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2010 Annual Report Financial Results

Net Revenue Diluted Earnings Per Share Geographic Breakdown of Revenue Dollars in billions Dollars Percent

50 2.00 2.01 100 9% 10% 10% Japan 43.6 40 80 13 % Europe 38.8 38.3 37.6 1. 50 24% 21% 34.2 35.4 35.1 20% Americas 30 30.1 1.18 60 26.8 19 % 26.5 1. 0 0 0.92 0.86 41% 20 0.77 40

0.50 57% 10 20 50% 26%

01 02 09080706050403 10 2006 2007 2008 2009 2010 2000 2005 2010

Capital Additions to Property, Dividends Per Share Paid Plant and Equipment Research and Development Dollars Dollars in billions Dollars in billions

0.80 6.0 5.9 8.0

5.2 5.2 5.0 6.6 0.63 0.60 4.5 4.5 6.0 5.9 5.8 0.55 0.56 5.7 5.7

0.45 0.40 0.40 3.0 4.0

0.20 1. 5 2.0

2006 2007 2008 2009 2010 20062007 2008 2009 2010 20062007 2008 2009 2010

On the cover: (Q generation Intel® Core™ processor family features ! built-in graphics that and gross margin were all the highest in Intel’s history. Growth opportunities, our enable a richer, higher performance computing strong product lineup, and our industry lead in manufacturing process technology ' !Q managing power use for longer battery life. #$#%&'

Past performance does not guarantee future results. This Annual Report to Stockholders contains forward-looking statements, and actual results could differ materially. ))*Q!*+/:) Letter From Your CEO

N !(Q K+ built-in graphics that enhance HD video, 3-D gaming, multitasking, across all regions and market segments continued videoconferencing, social networking, and multimedia performance, in 2010, contributing to revenue of $43.6 billion, yet also offer better overall power management and battery life. up 24% compared to 2009. Operating income Our continuing leadership in silicon manufacturing process technol- for 2010 rose to $15.6 billion, net income to !!+ $11.5 billion, and earnings per share to $2.01. Our continued focus on performance at low cost. We have been shipping products built using !! 32-nanometer (nm) process technology since 2009, and as of year- !!WBZ(] end 2010 our competition had not shipped any. We expect to start charges recorded in the fourth quarter of 2010 to repair and replace volume production on 22nm process technology in 2011. materials and systems impacted by a design issue related to the Connectivity N&W$&'%]' We are working to take full advantage of the growth potential in every for the affected product in early 2011. connected computing segment. In January 2011, we completed the PC and server businesses are strong €NS]$ #% will enable us to offer a portfolio of products that cover a broad range sold per day, and for the year the PC segment grew approximately ]*‚ƒ]J:„>ƒM(&N 17% worldwide. Part of that growth is driven by the increasingly we also acquired Texas Instruments’ cable modem product line, a move “Q#%!#% that we believe will allow us to bring the Internet and advanced household to one or more PCs per person in many mature markets. services to cable television—further enabling our vision of smart TV. PC growth also continues at a strong pace in most emerging markets. Security (!N! J!! previous years combined. As millions more people join the global number of connected devices against increasingly sophisticated online community, demand for high-performance servers continues viruses and malicious attacks. In 2010, as part of our effort to improve to increase. In 2010, we delivered Intel® ® processors and Intel® security across the range of computing devices, we announced plans N&!!!- €J:S!! mance as well as new reliability and security features, helping to company. We believe that the combination of hardware- and software- boost our Data Center Group revenue 35% over 2009. based security that will result from the acquisition will help us protect Delivering complete solutions consumers, corporations, and governments before attacks occur. (!!!H! Excellence in citizenship devices such as smartphones, smart TVs, tablets, in-vehicle systems, At Intel, we don’t separate corporate responsibility from our business; and more are connecting to the Internet and becoming more intelligent. it’s part of our overall global strategy. We continue to positively impact Intel is aggressively pursuing opportunities to expand our business in people’s lives through our technology, environmental stewardship, these new device categories with the Intel® ™ processor family. and ongoing commitment to transform education around the world. We closed 2010 with 1,700 design wins for embedded For the third consecutive year, Intel was the largest voluntary processors and over 4,900 total design engagements in the embedded purchaser of green power in the U.S., according to the U.S. Environ- market segment. We shipped our 80 millionth Intel Atom processor into mental Protection Agency, and our new Intel Israel Design Center the netbook market segment, and our products are being designed earned Leadership in Energy and Environmental Design (LEED) Gold into more than 35 tablets, many of which are expected to launch in %N‡ 2011. In 2010, we also introduced nine products for the smart TV Jones Sustainability Indexes for the 12th year in a row, and received * !K+ players, and set-top boxes. the Chairman’s Award from the Committee Encouraging Corporate We are transforming from a company with a primary focus on Philanthropy for Intel® Teach, our educator development program. the design and manufacture of semiconductor chips for PCs and I am honored to work with the men and women of Intel. They regu- servers to a computing company that delivers complete solutions larly deliver groundbreaking technologies, and over the last three years in the form of hardware and software platforms and supporting have contributed more than 3 million hours of volunteer service around services. We are also strengthening Intel’s ability to innovate across the world. Intel employees truly make amazing things happen. what we believe are the three critical pillars for all computing going `!+ Our new 2nd generation Intel® Core™ processors represent the largest increase in computing performance and capabilities over any previous #$#%&' 2010 Highlights Letter From Your Chairman

#NK‡ is to help balance how Intel uses the cash that the company generates to maximize stockholder value. Ways that Intel increases stockholder value include periodically repurchasing its own stock in the open market, and returning cash in the form of dividends. In 2010, Intel repurchased 70 million shares of common stock for $1.5 billion, and the total dividend payout was $3.5 billion, including a 12.5% increase in the quarterly dividend effective €]NS!! KH€ 22-nanometer BZ!€ manufacturing technology ramps up. Intel also works to increase stockholder value by investing in In 2009, we began shipping products built using 32nm process technology, and acquisitions, capital additions, and research and development to build by year-end 2010, none of our competitors had shipped any. We expect to start capabilities. For example, Intel plans to invest between $6 billion and volume production with 22nm process technology in 2011. Each generation can $8 billion to deploy its next-generation 22nm manufacturing process across several existing U.S. facilities and to build a new development factory in Oregon. The company also plans to build a new high-volume manufacturing facility in Arizona. Investments such as these help Intel to remain the most advanced semiconductor manufacturer in the world. In 2010, we enhanced Intel’s ongoing commitment to operating at the highest level of integrity by forming a new Compliance Committee KJ highly competitive global environment in which Intel operates, and work to ensure that the company remains in compliance with legal requirements in all geographies where Intel does business. I continue to take pride in how Intel’s education and access programs are increasing opportunities for women and underserved minorities Over 1 million PCs around the world. The annual Intel Science Talent Search (Intel STS) and sold worldwide per day. Intel International Science and Engineering Fair, programs of Society for Science & the Public, provide young people with opportunities to PC shipments grew by double-digit percentages in 2010, but computing is no showcase their research and compete for awards and scholarships. The caliber of the projects at these competitions is impressive: The how we work, live, and play. N$($!HJ' a navigation system designed to improve spacecraft travel. I am also proud of the mentoring and development programs focused on increasing diversity within Intel’s workforce, including targeted initiatives addressing gender diversity and underrepresented minorities. For example, since the creation of Intel’s Women’s Initiative in 2004, the number of women in technical mid- to senior-level Intel jobs has grown by 24%. I am committed to supporting continued !!!K Over the past year, I have had many opportunities to interact with Intel employees, during the course of business and at annual award events celebrating the extraordinary creativity and high quality of J– their work. Intel’s future is in excellent hands. invested in education in the last decade. Intel collaborates with governments, technology companies, NGOs, and other organizations to help transform education. We support education and entre- preneurship programs in over 70 countries to enable young people to acquire the skills they need to succeed in today’s innovation economy. •&$%K Corporate Directory

BOARD OF DIRECTORS CORPORATE OFFICERS Douglas L. Davis APPOINTED VICE Shane D. Wall Vice President Director, Strategic Planning, Ambassador Charlene Paul S. Otellini PRESIDENTS General Manager, Platform Architecture, and Barshefsky 3 6† President and Tablets and Netbooks Group Intel® Architecture Group Software, Ultra-Mobility Group Senior International Partner Chief Executive Officer John D. Barton Wilmer Cutler Pickering Hale Shmuel Eden David P. Whalen Andy D. Bryant General Manager, Platform and Dorr LLP Vice President Director, Smartphone Products Executive Vice President Validation Engineering A multinational law firm General Manager, Business Development, Technology, Manufacturing, PC Client Group Ultra-Mobility Group Susan L. Decker 1† 6 and Enterprise Services Michel A. Bell Private investor and advisor Chief Administrative Officer Douglas W. Fisher Director, Smartphone Products Elenora Yoeli Development Vice President Director, Intel® Atom™ and System John J. Donahoe 2 4 Sean M. Maloney General Manager, on Chip (SoC) Development Group President and Executive Vice President Daniel J. Casaletto Systems Software Division Chief Executive Officer General Manager, Director, Microprocessor Intel Capital eBay Inc. Intel® Architecture Group Ron Friedman Architecture and Performance Lisa M. Lambert A global online marketplace Vice President David Perlmutter Alan Crouch Managing Director, General Manager, Reed E. Hundt 1 3 6 Executive Vice President Director, Software Engineering Software and Services Sector Microprocessor and Chipset Principal General Manager, Development Bradley D. Daniels REH Advisors LLC Intel® Architecture Group Keith R. Larson Director, System on Chip (SoC) Managing Director, A strategic advice firm Erik Adrianus Hubertus Engineering Manufacturing Sector, Arvind Sodhani Huggers Paul S. Otellini 5 Executive Vice President and Taiwan, Korea, and Latin Vice President Boyd A. Davis President and President, America Regions General Manager, General Manager, Chief Executive Officer Intel Capital Digital Home Group Data Center Group Marketing Raheel A. Shah 1 6 Director, Mergers and Acquisitions James D. Plummer Anand Chandrasekher Ravi Jacob David R. Ditzel John M. Fluke Professor Senior Vice President Vice President Chief Architect, of Electrical Engineering General Manager, Intel Labs Treasurer Hybrid Parallel Computing Frederick E. Terman Dean Ultra-Mobility Group Vida Ilderem of the School of Engineering Christian Morales Ricardo J. Echevarria Director, Integrated Platform William M. Holt Stanford University Vice President General Manager, Research Lab Senior Vice President General Manager, Business Client Platform Division David S. Pottruck 2† 5 General Manager, Europe, Middle East, Africa Joseph D. Schutz Chairman and Technology and Gil G. Frostig Director, Microprocessor and Chief Executive Officer Manufacturing Group Stuart C. Pann Director, Low Power Components, Programming Research Red Eagle Ventures, Inc. Vice President Ultra-Mobility Group Renee J. James A San Francisco private General Manager, Wen-Hann Wang Senior Vice President Lisa H. Graff equity firm Business Management Group Director, Circuits and Systems General Manager, General Manager, Enterprise Research Jane E. Shaw 4 5† Software and Services Group Gregory R. Pearson Platforms and Services Division Chairman of the Board Vice President Legal and Corporate Thomas M. Kilroy James A. Johnson General Manager, Affairs Frank D. Yeary 1 3† 6 Senior Vice President General Manager, Worldwide Sales and Vice Chancellor General Manager, Visual Computing Group Peter M. Cleveland Operations Group University of California, Berkeley Sales and Marketing Group Director, Global Public Policy Thomas R. Macdonald Justin R. Rattner David B. Yoffie 2 4† Brian M. Krzanich General Manager, Shelly M. Esque Vice President Max and Doris Starr Vice President Platform Components Group Director, Corporate Affairs Group Director, Intel Labs Professor of International General Manager, President, Intel Foundation Intel Chief Technology Officer Business Administration Manufacturing and Supply Chain Rory M. McInerney Director, Microprocessor Cary I. Klafter Harvard Business School Babak Sabi A. Douglas Melamed Development Group Director, Corporate Legal Vice President Senior Vice President Corporate Secretary Director, FORMER CHIEF General Counsel Raviv Melamed Assembly Test and General Manager, Suzan A. Miller EXECUTIVE OFFICERS Deputy General Counsel AND CHAIRMEN OF Patricia Murray Technology Development Mobile Wireless Group THE BOARD Senior Vice President Sunil R. Shenoy Steven R. Rodgers Director, W. Eric Mentzer Vice President General Manager, Strategy, Deputy General Counsel Gordon E. Moore Human Resources General Manager, Co-Founder Planning, and Operations, Visual and Parallel Computing Sales and Marketing Retired Chief Executive Officer Sohail U. Ahmed Visual and Parallel Computing Group Group and Chairman of the Board Vice President Group Paul Bergevin Director, Kirk B. Skaugen Andrew S. Grove Logic Technology Development Alexander D. Peleg General Manager, Global Vice President, Senior Advisor Director, Intel® Architecture Communications Group Intel® Architecture Group Retired Chief Executive Officer Rani N. Borkar Strategic and Platform Planning General Manager, and Chairman of the Board Vice President and Cross Corporate Platform Nancy Bhagat General Manager, Microprocessor Data Center Group Technology Director, Marketing Strategy Craig R. Barrett and Campaigns Development Group Stacy J. Smith Retired Chief Executive Officer Rama K. Shukla Vice President and Chairman of the Board Diane M. Bryant Director, WiMAX Program Office Christopher J. (CJ) Bruno Vice President Chief Financial Officer President, Intel Americas, Inc. Arthur Rock Isic Silas Chief Information Officer Stephen L. Smith Co-Founder Director, PC Client Program Office Gregory M. Bryant Vice President Retired Chairman of the Board Deborah S. Conrad Director, Global Accounts – Lenovo Vice President Director, Gadi Singer General Manager, System on Chip (Sophia) Lee Fang Chew General Manager, Intel® Architecture 1 (SoC) Enabling Group General Manager, Services Member of Audit Committee Corporate Marketing Group Group Operations 2 Member of Compensation Ton H. Steenman Laura G. Crone Committee Robert B. Crooke Richard G. A. Taylor Vice President General Manager, Embedded and Director, Global Accounts – 3 Vice President Member of Compliance Director, Communications Group Hewlett-Packard Committee General Manager, Intel® Atom™ and Human Resources 4 Thomas H. Swinford Tammy L. Cyphert Member of Corporate System on Chip (SoC) Governance and Nominating Cary I. Klafter General Manager, Director, Global Operations and Development Group Committee Corporate Secretary LAN Access Division Productivity 5 Member of Executive Committee Leslie S. Culbertson Sriram Viswanathan Steven J. Dallman

6 Member of Finance Committee Vice President General Manager, General Manager, Worldwide Director, Finance WiMAX Program Office Reseller Channel Organization † Committee Chairman Corporate Directory (continued)

John E. Davies Information Technology Sunit Rikhi Douglas M. Carmean Legal and Corporate General Manager, General Manager, Custom Larrabee Chief Architect Patricia N. Perry Affairs Intel World Ahead Program Intel® Architecture Foundry General Manager, John H. Crawford David B. Papworth Richard R. Dwyer Customer Capability Ralph A. Schweinfurth Computer Architect Director, Microprocessor Product General Manager, Director, Manufacturing and Development Kumud M. Srinivasan Worldwide Embedded Sales Group Operations Eric Dishman General Manager, Platform Director, Health Innovation Software and Services Gordon G. Graylish Engineering Capability Eamonn Sinnott Group General Manager, Plant Manager, Fab 24 and Fab 10 Joel S. Emer Kimberly S. Stevenson Boris A. Babayan Enterprise Solutions Sales General Manager, Director, General Manager, IT Global Microarchitecture Research Director, Architecture Johan Jervøe Operations and Services Jacklyn A. Sturm Shivnandan D. Kaushik Director, General Manager, Tryggve Fossum Director, Systems Software Creative Services and Digital Technology and Worldwide Materials Director, Manufacturing Group Microarchitecture Development Marketing David J. Kuck Chi-Hwa Tsang Mostafa A. Aghazadeh Director, Parallel and Distributed Jeffrey P. McCrea Director, Thin Films and Chemical Glenn J. Hinton Director, Chandler Assembly Solutions Division Director, Mechanical Polish Technology Director, Technology Development IA-32 Microarchitecture Consumer Channels Group P. Geoffrey Lowney Neil R. Tunmore Development Mohsen Alavi Chief Technology Officer, Arthur W. Roehm Director, Corporate Services Director, Product Quality and Developer Products Division Director, Global Accounts – Dell Karl G. Kempf Reliability Joshua Walden Director, Decision Engineering Technology, Navin Shenoy David A. Baglee General Manager, Fab/Sort Manufacturing Rajesh Kumar Manufacturing, and General Manager, Director, NAND Manufacturing Asia-Pacific Region Director, Enterprise Services and Operations Chiang Yuan Yang Circuit and Low Power Technology and Robert P. Swinnen Peng Bai Director, Intel Mask Operation Technologies General Manager, Manufacturing Group Director, Derivative Logic Siva K. Yerramilli Wesley D. McCullough Service Provider Group Albert Fazio Technology Development General Manager, Design and Director, Ingredient Productization Director, Memory Technology Xu (Ian) Yang Technology Solutions and Customer Enabling, Melton C. Bost Development President, Intel China Ltd. Director, Yield Technology Microprocessor Development Group Paolo A. Gargini Kazumasa Yoshida SENIOR FELLOWS Nasser Bozorg-Grayeli Director, Technology Strategy President, Intel K.K. (Japan) Director, Intel® Architecture Group Thomas A. Piazza Director, Graphics Architecture Corporate Quality Network Stephen S. Pawlowski Tahir Ghani Software and Services Director, Transistor Technology General Manager, Central Shreekant Thakkar Group Robert E. Bruck and Integration, Architecture and Planning Director, General Manager, Technology Portland Technology Development Elliot D. Garbus Platform Architecture, General Manager, Manufacturing Engineering Intel Labs Ultra-Mobility Group Knut S. Grimsrud Visual Computing Software Peter Charvat Justin R. Rattner Director, Storage Architecture Division Director, PTD Patterning and Director, Intel Labs Brendan Traw Chief Technology Officer, Kostas A. Katsohirakis Manufacturing Intel Chief Technology Officer Chia-Hong Jan Digital Home Group Director, System on Chip (SoC) Director, Maxine Fassberg Software and Services Technology Integration Strategic Business Development Plant Manager, Fab 28 Ofri Wechsler Group Director, Mobility Microprocessor Jonathan Khazam General Manager, Intel Israel Kelin J. Kuhn Bryant E. Bigbee Architecture Director, Advanced Device General Manager, Visual and Gulsher S. Grewal Director, Systems Software Technology Parallel Computing Group Raj Yavatkar Plant Manager, D1DR Fab Technology, Director, Jose A. Maiz William A. Savage Timothy G. Hendry System on Chip (SoC) Architecture Director, Logic Technology Quality Director, Manufacturing, and Plant Manager, Fab 11X and Reliability Developer Products Division Enterprise Services Intel Labs Franklin B. Jones Technology and Technology, Genevieve Bell Neal R. Mielke General Manager, Customer Manufacturing Group Director, Interaction and Director, Reliability Methods Manufacturing, and Fulfillment, Planning, and Logistics Enterprise Services Mark T. Bohr Experience Research Paul A. Packman Director, Process Architecture Robin A. Martin Shekhar Y. Borkar Director, Transistor Technology Finance General Manager, and Integration Director, Development James G. Campbell Assembly Test Manufacturing Yan A. Borodovsky Microprocessor Technology Lab Corporate Controller Devadas D. Pillai Director, Advanced Lithography Michael C. Mayberry Vivek K. De Director, Operational Decision Ronald D. Dickel Director, Components Research Robert S. Chau Director, Support Technology Director, Global Tax and Trade Patricia A. McDonald Director, Transistor Research Circuit Technology Research Valluri R. Rao and Nanotechnology Christina S. Min Director, Product Health James P. Held Director, Analytical and Controller, Technology and Enhancement Organization Richard L. Coulson Director, Microsystems Technologies Manufacturing Group Steven C. Megli Director, I/O Architecture Tera-Scale Computing Research Vivek K. Singh Corine Perez General Manager, Ian A. Young Randy Mooney Director, Controller, Assembly Test Manufacturing Computational Lithography Director, Advanced Circuits Director, I/O Research Intel® Architecture Group and Technology Integration Kaizad R. Mistry Mario Paniccia Swaminathan Sivakumar R. Kevin Sellers Director, Director, Director, Lithography Director, Investor Relations Logic Technology Integration FELLOWS Photonics Technology Lab Joseph M. Steigerwald Human Resources John R. Pemberton Intel® Architecture Group Radia Perlman Director, Chemical Mechanical Plant Manager, Fab 32/1 2 Ogden M. Reid Matthew J. Adiletta Director, Polish Technology Director, Thomas A. Rampone Director, Communication Network and Security Technology Clair Webb Compensation and Benefits Infrastructure and Architecture General Manager, Gregory F. Taylor Director, Circuit Technology NAND Solutions Group Ardine Williams Ajay V. Bhatt Chief Architect, Kevin X. Zhang Director, Human Resources Chief Client Architect Integrated Platforms Research Director, Advanced Design Enterprise Services Fayé A. Briggs Richard A. Uhlig Director, Scalable Server Chief Virtualization Architect Architecture Investor Information

Investor materials. Intel’s Investor Relations web site contains company, to reinforce our commitment to conservation and responsible ! management. As part of our effort to further integrate sustainability frequently asked questions, and our online annual report, as well as into the culture at Intel, we continued to include an environmental other useful information. For investor information, including additional component in the formula used to determine the payout for employee ?+/+ˆ variable compensation, and through the Intel Environmental Excellence visit our web site at www.intc.com or call Intel at (408) 765-1480 (U.S.); Awards (now in their 11th year) we recognized our employees around ‰>>Š‹Œ‚>‚‰&Š‰@BŠ@>>>BBB‰Ž!/!Š the world for their projects to reduce environmental impact. We also (81) 298 47 8511 (Japan). continued to collaborate with others to drive global standards for products Intel on NASDAQ.NS(H:$‡:ˆƒ !!+% $JNH(% information is available at www.intel.com/go/environment. Direct stock purchase plan. Intel’s Direct Stock Purchase Plan allows Education initiatives. Intel believes that students everywhere deserve stockholders to reinvest dividends and purchase Intel common stock the skills needed to succeed in a knowledge-based economy. As part on a weekly basis. For more information, contact Intel’s transfer agent, of our efforts to improve teaching and learning through the effective Computershare Investor Services, LLC, by phone at (800) 298-0146 use of technology, and advance math, science, and engineering educa- (U.S. and Canada) or (312) 360-5123 (worldwide), or by e-mail through tion, Intel and the Intel Foundation invest approximately $100 million Computershare’s web site at www.computershare.com/contactus. annually in programs around the world—from professional develop- Transfer agent and registrar. Computershare Investor Services, LLC, ment for teachers to premier science and engineering fairs. In 2010, B)$%J:=$:$ we surpassed the milestone of training over 9 million teachers in more (800) 298-0146 (U.S. and Canada) or (312) 360-5123 (worldwide), than 60 countries through the Intel® Teach Program, founded in 1999. or send e-mail through Computershare’s web site at Complete information is available at www.intel.com/go/educate. www.computershare.com/contactus with any questions regarding The Intel World Ahead Program extends Intel’s efforts to advance the transfer of ownership of Intel stock. progress in accessibility, connectivity, content, and education in the Ernst & Young LLP, world’s developing communities, with a focus on advancing knowledge San Jose, California, USA. and skills development, job growth, and quality of life. Our goals also The Intel® brand. The Intel brand is consistently ranked as one of the include developing PCs tailored to local needs, driving critical con- most recognizable and valuable brands in the world. It represents our nectivity, cultivating sustainable local capabilities, and providing the commitment to moving technology forward and is the embodiment of education needed to make a difference in people’s lives. Complete what we make possible for people everywhere. As the world leader in information is available at www.intel.com/go/worldahead. computing innovation, Intel designs and builds the essential technologies Governance and ethics. Intel is committed to the highest standards that serve as the foundation for the world’s computing devices. of business ethics and corporate governance. Intel is a member of the Corporate responsibility disclosure. Detailed information on our =Hƒ%Ž)!# corporate responsibility and environmental sustainability management to reinforce our commitment to corporate citizenship. We are also J committed to promoting effective governance and responsibility in our !K‡NS% supply chain, and working collaboratively with others in our industry Responsibility Report, prepared using the Global Reporting Initiative’s through the Electronic Industry Citizenship Coalition. Our Corporate G3 Sustainability Reporting Guidelines, details our strategic priorities ƒƒ%%$%]J and performance on a wide variety of environmental, social, and gover- and other related policies are available at www.intel.com/go/governance. nance factors, including workplace practices, community engagement, Awards and recognitions. Each year, Intel receives awards and and supply chain responsibility initiatives. The report and supporting accolades from around the world for our business practices and work materials are available at www.intel.com/go/responsibility. in education, environmental sustainability, the community, and overall Environmental performance. We believe that technology is fundamen- corporate citizenship. In 2010, Fortune featured Intel in its “World’s !S!N J:%QK%]*Q a recognized leader in sustainability for the ways we work to minimize N!HS!B the environmental impacts of our operations and design products that greenest companies in the U.S., received its third Green Power Leader- !N ship Award from the EPA, and was named to the Dow Jones Sustainability Intel was the largest voluntary purchaser of green power according to Indexes for the 12th year in a row. Intel also received the 2010 the U.S. Environmental Protection Agency (EPA), and we announced Corporate Engagement Award from the Points of Light Institute for our plans for a third party to construct and operate eight solar installations employees’ outstanding commitment to their communities. Information at our facilities in the U.S. We also adopted a new water policy for the on additional awards is available at www.intel.com/go/awards.

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