Intel Foundry Services Fact Sheet
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Mac Labs. More Creativity
Mac labs. More creativity. More engagement. More learning. Every Mac comes ready for 21st-century learning. Mac OS X Server creates the ultimate lab environment. Creativity and innovation are critical skills in the modern Mac OS X Server includes simplified tools for creating wikis and workplace, which makes them critical skills to teach today’s blogs, so students and staff can set up and manage them with students. Apple offers comprehensive lab solutions for your little or no help from IT. The Spotlight Server feature makes it school or university that will creatively engage students and easy for students collaborating on projects to find and view motivate them to take an interest in their own learning. The content stored anywhere on the network. Of course, access iLife ’09 suite of applications comes standard on every Mac, controls are built in, so they only get the search results they’re so students can immediately begin creating podcasts, editing authorised to see. Mac OS X Server also allows for real-time videos, composing music, producing photo essays and more. streaming of audio and video content, which lets everyone get right to work instead of waiting for downloads – saving major Mac or PC? Have both. storage across your network. Now one lab really can solve all your computing needs. Every Mac is powered by an Intel processor and features Launch careers from your Mac lab. Mac OS X – the world’s most advanced operating system. As an Apple Authorised Training Centre for Education, your Mac OS X comes with an amazing dual-boot feature called school can build a bridge between students and real-world Boot Camp that lets students run Windows XP or Vista natively careers. -
GS40 0.11-Μm CMOS Standard Cell/Gate Array
GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. -
Integrated Step-Down Converter with SVID Interface for Intel® CPU
Product Order Technical Tools & Support & Folder Now Documents Software Community TPS53820 SLUSE33 –FEBRUARY 2020 Integrated Step-Down Converter with SVID Interface for Intel® CPU Power Supply 1 Features 3 Description The TPS53820 device is D-CAP+ mode integrated 1• Single chip to support Intel VR13.HC SVID POL applications step-down converter for low current SVID rails of Intel CPU power supply. It provides up to two outputs to • Two outputs to support VCCANA (5.5 A) and power the low current SVID rails such as VCCANA P1V8 (4 A) (5.5 A) and P1V8 (4 A). The device employs D-CAP+ • D-CAP+™ Control for Fast Transient Response mode control to provide fast load transient • Wide Input Voltage (4.5 V to 15 V) performance. Internal compensation allows ease of use and reduces external components. • Differential Remote Sense • Programmable Internal Loop Compensation The device also provides telemetry, including input voltage, output voltage, output current and • Per-Phase Cycle-by-Cycle Current Limit temperature reporting. Over voltage, over current and • Programmable Frequency from 800 kHz to 2 MHz over temperature protections are provided as well. 2 • I C System Interface for Telemetry of Voltage, The TPS53820 device is packaged in a thermally Current, Output Power, Temperature, and Fault enhanced 35-pin QFN and operates between –40°C Conditions and 125°C. • Over-Current, Over-Voltage, Over-Temperature (1) protections Table 1. Device Information • Low Quiescent Current PART NUMBER PACKAGE BODY SIZE (NOM) • 5 mm × 5 mm, 35-Pin QFN, PowerPAD Package TPS53820 RWZ (35) 5 mm × 5 mm (1) For all available packages, see the orderable addendum at 2 Applications the end of the data sheet. -
High-Level Synthesis Tools for Xilinx Fpgas
An Independent Evaluation of: High-Level Synthesis Tools for Xilinx FPGAs By the staff of Berkeley Design Technology, Inc. Executive Summary In 2009, Berkeley Design Technology Inc. (BDTI), an HLSTs provided roughly 40X better performance than a independent benchmarking and analysis firm, launched mainstream DSP processor, and that the high-level syn- the BDTI High-Level Synthesis Tool Certification Pro- thesis tools were able to achieve FPGA resource utiliza- gram™ to evaluate high-level synthesis tools for tion levels comparable to hand-written RTL code. FPGAs. Such tools take as their input a high-level repre- Furthermore, as we will discuss in this white paper, sentation of an application (written in C or MATLAB, for implementing our video application using the HLSTs example) and generate a register-transfer-level (RTL) along with Xilinx FPGA tools required a similar level of implementation for an FPGA. Thus far, two high-level effort as that required for the DSP processor. This find- synthesis tools, AutoESL’s AutoPilot and the Synopsys ing will no doubt be surprising to many, as FPGAs have Synphony C Compiler, have been certified under the historically required much more development time than program. DSPs. BDTI’s evaluation program uses two example appli- Based on our analysis, we believe that HLSTs can sig- cations, a video motion analysis application and a wireless nificantly increase the productivity of current FPGA receiver, to evaluate high-level synthesis tools (HLSTs) users. For those using DSP processors in highly demand- on a number of quantitative and qualitative metrics. As ing applications, we believe that FPGAs used with shown in Figure 1 and Figure 2, we found that the Xilinx HLSTs are worthy of serious consideration. -
Introduction to Intel® FPGA IP Cores
Introduction to Intel® FPGA IP Cores Updated for Intel® Quartus® Prime Design Suite: 20.3 Subscribe UG-01056 | 2020.11.09 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Introduction to Intel® FPGA IP Cores..............................................................................3 1.1. IP Catalog and Parameter Editor.............................................................................. 4 1.1.1. The Parameter Editor................................................................................. 5 1.2. Installing and Licensing Intel FPGA IP Cores.............................................................. 5 1.2.1. Intel FPGA IP Evaluation Mode.....................................................................6 1.2.2. Checking the IP License Status.................................................................... 8 1.2.3. Intel FPGA IP Versioning............................................................................. 9 1.2.4. Adding IP to IP Catalog...............................................................................9 1.3. Best Practices for Intel FPGA IP..............................................................................10 1.4. IP General Settings.............................................................................................. 11 1.5. Generating IP Cores (Intel Quartus Prime Pro Edition)...............................................12 1.5.1. IP Core Generation Output (Intel Quartus Prime Pro Edition)..........................13 1.5.2. Scripting IP Core Generation.................................................................... -
Introducing the New 11Th Gen Intel® Core™ Desktop Processors
Product Brief 11th Gen Intel® Core™ Desktop Processors Introducing the New 11th Gen Intel® Core™ Desktop Processors The 11th Gen Intel® Core™ desktop processor family puts you in control of your compute experience. It features an innovative new architecture for reimag- ined performance, immersive display and graphics for incredible visuals, and a range of options and technologies for enhanced tuning. When these advances come together, you have everything you need for fast-paced professional work, elite gaming, inspired creativity, and extreme tuning. The 11th Gen Intel® Core™ desktop processor family gives you the power to perform, compete, excel, and power your greatest contributions. Product Brief 11th Gen Intel® Core™ Desktop Processors PERFORMANCE Reimagined Performance 11th Gen Intel® Core™ desktop processors are intelligently engineered to push the boundaries of performance. The new processor core architecture transforms hardware and software efficiency and takes advantage of Intel® Deep Learning Boost to accelerate AI performance. Key platform improvements include memory support up to DDR4-3200, up to 20 CPU PCIe 4.0 lanes,1 integrated USB 3.2 Gen 2x2 (20G), and Intel® Optane™ memory H20 with SSD support.2 Together, these technologies bring the power and the intelligence you need to supercharge productivity, stay in the creative flow, and game at the highest level. Product Brief 11th Gen Intel® Core™ Desktop Processors Experience rich, stunning, seamless visuals with the high-performance graphics on 11th Gen Intel® Core™ desktop -
Intel® Omni-Path Architecture (Intel® OPA) for Machine Learning
Big Data ® The Intel Omni-Path Architecture (OPA) for Machine Learning Big Data Sponsored by Intel Srini Chari, Ph.D., MBA and M. R. Pamidi Ph.D. December 2017 mailto:[email protected] Executive Summary Machine Learning (ML), a major component of Artificial Intelligence (AI), is rapidly evolving and significantly improving growth, profits and operational efficiencies in virtually every industry. This is being driven – in large part – by continuing improvements in High Performance Computing (HPC) systems and related innovations in software and algorithms to harness these HPC systems. However, there are several barriers to implement Machine Learning (particularly Deep Learning – DL, a subset of ML) at scale: • It is hard for HPC systems to perform and scale to handle the massive growth of the volume, velocity and variety of data that must be processed. • Implementing DL requires deploying several technologies: applications, frameworks, libraries, development tools and reliable HPC processors, fabrics and storage. This is www.cabotpartners.com hard, laborious and very time-consuming. • Training followed by Inference are two separate ML steps. Training traditionally took days/weeks, whereas Inference was near real-time. Increasingly, to make more accurate inferences, faster re-Training on new data is required. So, Training must now be done in a few hours. This requires novel parallel computing methods and large-scale high- performance systems/fabrics. To help clients overcome these barriers and unleash AI/ML innovation, Intel provides a comprehensive ML solution stack with multiple technology options. Intel’s pioneering research in parallel ML algorithms and the Intel® Omni-Path Architecture (OPA) fabric minimize communications overhead and improve ML computational efficiency at scale. -
NOTICE of ANNUAL MEETING of STOCKHOLDERS April 23, 2001 ______
NOTICE OF ANNUAL MEETING OF STOCKHOLDERS April 23, 2001 ________________ To the Stockholders of Synopsys, Inc.: NOTICE IS HEREBY GIVEN that the Annual Meeting of Stockholders of Synopsys, Inc., a Delaware corporation (the “Company”), will be held on Monday, April 23, 2001, at 4:00 p.m., local time, at the Company’s principal executive offices at 700 East Middlefield Road, Mountain View, California 94043, for the following purposes: 1. To elect eight directors to serve for the ensuing year or until their successors are elected. 2. To approve an amendment to the Company’s Employee Stock Purchase Plan and International Employee Stock Purchase Plan to increase the number of shares of Common Stock reserved for issuance thereunder by 1,200,000 shares. 3. To approve an amendment to the 1992 Stock Option Plan to extend the term of the Plan from January 2002 to January 2007. 4. To ratify the appointment of KPMG LLP as independent auditors of the Company for fiscal year 2001. 5. To transact such other business as may properly come before the meeting or any adjournment or adjournments thereof. The foregoing items of business are more fully described in the Proxy Statement accompanying this Notice. Only stockholders of record at the close of business on February 26, 2001 are entitled to notice of and to vote at the meeting. All stockholders are cordially invited to attend the meeting in person. However, to assure your representation at the meeting, you are urged to sign and return the enclosed proxy (the “Proxy”) as promptly as possible in the envelope enclosed. -
Intel® Arria® 10 Device Overview
Intel® Arria® 10 Device Overview Subscribe A10-OVERVIEW | 2020.10.20 Send Feedback Latest document on the web: PDF | HTML Contents Contents Intel® Arria® 10 Device Overview....................................................................................... 3 Key Advantages of Intel Arria 10 Devices........................................................................ 4 Summary of Intel Arria 10 Features................................................................................4 Intel Arria 10 Device Variants and Packages.....................................................................7 Intel Arria 10 GX.................................................................................................7 Intel Arria 10 GT............................................................................................... 11 Intel Arria 10 SX............................................................................................... 14 I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17 Adaptive Logic Module................................................................................................ 17 Variable-Precision DSP Block........................................................................................18 Embedded Memory Blocks........................................................................................... 20 Types of Embedded Memory............................................................................... 21 Embedded Memory Capacity in -
IEEE 802.3Da SPMD TF Meeting May 19, 2021 Prepared by Peter Jones
IEEE 802.3da SPMD TF meeting May 19, 2021 Prepared by Peter Jones Presentations posted at: https://www.ieee802.org/3/da/index.html Agenda/Admin - Chad Jones All times in Pacific Time (PT) 7:01am: The Chair reviewed the agenda in https://www.ieee802.org/3/da/public/051921/8023da_agenda_051921.pdf. The Chair asked if there were any corrections or additions to the agenda. There being no corrections or additions, the agenda stands approved. The Chair asked if anyone hasn’t had a chance to review the minutes for April 21, 2021. None responded. The Chair asked if there were any change to be made to the April 21, 2021 minutes. None responded. The April 21, 2021 minutes were approved by unanimous consent. 7:09am: Call for patents was made, no one responded. 7:14am: opening agenda slides complete. The meeting moves on to presentations. Presentations/Discussion. 7:14am: LTspice Model Validation Chris DiMinico, MC Communications/PHY-SI LLC/SenTekse/Panduit Bob Voss, Panduit Paul Wachtel, Panduit 7:21am: presentation done, start of Q&A. 7:30am: Q&A done. 7:30am: Startup sequence Michael Paul, ADI 8.05am: presentation & Q&A done. 8:05am: Editors comments George Zimmerman, CME Consulting/various 8:28am: Closing remarks Next meeting: May 26, 2021 , 7:00am PT. Meeting closed – 8:31am PT Attendees (from Webex + emails) Name Employer Affiliation Attended 05/19 Alessandro Ingrassia Canova Tech Canova Tech y Anthony New Prysmian Group Prysmian Group y Bernd Horrmeyer Phoenix Contact Phoenix Contact y Bob Voss Panduit Corp. Panduit Corp. y Brian Murray Analog Devices Inc. -
Microchip Technology Inc
Microchip Technology Inc. Watchdog Report ™ MCHP (NASDAQ Global) | CIK:827054 | United States | SEC llings The new model for duciary analysis Sep 24, 2021 Jan 1, 2020 Jan 1, 2016 RECENT PERIOD HISTORICAL PERIOD Key Facts 10-Q led on Aug 3, 2021 for period ending Jun 2021 Business address: Chandler, Arizona, United States Reporting Irregularities RECENT HISTORICAL Industry: Semiconductor and Related Device Manufacturing (NAICS Financial Restatements 334413) SEC ler status: Large Accelerated Filer as of Jun 2021 Revisions Index member: S&P 500, Russell 1000 Out of Period Adjustments Market Cap: $45.3b as of Sep 24, 2021 Late Filings Annual revenue: $5.44b as of Mar 31, 2021 Impairments Corporate Governance Changes in Accounting Estimates CEO: Ganesh Moorthy since 2021 Disclosure Controls CFO: Eric J. Bjornholt since 2009 1st level Internal Controls Board Chairman: Steve Sanghi since 1993 Critical / Key Audit Matters Audit Committee Chair: NOT AVAILABLE Anomalies in the Numbers 2nd level RECENT HISTORICAL Benford's Law Auditor: Ernst & Young LLP since 2001 Outside Counsel (most recent): Wilson Sonsini Goodrich & Rosati Beneish M-Score Osborn Maledon PA Accounting Disclosure Complexity 3rd level Securities & Exchange Commission Concerns RECENT HISTORICAL SEC Reviewer: (unknown) 4th level SEC Oversight SEC Letters to Management Revenue Recognition Non-GAAP Measures Litigation & External Pressures RECENT HISTORICAL Signicant Litigation Securities Class Actions Shareholder Activism Watchdog Research, Inc., offers both individual and group subscriptions, Cybersecurity data feeds and/or custom company reports to our subscribers. Management Review Subscribe: We have delivered 300,000 public company reports to over RECENT HISTORICAL 27,000 individuals, from over 9,000 investment rms and to 4,000+ public CEO Changes company corporate board members. -
Xilinx XAPP107: Synopsys/Xilinx High Density Design Methodology Using
Product Obsolete/Under Obsolescence Application Note 3 0 Synopsys/Xilinx High Density Design Methodology Using FPGA Compiler™ XAPP107 August 6, 1998 (Version 1.0) 03*Written by: Bernardo Elayda & Ramine Roane Summary This paper describes design practices to synthesize high density designs (i.e. over 100k gates), composed of large functional blocks, for today’s larger Xilinx FPGA devices using the Synopsys FPGA Compiler. The Synopsys FPGA Compiler version 1998.02, Alliance Series 1.5, and the XC4000X family were used in preparing the material for this application note. Introduction designs preserving some levels of hierarchy will lead to better placement routing results and shorter compile times. For smaller designs, optimal quality of results can often be achieved by ungrouping hierarchical boundaries (compile The designer must determine which trade-offs to make to -ungroup_all). For high density designs, designers tra- meet his design goals and timing requirements. ditionally partition their circuits into small 5-10k gate mod- High density designs require greater selectivity on which ules. With todays version of FPGA Compiler (1998.02) and hierarchical boundaries to eliminate for synthesis. Flatten- currently available workstation hardware it is no longer nec- ing a 150k gate design can lead to long compile times, and essary to partition a design into small 5K to 10K blocks for compromise results. The following guidelines will help in efficient synthesis. In fact, artificial partitioning the design choosing which blocks to flatten in a large design: can worsen optimization results by breaking paths into sep- 1. Eliminating boundaries between combinatorial blocks arate partitions and preventing FPGA Compiler from being allows the synthesis tool to optimize glue logic across able to optimize the entire path.