Intel Tiger Lake I7 CPU| Sample 1 Table of Contents

REVERSEREVERSE COSTING COSTING® –®STRUCTURE?– STRUCTURAL, PROCESS PROCESS AND & COST REPORT

CLICKIntel TigerTO EDIT Lake MASTER i7 CPU TITLE STYLE Intel’s 11th-generation core processor using its latest 10nm SuperFin process. SPR21636 - Integrated Circuit report by Belinda Dube & Don Scansen Physical analysis by Veronique Le Troadec August 2021 – Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 1 Table of Contents

Overview / Introduction 4 Manufacturing Process 106 o Executive Summary o Die 1 Front-End Process & Fabrication Unit o Reverse Costing Methodology o Die 2 Front-End Process & Fabrication Unit Company Profile 10 o Final Test & Packaging Fabrication unit o Intel Company Profile& Products o Summary of the main parts o Intel Processors Cost Analysis 112 o Summary of the cost analysis 113 o Intel Locations o Yields Explanation & Hypotheses 116 o Market share, Revenue & Shipments o Processor Die 1 118 Physical Analysis 18 ✓ Die Front-End Cost o Summary of the Physical Analysis 19 ✓ Die Probe Test, Thinning & Dicing o Package Intel Tiger Lake i7 23 ✓ Die Wafer Cost ✓ Module Views ✓ Die Cost ✓ Package Dimensions o Processor Die 2 122 ✓ Package X-Ray Images ✓ Die Front-End Cost ✓ Package Cross section ✓ Die Probe Test, Thinning & Dicing o Processor Die 1 61 ✓ Die Wafer Cost ✓ Die 1 View & Dimensions ✓ Die Cost ✓ Die 1 Delayering & main Blocs o Packaged Intel Tiger Lake i7 126 ✓ Die 1 Die Process ✓ Packaging Cost ✓ Die 1 Die Cross-Section ✓ Component Cost ✓ Die 1 Die Process Characteristic Selling price 128 o Processor Die FloorPlan and TEM analysis on FinFET 78 Feedback 132 o Processor Die 2 93 System Plus Consulting Services 136 ✓ Die 2 View & Dimensions ✓ Die 2 Delayering & main Blocs ✓ Die 2 Die Process ✓ Die 2 Cross-Section ✓ Die 2 Process Characteristic

Overview / Introduction o Executive Summary The CPU market is constantly growing. According to Yole’s Quarterly Market Monitor, the processor market generated more than o Datasheet US $60B in 2020, with more than 100 million CPUs shipped in Q1 2021. This market is competitive and dominated by a few major o Reverse Costing Methodology players, including Intel – whose next-generation processors could potentially increase the company’s market share. o Glossary th Physical Analysis Tiger Lake is the name of Intel’s 11 -generation core processor. It is the latest laptop processor from Intel and uses the company’s 10nm SuperFin process technology and its 14nm processor chip. This ‘two-chip solution’ approach allows Intel to split off some Manufacturing Process Flow functions into a less advanced, cheaper process node. The chips are designed for mainstream, powerful, ultralight laptops, and Cost Analysis Intel’s Tiger Lake i7 processors have enhanced performance coupled with lower power consumption. Moreover, the chip includes Selling Price Analysis Intel’s new XE graphics. Feedback This 11th-generation core processor uses a 10nm FinFET process with enhanced performance compared to the previous 10nm Related Analyses process. The chip includes a large, embedded graphic – in fact, the Intel Iris XE graphics section occupies close to a third of the About System Plus Consulting chip area. For improved power management and low-power performance, the Intel Tiger Lake design includes several fully integrated voltage regulator blocks. The Intel Tiger Lake i7 SoC also features a very large graphics processing unit.

A full teardown was conducted to provide insights regarding the Intel Tiger Lake i7 CPU, and this report details the die layout in the package and features multiple analyses, including the 3D x-ray images. A package analysis reveals a BGA package that integrates two processors in flip chip position. This package includes two of Intel’s chips: one CPU using 10nm SuperFin and another CPU using14nm FinFET. Our floorplan analysis reveals the high-level chip architecture and an estimation of IP block area. Our front-end analysis uses a high-resolution TEM cross-section to expose Intel’s 10nm process, along with delayering images, while our back- end analysis uses CT-scan (3D x-ray) to reveal the layout structure of the package and the dies. Furthermore, this report provides high-resolution images, a materials analysis, and a detailed manufacturing process. Lastly, an estimation of the wafer cost, die cost, and component cost is furnished. ©2021 by System Plus Consulting | SPR21636 - Intel Tiger Lake i7 CPU| Sample 3 PHYSICAL ANALYSIS Module Overview- Teradown

Overview / Introduction Physical Analysis o Summary o Package o Module Overview o Views & Dimensions o X-Ray Images o Cross-Section o Die 1 o Views & Dimensions o Delayering o Die Process o Die Cross-section o Die 1 FloorPlan o Die 2 o Views & Dimensions o Delayering o Die Process o Die Cross-section Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Analyses About System Plus Consulting

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow o Processor Die 1 Front-End Process o Die 1 Fabrication Unit o Processor Die 2 Front-End Process o Die 2 Fabrication Unit o Final Test & Assembly Unit

Cost Analysis

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting

Note: The process flow of this technology is standard. The above parameters are enough to estimate the manufacturing cost of the die.

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Processor Die 1 Front End o Processor Die 1 Cost o Processor Die 2 Front End o Processor Die 2 Cost o Assembly Cost o Complete Module Cost

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis o Definitions of Price o Manufacturer Financials o Component Price

Feedback

Related Analyses

About System Plus Consulting

Overview / Introduction

Company Profile & Supply RELATED REPORTS RELATED MONITORS Chain

Physical Analysis By System Plus Consulting: By System Plus Consulting: • Apple M1 System-On-Chip • Smartphone Monitor Manufacturing Process Flow

Cost Analysis • Qualcomm Snapdragon 888 System on Chip with 5G By Yole Développement: Selling Price Analysis Modem • Processor Quarterly Market Feedback Monitor • Ambarella CV2 Computer Related Analyses Vision SoC

About System Plus Consulting

Overview / Introduction

Company Profile & Supply A Structure, Process and Cost Analysis Chain

Physical Analysis Reverse Costing® consists of disassembling a device or a system in order

Manufacturing Process Flow to identify its technology and discern its manufacturing processes and

Cost Analysis then using in-house models and tools to determine its cost.

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting o Company services o Contact

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedback

Related Analyses

About System Plus Consulting o Company services o Contact

Overview / Introduction

Company Profile & Supply Chain

Physical Analysis Manufacturing Process Flow Custom Cost Cost Analysis Monitor Analysis Methods Selling Price Analysis 1 per year 150 custom Training quarterly Feedback analyses per On demand updated year Related Analyses

About System Plus Consulting o Company services o Contact Report Teardown Costing 60+ per year Track Tools 205+ 5 process-based teardowns per and 3 parametric year costing tools

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis Frankfurt Feedback

Related Analyses Nantes Boise Seoul Phoenix Raleigh About System Plus Consulting Lyon Austin Cornelius o Company services o Contact Shenzhen Tokyo

Hsinchu

Singapore

Overview / Introduction REPORTS, MONITORS & TRACKS Company Profile & Supply Chain Europe and RoW Western US & Canada Korea Lizzie Levenez - [email protected] Steve Laferriere - [email protected] Peter Ok - [email protected] Physical Analysis +49 15 123 544 182 + 1 310 600 8267 +82 10 4089 0233 Manufacturing Process Flow Benelux, UK & Scandinavia Eastern US & Canada Japan Cost Analysis Marine Wybranietz - [email protected] Chris Youman - [email protected] Miho Ohtake - [email protected]

Selling Price Analysis +49 69 96 21 76 78 +1 919 607 9839 +81 34 4059 204

Feedback South Germany & France India and RoA Japan and Singapore Martine Komono - [email protected] Takashi Onozawa - [email protected] Itsuyo Oshiba - [email protected] Related Analyses +49 173 69 43 31 +81 80 4371 4887 +81 80 3577 3042 About System Plus Consulting o Company services DACH (North Germany, Austria, Switzerland) Greater China Japan o Contact Neha CHAUDHURY - [email protected] Mavis Wang - [email protected] Toru Hosaka – [email protected] +49 172 97 47 248 +886 979 336 809 +86 136 6156 6824 +81 90 1775 3866

HEADQUARTER REPORTS & MONITORS WEBSITE MARKETING, COMMUNICATION & PR & CUSTOM PROJECT SERVICES www.systemplus.fr Jean-Christophe Eloy, Marketing & 22 Bd Benoni Goullin Communication 44200 Nantes, France TRACKS WEBSITE [email protected] - +33 686 68 19 31 [email protected] - +33 2 40 18 09 16 Sandrine Leroy, Public Relations www.reverse-costing.com [email protected] - +33 4 72 83 01 89