DOCSLIB.ORG

November 19, 2013 Dear Stockholder: on Behalf of the Board of Directors of Mindspeed Technologies, Inc., I Am Pleased to Inform

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
November 19, 2013 Dear Stockholder: on Behalf of the Board of Directors of Mindspeed Technologies, Inc., I Am Pleased to Inform November 19, 2013 Dear Stockholder: On behalf of the board of directors of Mindspeed Technologies, Inc., I am pleased to inform you that on November 5, 2013, Mindspeed agreed to be acquired by M/A-COM Technology Solutions Holdings, Inc., pursuant to the terms of an Agreement and Plan of Merger by and among Mindspeed, MACOM and Micro Merger Sub, Inc., a wholly owned subsidiary of MACOM. Micro Merger Sub, Inc. has today commenced a tender offer to purchase all outstanding shares of common stock of Mindspeed at a price of $5.05 per share, net to the seller in cash, without interest and less applicable withholding taxes. After successful completion of the tender offer, Micro Merger Sub, Inc. will be merged with Mindspeed, and any Mindspeed common stock not purchased in the tender offer will be converted into the right to receive an amount equal to $5.05 per share in cash, without interest and less applicable withholding taxes, pursuant to the merger. Unless subsequently extended, the tender offer is scheduled to expire at 12:00 Midnight, New York City time, on December 17, 2013. As more fully set forth in the merger agreement, the tender offer is conditioned upon, among other things, there being validly tendered and not properly withdrawn a number of shares of Mindspeed common stock that, together with the shares then owned by MACOM or Micro Merger Sub, Inc., if any, would represent at least a majority of the shares outstanding of Mindspeed (assuming the conversion or exercise of all derivative securities convertible or exercisable immediately prior to the expiration date of the tender offer, including all convertible senior notes and vested options to purchase shares of Mindspeed’s common stock, regardless of the conversion or exercise price). After careful consideration, including a thorough review of the terms of the tender offer with Mindspeed’s legal and financial advisors, at a meeting held on November 5, 2013, the board of directors unanimously: (i) determined that the merger agreement and the transactions contemplated by the merger agreement, including the tender offer and the merger, are advisable, fair to, and in the best interests of Mindspeed and Mindspeed’s stockholders; (ii) approved and declared advisable the merger agreement, the tender offer, the merger and the other transactions contemplated by the merger agreement in accordance with the requirements of the Delaware General Corporation Law; and (iii) resolved to recommend that Mindspeed’s stockholders accept the tender offer and tender their shares to Micro Merger Sub, Inc. pursuant to the tender offer. Accordingly, for the other reasons described in more detail in the enclosed copy of Mindspeed’s solicitation/recommendation statement, the board of directors unanimously recommends that Mindspeed’s stockholders accept the tender offer and tender their shares pursuant to the tender offer. The solicitation/recommendation statement contains additional information relating to the tender offer and the merger, including a description of the reasons for the board of directors’ recommendations described above. Also enclosed are Micro Merger Sub, Inc’s Offer to Purchase, dated November 19, 2013, a Letter of Transmittal for use in tendering your shares and other related documents. These documents set forth the terms and conditions of the tender offer. We urge you to read the enclosed information and consider it carefully before tendering your shares. On behalf of the board of directors, we thank you for your support. Sincerely, Raouf Y. Halim Chief Executive Officer UNITED STATES SECURITIES AND EXCHANGE COMMISSION WASHINGTON, DC 20549 SCHEDULE 14D-9 (RULE 14d-101) SOLICITATION/RECOMMENDATION STATEMENT UNDER SECTION 14(d)(4) OF THE SECURITIES EXCHANGE ACT OF 1934 MINDSPEED TECHNOLOGIES, INC. (Name of Subject Company) MINDSPEED TECHNOLOGIES, INC. (Name of Persons Filing Statement) Common Stock, par value $0.01 per share (Title of Class of Securities) 602682205 (CUSIP Number of Class of Securities) Raouf Y. Halim Chief Executive Officer Mindspeed Technologies, Inc. 4000 MacArthur Boulevard, East Tower Newport Beach, California 92660-3095 (949) 579-3000 (Name, address and telephone numbers of person authorized to receive notices and communications on behalf of the persons filing statement) Copies to Robert Kornegay Robert Ishii Wilson Sonsini Goodrich & Rosati Professional Corporation 12235 El Camino Real, Suite 200 San Diego, California 92130-3002 (858) 350-2300 ‘ Check the box if the filing relates solely to preliminary communications made before the commencement of a tender offer. TABLE OF CONTENTS Page Item 1. Subject Company Information ................................................. 1 Item 2. Identity and Background of Filing Person ........................................ 1 Item 3. Past Contacts, Transactions, Negotiations and Agreements ........................... 2 Item 4. The Solicitation or Recommendation ............................................ 13 Item 5. Persons/Assets, Retained, Employed, Compensated or Used ......................... 47 Item 6. Interest in Securities of the Subject Company ..................................... 48 Item 7. Purposes of the Transaction and Plans or Proposals ................................ 51 Item 8. Additional Information ....................................................... 51 Item 9. Exhibits ................................................................... 62 ANNEX A Opinion of Morgan Stanley & Co. LLC, dated November 5, 2013 ..................... A-1 ANNEX B Opinion of Needham & Company, LLC, dated November 5, 2013 ..................... B-1 ANNEX C Section 262 of the General Corporation Law of the State of Delaware .................. C-1 Item 1. Subject Company Information. Name and Address. The name of the subject company is Mindspeed Technologies, Inc., a Delaware corporation (“Mindspeed” or the “Company”). Unless the context indicates otherwise, we use the terms “us,” “we” and “our” to refer to the Company. The address of the Company’s principal executive office is 4000 MacArthur Boulevard, East Tower, Newport Beach, California 92660-3095. The telephone number of the Company’s principal executive office is (949) 579-3000. Securities. This Solicitation/Recommendation Statement on Schedule 14D-9 (this “Statement”) relates to the common stock, $0.01 par value per share, of Mindspeed (the “Shares” or the “Common Stock”). As of the close of business on November 15, 2013, there were (i) 43,343,199 Shares issued and outstanding, (ii) 292,813 Shares reserved for future issuance or otherwise deliverable under the Company’s Retirement Savings Plan (the “Retirement Savings Plan”), (iii) 260,651 Shares reserved for future issuance or otherwise deliverable under the Company’s Amended and Restated Employee Stock Purchase Plan (the “ESPP”), (iv) 2,642,925 Shares reserved for future issuance or otherwise deliverable under the Company’s 2003 Long-Term Incentives Plan (the “2003 Long-Term Incentives Plan”), (v) 393,371 Shares reserved for future issuance or otherwise deliverable under the Company’s Directors Stock Plan (the “Directors Stock Plan”), (vi) 192,013 Shares reserved for future issuance or otherwise deliverable under the Company’s Inducement Incentive Plan (the “Inducement Incentive Plan”), (vii) 7,240,743 Shares reserved for future issuance or otherwise deliverable under the Company’s 2013 Equity Incentive Plan (the “2013 Equity Incentive Plan”, and, together with the Retirement Savings Plan, the ESPP, the 2003 Long-Term Incentives Plan, the Directors Stock Plan and the Inducement Incentive Plan, the “Company Equity Plans”), (viii) 111,250 Shares reserved for future issuance or otherwise deliverable in connection with inducement awards outside of the Company Equity Plans, (ix) 8,205,129 Shares issuable upon the conversion of certain notes sold under the Indenture, dated as of June 19, 2012, by and among Mindspeed, certain of its subsidiaries and Wells Fargo Bank, N.A. and (x) 561,992 Shares issuable upon or otherwise deliverable in connection with the exercise of outstanding vested stock options under the Company Equity Plans. Item 2. Identity and Background of Filing Person. Name and Address. Mindspeed, the subject company, is the person filing this Statement. The name, business address and business telephone number of the Company are set forth in Item 1 above under the heading “Name and Address.” Tender Offer. This Statement relates to the tender offer by Micro Merger Sub, Inc., a Delaware corporation (“Purchaser”) and a wholly owned subsidiary of M/A-COM Technology Solutions Holdings, Inc., a Delaware corporation (“Parent”or“MACOM” and together with Purchaser, the “Offerors”), disclosed in the Tender Offer Statement on Schedule TO (together with the exhibits thereto, as amended, the “Schedule TO”), filed by Purchaser and Parent with the Securities and Exchange Commission (the “SEC”) on November 19, 2013, pursuant to which Purchaser has offered to purchase all outstanding Shares at a purchase price of $5.05 per share, net to the holder thereof in cash (the “Offer Price”), without interest and less applicable withholding taxes, upon the terms and subject to the conditions set forth in the Offer to Purchase, dated November 19, 2013 (the “Offer to Purchase”), and in the related Letter of Transmittal (the “Letter of Transmittal” which, together with the Offer to Purchase, as each may be amended or supplemented from time to time in accordance with the Merger Agreement (as defined below), constitute the “Offer”). A copy
Load more

Recommended publications
  • Paradigm Shift: the Winners Are
    PARADIGM SHIFT: THE WINNERS ARE Dr. Jeremy Wang Asia Pacific Executive Director, GSA July 30, 2008 GSA Mission Accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. GSA Board of Directors Dwight Decker Sanjay Jha Jodi Shelton Danny Biran Rick Cassidy Guillame Aart de Geus Conexant Qualcomm Altera TSMC North d’Eyssautier Synopsys, America picoChip Inc. Jack Harding Colin Harris Kenneth Joyce Fu Tai Liou Steven Longoria Dr. Nicky Lu Chris eSilicon Corp PMC-Sierra, Amkor UMC IBM Etron Malachowsky Inc. Technology, Inc. NVIDIA Vahid Manian Michael Rekuc Walden Rhines Naveed Vincent Tong Dr. Albert Wu Dr. Tien Wu Broadcom Chartered Mentor Graphics Sherwani Xilinx Marvell ASE, Inc. Corporation Open-Silicon Asia-Pacific Leadership Council Chairman Dr. Chintay Shih Xiaolang Yan Ming Kai Tsai H.P. Lin Qin-Sheng Wang K.C. Shih Dr. Nicky Lu Special Advisor College of MediaTek Faraday IC China Semiconductor Global Unichip Etron Information Industry Association Science and Engineering Zhejiang University Special Advisor Gordon Gau Chou-Chye Wen-Chi Chen Dr. Woodward Dr. Zhonghan Dr. Shaojun Wei Holtek Huang VIA Yang (John) Deng Phoenix Sunplus Silicon7 Vimicro Microelectronics Jordan Wu Dr. Ki Soo Lun Zhao Dr. Ping Wu Himax Hwang Datang Spreadtrum Technologies Core Logic, Inc. Microelectronics Communications Inc. EMEA Leadership Council David Milne Jalal Bagherli David Baillie Kobi Ben-Zvi Stan Boland Wolfson Dialog CamSemi Wintegra Icera Microelectronics Semiconductor Warren East Guillame d’Eyssautier Danny Hachoen Gennady Krasnikov Chris Ladas ARM, Inc. picoChip DSP Group Mikron JSC CSR Key Topics •Analog/Mixed Signal •Wireless •Automotive Eric Mayer John Schmitz Infineon NXP Semiconductor VC Advisory Council Wayne Cantwell Steve Domenik Phillip T.
    [Show full text]
  • CHIPS for EVERYTHING: Britain’S Opportunities in a Key Global Market FRONT COVER (See Paragraphs 4.5 and 4.6)
    HOUSE OF LORDS Select Committee on Science and Technology CHIPS FOR EVERYTHING: Britain’s opportunities in a key global market FRONT COVER (see paragraphs 4.5 and 4.6) 1 The first illustration shows a technician holding a 300 mm wafer of silicon on which several hundred chips will be fabricated. 2 The second is a Cirrus Logic chip incorporating an ARM920T core, enlarged from its actual size of about a centimetre square. Over 600 such chips — each containing tens of millions of transistors — could be fabricated on one 300 mm wafer. 3 The third is an electron micrograph showing the layered structure of a chip built up in the 20 or so stages of the fabrication process. Most obvious are three layers of metal interconnect, but field-effect transistors are visible at the lowest levels towards the bottom left corner. The image is highly magnified. 2002 technology allows the strips of metal interconnect to be no more than 200 nanometres wide, about one five-hundredth of the thickness of the paper on which this Report is printed. At the same magnification, the image of the whole 300 mm wafer would be nearly 4 kilometres across and that of the Cirrus/ARM920T chip would be about 125 metres across. 1 International SEMATECH: Austin, TX, 2001. © Semiconductor Industry Association, reproduced by permission. 2 © ARM Ltd UK and Cirrus Logic Inc USA, reproduced by permission. 3 Image (rights reserved) by courtesy of the Semiconductor Equipment Assessment, an EU-funded project, as published by European Semiconductor magazine. REAR COVER (see paragraph 4.15) A typical table from the International Technology Roadmap for Semiconductors (ITRS), 2001 edition.
    [Show full text]
  • Inter Design Technology Review
    T E C H N O L O G Y R E V I E W I N T E R D E S I G N A wireless world? Demand for wireless connectivity drives comms industry innovations. By Graham Pitcher. he world continues to be driven by the need ± almost the demand T ± to communicate and we're get- ting our `fix' through a range of wireless communication options. The more obvious wireless communi- cations are the ones used in our day to day affairs ± the mobile phone and one of the WiFi variants; IEEE802.11a, b or g. But, as the BBC is careful to say when dis- cussing its magazines, other wireless com- munication methods are available. And there were interesting developments in the Bluetooth, ultrawideband, ZigBee and zlik said: ªWiFi and Bluetooth wireless Philips Research created a ©fully functional© IEEE802.20 worlds. technologies are already working side by 13.56MHz rfid tag based entirely on The Bluetooth Special Interest Group side in applications across the globe. We plastic electronics. The device could see (SIG) announced its intention to work see this as a trend that will only increase barcodes being obsoleted. with ultrawide band developers in May and acknowledge the potential in the 2005. That turned out to be the first of future for the technologies to work not a number of approaches designed to inte- just concurrently but jointly to achieve for less than a second. Sharing a phone call, grate Bluetooth technology into other more advanced wireless applications.º pairing a new headset, or setting up wire- communications protocols.
    [Show full text]
  • Universidade Federal Do Rio De Janeiro Instituto De Química Programa De Pós-Graduação Em Ciência De Alimentos
    UNIVERSIDADE FEDERAL DO RIO DE JANEIRO INSTITUTO DE QUÍMICA PROGRAMA DE PÓS-GRADUAÇÃO EM CIÊNCIA DE ALIMENTOS Compostos bioativos recuperados de farelo de soja (Glycine max) por extração aquosa: compostos fenólicos e peptídeos antimicrobianos e antitumorais Cyntia da Silva de Freitas Rio de Janeiro 2018 Cyntia da Silva de Freitas Compostos bioativos recuperados de farelo de soja (Glycine max) por extração aquosa: compostos fenólicos e peptídeos antimicrobianos e antitumorais Tese de Doutorado apresentada ao Programa de Pós-graduação em Ciência de Alimentos, Instituto de Química, Universidade Federal do Rio de Janeiro, como requisito parcial à obtenção do título de Doutor em Ciência de Alimentos. Orientadores: Profa .Dra . Vânia Margaret Flosi Paschoalin Prof. Dr. Eduardo Mere Del Aguila Dra. Patricia Ribeiro Pereira Rio de Janeiro 2018 Freitas, Cyntia da Silva de. Compostos bioativos recuperados de farelo de soja (Glycine max) por extração aquosa: compostos fenólicos e peptídeos antimicrobianos e antitumorais. / Cyntia da Silva de Freitas. – Rio de Janeiro: UFRJ, 2014. p., il. Tese (Doutorado em Ciência de Alimentos) – Universidade Federal do Rio de Janeiro, Instituto de Química, 2018. Orientadores: Eduardo Mere Del Aguila, Vânia Margaret Flosi Paschoalin e Patricia Ribeiro Pereira. 1. Glycine max. 2. Farelo da soja. 3. Peptídeos antimicrobianos. I. Del Aguila, Eduardo Mere. II. Paschoalin, Vânia Margaret Flosi. III. Pereira, Patricia Ribeiro. III. Universidade Federal do Rio de Janeiro. Programa de Pós Graduação em Ciência de Alimentos. IV. Título. Cyntia da Silva de Freitas COMPOSTOS BIOATIVOS RECUPERADOS DE FARELO DE SOJA (GLYCINE MAX) POR EXTRAÇÃO AQUOSA: COMPOSTOS FENÓLICOS E PEPTÍDEOS ANTIMICROBIANS E ANTITUMORAIS Profa. Dra. Vânia Margaret Flosi Paschoalin Prof.
    [Show full text]
  • Microwave Engineering Europe
    european November/December 2011 business press engineeringengineering europeeurope Radar MEMS/Nanotechnology Low Power RF www.microwave-eetimes.com The European journal for the microwave and wireless design engineer 2 NEWS Performance vs. price? At last, resistive parts that make a priority of both. World needs over 10 million small cells by 2015 Chicago will need approximately demand for data is often high- 84,500 small cells to deliver est. Other sites include airports, truly high-speed LTE by 2015, stations, office buildings and with acceptable coverage and outdoor sites providing wider speeds, according to analysis coverage in busy street areas. from Picochip. To provide LTE The report was put together Got a resistive component priority checklist by Picochip’s CTO Dr Pulley, who of your own? Include Anaren on your RFQ everywhere in the US around list, and we’ll show you how we measure up! 1.8 million small cells would be also concluded that worldwide required, based on estimations there would need to be in excess Designed specifi cally for on data growth and usage across of ten million small cells to deliver commercial wireless the country. This is in addition to comparable performance. bands – and priced more residential femtocells and Wi-Fi. The US is already seeing wide- competitively than ever The analysis models what will spread deployment of LTE, with before – Anaren’s new be required to deliver the adver- basestations being deployed now wireless resistive compo- tised data rates consistently to to deliver next generation ser- nents are the answer when users wherever they are.
    [Show full text]
  • Company Vendor ID (Decimal Format) (AVL) Ditest Fahrzeugdiagnose Gmbh 4621 @Pos.Com 3765 0XF8 Limited 10737 1MORE INC
    Vendor ID Company (Decimal Format) (AVL) DiTEST Fahrzeugdiagnose GmbH 4621 @pos.com 3765 0XF8 Limited 10737 1MORE INC. 12048 360fly, Inc. 11161 3C TEK CORP. 9397 3D Imaging & Simulations Corp. (3DISC) 11190 3D Systems Corporation 10632 3DRUDDER 11770 3eYamaichi Electronics Co., Ltd. 8709 3M Cogent, Inc. 7717 3M Scott 8463 3T B.V. 11721 4iiii Innovations Inc. 10009 4Links Limited 10728 4MOD Technology 10244 64seconds, Inc. 12215 77 Elektronika Kft. 11175 89 North, Inc. 12070 Shenzhen 8Bitdo Tech Co., Ltd. 11720 90meter Solutions, Inc. 12086 A‐FOUR TECH CO., LTD. 2522 A‐One Co., Ltd. 10116 A‐Tec Subsystem, Inc. 2164 A‐VEKT K.K. 11459 A. Eberle GmbH & Co. KG 6910 a.tron3d GmbH 9965 A&T Corporation 11849 Aaronia AG 12146 abatec group AG 10371 ABB India Limited 11250 ABILITY ENTERPRISE CO., LTD. 5145 Abionic SA 12412 AbleNet Inc. 8262 Ableton AG 10626 ABOV Semiconductor Co., Ltd. 6697 Absolute USA 10972 AcBel Polytech Inc. 12335 Access Network Technology Limited 10568 ACCUCOMM, INC. 10219 Accumetrics Associates, Inc. 10392 Accusys, Inc. 5055 Ace Karaoke Corp. 8799 ACELLA 8758 Acer, Inc. 1282 Aces Electronics Co., Ltd. 7347 Aclima Inc. 10273 ACON, Advanced‐Connectek, Inc. 1314 Acoustic Arc Technology Holding Limited 12353 ACR Braendli & Voegeli AG 11152 Acromag Inc. 9855 Acroname Inc. 9471 Action Industries (M) SDN BHD 11715 Action Star Technology Co., Ltd. 2101 Actions Microelectronics Co., Ltd. 7649 Actions Semiconductor Co., Ltd. 4310 Active Mind Technology 10505 Qorvo, Inc 11744 Activision 5168 Acute Technology Inc. 10876 Adam Tech 5437 Adapt‐IP Company 10990 Adaptertek Technology Co., Ltd. 11329 ADATA Technology Co., Ltd.
    [Show full text]
  • ETSI – EUROPEAN STANDARDS for GLOBAL USE an Overview of the European Telecommunications Standards Institute
    ETSI – EUROPEAN STANDARDS FOR GLOBAL USE An overview of the European Telecommunications Standards Institute Ultan Mulligan ETSI Workshop, Madrid, 11 April 2012 © ETSI 2012. All rights reserved ETSI A European standards organization Active in all areas of ICT Setting globally-applicable standards for • telecommunications • radiocommunications • broadcasting • related topics Independent, not-for-profit organization, created in 1988 ISO 9001:2008 certified Offering direct participation 740 Member companies and organisations We have almost 30 000 publications - freely available! http://www.etsi.org http://portal.etsi.org © ETSI 2011. All rights reserved Collaboration Strategic collaboration with numerous global and regional standards-making organizations and industry groupings Formally recognized as a European Standards Organization, with a global perspective Contributing technical standards to support regulation Defining radio frequency requirements for the technologies we standardize © ETSI 2012. All rights reserved 3 ETSI is not … a REGULATORY body, but… • we provide technical specifications to support regulation a CERTIFICATION body, but… • we provide specifications and other tools to assist certification a FREQUENCY ALLOCATION body, but… • we collect, co-ordinate and contribute frequency requirements for the ICT community part of the European Commission, nor part of CEPT, but… • we work closely with these and many other organisations © ETSI 2011. All rights reserved Products & services Technical specifications and standards with global
    [Show full text]
  • The Femtocell Grows up and Leaves Home by Nigel Toon, CEO, Picochip
    Technology for coping with Video The femtocell grows up and leaves home by Nigel Toon, CEO, Picochip Due to limited spectrum availability and the air interfaces nearing maximum efficiency, small cells are one of the few options remaining to increase capacity. With femtocells chips getting more powerful and their cost greatly reduced in volume rollout, the residential femtocell becomes a viable proposition. Femtocells plug holes in coverage, which is the top-most cause of subscribers’ churn. Now the ‘metro’ (that is, beyond residential) femtocell concept is also beginning to take hold and to shake up the conventional network. For Enterprise market, the integration of the femtocell with PBX brings many useful mobile-integration services. For all these reasons, this article declares that this is the year that femtocells come of age. Nigel Toon is the Chief Executive Officer and President of Picochip. Nigel Toon joined PicoChip from Icera, which he co-founded in 2002, where he was responsible for sales and marketing and was a member of the Board of Directors. He played a key role in growing Icera into a global leader in wireless technology. Prior to founding Icera, Mr Toon served at Altera Corporation (NASDAQ: ALTR), latterly as Vice President and Managing Director for the company’s European business unit; a post he assumed in 1998, having previously held the roles of Regional Sales Manager and Field Applications Engineer. Mr Toon’s early career included business development and engineering roles with Standard Microsystems, Memec PLC and GEC. Nigel Toon studied Electrical and Electronic Engineering at Heriot Watt University and is a Member of the IEEE.
    [Show full text]
  • Summary of Important Announcements at Mobile World Congress a Few “Chip Level” Takeaways from MWC
    February 26, 2013 N. Quinn Bolton, CFA • [email protected] • 212-705-0322 Communication ICs Summary of Important Announcements at Mobile World Congress A few “Chip Level” takeaways from MWC Industry Note – Given the flurry of product announcements ahead, and during Day 1, of Mobile World Congress, we thought it would be appropriate to shed some light on what we see as key developments relating to our Communication IC coverage universe. Companies Under Coverage: ANAD: ProEficient Solution to Power Samsung Galaxy Music Duos and Chat BRCM: 4G LTE-Advanced modem combines two LTE carriers to deliver speeds of 150Mbps BRCM: HTC chooses Broadcom 5G WiFi technology in its newly launched HTC One smartphone BRCM: Broadcom and Radisys collaborate on 4G LTE small cells for multiple markets BRCM: Boosts 4G LTE mobile backhaul capacity by 50% with new microwave SoC solution BRCM: Broadcom expands multi-mode 3G/4G LTE small cell offering CAVM: Huawei selects Cavium’s PureVu CNW6611L for its AirSharing AM02 wireless media adaptor CAVM: LG U selects Cavium's OCTEON Fusion for powering its small cell deployment for LTE INTC: Intel introduces company’s first dual-core application processors for smartphones INTC: Intel announces multi-mode baseband solution, XMM7160, supporting LTE / DC-HSPA+ / EDGE MRVL: Baidu rolls out first commercial deployment of servers based on Marvell’s ARM processors MSPD: Mindspeed announces next generation Transcede SoCs for Metro/Premium Enterprise small cell applications MSPD: Radisys and Mindspeed continue small cell leadership
    [Show full text]
  • 20061014.Pdf
    SEARCH RESEARCH TOOLS Economist.com Choose a research tool... advanced search » Subscribe Activate Help Thursday October 12th 2006 Welcome = requires subscription My Account » Manage my newsletters LOG OUT » » PRINT EDITION Print Edition October 14th 2006 On the cover Previous print editions Subscribe America, China and Russia Oct 7th 2006 Subscribe to the print edition must all make sacrifices to Sep 30th 2006 Or buy a Web subscription for stop a nuclear arms race in Sep 23rd 2006 full access online Asia and the Middle East: Sep 16th 2006 leader Sep 9th 2006 RSS feeds Receive this page by RSS feed More print editions and covers » The world this week Politics this week Full contents Enlarge current cover Business this week Past issues/regional covers Subscribe A survey of telecoms convergence Leaders GLOBAL AGENDA Your television is ringing North Korea POLITICS THIS WEEK Who can stop him now? All things to all men BUSINESS THIS WEEK Somalia The end of the line Seeking moderates, fearing war OPINION Home and away Leaders Telecoms Letters Here we go again, sort of Tuning in to the future? Ex-communist countries WORLD Changing the rules Europe's fraying fringe United States The Americas American politics Winners and losers Asia Crash and re-boot Middle East & Africa Sources and acknowledgements Europe Britain Offer to readers Country Briefings Letters Cities Guide On the yen, Egypt, Austin, Sakhalin Island, Iraq, Business SURVEYS maglev trains, India and China, squash, Canada's native minorities, Ann Richards BUSINESS Google and YouTube
    [Show full text]
  • Using TV White Space for Interference Mitigation in LTE Femtocell Networks
    Proceedings of ICCTA2011 Using TV White Space for Interference Mitigation in LTE Femtocell Networks Fei Peng, Yue Gao, Yue Chen, K K Chai, Laurie Cuthbert Queen Mary University of London School of Electronic Engineering and Computer Science London, United Kingdom [email protected] Abstract technology to get access to certain licensed bands, like TVWS is being promoted by international The traditional Femtocell shares the same licensed organisations, such as Federal Communications frequency band with Macrocell, thus introducing Commission (FCC) in US, and recently by Ofcom cross-tier interference. Interference mitigation in UK. between the Femtocell and Macrocell is considered to be one of the major challenges in Femtocells Among many potential applications for the TVWS, Network. In this paper, the released TV spectrum one promising application network scenarios is by the digital switchover named TV White Space Long Term Evolution (LTE) Femtocell Network, in (TVWS) is proposed to reduce the interference for which it is referred as the HeNB [4]. It is a home the LTE Femtocell Network. Based on the base station with short range, low cost, and being combination of cognitive sensing and TVWS, a linked with the cellular network via a broadband novel resource allocation scheme is applied to connection; it could offload the traffic in cellular mitigate the interference that Macro users are network. Therefore Femtocell is an effective suffering from nearby Femtocells. A single cell approach to improve the indoor coverage and cell Long Term Evolution (LTE) Femtocell simulator is capacity. The main challenge in Femtocell established to demonstrate the system performance.
    [Show full text]
  • Яюw W W . D a T a S H E E T 4 U . C
    www.DataSheet4U.com M28975 ZipWirePlus G.shdsl Transceiver with Embedded Microprocessor Data Sheet 500054D November 2002 www.DataSheet4U.com Ordering Information Marketing Name Description Package Ambient Temperature Range 176-pin LQFP M28945-33 DSP/Framer –40 °C to +85 °C 48-pin ETQFP 13 × 13 mm FPBGA M28945-13 DSP/Framer –40 °C to +85 °C 48-pin ETQFP M28927-29 AFE/Line Driver 6 x 6 mm 48-pin ETQFP –40 °C to +85 °C Revision History Revision Level Date Description A Advance June 2000 Initial release. Advance Added copyright information to footer on front page. No technical B August 2000 information was changed. Advance Updated pin-out and description C January 2001 Major overhaul to reflect M28975 functionality Advance Added marketing number to front page. D January 2001 No technical information was changed. A Preliminary May 2001 New document number 500054A. Formerly known as 101083D. New document number 500054B. Document 500054B was separated into two documents. This document B Preliminary October 2001 contains the hardware information. See M28975 ZipWirePlus G.shdsl Transceiver with Embedded Microprocessor Programmer Reference Manual for the software information. Deleted LGA package information. C Preliminary November 2002 Removed erroneous operation modes. D Preliminary November 2002 Corrected figures and tables. © 2002, Mindspeed Technologies™, A Conexant Business All rights reserved. Information in this document is provided in connection with Mindspeed Technologies (“Mindspeed”) products. These materials are provided by Mindspeed as a service to its customers and may be used for informational purposes only. Mindspeed assumes no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and product descriptions at any time, without notice.
    [Show full text]