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Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies Ryan M

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Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies Ryan M Air Force Institute of Technology AFIT Scholar Theses and Dissertations Student Graduate Works 3-14-2014 Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies Ryan M. Dowden Follow this and additional works at: https://scholar.afit.edu/etd Recommended Citation Dowden, Ryan M., "Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies" (2014). Theses and Dissertations. 598. https://scholar.afit.edu/etd/598 This Thesis is brought to you for free and open access by the Student Graduate Works at AFIT Scholar. It has been accepted for inclusion in Theses and Dissertations by an authorized administrator of AFIT Scholar. For more information, please contact [email protected]. PROCESS DEVELOPMENT FOR THE FABRICATION OF SPHEROIDAL MICRODEVICE PACKAGES UTILIZING MEMS TECHNOLOGIES THESIS Ryan M. Dowden, Second Lieutenant, USAF AFIT-ENG-14-M-26 DEPARTMENT OF THE AIR FORCE AIR UNIVERSITY AIR FORCE INSTITUTE OF TECHNOLOGY Wright-Patterson Air Force Base, Ohio DISTRIBUTION STATEMENT A. APPROVED FOR PUBLIC RELEASE; DISTRIBUTION UNLIMITED The views expressed in this thesis are those of the author and do not reflect the official policy or position of the United States Air Force, Department of Defense, or the United States Government. This material is declared a work of the U.S. Government and is not subject to copyright protection in the United States. AFIT-ENG-14-M-26 PROCESS DEVELOPMENT FOR THE FABRICATION OF SPHEROIDAL MICRODEVICE PACKAGES UTILIZING MEMS TECHNOLOGIES THESIS Presented to the Faculty Department of Electrical and Computer Engineering Graduate School of Engineering and Management Air Force Institute of Technology Air University Air Education and Training Command In Partial Fulfillment of the Requirements for the Degree of Master of Science in Electrical Engineering Ryan M. Dowden, BS Second Lieutenant, USAF March 2014 DISTRIBUTION STATEMENT A. APPROVED FOR PUBLIC RELEASE; DISTRIBUTION UNLIMITED AFIT-ENG-14-M-26 PROCESS DEVELOPMENT FOR THE FABRICATION OF SPHEROIDAL MICRODEVICE PACKAGES UTILIZING MEMS TECHNOLOGIES Ryan M. Dowden, BS Second Lieutenant, USAF Approved: //signed// 12 March 2014 . Derrick Langley, Maj, USAF (Chairman) Date //signed// 12 March 2014 LaVern A. Starman, Ph.D. (Member) Date //signed// 12 March 2014 Ronald A. Coutu, Jr., Ph.D. (Member) Date AFIT-ENG-14-M-26 Abstract Sub-mm3 spherical microrobots are being researched as a path towards reconfigurable wireless networks and programmable matter. The microrobot design requires a spheroidal microdevice package compatible with solar energy collection, wireless sensing, and electrostatic actuation mechanisms to be developed. Throughout this research, a variety of MEMS fabrication techniques were evaluated with regards to their applicability to the packaging process. SF6-based plasma was determined to be a preferable alternative to wet HNA etching when producing repeatable bulk isotropic etches in silicon. The effect of silicon crystal orientation on etch variance and anisotropy was also investigated. HNA polishing was demonstrated as an effective method of reducing undercutting, surface roughness, and anisotropy. MatLab image processing routines were developed and incorporated into etch analysis, providing an efficient method of data collection. A method of performing sophisticated wafer alignment and photolithography processes by leveraging existing cleanroom devices was proposed. This research established a path forward for an advanced packaging scheme designed to move microelectronics packages away from the planar circuit board configurations of the past and into the autonomous architectures of the future. The proposed design is applicable to a wide variety of microelectronics applications while meeting the requirements of the sub-mm3 spherical microrobot system. iv AFIT-ENG-14-M-26 To Mom and Dad, for always encouraging me to explore… v Acknowledgments First, I would like to thank my research advisor, Maj Derrick Langley, for his support and gentle vectoring provided to me in this endeavor. Your patience and understanding are truly unrivaled, and a model for young officers such as myself. I must also thank Mr. Tom Stephenson and Mr. Rich Johnston for aiding me throughout my adventures in the AFIT cleanroom, and Mr. Andy Browning for his help conducting hours of silicon etches in the AFRL cleanroom. I would like to give a special thanks to my companions in the MEMS lab, with whom I shared many of the up and downs of the last 18 months. Your mentoring, support, and most importantly, friendship, have made the long hours of graduate school surprisingly enjoyable. Similarly, a big thank you also goes out to my roommate Kyle, for teaching me the mysteries of the snatch, sharing countless hours exploring the Miami Valley by bike, being my go-to homework partner, and providing the proverbial “kick in the butt” whenever necessary, which turned out to be quite often. Most of all I want to thank my family and friends, who have provided support and distraction whenever necessary, which turned out to be more often. Ryan M. Dowden vi Table of Contents Page Abstract .............................................................................................................................. iv Acknowledgments.............................................................................................................. vi List of Figures .................................................................................................................... ix List of Tables .....................................................................................................................xv List of Equations .............................................................................................................. xvi I. Introduction .....................................................................................................................1 Background .....................................................................................................................1 Justification .....................................................................................................................2 Scope ...............................................................................................................................3 Methodology ...................................................................................................................4 Materials and Equipment ................................................................................................4 Summary .........................................................................................................................5 II. Literature Review ............................................................................................................7 Chapter Overview ...........................................................................................................7 Previous AFRL Research ................................................................................................8 Programmable Matter....................................................................................................11 Self-Reconfigurable Modular Robotics .................................................................. 13 Solid-State Microrobotics ....................................................................................... 14 Microelectromechanical Systems .................................................................................17 Bulk Micromachining ............................................................................................. 19 Surface Micromachining ......................................................................................... 27 Packaging ................................................................................................................ 38 Particularly Relevant Prior Research ............................................................................42 Inertial Confinement Fusion Targets ....................................................................... 42 Silicon Microlens and Microlens Mold Fabrication ............................................... 44 Hemispherical Shell Resonators .............................................................................. 47 Investigation of Anisotropy in Isotropic Silicon Etching ........................................ 49 Summary .......................................................................................................................50 vii III. Methodology ................................................................................................................51 Chapter Overview .........................................................................................................51 Isotropic Etching ...........................................................................................................51 HNA Etch Studies ................................................................................................... 52 Reactive Ion Etch Studies ....................................................................................... 54 Deep Silicon Etch (DSE) Studies ............................................................................ 54 HNA Polishing ..............................................................................................................57 MatLab Image Processing Tools ...................................................................................60
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