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Intel Tiger Lake I7 CPU| Sample 1 Table of Contents REVERSEREVERSE COSTING COSTING® –®STRUCTURE?– STRUCTURAL, PROCESS PROCESS AND & COST REPORT CLICKIntel TigerTO EDIT Lake MASTER i7 CPU TITLE STYLE Intel’s 11th-generation core processor using its latest 10nm SuperFin process. SPR21636 - Integrated Circuit report by Belinda Dube & Don Scansen Physical analysis by Veronique Le Troadec August 2021 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 1 Table of Contents Overview / Introduction 4 Manufacturing Process 106 o Executive Summary o Die 1 Front-End Process & Fabrication Unit o Reverse Costing Methodology o Die 2 Front-End Process & Fabrication Unit Company Profile 10 o Final Test & Packaging Fabrication unit o Intel Company Profile& Products o Summary of the main parts o Intel Processors Cost Analysis 112 o Summary of the cost analysis 113 o Intel Locations o Yields Explanation & Hypotheses 116 o Market share, Revenue & Shipments o Processor Die 1 118 Physical Analysis 18 ✓ Die Front-End Cost o Summary of the Physical Analysis 19 ✓ Die Probe Test, Thinning & Dicing o Package Intel Tiger Lake i7 23 ✓ Die Wafer Cost ✓ Module Views ✓ Die Cost ✓ Package Dimensions o Processor Die 2 122 ✓ Package X-Ray Images ✓ Die Front-End Cost ✓ Package Cross section ✓ Die Probe Test, Thinning & Dicing o Processor Die 1 61 ✓ Die Wafer Cost ✓ Die 1 View & Dimensions ✓ Die Cost ✓ Die 1 Delayering & main Blocs o Packaged Intel Tiger Lake i7 126 ✓ Die 1 Die Process ✓ Packaging Cost ✓ Die 1 Die Cross-Section ✓ Component Cost ✓ Die 1 Die Process Characteristic Selling price 128 o Processor Die FloorPlan and TEM analysis on FinFET 78 Feedback 132 o Processor Die 2 93 System Plus Consulting Services 136 ✓ Die 2 View & Dimensions ✓ Die 2 Delayering & main Blocs ✓ Die 2 Die Process ✓ Die 2 Cross-Section ✓ Die 2 Process Characteristic ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 2 Executive Summary Overview / Introduction o Executive Summary The CPU market is constantly growing. According to Yole’s Quarterly Market Monitor, the processor market generated more than o Datasheet US $60B in 2020, with more than 100 million CPUs shipped in Q1 2021. This market is competitive and dominated by a few major o Reverse Costing Methodology players, including Intel – whose next-generation processors could potentially increase the company’s market share. o Glossary th Physical Analysis Tiger Lake is the name of Intel’s 11 -generation core processor. It is the latest laptop processor from Intel and uses the company’s 10nm SuperFin process technology and its 14nm processor chip. This ‘two-chip solution’ approach allows Intel to split off some Manufacturing Process Flow functions into a less advanced, cheaper process node. The chips are designed for mainstream, powerful, ultralight laptops, and Cost Analysis Intel’s Tiger Lake i7 processors have enhanced performance coupled with lower power consumption. Moreover, the chip includes Selling Price Analysis Intel’s new XE graphics. Feedback This 11th-generation core processor uses a 10nm FinFET process with enhanced performance compared to the previous 10nm Related Analyses process. The chip includes a large, embedded graphic – in fact, the Intel Iris XE graphics section occupies close to a third of the About System Plus Consulting chip area. For improved power management and low-power performance, the Intel Tiger Lake design includes several fully integrated voltage regulator blocks. The Intel Tiger Lake i7 SoC also features a very large graphics processing unit. A full teardown was conducted to provide insights regarding the Intel Tiger Lake i7 CPU, and this report details the die layout in the package and features multiple analyses, including the 3D x-ray images. A package analysis reveals a BGA package that integrates two processors in flip chip position. This package includes two of Intel’s chips: one CPU using 10nm SuperFin and another CPU using14nm FinFET. Our floorplan analysis reveals the high-level chip architecture and an estimation of IP block area. Our front-end analysis uses a high-resolution TEM cross-section to expose Intel’s 10nm process, along with delayering images, while our back- end analysis uses CT-scan (3D x-ray) to reveal the layout structure of the package and the dies. Furthermore, this report provides high-resolution images, a materials analysis, and a detailed manufacturing process. Lastly, an estimation of the wafer cost, die cost, and component cost is furnished. ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 3 PHYSICAL ANALYSIS Module Overview- Teradown Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 5 Package X-Ray Images Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting 3D Package X-Ray Image ©2021 by System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 6 Package X-Ray Images Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 7 Package Cross-Section – Processor Die 1 Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 8 Package Cross-Section – Processor Die 1 Copper pillars Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting Copper pillar EDX Analysis ©2021 by System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 9 Package Cross-Section – Package Die 2 copper pillars Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting Package Cross-section( under die 2) – Optical View ©2021 by System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 10 Die 1 Process – Technology Node Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting Die 1 FinFET transistors- SEM View ©2021 by System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 11 Die 1 Process Cross-Section – Metal Layers Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 12 Die 1- Floorplan – High Level IP Blocks Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing
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