FPGA Architecture White Paper
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Wind River Vxworks Platforms 3.8
Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................ -
Intel Quartus Prime Pro Edition User Guide: Programmer Send Feedback
Intel® Quartus® Prime Pro Edition User Guide Programmer Updated for Intel® Quartus® Prime Design Suite: 21.2 Subscribe UG-20134 | 2021.07.21 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Intel® Quartus® Prime Programmer User Guide..............................................................4 1.1. Generating Primary Device Programming Files........................................................... 5 1.2. Generating Secondary Programming Files................................................................. 6 1.2.1. Generating Secondary Programming Files (Programming File Generator)........... 7 1.2.2. Generating Secondary Programming Files (Convert Programming File Dialog Box)............................................................................................. 11 1.3. Enabling Bitstream Security for Intel Stratix 10 Devices............................................ 18 1.3.1. Enabling Bitstream Authentication (Programming File Generator)................... 19 1.3.2. Specifying Additional Physical Security Settings (Programming File Generator).............................................................................................. 21 1.3.3. Enabling Bitstream Encryption (Programming File Generator).........................22 1.4. Enabling Bitstream Encryption or Compression for Intel Arria 10 and Intel Cyclone 10 GX Devices.................................................................................................. 23 1.5. Generating Programming Files for Partial Reconfiguration......................................... -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
Intel Quartus Prime Pro Edition User Guide: Partial Reconfiguration Send Feedback
Intel® Quartus® Prime Pro Edition User Guide Partial Reconfiguration Updated for Intel® Quartus® Prime Design Suite: 19.3 Subscribe UG-20136 | 2019.11.18 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Creating a Partial Reconfiguration Design.......................................................................4 1.1. Partial Reconfiguration Terminology..........................................................................5 1.2. Partial Reconfiguration Process Sequence..................................................................6 1.3. Internal Host Partial Reconfiguration........................................................................ 7 1.4. External Host Partial Reconfiguration........................................................................ 9 1.5. Partial Reconfiguration Design Considerations............................................................9 1.5.1. Partial Reconfiguration Design Guidelines.................................................... 11 1.5.2. PR File Management.................................................................................12 1.5.3. Evaluating PR Region Initial Conditions....................................................... 16 1.5.4. Creating Wrapper Logic for PR Regions........................................................16 1.5.5. Creating Freeze Logic for PR Regions.......................................................... 17 1.5.6. Resetting the PR Region Registers.............................................................. 18 1.5.7. Promoting -
EDN Magazine, December 17, 2004 (.Pdf)
ᮋ HE BEST 100 PRODUCTS OF 2004 encompass a range of architectures and technologies Tand a plethora of categories—from analog ICs to multimedia to test-and-measurement tools. All are innovative, but, of the thousands that manufacturers announce each year and the hundreds that EDN reports on, only about 100 hot products make our readers re- ally sit up and take notice. Here are the picks from this year's crop. We present the basic info here. To get the whole scoop and find out why these products are so compelling, go to the Web version of this article on our Web site at www.edn.com. There, you'll find links to the full text of the articles that cover these products' dazzling features. ANALOG ICs Power Integrations COMMUNICATIONS NetLogic Microsystems Analog Devices LNK306P Atheros Communications NSE5512GLQ network AD1954 audio DAC switching power converter AR5005 Wi-Fi chip sets search engine www.analog.com www.powerint.com www.atheros.com www.netlogicmicro.com D2Audio Texas Instruments Fulcrum Microsystems Parama Networks XR125 seven-channel VCA8613 FM1010 six-port SPI-4,2 PNI8040 add-drop module eight-channel VGA switch chip multiplexer www.d2audio.com www.ti.com www.fulcrummicro.com www.paramanet.com International Rectifier Wolfson Microelectronics Motia PMC-Sierra IR2520D CFL ballast WM8740 audio DAC Javelin smart-antenna IC MSP2015, 2020, 4000, and power controller www.wolfsonmicro.com www.motia.com 5000 VoIP gateway chips www.irf.com www.pmc-sierra.com www.edn.com December 17, 2004 | edn 29 100 Texas Instruments Intel DISCRETE SEMICONDUCTORS -
Introduction to Intel® FPGA IP Cores
Introduction to Intel® FPGA IP Cores Updated for Intel® Quartus® Prime Design Suite: 20.3 Subscribe UG-01056 | 2020.11.09 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Introduction to Intel® FPGA IP Cores..............................................................................3 1.1. IP Catalog and Parameter Editor.............................................................................. 4 1.1.1. The Parameter Editor................................................................................. 5 1.2. Installing and Licensing Intel FPGA IP Cores.............................................................. 5 1.2.1. Intel FPGA IP Evaluation Mode.....................................................................6 1.2.2. Checking the IP License Status.................................................................... 8 1.2.3. Intel FPGA IP Versioning............................................................................. 9 1.2.4. Adding IP to IP Catalog...............................................................................9 1.3. Best Practices for Intel FPGA IP..............................................................................10 1.4. IP General Settings.............................................................................................. 11 1.5. Generating IP Cores (Intel Quartus Prime Pro Edition)...............................................12 1.5.1. IP Core Generation Output (Intel Quartus Prime Pro Edition)..........................13 1.5.2. Scripting IP Core Generation.................................................................... -
North American Company Profiles 8X8
North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications. -
CHAPTER 3: Combinational Logic Design with Plds
CHAPTER 3: Combinational Logic Design with PLDs LSI chips that can be programmed to perform a specific function have largely supplanted discrete SSI and MSI chips in board-level designs. A programmable logic device (PLD), is an LSI chip that contains a “regular” circuit structure, but that allows the designer to customize it for a specific application. PLDs sold in the market is not customized with specific functions. Instead, it is programmed by the purchaser to perform a function required by a particular application. PLD-based board-level designs often cost less than SSI/MSI designs for a number of reasons. Since PLDs provide more functionality per chip, the total chip and printed- circuit-board (PCB) area are less. Manufacturing costs are reduced in other ways too. A PLD-based board manufacturer needs to keep samples of few, “generic” PLD types, instead of many different MSI part types. This reduces overall inventory requirements and simplifies handling. PLD-type structures also appear as logic elements embedded in LSI chips, where chip count and board areas are not an issue. Despite the fact that a PLD may “waste” a certain number of gates, a PLD structure can actually reduce circuit cost because its “regular” physical structure may use less chip area than a “random logic” circuit. More importantly, the logic function performed by the PLD structure can often be “tweaked” in successive chip revisions by changing just one or a few metal mask layers that define signal connections in the array, instead of requiring a wholesale addition of gates and gate inputs and subsequent re-layout of a “random logic” design. -
Intel® Arria® 10 Device Overview
Intel® Arria® 10 Device Overview Subscribe A10-OVERVIEW | 2020.10.20 Send Feedback Latest document on the web: PDF | HTML Contents Contents Intel® Arria® 10 Device Overview....................................................................................... 3 Key Advantages of Intel Arria 10 Devices........................................................................ 4 Summary of Intel Arria 10 Features................................................................................4 Intel Arria 10 Device Variants and Packages.....................................................................7 Intel Arria 10 GX.................................................................................................7 Intel Arria 10 GT............................................................................................... 11 Intel Arria 10 SX............................................................................................... 14 I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17 Adaptive Logic Module................................................................................................ 17 Variable-Precision DSP Block........................................................................................18 Embedded Memory Blocks........................................................................................... 20 Types of Embedded Memory............................................................................... 21 Embedded Memory Capacity in -
Demystifying Internet of Things Security Successful Iot Device/Edge and Platform Security Deployment — Sunil Cheruvu Anil Kumar Ned Smith David M
Demystifying Internet of Things Security Successful IoT Device/Edge and Platform Security Deployment — Sunil Cheruvu Anil Kumar Ned Smith David M. Wheeler Demystifying Internet of Things Security Successful IoT Device/Edge and Platform Security Deployment Sunil Cheruvu Anil Kumar Ned Smith David M. Wheeler Demystifying Internet of Things Security: Successful IoT Device/Edge and Platform Security Deployment Sunil Cheruvu Anil Kumar Chandler, AZ, USA Chandler, AZ, USA Ned Smith David M. Wheeler Beaverton, OR, USA Gilbert, AZ, USA ISBN-13 (pbk): 978-1-4842-2895-1 ISBN-13 (electronic): 978-1-4842-2896-8 https://doi.org/10.1007/978-1-4842-2896-8 Copyright © 2020 by The Editor(s) (if applicable) and The Author(s) This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Open Access This book is licensed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made. The images or other third party material in this book are included in the book’s Creative Commons license, unless indicated otherwise in a credit line to the material. -
Moore's Law Motivation
Motivation: Moore’s Law • Every two years: – Double the number of transistors CprE 488 – Embedded Systems Design – Build higher performance general-purpose processors Lecture 8 – Hardware Acceleration • Make the transistors available to the masses • Increase performance (1.8×↑) Joseph Zambreno • Lower the cost of computing (1.8×↓) Electrical and Computer Engineering Iowa State University • Sounds great, what’s the catch? www.ece.iastate.edu/~zambreno rcl.ece.iastate.edu Gordon Moore First, solve the problem. Then, write the code. – John Johnson Zambreno, Spring 2017 © ISU CprE 488 (Hardware Acceleration) Lect-08.2 Motivation: Moore’s Law (cont.) Motivation: Dennard Scaling • The “catch” – powering the transistors without • As transistors get smaller their power density stays melting the chip! constant 10,000,000,000 2,200,000,000 Transistor: 2D Voltage-Controlled Switch 1,000,000,000 Chip Transistor Dimensions 100,000,000 Count Voltage 10,000,000 ×0.7 1,000,000 Doping Concentrations 100,000 Robert Dennard 10,000 2300 Area 0.5×↓ 1,000 130W 100 Capacitance 0.7×↓ 10 0.5W 1 Frequency 1.4×↑ 0 Power = Capacitance × Frequency × Voltage2 1970 1975 1980 1985 1990 1995 2000 2005 2010 2015 Power 0.5×↓ Zambreno, Spring 2017 © ISU CprE 488 (Hardware Acceleration) Lect-08.3 Zambreno, Spring 2017 © ISU CprE 488 (Hardware Acceleration) Lect-08.4 Motivation Dennard Scaling (cont.) Motivation: Dark Silicon • In mid 2000s, Dennard scaling “broke” • Dark silicon – the fraction of transistors that need to be powered off at all times (due to power + thermal -
Ice40 Ultraplus Family Data Sheet
iCE40 UltraPlus™ Family Data Sheet FPGA-DS-02008 Version 1.4 August 2017 iCE40 UltraPlus™ Family Data Sheet Copyright Notice Copyright © 2017 Lattice Semiconductor Corporation. All rights reserved. The contents of these materials contain proprietary and confidential information (including trade secrets, copyright, and other Intellectual Property interests) of Lattice Semiconductor Corporation and/or its affiliates. All rights are reserved. You are permitted to use this document and any information contained therein expressly and only for bona fide non-commercial evaluation of products and/or services from Lattice Semiconductor Corporation or its affiliates; and only in connection with your bona fide consideration of purchase or license of products or services from Lattice Semiconductor Corporation or its affiliates, and only in accordance with the terms and conditions stipulated. Contents, (in whole or in part) may not be reproduced, downloaded, disseminated, published, or transferred in any form or by any means, except with the prior written permission of Lattice Semiconductor Corporation and/or its affiliates. Copyright infringement is a violation of federal law subject to criminal and civil penalties. You have no right to copy, modify, create derivative works of, transfer, sublicense, publicly display, distribute or otherwise make these materials available, in whole or in part, to any third party. You are not permitted to reverse engineer, disassemble, or decompile any device or object code provided herewith. Lattice Semiconductor Corporation reserves the right to revoke these permissions and require the destruction or return of any and all Lattice Semiconductor Corporation proprietary materials and/or data. Patents The subject matter described herein may contain one or more inventions claimed in patents or patents pending owned by Lattice Semiconductor Corporation and/or its affiliates.