DOCSLIB.ORG

Cadence Design Systems, Inc. 2021 Proxy Statement

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Cadence Design Systems, Inc. 2021 Proxy Statement NOTICE OF 2021 ANNUAL MEETING OF STOCKHOLDERS The 2021 Annual Meeting of Stockholders of CADENCE DESIGN SYSTEMS, INC., a Delaware corporation, will be held as follows: When: Where: May 6, 2021 Virtual Meeting 1:00 p.m. Pacific Time www.meetingcenter.io/226058748 Items of Business: The purpose of the 2021 Annual Meeting of Stockholders is to consider and take action on the following: 1. To elect the nine directors named in the proxy statement to serve until the 2022 Annual Meeting of Stockholders and until their successors are elected and qualified, or until the directors’ earlier death, resignation or removal. 2. To vote on an advisory resolution to approve named executive officer compensation. 3. To ratify the selection of PricewaterhouseCoopers LLP as the independent registered public accounting firm of Cadence for its fiscal year ending January 1, 2022. 4. To vote on a stockholder proposal regarding action by written consent, if properly presented at the meeting. 5. To transact such other business as may properly come before the meeting or any adjournment or postponement thereof. These items of business are more fully described in the proxy statement accompanying this notice. Record Date: Holders of Cadence Design Systems, Inc. common stock at the close of business on March 8, 2021 are entitled to notice of and to vote at the 2021 Annual Meeting of Stockholders and any adjournment or postponement thereof. How to Vote: Your vote is important to us. Please cast your vote promptly via the internet, telephone or mail. Specific instructions on how to vote are included in the Notice of Internet Availability of Proxy Materials that Cadence will mail to its stockholders as of the Record Date on or about March 26, 2021. You will also be able to vote your shares electronically during the virtual 2021 Annual Meeting. How to Attend: Due to the public health impact of the COVID-19 pandemic, Cadence’s 2021 Annual Meeting will be held online at www.meetingcenter.io/226058748 via live audio webcast. Stockholders will be able to attend and participate in the annual meeting online, vote their shares electronically, view the list of registered stockholders as of the Record Date and submit questions through the virtual meeting platform during the meeting. Please refer to the “Information About the Annual Meeting” section of this proxy statement for detailed instructions on how to register for and attend the 2021 Annual Meeting. By Order of the Board of Directors, San Jose, California Alinka Flaminia March 26, 2021 Senior Vice President, Chief Legal Officer and Corporate Secretary TABLE OF CONTENTS Proxy Statement ............................................................................. 1 Letter from the Chairman of the Board ........................................................... 1 Corporate Governance ........................................................................ 3 Board of Directors ............................................................................ 7 Stockholder Engagement ...................................................................... 20 Matters to Be Considered at the Annual Meeting ................................................... 23 Proposal 1: Election of Directors ................................................................ 23 Proposal 2: Advisory Resolution to Approve Named Executive Officer Compensation .................... 31 Proposal 3: Ratification of the Selection of the Independent Registered Public Accounting Firm ............ 32 Report of the Audit Committee .................................................................. 33 Fees Billed to Cadence by the Independent Registered Public Accounting Firm During Fiscal 2020 and 2019 .... 34 Proposal 4: Stockholder Proposal ............................................................... 36 Security Ownership of Certain Beneficial Owners and Management ................................... 40 Compensation Discussion and Analysis .......................................................... 43 Compensation Committee Report ............................................................... 57 Compensation Committee Interlocks and Insider Participation ........................................ 58 Compensation of Executive Officers ............................................................. 59 Potential Payments Upon Termination or Change in Control ......................................... 68 Equity Compensation Plan Information ........................................................... 75 Pay Ratio Disclosure .......................................................................... 76 Certain Transactions .......................................................................... 79 Information About the Annual Meeting ............................................................ 82 Other Matters ................................................................................ 89 PROXY STATEMENT LETTER FROM THE CHAIRMAN OF THE BOARD Dear Cadence stockholders: My fellow directors and I have been keenly focused this year on overseeing the execution of Cadence’s business strategy and prudent risk management while navigating the evolving challenges presented by COVID-19. I am pleased to communicate with you about several of the board’s priorities and actions since the 2020 annual meeting. The board of directors of Cadence represents your interests as we work towards creating sustainable long-term value in an uncertain and dynamic environment. Business Strategy and Risk Management Over the past year, the board and management of Cadence oversaw unprecedented adjustments to our operations in order to safeguard the health and well-being of our employees, customers, vendors and our broader communities. As the pandemic unfolded, we transitioned from approximately 50 global sites to a distributed workforce in over 8,000 homes. Our leadership and employees have risen to the challenge and have maintained high levels of innovation and productivity during this difficult time, enabling us to effectively execute on our strategic priorities and achieve outstanding business results. In 2020, we continued to further our Intelligent System Design™ strategy to deliver computational software, hardware and IP offerings to customers that are innovating the next generation of electronic products and systems that keep us safe, healthy and connected. I am proud that the company’s agility and resilience have enabled us to accelerate our momentum at marquee customer accounts, expand our portfolio through compelling acquisitions and organic growth, and win customers in targeted vertical segments. Corporate Social Responsibility and Human Capital Management If there is a silver lining to a year marked by extraordinary macro challenges, it is that it has served as a reminder of the importance of community and connection. Our One Cadence–One Team culture underpins our firm belief that the best ideas come from inclusive collaboration, and that a diverse, highly supported and engaged workforce is critical to the foundation of our business success. The events of this year have prompted us to intensely focus on the physical and mental health of our employees, and further our deep commitment to address gender and racial disparities in our workforce, which remain a particular challenge in our industry. In 2020, we continued to expand and deepen our environmental initiatives. Among our efforts to be a responsible organization that positively impacts society, we are actively investing in initiatives to help combat global climate change by reducing our environmental footprint. Using 2019 as a baseline, we have set a target to reduce our greenhouse gas Scope 1 and Scope 2 emissions by 15% by 2025. In addition, Cadence continues to advance technologies that enable the design of high-performance systems with progressively lower power consumption, an essential driver for the electronics industry that ripples through our ecosystem. I encourage you to review the Corporate Social Responsibility section of this proxy statement, as well as our 2020 Sustainability Report, which is available on the Corporate Social Responsibility page at www.cadence.com, for more information on all of our environmental, social and governance initiatives. 1 Ongoing Board and Management Succession Planning Succession planning at the board and senior management levels remains a key focus. We discuss board refreshment regularly as we work to ensure that the board continues to be comprised of individuals with relevant expertise, integrity, experience, skills, judgment, and diversity of background. In January 2021, we appointed Julia Liuson to the board and its strategy committee. Julia brings to our board deep technology and operational expertise coupled with strong domain knowledge from her long-time service as an executive at Microsoft. We also adjusted the composition of several of our board committees, including appointing Lewis Chew as audit committee chair, in 2020. Earlier this month, our colleague Sue Bostrom decided to step down from the board upon the expiration of her term at the upcoming 2021 annual meeting. My fellow directors and I thank her for her dedicated long-time service, including her steadfast leadership of our strategy committee. Cadence benefited greatly from the perspectives that Sue brought to the boardroom, and as we look to the future of Cadence’s board, we remain committed to seeking out diverse leaders who can apply their unique and valuable experiences to the stewardship of our company.
Load more

Recommended publications
  • Cadence SPB / Orcad 17.4 System Requirements
    A Parallel Systems Technical Note Cadence SPB / OrCAD 17.4 System Requirements Supported Operating Systems Windows 10 (64-bit) Professional, including Dark Theme mode Windows Server 2012 (All Service Packs) Windows Server 2012 R2 Windows Server 2016 Note: Cadence Allegro and OrCAD products do not support Windows 10 Starter and Home Basic. In addition, Windows Server support does not include support for Windows Remote Desktop. Windows RT and Tablets/Phones, including Windows 10 Phone, are not supported. Note: 64-bit Windows require 64-bit Flex software dongle drivers if using dongle-based licensing. Recommended Hardware Intel® Core™ i7 4.30 GHz or AMD Ryzen™ 7 4.30 GHz with at least 4 cores Note: Faster processors are preferred. 16 GB RAM 50 GB free disk space (SSD drive is recommended) 1920 x 1200 display resolution with true color (at least 32bit colour) A dedicated graphics card supporting OpenGL, minimum 2GB (with additional support for DX11 for 3D Canvas) Dual monitors (For physical design) Broadband Internet connection for some service Ethernet port/card (for network communications and security hostID) Three-button Microsoft-compatible mouse Supported MATLAB Version R2019A-64Bit (For the PSpice-MATLAB interface) Microsoft SharePoint for Allegro Pulse Cadence® Allegro® Pulse supports an interface to Microsoft SharePoint. Following are the requirements for SharePoint: • Windows Server 2012 (64-bit) • SharePoint Foundation 2013 • Microsoft SQL Server 2012 (64-bit) • Following 64-bit browsers: • Microsoft® Internet Explorer® 11.0 on windows • Mozilla Firefox 52.0 ESR on Windows • Mozilla Firefox 52.0 on Linux • Google Chrome 58.0 on Windows Using Spaces in File and Directory Names Support for spaces in file and directory names applies only to Windows.
    [Show full text]
  • The Evolving Role of Semiconductor Consortia in the United States and Japan
    Portland State University PDXScholar Business Faculty Publications and Presentations The School of Business Fall 1998 The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham University of California - Berkeley Greg Linden University of California - Berkeley Melissa M. Appleyard Portland State University, [email protected] Follow this and additional works at: https://pdxscholar.library.pdx.edu/busadmin_fac Part of the Business Administration, Management, and Operations Commons Let us know how access to this document benefits ou.y Citation Details Ham, R., Linden, G., & Appleyard, M. M. (1998). The Evolving Role of Semiconductor Consortia in the United States and Japan. California Management Review, 41(1), 137-163. This Article is brought to you for free and open access. It has been accepted for inclusion in Business Faculty Publications and Presentations by an authorized administrator of PDXScholar. Please contact us if we can make this document more accessible: [email protected]. The Evolving Role of Semiconductor Consortia in the United States and Japan Rose Marie Ham Greg Linden Melissa M. Appleyard ince the late 1970s, governments throughout the industrialized economics have proclaimed the benefits of research consortia. In the United States, tor example, ihe 1984 National Cooperative Research SAct (NCRA) relaxed U.S. antitrust laws to encourage the formation of research consortia hy firms in the same industry; by the end of 1995, over 575 consortia had heen registered under the NCRA in a variety of
    [Show full text]
  • GS40 0.11-Μm CMOS Standard Cell/Gate Array
    GS40 0.11-µm CMOS Standard Cell/Gate Array Version 1.0 January 29, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.
    [Show full text]
  • TJR-1197 Goodbye.Pdf
    CYPRESS SEMICONDUCTOR CORPORATION Internal Correspondence Date: August 19, 2016 WW: 3316 To: All Cypress Employees Author: T.J. Rodgers Author File#: TJR#1197 Subject: Goodbye cc: BoD, Jim Collins, Larry Sonsini It’s 2:30 in the afternoon on August 17, my last official day at Cypress. After packing my stuff, I realized there were goodbyes to write. So, this won’t be a typical “TJ memo,” revised 10 times, logical and filled with fact-checked data; it will be more stream-of-consciousness in style. In a way, writing this memo is like talking to your wife of 34 years, while she’s on her deathbed. What do you say? I’ve enjoyed being with you? We’ve done a lot of good things together? There are really no appropriate words. But, perhaps there are. In the 1970 movie Patton, as the General leaves his command, he says, “Gentlemen, all good things must come to an end. And the best thing that has happened to me in my life has been the honor and privilege of commanding the 3rd Army. Goodbye, and God bless you.” This is the way I feel about Cypress. We have a lot to be proud of. Cypress was founded in December 1982, when there were 59 publically traded American chip companies. Today, only 15 of them are left—and we are one of the 15. That statement applies to every Cypress employee, whether you came from old Cypress, Spansion, Fujitsu, Broadcom or Ramtron. Each of us has made it in the industry for a long time; we all now fight together under one flag; and we’re all still around because we’ve earned the right to be.
    [Show full text]
  • Timeline of the Semiconductor Industry in South Portland
    Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts.
    [Show full text]
  • Pcn Wafer Foundry Site Qualification Template
    Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600 PRODUCT CHANGE NOTIFICATION PCN: PCN170501 Date: February 28, 2017 Subject: Qualification of Texas Instruments’ DMOS6 as an Additional Wafer Fab Site, Cypress’ Test 25 as an Additional Wafer Sort Site for 2Mb F-RAM Serial Product Family To: FUTURE ELECTRONICS FUTURE ELE [email protected] Change Type: Major Description of Change: Cypress announces the qualification of Texas Instruments DMOS6 as an additional wafer fab site and Test 25 as an additional wafer sort site for its 2Mb F-RAM Serial Product Family. This qualification is part of the flexible manufacturing initiative which allows Cypress to meet its delivery commitments in dynamic, changing market conditions. Benefit of Change: By adding the DMOS6 and Test 25 sites, Cypress will have the added capability to meet upside market demand, and ensure consistent and reliable delivery to customers. Affected Parts: 6 Part Numbers Affected: See the attached ‘Affected Parts List’ file for a list of all part numbers affected by this change. Note that any new parts that are introduced after the publication of this PCN will include all changes outlined in this PCN. Qualification Status: The changes listed in this PCN have been qualified through a series of tests documented in the Qualification Test Plan (QTP) reports indicated in the table below. These qualification reports can be found as attachments to this notification or by visiting www.cypress.com and typing the QTP number in the keyword search window. Qualification QTP Report Number TI DMOS6 Wafer Fab for 64Kb F-RAM Serial Industrial-Grade 143905 FRAM Wafer Sort at Test 25 Site Sample Status: Qualification samples are not built ahead of time for all part numbers affected by this change.
    [Show full text]
  • Designcon 2016 Needs and Capabilities for Modeling Of
    DesignCon 2016 Needs and Capabilities for Modeling of Capacitor Derating Panel discussion Brad Brim, Cadence Design Systems Istvan Novak, Oracle Tim Michalka, Qualcomm Technologies Wilmer Companioni, KEMET Electronics Shoji Tsubota, Murata Manufacturing Sam Chitwood, Cadence Design Systems Abstract Capacitors vary with temperature, bias voltage and age; a phenomenon typically referred to as derating. Libraries of SPICE or S-parameter models are provided by component manufacturers for non-derated components - new capacitors at a specific temperature and bias. Detailed derating data and related methodologies are often considered manufacturer-proprietary. Some manufacturers provide software to generate and display derated models while others specify general derating behavior in data sheets. OEMs have expressed a desire for more detailed and automated power integrity analyses to consider derating effects. Representatives from component manufacturers, OEMs and EDA will discuss these analysis needs and the electrical models required to support such. Audience participation is strongly encouraged to help judge the breadth of industry need in this area and help influence future contributions. TITLE Needs and Capabilities for Modeling of Capacitor Derating Moderator: Image Brad Brim (Cadence) Participants: Istvan Novak (Oracle) Tim Michalka (Qualcomm) Wilmer Companioni (KEMET) Shoji Tsubota (Murata) Sam Chitwood (Cadence) Needs and Capabilities for Modeling of Capacitor Derating Brad Brim (Cadence) 1 Moderator Brad Brim Product Engineering Architect, Cadence Design Systems [email protected] Brad has been in the EDA industry for more than 25 years. His graduate studies and initial commercial contributions were in the area of electromagnetic simulation and passive component modeling for circuit simulation. Some of the products he has worked on include: Momentum, ADS, HFSS, PowerSI and OptimizePI.
    [Show full text]
  • Cad Veteran Richard Smith Joins Micro Magic, Inc. As Senior Technical Advisor
    CAD Veteran Richard Smith Joins Micro Magic, Inc. Press Release CAD VETERAN RICHARD SMITH JOINS MICRO MAGIC, INC. AS SENIOR TECHNICAL ADVISOR “Dick brings a tremendous Sunnyvale, California -- June 7, 1999 -- Micro Magic, Inc. wealth of technical and (MMI) today announced the appointment of Dr. Richard business experience in C. Smith as senior technical advisor. Smith comes to MMI EDA to Micro Magic from Cadence Design Systems, Inc., where he was most re- and its customers. Dick cently a senior program manager in consulting services. At will be responsible for Cadence, he also served in software support management assisting with product and as the program manager for the Texas Instruments needs and definitions and account. Smith has held technical and management posi- for launching a design tions with Texas Instruments, National Semiconductor, and center and sales support capability in the Central Hewlett-Packard. region of the U.S.” Mark Santoro, MMI's president and CEO, stated, "Dick Mark Santoro President brings a tremendous wealth of technical and business expe- and CEO Micro Magic, rience in EDA to Micro Magic and its customers. Dick will Inc. be responsible for assisting with product needs and defini- tions and for launching a design center and sales support Contact: Heidi Vantulden capability in the Central region of the U.S." Armstrong Kendall, Inc. 503-672-4685 "MMI has a fresh new approach to EDA. It's a company of highly skilled design engineers who create very high per- heidi@armstrongkendall. formance processors and memories, and the EDA software com environment for managing the entire process," stated Dr.
    [Show full text]
  • Exhibit 21.1 SUBSIDIARIES of CYPRESS SEMICONDUCTOR
    Exhibit 21.1 SUBSIDIARIES OF CYPRESS SEMICONDUCTOR CORPORATION Name Jurisdiction of Incorporation Cypress Semiconductor Corporation United States Of America Cascade Semiconductor Corporation United States Of America CY Holding One LLC United States Of America CY Holding Two LLC United States Of America CY Support Mexico Cyland Corporation Philippines Cypress Manufacturing, Ltd. Cayman Islands Cypress Microsystems, Inc. United States Of America Cypress Semiconductor (China) Company Limited China Cypress Semiconductor (Luxembourg) Sarl Luxembourg Lara (CSC) -Mauritius LLC Mauritius Cypress Semiconductor (Minnesota) Inc. United States Of America Cypress Semiconductor (Scandinavia) AB Sweden Cypress Semiconductor (Switzerland) Sarl Switzerland Cypress Semiconductor (Texas) Inc. United States Of America Cypress Semiconductor (Thailand) Co., Ltd. Thailand Cypress Semiconductor (UK) Limited United Kingdom Cypress Semiconductor Canada Canada Cypress Semiconductor Corporation (Belgium) Belgium Cypress Semiconductor GmbH Germany Cypress Semiconductor Holding One LLC United States Of America Cypress Semiconductor International (Hong Kong) Limited Hong Kong Cypress Semiconductor International Sales B.V. Netherlands Cypress Semiconductor Intl Inc. United States Of America Cypress Semiconductor Ireland Ireland Cypress Semiconductor Italia S.r.l. Italy Cypress Semiconductor K.K. Japan Japan Cypress Semiconductor Korea Ltd. Korea Cypress Semiconductor Phil. Headquarters Ltd. Cayman Islands Cypress Semiconductor Procurement LLC United States Of America Cypress Semiconductor Round Rock, Inc. United States Of America Cypress Semiconductor SARL France Cypress Semiconductor Singapore Pte. Ltd Singapore Cypress Semiconductor Solutions Mexico Cypress Semiconductor Taiwan Taiwan Cypress Semiconductor Tech. India Ltd. India Cypress Semiconductor Technology (Shanghai) Co., Ltd. China Cypress Semiconductor Technology Ltd. Cayman Islands Cypress Semiconductor World Trade Corp. Cayman Islands Cypress EnviroSystems Corporation United States Of America Cypress Venture Fund I, L.L.C.
    [Show full text]
  • GS30 Product Overview
    GS30 0.15-µm CMOS Standard Cell/Gate Array Version 1.0 February, 2001 Copyright Texas Instruments Incorporated, 2001 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the materials, methods, techniques, or apparatus described herein are the exclusive property of Texas Instruments. No disclosure of information or drawings shall be made to any other person or organization without the prior consent of Texas Instruments. IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this war- ranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WAR- RANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.
    [Show full text]
  • Cadence Design Systems, Inc
    Confidential Cadence Design Systems, Inc. February/March 2019 Safe Harbor Statement and Regulation G Safe Harbor Statement The following discussion contains forward looking statements, and our actual results may differ materially from those expectations discussed here. Additional information concerning factors that could cause such a difference can be found in our Form 10-Q for the quarter ended September 29, 2018, our Form 10-K for the year ended December 29, 2018, the company’s future filings with the Securities and Exchange Commission and the cautionary statements regarding forward-looking statements in our February 19, 2019 earnings press release for the quarter ended December 29, 2018. Regulation G In addition to financial results prepared in accordance with Generally Accepted Accounting Principles, or GAAP, this presentation will also contain certain non-GAAP financial measures. Cadence management believes that in addition to using GAAP results in evaluating our business, it can also be useful to measure results using certain non-GAAP financial measures. Investors and potential investors are encouraged to review the reconciliation of non-GAAP financial measures with their most direct comparable GAAP financial results, including those set forth in our February 19, 2019 press release and our CFO Commentary for the quarter ended December 29, 2018, both of which can be found in the quarterly earnings section of the investor relations portion of our website at cadence.com. 2 © 2019 Cadence Design Systems, Inc. All rights reserved. Cadence-at-a-glance • Leading provider of system design enablement (SDE) solutions – software, hardware, and IP • Mission critical technology for designing today’s electronic systems • Culture of innovation - more than 20 significant new products in last 3 years • Subscription software model with very high customer renewal rates and loyalty • Revenue: ~$2.14B • Headquarters in Silicon Valley ~7500 employees worldwide NASDAQ: CDNS; S&P 500 & Nasdaq 100 indexes 3 © 2019 Cadence Design Systems, Inc.
    [Show full text]
  • Discrete Semiconductor Products Fairchild@50
    Fairchild Oral History Panel: Discrete Semiconductor Products Fairchild@50 (Panel Session # 3) Participants: Jim Diller Bill Elder Uli Hegel Bill Kirkham Moderated by: George Wells Recorded: October 5, 2007 Mountain View, California CHM Reference number: X4208.2008 © 2007 Computer History Museum Fairchild Semiconductor: Discrete Products George Wells: My name's George Wells. I came to Fairchild in 1969, right in the midst of the Hogan's Heroes, shall we say, subculture, at the time. It was difficult to be in that environment as a bystander, as someone watching a play unfold. It was a difficult time, but we got through that. I came to San Rafael, Wilf asked me to get my ass up to San Rafael and turn it around or shut it down. So I was up in San Rafael for a while, and then I made my way through various different divisions, collecting about 15 of them by the time I was finished. I ended up as executive vice president, working for Wilf, and left the company about a year and a half after the Schlumberger debacle. That's it in a nutshell. Let me just turn over now to Uli Hegel, who was with Fairchild for 38 years, one of the longest serving members, I believe, in the room. Maybe the longest serving member. Uli, why don't you tell us what you did when you came, when you came and what jobs you had when you were there. Uli Hegel: I came to Fairchild in 1959, September 9, and hired into R&D as a forerunner to the preproduction days.
    [Show full text]