351-2 Lecture Slides
351-2: Physics of Materials II
Bruce Wessels and Peter Girouard Department of Materials Science and Engineering Northwestern University October 1, 2019
Contents
1 Catalog Description (351-1,2)6
2 Course Outcomes6
3 351-2: Solid State Physics6
4 Semiconductor Devices7 4.1 Law of Mass Action...... 7 4.2 Chemistry and Bonding...... 8 4.3 Reciprocal Lattice...... 11 4.4 Nearly Free Electron Model...... 11 4.5 Two Level Model...... 11
5 Band Diagrams 12 5.1 P- and N-Type Semiconductors...... 13 5.2 P-N Junctions...... 13 5.3 Boltzmann Statistics: Review...... 13 5.4 P-N Junction Equilibrium...... 14 5.5 Charge Profile of the p-n Junction...... 14 5.6 Calculation of the Electric Field...... 15 5.7 Calculation of the Electric Potential...... 16 5.8 Junction Capacitance...... 17 5.9 Rectification...... 18 5.10 Junction Capacitance...... 19
6 Transistors 19 6.1 pnp Device...... 20 6.2 pnp Device...... 21 6.3 Amplifier Gain...... 21
1 CONTENTS CONTENTS
6.4 Circuit Configurations...... 22 6.5 MOSFETs...... 23 6.6 Oxide-Semiconductor Interface...... 23 6.7 Depletion and Inversion...... 24 6.8 Channel Pinch-Off...... 24 6.9 Tunnel Diodes...... 25 6.10 Gunn Effect...... 26 6.11 Gunn Diodes...... 26
7 Heterojunctions 26 7.1 Quantum Wells...... 27 7.2 Heterostructures and Heterojunctions...... 28 7.3 Layered Structures: Quantum Wells...... 28 7.4 Transitions between Minibands...... 29 7.5 Quantum Dots...... 29 7.6 Quantum Dot Example: Biosensor...... 30 7.7 Quantum Cascade Devices...... 30
8 Optoelectronics 31 8.1 I-V Characteristics...... 32 8.2 Power Generation...... 32 8.2.1 Solar Cell Efficiency...... 33 8.2.2 Other Types of Solar Cells...... 33 8.2.3 Metal-Semiconductor Solar Cells...... 34 8.2.4 Schottky Barrier and Photo Effects...... 34 8.2.5 Dependence of φB on Work Function...... 35 8.2.6 Pinned Surfaces...... 36 8.2.7 Light Emitting Diodes (LEDs)...... 37 8.2.8 Light Emitting Diodes (LEDs)...... 37 8.2.9 Solid Solution Alloys...... 37 8.2.10 LED Efficiency...... 38
9 Lasers 38 9.1 Emission Rate and Laser Intensity...... 39 9.2 Two Level System...... 39 9.3 Planck Distribution Law...... 40 9.4 Transition Rates...... 40 9.5 Two Level System...... 41 9.6 Three Level System...... 41 9.7 Lasing Modes...... 45 9.8 Laser Examples...... 45 9.8.1 Ruby...... 45 9.8.2 Others Examples...... 46 9.9 Threshold Current Density...... 46 9.10 Comparison of Emission Types...... 48
2 CONTENTS CONTENTS
9.11 Cavities and Modes...... 48 9.11.1 Longitudinal Laser Modes...... 49 9.11.2 Transverse Laser Modes...... 49 9.12 Semiconductor Lasers...... 49 9.13 Photonic Bandgap Materials...... 50
10 Band Diagrams 50 10.1 Band Diagrams...... 51 10.2 Heterojunctions and the Anderson Model...... 51 10.3 Band Bending at p-n Junctions...... 51 10.3.1 Calculate the Conduction Band Discontinuity...... 52 10.3.2 Calculate the Valence Band Discontinuity...... 53 10.3.3 Example: p-GaAs/n-Ge...... 54
11 Dielectric Materials 54 11.1 Macroscopic Dielectric Theory...... 55 11.2 Microscopic Structure...... 56 11.2.1 Relation of Macroscopic to Microscopic...... 57 11.3 Polarizability...... 57 11.4 Polarization in Solids...... 57 11.5 Dipole Moment...... 58 11.6 Polarizability of Solids...... 59 11.7 Dielectric Constant...... 59 11.8 Claussius Mossotti Relation...... 60 11.9 Frequency Dependence...... 60 11.10Quantum Theory of Polarizability...... 62 11.11Ferroelectrics...... 62
12 Phase Transitions 63 12.1 Lattice Instabilities...... 63 12.2 Curie Weiss Law...... 63 12.3 Ferroelectrics...... 64 12.3.1 First versus Second Order Transitions...... 66 12.3.2 Ferroelectric Example: BaTiO3 ...... 66 12.4 Other Instabilities...... 67 12.5 Piezoelectrics...... 67
13 Diamagnetism and Paramagnetism 68 13.1 Diamagnetism...... 69 13.2 Paramagnetism...... 70 13.2.1 Calculation of Susceptibility...... 72 13.2.2 Calculation of Total Angular Momentum J ...... 73 13.2.3 Spectroscopic Notation...... 73 13.2.4 Paramagnetic Susceptibility...... 73 13.2.5 Calculation of J ...... 73 13.2.6 Spin Orbit Interactions...... 74
3 CONTENTS CONTENTS
13.2.7 Effective Magnetic Number...... 74 13.2.8 Paramagnetic Properties of Metals...... 75 13.2.9 Band Model...... 75 13.2.10 Multivalent Effects...... 76
14 Ferromagnetism 77 14.1 Ferromagnetic Phase Transition...... 77 14.2 Molecular Field...... 78 14.2.1 Prediction of TC ...... 79 14.2.2 Temperature Dependence of M(T ) for Ferromagnetism. 80 14.2.3 Ferromagnetic-Paramegnetic Transition...... 80 14.2.4 Ferromagnetic-Paramagnetic Transition...... 80 14.2.5 Ferromagnetic-Paramagnetic Transition...... 81 14.2.6 Ferromagnetic-Paramagnetic Transition...... 81 14.2.7 Ferromagnetism of Alloys...... 82 14.2.8 Transition Metals...... 82 14.2.9 Ni Alloys...... 82 14.2.10 Band Model...... 83 14.2.11 Spin Waves...... 83 14.2.12 Magnon Dispersion...... 84 14.3 Ferrimagnetic Order...... 84 14.3.1 Magnetic Oxides...... 85 14.3.2 Magnetization and Hysteresis...... 86 14.4 Domains and Walls...... 86 14.4.1 Energy of Bloch Domain Walls...... 87 14.5 Anisotropy of Magnetization...... 87 14.5.1 Anisotropy of Magnetization...... 88 14.6 Ferrimagnetic Ordering...... 88 14.6.1 Exchange Terms and Susceptibility...... 89 14.6.2 Structure Dependence of Jex ...... 89
15 Optical Materials 89 15.1 Frequency Doubling...... 90 15.2 Nonlinearity in Refractive Index...... 90 15.3 Electro-Optic Modulators...... 91 15.4 Optical Memory Devices...... 91 15.5 Volume Holography...... 92 15.6 Photorefractive Crystals...... 92 15.7 Photorefractive Crystals...... 93 15.8 All-Optical Switching...... 93 15.9 Acousto-Optic Modulators...... 94 15.10Integrated Optics...... 94 15.11Dielectric Waveguides...... 95 15.12Phase Shifter...... 95 15.13LiNbO Phase Shifter...... 96
4 CONTENTS CONTENTS
16 Superconductivity 96 16.1 BCS Theory...... 96 16.2 Density of States and Energy Gap...... 97 16.3 Heat Capacity...... 97 16.4 Superconductor Junctions...... 98 16.5 Junctions...... 98 16.6 Type I and Type II Superconductors...... 98 16.7 High TC Superconductors...... 99 16.8 Cuprate Superconductors...... 99
17 351-2 Problems 100
18 351-2 Laboratories 101 18.1 Laboratory 1: Measurement of Charge Carrier Transport Param- eters Using the Hall Effect...... 101 18.1.1 Objective...... 101 18.1.2 Outcomes...... 102 18.1.3 References...... 102 18.1.4 Pre-Lab Questions...... 102 18.1.5 Experimental Details...... 103 18.1.6 Instructions/Methods...... 104 18.1.7 Link to Google Form for Data Entry...... 104 18.1.8 Lab Report Template...... 104 18.1.9 Hints for derivation...... 105 18.2 Laboratory 2: Diodes...... 106 18.2.1 Objective...... 106 18.2.2 Outcomes...... 106 18.2.3 Pre-lab Questions...... 106 18.2.4 References...... 107 18.3 Laboratory 3: Transistors...... 110 18.3.1 Objective...... 110 18.3.2 Outcomes...... 110 18.3.3 Pre-lab questions...... 110 18.3.4 Experimental Details...... 111 18.4 Laboratory 4: Dielectric Materials...... 113 18.4.1 Objective...... 113 18.4.2 Outcomes...... 113 18.4.3 Pre-lab questions...... 113 18.4.4 Experimental Details...... 114 18.4.5 References...... 115 18.4.6 Instructions/Methods...... 115 18.4.7 Lab Report Template...... 115 18.5 Laboratory 5: Magnetic Properties...... 118
5 3 351-2: SOLID STATE PHYSICS
1 Catalog Description (351-1,2)
Quantum mechanics; applications to materials and engineering. Band struc- tures and cohesive energy; thermal behavior; electrical conduction; semicon- ductors; amorphous semiconductors; magnetic behavior of materials; liquid crystals. Lectures, laboratory, problem solving. Prerequisites: GEN ENG 205 4 or equivalent; PHYSICS 135 2,3.
2 Course Outcomes 3 351-2: Solid State Physics
At the conclusion of 351-2 students will be able to: 1. Given basic information about a semiconductor including bandgap and doping level, calculate the magnitudes of currents that result from the application of electric fields and optical excitation, distinguishing be- tween drift and diffusion transport mechanisms. 2. Explain how dopant gradients, dopant homojunctions, semiconductor- semiconductor hetero junctions, and semiconductor-metal junctions per- turb the carrier concentrations in adjacent materials or regions, identify the charge transport processes at the interfaces, and describe how the application of an electric field affects the band profiles and carrier con- centrations. 3. Represent the microscopic response of dielectrics to electric fields with simple physical models and use the models to predict the macroscopic polarization and the resulting frequency dependence of the real and imaginary components of the permittivity. 4. Given the permittivity, calculate the index of refraction, and describe how macroscopic phenomena of propagation, absorption, reflection and transmission of plane waves are affected by the real and imaginary com- ponents of the index of refraction. 5. Identify the microscopic interactions that lead to magnetic order in ma- terials, describe the classes of magnetism that result from these interac- tions, and describe the temperature and field dependence of the macro- scopic magnetization of bulk crystalline diamagnets, paramagnets, and ferromagnets. 6. Specify a material and microstructure that will produce desired magnetic properties illustrated in hysteresis loops including coercivity, remnant magnetization, and saturation magnetization.
6 4 SEMICONDUCTOR DEVICES
7. Describe the output characteristics of p-n and Schottky junctions in the dark and under illumination and describe their utility in transistors, light emitting diodes, and solar cells. 8. For technologies such as cell phones and hybrid electric vehicles, iden- tify key electronic materials and devices used in the technologies, specify basic performance metrics, and relate these metrics to fundamental ma- terials properties.
4 Principles of Semiconductor Devices
Recall that the conductivity of semiconductors is given by
σ = neµ + peµ (4.1) where n is the number of electrons, e is the electronic charge, µ is the mobility in cm2/V/s. The following trends for conductivity versus temperature are noted for metals, semiconductors, and insulators:
1. Metals: n and p are constant with temperature. Mobility is related to temperature as µ ∝ T −a, where T is temperature and a is a con- stant. Conductivity decreases with increasing temperature. The resis- tivity ρ (ρ = 1/σ) can be written as a sum of contributing factors using Matthiessen’s rule as ρ = ρ0 + ρ(T )
where ρ0 is a constant and ρ(T ) is the temperature dependent resistivity. A typical carrier concentration for a metal is 1023cm−3. Metals do not have a gap between the conduction and valence bands. 2. Semiconductors: n and p are not constant with temperature but are ther- mally activated. Mobility is related to temperature as µ ∝ T −a. The typi- cal range of carrier concentrations for semiconductors is 1014 −1020cm−3. The range of bandgaps for semiconductors is typically 0.1 − 3.0 eV.
3. Insulators: n and p are much lower than they are in metals and semicon- ductors. A typical carrier concentration for an insulator is < 107cm−3. The conductivity is generally a function of temperature. The bandgap for insulators is > 3.0 eV.
4.1 Law of Mass Action The equilibrium concentration of electrons and holes can be determined by treating them as chemical species. At equilibrium,
[np] [n] + [p] (4.2)
7 4.2 Chemistry and Bonding 4 SEMICONDUCTOR DEVICES
The rate constant is given by [n][p] = K(T ) (4.3) [np] where
K(T ) = [F (T )]2 exp[−∆E/kT ] (4.4) Consider the intrinsic case, that is, when the semiconductor is not doped with chemical impurities. For this case,
[n] = [p] = [ni] = A exp[−∆E/2kT ] (4.5) where ni is the intrinsic carrier concentration. For an intrinsic semiconductor, the conductivity is
∼ σ = 2nieµ = σ0 exp[−∆E/2kT ] (4.6) A log σ versus 1/T plot gives a straight line as shown in Fig. 4.1a.
IOS IOS
1/T K 1/T (a) (b)
Figure 4.1: (a) Log versus 1/T plot of conductivity and resistivity in semicon- ductors. (b) Log of conductivity versus 1/T plot for a semiconductor spanning the regimes of extrinsic and intrinsic conduction.
At lower temperatures where ∆Eg > kT , the conductivity is dominated by carriers contributed from ionized impurities. For temperatures where ∆Eg < kT , thermal energy is sufficient to excite electrons from the valence to conduc- tion band. In this regime, the intrinsic carriers dominate the conduction. The two regimes of conduction are illustrated in Fig. 4.1b.
4.2 Chemistry and Bonding From the periodic table, we know the valence, atomic weight, and atomic size. A portion of the periodic table with groups IIIA-VIA is shown in Fig. 4.2. On the left side (group IIIA) are metals. The right hand side (group VIA) con- tains nonmetals. In between these two groups are elemental semiconductors and elements that form compound semiconductors. At the bottom of the table (In, Sn, and Sb) are more metallic elements. Group IVA consists of the covalent semiconductors Si, Ge, and gray Sn.
8 4.2 Chemistry and Bonding 4 SEMICONDUCTOR DEVICES
IIIA IVA VA VIA
B CN O
Al Si P more Ga Ge As non- metallic In Sn Sb
more metallic Figure 4.2: Portion of the periodic table showing elements in typical elemental and compound semiconductors.
Electronic bands are made from an assembly of atoms with individual quan- tum states. The spectroscopic notation for quantum states is given by
1s22s22p63s23p63d104s2... (4.7) By the Pauli exclusion principle, no two electrons can share the same quantum state. This results in a formation of electronic bands when atoms are brought together in a periodic lattice. The atomic bonding energy as a function of dis- tance between atoms is shown in Fig. 4.3. In this figure, deq is the equilibrium
E
d
Figure 4.3: Potential energy versus distance between atoms. The equilibrium distance, deq corresponds to the minimum in the energy curve. The different energies corresponding to deq form discrete levels in an electronic band. distance between atoms with the lowest potential energy and is equal to the lattice constant. The energies correponding to deq form the allowed energies in electronic bands. A diagram showing the energy levels in electronic bands is shown in Fig. 4.4. Core electrons do not contribute to conduction. Conduction of charge carri- ers occurs in only in partially filled bands. A diagram showing the filling of energy states in the valence band is given in Fig. 4.5. Note that two electrons occupy each energy state having different values of the spin quantum number, that is, “spin up” or “spin down.” Recall that semiconductors have band gap energies of 0.1−3.0 eV that separate the conduction from the valence band. An electron can be promoted from the valence to conduction band if it is supplied with energy greater than or equal to the band gap energy. The source of this energy may be thermal, optical, or
9 4.2 Chemistry and Bonding 4 SEMICONDUCTOR DEVICES
E 2p etc anti-bonding states in a forbidden periodic energy lattice band single atom 2s valence elctrons bonding
core 1s electrons
Figure 4.4: Energy diagram showing the electronic bands formed in a crys- talline solid.
bond filled
spin up spin down valence partially filled metallic (a) (b)
Figure 4.5: (a) Diagram of energy states in a filled valence band. Up arrows indicate the “spin up” state and down arrows indicate the “spin down” state.. (b) Filling of states in a partially filled band. Since the band is partially filled, the electrons can contribute to conduction. electrical in nature. A simple two-level band model for a semiconductor show- ing the conduction and valence band levels is shown in Fig. 4.6a Also shown (Fig. 4.6b) is a diagram illustrating the process of promoting an electron from the valence to conduction band. When an electron is excited to the conduc- tion band, it leaves behind a “hole” in the valence band, which represents an unfilled energy state. As discussed earlier with regards to the conductivity in semiconductors, both electrons and holes contribute to conduction (see Eqn. 4.1).
e (n)
h (p) (a) (b)
Figure 4.6: (a) Energy band diagram for a simple two-level system. (b) Dia- gram illustrating the generation of an electron and hole pair.
10 4.3 Reciprocal Lattice 4 SEMICONDUCTOR DEVICES
4.3 Reciprocal Lattice and the Brillouin Zone • Reciprocal space: k-space, momentum space
~p = ~~k
• ~k is the reciprocal lattice vector with units 1/cm
Reciprocal 2D Square Lattice
Irreducible Brillouin Zone
4.4 Nearly Free Electron Model
2 1/3 • Fermi wavevector: kF = (3π n)
2 2 ~ kF • Fermi energy: E = F 2m
• Conductivity is proportional to the Fermi surface area, SF . σ ∝ SF
Constant energy surface for free electrons
Fermi surface of second BZ
First Brillouin Zone
4.5 Two Level Model
11 5 BAND DIAGRAMS
E
K
• Parabolic bands: E = ~2k2/2m∗. m∗ ≡ effective mass £ • Origin? Solution to the Schrodinger¢ Equation, HΨ = ¡EΨ for free elec- trons
5 Semiconductor Band Diagrams
Direct Bandgap
E
K
Indirect Bandgap
12 5.1 P- and N-Type Semiconductors 5 BAND DIAGRAMS
E
K
• Direct bandgap semiconductors: III-V’s • Indirect bandgap semiconductors: Si, Ge
5.1 P- and N-Type Semiconductors
E Intrinsic
X
n-type
p-type
5.2 P-N Junctions
p-n Junction n-type n-type
p-type
transition region W (space change region) p-type
5.3 Boltzmann Statistics: Review
For Ev as the reference energy (EV = 0), Ec − EF n = N exp − (5.1) s kT
13 5.4 P-N Junction Equilibrium 5 BAND DIAGRAMS
EF − EV −EF p = N exp − = N exp (5.2) s kT S kT ∼ ∼ For fully ionized acceptors, p = NA. For fully ionized donors, n = ND.
Ns = Density of states § ¤ The Fermi Level for electrons¦ and holes are calculated¥ from Eq.5.1 and 5.2, respectively:
Electrons: EF = Ec − kT ln(NS/n)
Holes: EF = EV + kT ln(NS/p)
Note: these equations are true for non-generate semiconductors.
5.4 P-N Junction Equilibrium Poisson’s equation - describes potential distribution φ(x):
d2φ(x) ρ(x) = − dx2
φ(x) ≡ Potential ≡ Dielectric Constant of Material ρ(x) ≡ Charge Density
Assume that the donors and acceptors are fully ionized
− + p-type: NA → NA + p + − n-type: ND → ND + e
Note: the space charge region is positive on the n-side and negative on the p-side.
5.5 Charge Profile of the p-n Junction
+ neutral -
W
14 5.6 Calculation of the Electric Field 5 BAND DIAGRAMS
• Total charge: ρ(x) = e [p(x) + ND(x) − n(x) − NA(x)]
• Space charge width: w = xn + xp
• Charge balance: NAxp = NDxn • Note that x = 0 at the junction interface.
5.6 Calculation of the Electric Field d2φ ρ dφ = − = −E dx2 dx dE ρ ⇒ = dx Z ρ E(x) = dx Separate the integral for the n- and p-regions:
Z 0 ρ(x) Z xn ρ(x) E(x) = dx + dx −xp 0 | {z } | {z } p-region n-region Important assumptions made:
1. ρ ≈ eND in the n region, and ρ ≈ −eNA in the p region. 2. ρ is constant in the separate n and p regions. Boundary conditions:
1. E(x = −xp) = E(x = xn) = 0 2. E is continuous at the junction
Resulting electric field across the junction: ( − eNA (x + x ), −x ≤ x ≤ 0 E(x) = p p eND (x − xn), 0 ≤ x ≤ xn ( − eNA (x + x ), −x ≤ x ≤ 0 E(x) = p p eND (x − xn), 0 ≤ x ≤ xn
Electric Field in the Junction
15 5.7 Calculation of the Electric Potential 5 BAND DIAGRAMS
5.7 Calculation of the Electric Potential Recall Z φ = − Edx
Boundary conditions: 1. φ is continuous at the junction boundary
2. φ = 0 at x = −xp (chosen arbitrarily) Resulting potential across the junction:
( eNA 1 2 1 2 x + x · xp + xp , −xp ≤ x ≤ 0 φ(x) = 2 2 eND NA 2 1 2 x + x · xn − x , 0 ≤ x ≤ xn 2ND p 2
Electric Potential in the Junction
16 5.8 Junction Capacitance 5 BAND DIAGRAMS
5.8 Junction Capacitance • Space charge width: 1/2 " 1/2 1/2# 2φ0 NA ND w = xp + xn = + e(NA + ND) ND NA
φ0 ≡ Built-in potential
• Note that, from charge balance, NAxp = NDxn • Junction capacitance: C = F/cm2 w • One-sided abrupt junction: heavily doped p or n + • Consider the case of a p -n junction. For NA ND,
2φ 1/2 w = 0 eND
eN 1/2 C = D 2φ0
17 5.9 Rectification 5 BAND DIAGRAMS
5.9 Rectification Band Diagram Current-Voltage Characteristic
I
V
Reverse Forward Bias Bias
transition region
• Larger Eg, larger φ0
• ID = I0D exp(−eφ0/kT )
−3 14 Eg ni (cm × 10 ) Ge 0.66 0.24 Si 1.08 0.00015 GaAs 1.4 - GaP 2.25 - GaN 3.4 -
• Under a forward bias +φ1, the built in potential is reduced by φ1 and there is a higher probability of electrons going over the barrier.
• Barrier height under forward bias: e(φ0 − φ) • Current increases exponentially with forward bias voltage.
p n Forward Bias
p n Reverse Bias
• Under a reverse bias +φ1, the built in potential is increased by φ1 and there is a lower probability of electrons going over the barrier.
18 5.10 Junction Capacitance 6 TRANSISTORS
5.10 Junction Capacitance Definition of capacitance: ∂Q C ≡ ∂φ
For a one-sided abrupt junction, recall that Q = eNDxn, where
1/2 2(φ0 + φ1)NA xn = eND(ND + NA) The total charge Q for a one sided junction is then
1/2 NAND Q = 2e(φ0 + φ1) NA + ND
Calculate the capacitance as a function of bias voltage φ1:
∂Q e N N 1/2 C = = A D ∂φ1 2(φ0 + φ1) NA + ND
2 A plot of 1/C versus φ1 is called a Mott Schottky plot and yields NA or ND.
U
6 Transistors: Semiconductor Amplifiers
• Three terminal device
19 6.1 pnp Device 6 TRANSISTORS
• Bipolar Junction Transistor (BJT): consists of two p-n junctions back-to- back • The three seminconductor regions are the emitter, base, and collector
• pnp and npn devices
emitter base collector
p n p +
input output
6.1 pnp Device • Emitter-Base junction is forward biased, and the Collector-Base junction is reverse biased • Little recombination in the Base region
• Holes are injected into the Base from the Emitter and collected at the Collector.
Device Diagram
base (n) + +
emitter collector (p) (p)
forward reversed biased junction biased junction
Circuit Diagram
20 6.2 pnp Device 6 TRANSISTORS
6.2 pnp Device Device Diagram
base (n) + +
emitter collector (p) (p)
forward reversed biased junction biased junction
Band Diagram
emitter collector
base
6.3 Amplifier Gain Voltage across the junctions:
φr icφr ieφf ≈ 10 V/V φf Nodal analysis at the base for pnp and npn devices:
21 6.4 Circuit Configurations 6 TRANSISTORS
npn e
b
c
ic ≈ ie and ic = αie
From nodal analysis at the base, ic = ie − ib.
αib α ⇒ i = = h i with h = c 1 − α fe b fe 1 − α hfe is the current gain parameter. α ∼ 0.9.
6.4 Circuit Configurations • Circuit configurations include the common-base, common-collector, and common-emitter.
• The term following “common” indicates which terminal is common to the input and output.
Common-Emitter Diagram
n + p + n
Common-Base I-V Characteristic
22 6.5 MOSFETs 6 TRANSISTORS
2mA 3mA = 4mA
6.5 MOSFETs • MOSFET: Metal Oxide Semiconductor Field Effect Transistor • An applied electric field induces a channel between the source and drain through which current conducts.
gate source drain
oxide
n conduction channel
body
6.6 Oxide-Semiconductor Interface Changing the gate bias causes the following: 1. Band bending at the oxide-semiconductor interface.
2. Accumulation of charge at the interface 3. An increase in channel conductance.
23 6.7 Depletion and Inversion 6 TRANSISTORS
filled states (conducting electrons)
oxide semiconductor
6.7 Depletion and Inversion • Band bending in the opposite sense leads to depletion of charge carriers. • Inversion occurs when the Fermi level of an n (p) type semiconductor intercepts the valence (conduction) band due to band bending. • The channel in a MOSFET is an inversion layer.
Depletion Inversion
filled states (conducting holes)
6.8 Channel Pinch-Off
• A threshold voltage VT is required for channel inversion.
• For a positive gate voltage VG, the potential across the oxide- semiconductor junction is VG − VT .
• For a positive voltage between the drain and source (VDS), the potential near the drain is VG − VT − VDS.
• For VDS ≥ VG − VT , the channel is depleted near the drain, resulting in “pinch-off.” source gate drain
pinched-off channel channel p
24 6.9 Tunnel Diodes 6 TRANSISTORS
2 • In saturation mode (VDS ≥ VG − VT ), ID ∝ VGS
• A small change in VDS causes a large change in ID.
Increasing Gate Bias
G = Gate S = Source D = Drain
6.9 Tunnel Diodes • Consists of a heavily doped p+-n+ structure −x/a • Tunneling current: I ∝ Neff e • Electrons tunnel from filled to empty states across the junction
insulating region (barrier)
• Electrons can go over the barrier or through the barrier (tunneling)
Rectifying Tunneling Thin Junction negative resistance region I I I
V V V
25 6.10 Gunn Effect 7 HETEROJUNCTIONS
6.10 Gunn Effect • Excitation of electrons under a high field to a higher energy conduction band with larger effective mass
−1 2 eτ ∗ 1 ∂ E σ = neµ and µ = , m = m∗ ~2 ∂k2 | {z } band curvature
GaAs E band diagram
heavy electron light electron
K
6.11 Gunn Diodes • Negative resistance due to increased effective mass
ne2τ J = σE = E m∗ • Transfer of electrons from one valley to another (Transferred Electron Device, TED)
I
negative positive A resistance resistance B
0 V
7 Heterojunctions and Quantum Wells
• Composed of semiconductor super-lattices (alternating layers of differ- ent semiconductors) • Multilayers grown by Molecular Beam Epitaxy (MBE) and Metal- Organic Chemical Vapor Deposition (MOCVD)
26 7.1 Quantum Wells 7 HETEROJUNCTIONS
• Used in the construction of lasers, detectors, and modulators • Utilizes band offset, can be used to confine carriers
GaAlAs GaAs
7.1 Quantum Wells • From the particle in a box solution, minibands are formed within the well
GaAlAs GaAs GaAlAs
miniband
HΨ = EΨ; Ψ = A exp(−knx)
nπ kn = Lx
2 2 2 2 2 ~ k ~ π nx Ex = ∗ = ∗ 2 2m 2m Lx
I II
27 7.2 Heterostructures and Heterojunctions 7 HETEROJUNCTIONS
• Smaller Lx, larger energy of miniband
• Lx can be tuned to engineer the band gap
7.2 Heterostructures and Heterojunctions • Devices that use heterojunctions and heterostructures: lasers, modulation-doped field effect transistors (MODFETs) • Types of heterostructures: quantum wells (2D), wires (1D), and dots (0D)
Well Wire Dot
2D 1D 0D (confinement in (confinement in (confinement in 1 direction) 2 directions) 3 directions)
7.3 Layered Structures: Quantum Wells • “Cladding” layer can confine carriers due to difference in bandgap and light due to difference in refractive index. • Examples: GaAs/GaAlAs, InP/InGaAsP, GaN/InGaN
• Semiconductor 1 is “lattice matched” (same lattice constant as substrate) • Semiconductor 2 is the strained layer (different lattice constant)
semiconductor 2 semiconductor 1 Z semiconductor 2
28 7.4 Transitions between Minibands 7 HETEROJUNCTIONS
7.4 Transitions between Minibands • Allowed initial and final states are governed by “selection rules.” • Will have conduction in minibands
• Energy of states:
2 2 2 2 ~ k ~ nπ E = ∗ = ∗ 2m 2m Lx
GaAlAs GaAs GaAlAs
n=2
n=1 miniband
n=1
n=2
7.5 Quantum Dots Quantum Dots
Substrate
29 7.6 Quantum Dot Example: Biosensor 7 HETEROJUNCTIONS
• Electrons are confined in all dimensions to “dots.” • Quantum Dots: clusters of atoms 3-10 nm in diameter. • QDs can be created by colloidal chemical synthesis or island growth epi- taxy. • Modeled after the hydrogen atom with radius R. Quantized energies:
2 2 ~ αi Ei = 2mi R
αi ≡ quantum number
7.6 Quantum Dot Example: Biosensor
bioactive material CdTe
ZnSe
• Solution synthesized colloidal quantum dots (CQD) • Fluorescence energy depends on surface and size of dot • Binding of molecules to the surface of the QD quenches the photolumi- nescent intensity.
7.7 Quantum Cascade Devices • Consist of multiple quantum wells
• Band bending occurs with bias
30 8 OPTOELECTRONICS
8 Optoelectronic Devices: Photodetectors and So- lar Cells
• Light incident on a p-n junction generates electron-hole pairs which are separated by the built in potential. • Separated carriers contribute to the photocurrent.
+
p n
I
V
with light
e
h
31 8.1 I-V Characteristics 8 OPTOELECTRONICS
8.1 I-V Characteristics qV/kT • Diode equation: I = I0 e − 1
• Short circuit current: Isc = Aq(Le + Lh)G
Le ≡ Electron diffusion length Lh ≡ Hole diffusion length G ≡ Carrier generation rate (depends on light intensity)