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Nettop Platform for 2008 System Design White Paper

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Nettop Platform for 2008 System Design White Paper Nettop Platform for 2008 System Design White Paper June 2008 Document Number: 319980 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Atom™ processor 200 series components may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2008, Intel Corporation 2 White Paper Contents 1 Introduction .....................................................................................................7 1.1 Scope ...................................................................................................7 1.2 Audience...............................................................................................7 1.3 Reference Documents ................................. Error! Bookmark not defined. 2 Platform Vision .................................................................................................8 2.1 Platform Capabilities ...............................................................................8 3 Platform Overview ..........................................................................................10 ® 3.1 Hardware – Intel Desktop Board D945GCLF............................................10 3.2 Firmware ............................................................................................13 3.3 Software .............................................................................................13 3.3.1 Operating Systems ..................................................................13 3.3.2 Drivers ..................................................................................14 4 System Configuration ......................................................................................16 4.1 System Components.............................................................................16 4.2 Display ...............................................................................................17 4.3 Power Supply.......................................................................................19 4.3.1 Power Supply Requirement .......................................................19 4.3.2 Common Internal Power Supply ................................................20 4.3.3 External Adapter and DC-DC Board............................................21 4.3.4 Energy Star* Qualified External Power Supply (Adapter) ...............22 5 Improving System Thermal Performance ............................................................24 5.1 Typical Thermal Solutions......................................................................24 5.2 Boundary Conditions for System Thermal Design ......................................25 5.3 Case Studies .......................................................................................26 5.3.1 Case Study #1........................................................................27 5.3.2 Case Study #2........................................................................27 5.3.3 Case Study #3........................................................................27 5.4 Summary............................................................................................31 6 System Testing...............................................................................................34 6.1 Validation............................................................................................34 6.1.1 Board Level Validation .............................................................34 6.1.2 System Level Testing...............................................................35 6.1.3 Quality and Reliability ..............................................................38 6.1.4 Required by Regulations...........................................................39 6.1.5 Reliability Testing....................................................................40 White Paper 3 Figures Figure 1 Platform Configuration .......................................................................10 Figure 2 Major components on board................................................................12 Figure 3 S-Video Connections..........................................................................17 Figure 4 S-Video Pin Definitions.......................................................................18 Figure 5 Typical Input Voltage of the DC-DC board in the Market, for example 12 V ..............................................................................21 Figure 6 Typical Input Voltage of the DC-DC Board in the Market, for example 19 V .............................................................................22 Figure 7 Airflow Boundary Conditions for Passive Heatsink Design in Various Micro ATX Chassis ............................................................................25 Figure 8 Schematic of Typical Micro ATX System Placement ................................26 Figure 9 Case study #1: PSU Fan (A) + System Fan (B)....................................28 Figure 10 Results of Two Chassis Tested Using Same Heatsink on Processor ...........28 Figure 11 Case Study #2: PSU Fan (A) + System Fan (C) ...................................29 Figure 12 Results Chassis #3 Tested Using Same Heatsink on Processor ................29 Figure 13 Case Study #3: System Fan (D) versus System Fan (F) ........................30 Figure 14 I mpact of System Fan Placement on the Airflow Over Processor Heatsink 30 Figure 15 0° Angle Attach Methodology (top view, not to scale) ............................37 Figure 16 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view, not to scale) .................................................................38 Tables Table 1 Platform Features................................................................................9 Table 2 Platform Features Summary................................................................11 Table 3 Items in Figure 2...............................................................................12 Table 4 Drivers and Software for Devices.........................................................14 Table 5 System Components List ....................................................................16 Table 6 Video Specifications...........................................................................18 Table 7 Typical Power Distribution ..................................................................19 Table 8 Summary of Case Studies...................................................................32 Table 9 Shock Parameters .............................................................................40 Table 10 Vibration Parameters .........................................................................41 4 White Paper Revision History Revision Description Revision Date Number -001 Initial release. June 2008 § White Paper 5 6 White Paper Introduction 1 Introduction The basic computing market segment is commonly considered a simplified PC solution at a system price point of $299 USD and below. These computers are part of a new family of computers; called “nettops”, which represent a new generation of low-cost PCs running on Intel processors. These systems are targeted at users in both mature and emerging market segments whose computing needs and price points require focused and targeted system solutions. With a small form-factor ideal for young kids and designed to be affordable to first- time users, nettops are configured to run less demanding applications. This white paper provides a guideline for building a nettop platform for the worldwide sub-entry market segment using the Intel® Desktop Board D945GCLF with the Intel® Atom™ processor 200 series. This product is Intel’s targeted solution for this marketplace. 1.1 Scope This document consolidates architectural requirements and specifications for delivering a low cost client platform. This document does NOT: • Repeat information readily available in standard specifications, but it will reference them. • Address warranty, distribution costs, tariffs, price, or any other financial or legal terms and conditions. 1.2 Audience The target audience for this document includes: • OEMs, platform designers and integrators seeking
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