Hardware-Enabled Security: 3 Enabling a Layered Approach to Platform Security for Cloud 4 and Edge Computing Use Cases
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Solution Briefs A10 and Ncipher Strengthen the Security Of
SOLUTION BRIEF A10 AND nCIPHER STRENGTHEN THE SECURITY OF APPLICATION DELIVERY PLATFORMS A10 THUNDER INTEGRATES WITH nCIPHER nSHIELD TO DELIVER FIPS 140-2 LEVEL 3 PROTECTION OF TLS/SSL KEYS Organizations increasingly depend on application networking CHALLENGE solutions to run critical business processes that involve Protecting and managing the private and sensitive information. To fulfill demands of increasing numbers of TLS/SSL keys—without impacting application businesses, data centers, networks and applications must delivery, performance or compliance not only be available 24-7 and run at optimum speeds, but requirements—is critically important in today’s business environment. must also protect against attacks that could compromise the confidentiality and integrity of the data they process. SOLUTION A10 Thunder ADC integrates with With the reliance on web application services, sensitive nCipher nShield hardware security modules (HSMs) to protect and information exchanged online and in the cloud is at risk manage the TLS/SSL keys. As part of interception and exploitation. Transport layer security/ of this integration, keys are stored in the hardware of nShield HSMs, and secure sockets layer (TLS/SSL) is used to protect sensitive encryption- and signature-processing information by encrypting the data. However, a compromise (involving private keys) are executed within its protected boundary. This of the encryption keys can lead to a breach of the data flowing provides robust protection and between end-user devices and Web servers. With growing management of the cryptographic keys and encryption process. use of TLS/SSL, protecting and managing the underpinning cryptographic keys is a vital function. BENEFITS • Delivers secure application availability and acceleration THE CHALLENGE • Strengthens TLS/SSL cryptographic As organizations and businesses increasingly deliver services key management through Web and cloud-based applications, more sensitive data • Enables robust FIPS 140-2 Level is transacted over TLS/SSL tunnels to protect confidentiality. -
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference
Intel® Architecture Instruction Set Extensions and Future Features Programming Reference 319433-037 MAY 2019 Intel technologies features and benefits depend on system configuration and may require enabled hardware, software, or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifica- tions. Current characterized errata are available on request. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Intel does not guarantee the availability of these interfaces in any future product. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1- 800-548-4725, or by visiting http://www.intel.com/design/literature.htm. Intel, the Intel logo, Intel Deep Learning Boost, Intel DL Boost, Intel Atom, Intel Core, Intel SpeedStep, MMX, Pentium, VTune, and Xeon are trademarks of Intel Corporation in the U.S. -
Hardware Security Module for E-Payments
Hardware Security Module for e-Payments Payment Security in FIPS 140-2 Level 3 Hardware Today's payments industry has increasingly become a target for fraud. To address rising levels of disputed transactions, the card associations have introduced advanced security controls, including improved authentication techniques that demand sophisticated hardware-based cryptographic processing. The nCipher hardware security module (HSM) INDUSTRY APPLICATION payShield option is designed to meet the stringent security requirements of the payments The payShield Option Pack for nCipher HSM industry, strengthening the security of card and provides payments functionality to secure and PIN authentication systems by securing accelerate payments industry applications. transaction processes in a FIPS 140-2 Level 3* ePayments validated tamper-resistant environment. In The 3-D Secure specification mandates the use addition to providing increased security, of FIPS certified hardware for storage and PRODUCT SHEET DATA payShield enabled HSM can dramatically management of cryptographic keys. payShield increase transaction throughput by processing provides a single HSM solution that supports high volumes of symmetric and asymmetric Visa's 3-D Secure Cardholder Authentication cryptographic operations, an important Verification Value (CAVV) using the Visa Card requirement of payments initiatives such as Verification Value (CVV) method, as well as 3-D Secure, Visa DPA, MasterCard CAP. MasterCard’s SPA Account Authentication Value *Federal Information Processing Standard (FIPS) 140-2 Level 3 is (AAV) and Card Authentication Program (CAP). the international security standard for cryptographic modules EMV smart card support CARDHOLDER EMV is a smart card standard developed by AUTHENTICATION Europay, MasterCard and Visa to address the universal aspects of chip card issuance and Supported by the major card associations, acceptance. -
Accurate Throughput Prediction of Basic Blocks on Recent Intel Microarchitectures
Accurate Throughput Prediction of Basic Blocks on Recent Intel Microarchitectures Andreas Abel and Jan Reineke Saarland University Saarland Informatics Campus Saarbrücken, Germany abel, [email protected] ABSTRACT been shown to be relatively low; Chen et al. [12] found that Tools to predict the throughput of basic blocks on a spe- the average error of previous tools compared to measurements cific microarchitecture are useful to optimize software per- is between 9% and 36%. formance and to build optimizing compilers. In recent work, We have identified two main reasons that contribute to several such tools have been proposed. However, the accuracy these discrepancies between measurements and predictions: of their predictions has been shown to be relatively low. (1) the microarchitectural models of previous tools are not In this paper, we identify the most important factors for detailed enough; (2) evaluations were partly based on un- these inaccuracies. To a significant degree these inaccura- suitable benchmarks, and biased and inaccurate throughput cies are due to elements and parameters of the pipelines of measurements. In this paper, we address both of these issues. recent CPUs that are not taken into account by previous tools. In the first part, we develop a pipeline model that is signif- A primary reason for this is that the necessary details are icantly more detailed than those of previous tools. It is appli- often undocumented. In this paper, we build more precise cable to all Intel Core microarchitectures released in the last models of relevant components by reverse engineering us- decade; the differences between these microarchitectures can ing microbenchmarks. -
A Hardware Security Module Is Found Not Immune to Hacking
Memo 12/06/2019 - TLP:WHITE A Hardware Security Module is found not immune to hacking Reference: Memo [190612-1] Date: 12/06/2019 - Version: 1.1 Keywords: HSM, cryptography, PKCS#11, digital services Sources: publicly available information Key Points Security researchers released a paper revealing how they managed to hack a Hardware Security Module (HSM). HSM-s are used to generate, manipulate and store sensitive cryptographic secrets (SIM cards, credit cards, secure boot hardware, disk and database encryption, PKI...). HSM-s are also used by cloud service providers, such as Google or Amazon, allowing clients to centrally create, manage and use their cryptographic secrets. Summary Researchers from a French technology company, specialising in blockchain and cryptocurrency ecosystems, published and presented a paper detailing how they managed to dump the whole content of a Hardware Security Module (HSM), manufactured by an undisclosed company. In order to achieve this, they proceeded as follows: 1. They started by using legitimate software development kit (SDK) access to their test HSM to upload a firmware module that would give them a shell inside the HSM. Note: A SDK is typically a set of software development tools that allows for the creation of applications for a certain software package, software framework, hardware platform, or computer system. Note that this SDK access was used to discover the vulnerabilities, but is not necessary to exploit them. 2. They then used the shell to run a fuzzer on the internal implementation of PKCS#11 commands to find reliable, exploitable buffer overflows. Note: PKCS#11 refers to public-key cryptography standards or to a programming interface used to create and manipulate cryptographic tokens. -
Key Management Guide CIO IT Security
IT Security Procedural Guide: Key Management CIO-IT Security-09-43 Revision 4 April 13, 2020 Office of the Chief Information Security Officer CIO-IT Security-09-43, Revision 4 Key Management VERSION HISTORY/CHANGE RECORD Person Page Change Posting Change Reason for Change Number of Number Change Change Revision 1 – November 19, 2008 1 Eric Additional References to x.509 Response to comments 1,6,16 Hummel Common Framework Revision 2 – February 25, 2016 1 Salamon Updated Policy and NIST references Updated to current versions of Throughout CIO 2100.1, NIST SP 800-53, and NIST SP 800-57 2 Wilson, Updated GSA Logo, formatting, Updated GSA Logo, formatting Throughout Klemens style changes and style. Revision 3 – March 6, 2018 1 Salamon Removed NIST SP 800-21 and NIST SP 800-21 withdrawn, 2, 7, 17 updated Policy references updated to current CIO 2100.1 2 Salamon Updated Procedural Guide links Updated Procedural Guides 8 3 Dean Changes throughout the document Updated to current guide Throughout to correspond with current guide structure, style, and formatting structure and formatting. Revision 4 – April 13, 2020 1 Richards Updated references and minor Scheduled update Throughout language clarifications 2 Salamon Updated Section 2 to include Operational feedback 7 specific requirements for key management 3 Salamon Scope updated in Section 1.2 Operational feedback 3 U.S. General Services Administration CIO-IT Security-09-43, Revision 4 Key Management Approval IT Security Procedural Guide: Key Management, CIO-IT Security-09-43, Revision 4 is hereby approved for distribution. X Bo Berlas Chief Information Security Officer Contact: GSA Office of the Chief Information Security Officer (OCISO), Security Engineering Division (ISE) at [email protected] U.S. -
EARNINGS Presentation Disclosures
Q2 2020 EARNINGS Presentation Disclosures This presentation contains non-GAAP financial measures. Earnings per share (EPS), gross margin, and operating margin are presented on a non- GAAP basis unless otherwise indicated, and this presentation also includes a non-GAAP free cash flow (FCF) measure. The Appendix provides a reconciliation of these measures to the most directly comparable GAAP financial measure. The non-GAAP financial measures disclosed by Intel should not be considered a substitute for, or superior to, the financial measures prepared in accordance with GAAP. Please refer to “Explanation of Non-GAAP Measures” in Intel's quarterly earnings release for a detailed explanation of the adjustments made to the comparable GAAP measures, the ways management uses the non-GAAP measures, and the reasons why management believes the non-GAAP measures provide investors with useful supplemental information. Statements in this presentation that refer to business outlook, future plans, and expectations are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipate," "expect," "intend," "goals," "plans," "believe," "seek," "estimate," "continue,“ “committed,” “on-track,” ”positioned,” “launching,” "may," "will," “would,” "should," “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on estimates, forecasts, projections, uncertain events or assumptions, including statements relating to total addressable market (TAM) or market opportunity, future products and technology and the expected availability and benefits of such products and technology, including our 10nm and 7nm process technologies, products, and product designs, and anticipated trends in our businesses or the markets relevant to them, also identify forward-looking statements. -
Intel® Tiger Lake-UP3 Solution
Intel® Tiger Lake-UP3 Solution ® Intel Tiger Lake-UP3 Platform Overview Graphics Media, and Display Security and Manageability ● New Xe (Gen12) Gfx Engine with up to 96 Eus ● Intel® Total Memory Encryption (Intel® TME) ● 4 independent display units (4 x 4K or 2 x 8K) * Hardware based encryption to protect entire memory contents ● Image processing unit IPU6 from physical attacks * Up to 27MP image capture ● Intel® AES-NI * Up to 4K@60fps video performance * A new, hardware based AES-NI instruction set to protect * Support for 4 concurrent streams private keys from malware * VTIO and RGB-IR for facial recognitionn * Keys are no longer exposed and handlers are utilized to perform encrypt/decrypt operations ● Control-Flow Enforcement Technology AI Experience Enhanced Features ● Vector Neural Network Instruction (VNNI) improves ● Up to 4 cores inferencing workload performance ● In-Band ECC available ● Common industry wide AI frameworks optimized on Tiger ● PCIe 4.0 (off CPU complex), 12 HSIO lanes (off PCH complex) Lake architecture (via OpenVINO™) ● Improved Thunderbolt™ data performance ● Intel® Deep Learning Boost ● Integrated Type C subsystem with for USB4 compliance ● AI/DL Instruction Sets including VNNI and CV/AI applications ® Intel Tiger Lake-UP3 Platform Block Diagram eDP DDR4/LPDDR4x (2ch) www.ieiworld.com 2 DDI PCIe 4.0 (1x4) TIGER LAKE-UP3 USB 3.2 Gen2 Thunderbolt™ 3 USB 3.2 Gen1 Hi-Speed USB 2.0 PCIe 3.0 CERTIFIED USB ™ SATA 6Gb/s Intel® Wireless-AC TIGER LAKE Intel® LAN PHY 2.5GbE TSN MAC ® PCH-LP Intel About IEI-2021-V10 ® -
Spoofing a Hardware Security Module
DEVELOPING AND CONNECTING ISSA CYBERSECURITY LEADERS GLOBALLY Spoofing a Hardware Security Module By Jeff Stapleton – ISSA member, St. Louis Chapter This article compares valid key management techniques using a cryptographic hardware security module (HSM) with commonly used untrustworthy software-based crypto methods that basically spoof the HSM. Two hardware-based techniques are contrasted with three hybrid-based methods. Security issues for the software-based methods are discussed, and an alternative standards- based scheme is introduced. Abstract This article compares valid key management tech- niques using a cryptographic hardware security module (HSM) with commonly used untrustworthy software-based crypto methods that basically spoof the HSM. Software-based cryptography is generally Figure 1 – Hardware cheaper and easier to implement but at higher risk data encryption of key compromise whereas hardware-based cryp- tography has vastly lower risks but at greater costs and com- key encryption. The HSM spoofing problem arises when the plexity. Attempts at combining software-based crypto with data encryption is performed in software but the key man- hardware-based key management often introduces poor key agement is attempted in cryptographic hardware. Three un- management solutions. Two hardware-based techniques are trustworthy key management methods are contrasted with contrasted with three hybrid-based methods. Security issues the valid techniques: faux key, KMIP unwrapped keys, and for the software-based methods are discussed, and an alter- PKCS#12 password based key derivation functions [2]. The se- native standards-based scheme is introduced. curity weaknesses are explained and an alternate method is in- troduced: database encryption key management (DBEKM) [3]. his article compares valid key management tech- Hardware data encryption niques using a cryptographic hardware security mod- ule (HSM) [1] with commonly used untrustworthy The first HSM key management method discussed is cryp- Tmethods that essentially spoof an HSM. -
Trescca D3.2
Project acronym: TRESCCA Project title: TRustworthy Embedded systems for Secure Cloud Computing Project number: European Commission – 318036 Call identifier: FP7-ICT-2011.1.4 Start date of project: 01 Oct. 2012 Duration: 36 months Document reference number: D3.2 Document title: Secure Hypervisor Version: 1.3 Due date of document: April 2015 Actual submission date: May 2015 Lead beneficiary: VOSYS Participants: Michele PAOLINO, Alvise RIGO, Daniel RAHO, Maria SOLER (VOSYS), Miltos GRAMMATIKAKIS (TEI), Renaud PACALET (TP) Reviewers: Bernhard Katzmarski (OFFIS) Project co-funded by the European Commission within the 7th Framework Programme DISSEMINATION LEVEL PU Public X PCA Public with confidential annex CO Confidential, only for members of the consortium (including Commission Services) Project: TRESCCA Document ref.: D3.2 EC contract: 318036 Document title: Secure Hypervisor Document version: 1.3 Date: May 2015 CONTENTS 1 Introduction 5 1.1 Purpose of the Document . .5 2 The Trusted Compartment 6 2.1 Trusted Compartment Implementation . .6 2.1.1 TrustZone . .6 2.1.2 HSM-NoC . .7 2.2 Security HW accelerators . .7 3 The Trusted Execution Environment (TEE) 9 3.1 Introduction to the Trusted Execution Environment(TEE) . .9 3.2 The GlobalPlatform Standard . 10 3.2.1 The GlobalPlatform TEE API . 11 3.3 The TEE state of the art . 13 3.3.1 Closed Solutions . 13 3.3.2 Open Source Solutions . 14 4 The KVM TEE 16 4.1 The KVM hypervisor . 16 4.2 TEE Implementation and virtualization . 16 4.2.1 Secure World . 17 4.2.2 TEE virtualization . 20 4.3 Features . 20 4.3.1 Isolated Execution . -
11Th Gen Intel® Core™ Vpro® Mobile Processors & Intel® Xeon® W
11th Gen Intel® Core™ vPro® mobile processors & Intel® Xeon® W-11000 processors for mobile workstations Powering the unrivaled Intel vPro® platform PROCESSOR BRIEF Empowering enterprises to meet evolving business needs Business technology needs have changed a lot over the past few years. Now, both IT and everyday end users prefer more user-friendly technology that can easily adapt to today’s more flexible working environment. The Intel vPro® platform provides tools and technologies you can count on to help your business keep up with the needs of an ever-changing world. It’s time to set a new standard for business security, performance, and remote manageability in your organization. The latest 11th Gen Intel vPro® platform processors are designed to deliver business-class performance, comprehensive hardware-based security, and optimal user experiences — making it the unrivaled PC platform for business. A scalable processor portfolio The 11th Gen Intel® Core™ vPro® processors are segmented into the i5, i7, and i9 processor brands which, along with Intel® Xeon® W-11000 processors for mobile workstations, give enterprises greater flexibility to meet a wide variety of performance and price point requirements across their organization. 11th Gen Intel® Core™ vPro® U-series i5 and i7 processors power highly mobile business-class notebooks in a thin-and-light form factor. These PCs are designed for on-the-go employees and feature exclusive Intel® Iris® Xe graphics for impressive visual performance. Processors with the i5 brand feature 4 cores, 8 threads, and an 8 MB cache. Processors with the i7 brand support 4 cores, 8 threads, and a 12 MB cache. -
5 Microprocessors
Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 5 Microprocessors “MEGAHERTZ: This is a really, really big hertz.” —DAVE BARRY In this chapter, you will learn or all practical purposes, the terms microprocessor and central processing how to Funit (CPU) mean the same thing: it’s that big chip inside your computer ■ Identify the core components of a that many people often describe as the brain of the system. You know that CPU CPU makers name their microprocessors in a fashion similar to the automobile ■ Describe the relationship of CPUs and memory industry: CPU names get a make and a model, such as Intel Core i7 or AMD ■ Explain the varieties of modern Phenom II X4. But what’s happening inside the CPU to make it able to do the CPUs amazing things asked of it every time you step up to the keyboard? ■ Install and upgrade CPUs 124 P:\010Comp\BaseTech\380-8\ch05.vp Friday, December 18, 2009 4:59:24 PM Color profile: Disabled Composite Default screen BaseTech / Mike Meyers’ CompTIA A+ Guide to Managing and Troubleshooting PCs / Mike Meyers / 380-8 / Chapter 5 Historical/Conceptual ■ CPU Core Components Although the computer might seem to act quite intelligently, comparing the CPU to a human brain hugely overstates its capabilities. A CPU functions more like a very powerful calculator than like a brain—but, oh, what a cal- culator! Today’s CPUs add, subtract, multiply, divide, and move billions of numbers per second.