February 26, 2013 N. Quinn Bolton, CFA •
[email protected] • 212-705-0322 Communication ICs Summary of Important Announcements at Mobile World Congress A few “Chip Level” takeaways from MWC Industry Note – Given the flurry of product announcements ahead, and during Day 1, of Mobile World Congress, we thought it would be appropriate to shed some light on what we see as key developments relating to our Communication IC coverage universe. Companies Under Coverage: ANAD: ProEficient Solution to Power Samsung Galaxy Music Duos and Chat BRCM: 4G LTE-Advanced modem combines two LTE carriers to deliver speeds of 150Mbps BRCM: HTC chooses Broadcom 5G WiFi technology in its newly launched HTC One smartphone BRCM: Broadcom and Radisys collaborate on 4G LTE small cells for multiple markets BRCM: Boosts 4G LTE mobile backhaul capacity by 50% with new microwave SoC solution BRCM: Broadcom expands multi-mode 3G/4G LTE small cell offering CAVM: Huawei selects Cavium’s PureVu CNW6611L for its AirSharing AM02 wireless media adaptor CAVM: LG U selects Cavium's OCTEON Fusion for powering its small cell deployment for LTE INTC: Intel introduces company’s first dual-core application processors for smartphones INTC: Intel announces multi-mode baseband solution, XMM7160, supporting LTE / DC-HSPA+ / EDGE MRVL: Baidu rolls out first commercial deployment of servers based on Marvell’s ARM processors MSPD: Mindspeed announces next generation Transcede SoCs for Metro/Premium Enterprise small cell applications MSPD: Radisys and Mindspeed continue small cell leadership