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Organometallic Compounds Suitable for Use in Vapor Deposition Processes

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Organometallic Compounds Suitable for Use in Vapor Deposition Processes Europäisches Patentamt *EP001464724A2* (19) European Patent Office Office européen des brevets (11) EP 1 464 724 A2 (12) EUROPEAN PATENT APPLICATION (43) Date of publication: (51) Int Cl.7: C23C 16/22, C07F 7/30, 06.10.2004 Bulletin 2004/41 C07F 7/02 (21) Application number: 04251948.8 (22) Date of filing: 01.04.2004 (84) Designated Contracting States: (72) Inventors: AT BE BG CH CY CZ DE DK EE ES FI FR GB GR • Shenai-Khatkhate, Deodatta Vinayak HU IE IT LI LU MC NL PL PT RO SE SI SK TR Danvers Massachusetts 01923 (US) Designated Extension States: • Power, Michael Brendan AL HR LT LV MK Newburyport Massachusetts 01950 (US) (30) Priority: 05.04.2003 US 460791 P (74) Representative: Kent, Venetia Katherine 22.10.2003 US 513476 P Rohm and Haas (UK) Ltd European Patent Department (71) Applicant: Rohm and Haas Electronic Materials, 28th. Floor, City Point L.L.C. One Ropemaker Street Marlborough, Massachusetts 01752 (US) London EC2Y 9HS (GB) (54) Organometallic compounds suitable for use in vapor deposition processes (57) Organometallic compounds suitable for use as metallic precursors are also provided. Such Group IV vapor phase deposition precursors for Group IV metal- metal-containing films are particularly useful in the man- containing films are provided. Methods of depositing ufacture of electronic devices. Group IV metal-containing films using certain organo- EP 1 464 724 A2 Printed by Jouve, 75001 PARIS (FR) EP 1 464 724 A2 Description Background of the Invention 5 [0001] The present invention relates generally to the field of organometallic compounds. In particular, the present invention relates to the certain organometallic compounds suitable for use in vapor deposition processes. [0002] Metal films may be deposited on surfaces, such as non-conductive surfaces, by a variety of means such as chemical vapor deposition ("CVD"), physical vapor deposition ("PVD"), and other epitaxial techniques such as liquid phase epitaxy ("LPE"), molecular beam epitaxy ("MBE"), chemical beam epitaxy ("CBE") and atomic layer deposition 10 ("ALD"). Chemical vapor deposition processes, such as metalorganic chemical vapor deposition ("MOCVD"), deposit a metal layer by decomposing organometallic precursor compounds at elevated temperatures, i.e., above room tem- perature, either atmospheric pressure or at reduced pressures. A wide variety of metals may be deposited using such CVD or MOCVD processes. [0003] For semiconductor and electronic device applications, these organometallic precursor compounds must be 15 highly pure and be substantially free of detectable levels of both metallic impurities, such as silicon and zinc, as well as oxygenated impurities. Oxygenated impurities are typically present from the solvents used to prepare such orga- nometallic compounds, and are also present from other adventitious sources of moisture or oxygen. [0004] For certain applications where high speed and frequency response of an electronic device is desired, silicon- only devices, e.g. silicon bipolar transistors, have not been competitive. In a heterojunction bipolar transistor ("HBT"), 20 a thin silicon-germanium layer is grown as the base of a bipolar transistor on a silicon wafer. The silicon-germanium HBT has significant advantages in speed, frequency response, and gain when compared to a conventional silicon bipolar transistor. The speed and frequency response of a silicon-germanium HBT are comparable to more expensive gallium-arsenide HBTs. [0005] The higher gain, speeds, and frequency response of silicon-germanium HBTs have been achieved as a result 25 of certain advantages of silicon-germanium not available with pure silicon, for example, narrower band gap and reduced resistivity. Silicon-germanium may be epitaxially grown on a silicon substrate using conventional silicon processing and tools. This technique allows one to engineer device properties such as the energy band structure and carrier mobility. For example, it is known in the art that grading the concentration of germanium in the silicon-germanium base builds into the HBT device an electric field or potential gradient, which accelerates the carriers across the base, thereby 30 increasing the speed of the HBT device compared to a silicon-only device. A common method for fabricating silicon and silicon-germanium devices is by CVD. A reduced pressure chemical vapor deposition technique ("RPCVD") used to fabricate the HBT device allows for a controlled grading of germanium concentration across the base layer as well as precise control over the doping profile. [0006] Germane (GeH4) is the conventional precursor for germanium deposition while silane (SiH4), and dichlorosi- 35 lane (SiH2Cl2) are conventional precursors for silicon deposition. These precursors are difficult to handle and have high vapor pressures. For example, germane decomposes violently at 280° C, which is below the temperature used to grow germanium films. Accordingly, processes employing either germane or silane require extensive safety proce- dures and equipment. Germane typically requires film growth temperatures of approximately 500° C or higher for thermal CVD applications. Such decomposition temperatures are not always suitable, such as in mass production 40 applications where there is a need for lower temperatures, e.g. 200°C. Other CVD applications require higher growth temperatures which cause conventional precursors to break up prematurely which, in turn, leads to the formation of particles and a reduction in metal film growth rates. A further problem with conventional silicon and germanium pre- cursors is that when a relatively stable silicon precursor and a relatively unstable germanium precursor are used to deposit a silicon-germanium film, the differences in precursor stability makes control of the silicon-germanium compo- 45 sition difficult. There is a need for precursors for silicon and germanium vapor phase deposition that are safer to handle and have decomposition temperatures tailored to specific conditions. There is also a desire for silicon and germanium precursors that have matched stability characteristics. Summary of the Invention 50 [0007] The present inventors have surprisingly found that the above deficiencies can be remedied. The present invention provides a method of depositing a metal-containing film on a substrate including the steps of: a) conveying one or more of the organometallic compounds of formula I in a gaseous phase to a deposition chamber containing the substrate, 55 2 EP 1 464 724 A2 5 10 wherein M is Si or Ge; R1 and R2 are independently chosen from H, alkyl, alkenyl, alkynyl and aryl; each R3 is inde- 3 4 pendently chosen from (C1-C12)alkyl, alkenyl, alkynyl and aryl, provided that R is not cyclopentadienyl; each R is independently chosen from (C3-C12)alkyl; X is halogen; a = 0-3; b = 0-3; c = 0-3; d = 0-3; e = 0-4; and a+b+c+d+ e = 4; wherein R3 ≠ R4; wherein the sums of a + b and a + d are each ≤ 3; provided that when M = Si the sum of b + cis≤3; b) decomposing the one or more organometallic compounds in the deposition chamber; and c) depositing the 15 metal film on the substrate. [0008] Also, the present invention provides a device for feeding a fluid stream saturated with an organometallic compound suitable for depositing a metal film containing silicon, germanium and combinations thereof to a chemical vapor deposition system including a vessel having an elongated cylindrical shaped portion having an inner surface having a cross-section, a top closure portion and a bottom closure portion, the top closure portion having an inlet 20 opening for the introduction of a carrier gas and an outlet opening, the elongated cylindrical shaped portion having a chamber containing one or more organometallic compounds of formula I 25 30 wherein M is Si or Ge; R1 and R2 are independently chosen from H, alkyl, alkenyl, alkynyl and aryl; each R3 is inde- 3 4 pendently chosen from (C1-C12)alkyl, alkenyl, alkynyl and aryl, provided that R is not cyclopentadienyl; each R is independently chosen from (C3-C12)alkyl; X is halogen; a = 0-3; b = 0-3; c = 0-3; d = 0-3; e = 0-4; and a+b+c+d+ 35 e = 4; wherein R3 ≠ R4; wherein the sums of a + b and a + d are each ≤ 3; provided that when M = Si the sum of b + cis≤3; the inlet opening being in fluid communication with the chamber and the chamber being in fluid communication with the outlet opening. [0009] Another embodiment of the present invention is an apparatus for vapor deposition of metal films including one or more devices for feeding a fluid stream including one or more organometallic compounds described above. 40 [0010] The present invention further provides an organogermanium compound of formula IIA or IIB: 45 50 wherein R1 and R2 are independently chosen from alkyl, alkenyl, alkynyl or aryl; each R3 is independently chosen from 4 (C1-C12)alkyl, alkenyl, alkynyl and aryl; each R is independently chosen from branched and cyclic (C3-C5)alkyl; each 5 R is independently chosen from (C1-C12)alkyl, alkenyl, alkynyl and aryl; X is halogen; a' = 0-3; b' = 0-2; c' = 1-3; d' = 0-3; a' + b' + c' + d' = 4; a" = 0-2; b" = 0-2; e" = 1-2; f " = 0-2; a" + b" + e" + f" = 4; wherein at least two of a", b" and f" ≠ 55 4 5 3 0; provided when a" = 1, e" = 1, f " = 2, and R = (CH3)C that R ≠ CH3; and provided that R is branched or cyclic (C3-C5)alkyl when c' + d' = 4. [0011] In further embodiment, the present invention provides a method of depositing a germanium-containing film on a substrate comprising the steps of: a) conveying one or more of the organogermanium compounds described 3 EP 1 464 724 A2 above in a gaseous phase to a deposition chamber containing the substrate; b) decomposing the one or more orga- nogermanium compounds in the deposition chamber; and c) depositing the germanium-containing film on the substrate.
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