techniques, and communities in recent years.
    [Show full text]
  • ARM's Mali Graphics P/E 46.5X 37.1X 33.0X 28.9X Technology
    INDEPENDENT RESEARCH ARM Holdings 7th December 2015 Cash me if you can Semiconductors Fair Value 1310p (price 1,122p) BUY Coverage initiated Bloomberg ARM.LN ARM Holdings designs and licences processors used by a large Reuters ARM.L majority of industry players. The group was one of the main winners 12-month High / Low (p) 1,205 / 848.5 of the smartphones wave such that the share price has rocketed from Market capitalisation (GBPm) 15,766 Enterprise Value (BG estimates GBPm) 14,799 75p in 2009 to more than 1100p these days. As we go into 2016, Avg. 6m daily volume ('000 shares) 4,640 questions primarily concern sources of future growth. We have Free Float 79.4% identified in particular, network infrastructure, servers, IoT and the 3y EPS CAGR 17.3% Gearing (12/14) -44% increasing adoption of ARM technologies enabling a rise in the Dividend yields (12/15e) 0.66% royalty rate per chip. In all, we have factored in average EPS growth of 16% for the next three years and value the share at 1310p (upside of YE December 12/14 12/15e 12/16e 12/17e 18%). Revenue (GBPm) 795.20 965.82 1,104 1,226 EBITA GBPm) 400.4 498.1 559.6 634.9 Op.Margin (%) 50.3 51.6 50.7 51.8 Further potential in smartphones! Although we have noted a Diluted EPS (p) 24.12 30.21 33.95 38.89 slowdown in smartphone sales momentum, we believe the group could EV/Sales 18.99x 15.32x 13.08x 11.45x benefit from 1/ moves upscale in processors (from 32-bits to 64-bits), 2/ EV/EBITDA 34.6x 27.3x 23.6x 20.3x EV/EBITA 37.7x 29.7x 25.8x 22.1x the multiplication of cores and 3/ the adoption of ARM's Mali graphics P/E 46.5x 37.1x 33.0x 28.9x technology.
    [Show full text]
  • PC302 Features Description
    PC302 Features Implements a complete 3GPP Release 7 Description WCDMA Femto Access Point (FAP) SoC The Picochip PC302 is a complete single chip supporting 3GPP 3G Home NodeB (HNB) modem 4 users (TR25.820). Up to 21Mbps HSDPA The PC302 consists of a 3GPP NodeB PHY, Up to 5.7Mbps HSUPA ARM11 processor, cryptographic engine, high- Programmable architecture allows speed accelerators, and peripherals to support reconfiguration to network monitoring HSPA WCDMA FAP requirements. All baseband functions to support zero-touch femtocell processing requirements from digital samples to provisioning or OEM specific code and from RF through to network interfacing is High performance ARM11 subsystem integrated enabling an extremely low BOM cost. suitable for running femtocell stacks that can support secure 3GPP Iuh or SIP/IMS Software support is provided for 3GPP Release 7 ARM1176JZ-S 400MHz processing WCDMA FDD, greatly reducing development core effort and time. Release 8 Home BS specifications Advanced security features including apply. The PHY is based Picochip’s field trial TrustZone Security robust and proven femtocell technology. Hardware accelerator support for RNC stacks are available which have been authentication and encryption suitable optimized for the PC302 and support network for IPsec, SRTP and Kasumi interfaces such as the HNB Iuh or SIP/IMS picoArray Programmable PHY architectures. Network Monitor Software to aid zero-touch provisioning is Software upgrades available such as 2G and 3G network monitoring Customer programmed features functions for cell planning and handoff to enable 10/100 Ethernet MAC and MII Self Organizing Networks SON (TR32.821) NTP/PTP Timestamp or IEEE1588 functions and Dynamic Spectrum Management.
    [Show full text]
  • Mindspeed Technologies™ >
    Mindspeed Technologies™ > > Notice of 2004 Annual Meeting and Proxy Statement 2003 Annual Report on Form 10-K About Mindspeed Technologies™ Headquartered in Newport Beach, Calif., Mindspeed Technologies, Inc. designs, > develops and sells semiconductor networking solutions for communications applications in enterprise, access, metropolitan and wide area networks. The company’s four key product families include high-performance analog transmission and switching solutions, multiservice access products designed to support voice and data services across wireline and wireless networks, T/E carrier physical-layer and link-layer devices, and ATM/MPLS network processors. Mindspeed’s products are used in a wide variety of network infrastructure equipment including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, and digital loop carrier equipment. To learn more, visit us at www.mindspeed.com. Dear Shareholder, Fiscal 2003 was a year of transformation for Mindspeed Technologies. It began as the third year of the worst downturn in the history of the semiconductor industry. The year ended with increasing indicators of a market recovery, and Mindspeed completing its first full quarter as a public company. We completed our long-awaited spin-off to shareholders of Conexant Systems on June 27th and our common stock initially began trading on the American Stock Exchange. Investors responded very positively to our transformation into an independent public company. After the close of fiscal 2003, we transferred the listing of our shares to the NASDAQ National Market, the premier stock market > for technology companies. Our common stock began trading on the NASDAQ National Market on December 15th under the symbol MSPD.
    [Show full text]
  • Lte-Advanced and Next Generation Wireless Networks Channel Modelling and Propagation
    LTE-ADVANCED AND NEXT GENERATION WIRELESS NETWORKS LTE-ADVANCED AND NEXT GENERATION WIRELESS NETWORKS CHANNEL MODELLING AND PROPAGATION Editors Guillaume de la Roche Mindspeed Technologies, France Andres´ Alayon´ Glazunov KTH Royal Institute of Technology, Sweden Ben Allen University of Bedfordshire, UK A John Wiley & Sons, Ltd., Publication This edition first published 2013 © 2013 John Wiley and Sons Ltd Registered office John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex, PO19 8SQ, United Kingdom For details of our global editorial offices, for customer services and for information about how to apply for permission to reuse the copyright material in this book please see our website at www.wiley.com. The right of the author to be identified as the author of this work has been asserted in accordance with the Copyright, Designs and Patents Act 1988. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by the UK Copyright, Designs and Patents Act 1988, without the prior permission of the publisher. Wiley also publishes its books in a variety of electronic formats. Some content that appears in print may not be available in electronic books. Designations used by companies to distinguish their products are often claimed as trademarks. All brand names and product names used in this book are trade names, service marks, trademarks or registered trademarks of their respective owners. The publisher is not associated with any product or vendor mentioned in this book.
    [Show full text]
  • November 19, 2013 Dear Stockholder: on Behalf of the Board of Directors of Mindspeed Technologies, Inc., I Am Pleased to Inform
    November 19, 2013 Dear Stockholder: On behalf of the board of directors of Mindspeed Technologies, Inc., I am pleased to inform you that on November 5, 2013, Mindspeed agreed to be acquired by M/A-COM Technology Solutions Holdings, Inc., pursuant to the terms of an Agreement and Plan of Merger by and among Mindspeed, MACOM and Micro Merger Sub, Inc., a wholly owned subsidiary of MACOM. Micro Merger Sub, Inc. has today commenced a tender offer to purchase all outstanding shares of common stock of Mindspeed at a price of $5.05 per share, net to the seller in cash, without interest and less applicable withholding taxes. After successful completion of the tender offer, Micro Merger Sub, Inc. will be merged with Mindspeed, and any Mindspeed common stock not purchased in the tender offer will be converted into the right to receive an amount equal to $5.05 per share in cash, without interest and less applicable withholding taxes, pursuant to the merger. Unless subsequently extended, the tender offer is scheduled to expire at 12:00 Midnight, New York City time, on December 17, 2013. As more fully set forth in the merger agreement, the tender offer is conditioned upon, among other things, there being validly tendered and not properly withdrawn a number of shares of Mindspeed common stock that, together with the shares then owned by MACOM or Micro Merger Sub, Inc., if any, would represent at least a majority of the shares outstanding of Mindspeed (assuming the conversion or exercise of all derivative securities convertible or exercisable immediately prior to the expiration date of the tender offer, including all convertible senior notes and vested options to purchase shares of Mindspeed’s common stock, regardless of the conversion or exercise price).
    [Show full text]
  • Secure and Trusted Femtocells
    Secure and trusted Femtocells Secure and trusted Femtocells Technical White Paper V1.1 June 2011 2nd edition February 2012 Mindspeed Ltd Upper Borough Court Upper Borough Walls Bath BA1 1RG UK Mindspeed Technologies, Inc Page 1 of 16 Secure and trusted Femtocells +44 1225 469744 www.mindspeed.com Contents 1 Introduction 4 1.1 Network Considerations 5 1.1 RF Considerations 7 1.2 Synchronization 7 1.3 Provisioning 7 2 Low-Cost Implementation 7 3 Security 9 3.1 TrustZone Technology 10 3.2 Secure boot 11 3.3 Untrusted CMs and ODMs 11 3.4 Prevention of unauthorised baseband software 12 3.5 Use of TrustZone to provide digital certificate authentication 12 3.6 Air-interface encryption 13 4 Conclusions 15 References 16 Glossary 16 Mindspeed Technologies, Inc Page 2 of 16 Secure and trusted Femtocells Executive Summary Femtocells (or, more generally, small cells) have emerged as a key enabler of future communications network development. More than a useful add-on that delivers better service to the consumer and increased revenue to operators, they are also an essential part of future network architectures. The concept is simple: making a basestation cheap enough to be deployed in high volume for residential use, connected to the core network via broadband. This can deliver to a subscriber the same service and benefits as a fixed-mobile convergence (FMC) offering such as voice-over-WiFi, but using existing standard handsets. Moreover, the use of femtocell and small cell architectures can help to surmount many of the technical challenges that have become evident as operators deploy 3G networks: and that look set to worsen with the advent of 3G Long Term Evolution (LTE) and WiMAX.
    [Show full text]