MEMS Micromachining Overview Primary Knowledge Unit Participant Guide
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A Review Paper on Enhancement of Radio Frequency Microelectro Mechanical Systems
International Journal of Engineering Research & Technology (IJERT) ISSN: 2278-0181 Vol. 3 Issue 10, October- 2014 A Review Paper on Enhancement of Radio Frequency MicroElectro Mechanical Systems Shilpa G. Kulkarni Electronics And Telecommunication Engineering V.I.T.Wadala Mumbai - India Abstract—Radio Frequency Micro Electro Mechanical Systems (RF MEMS) refers to the design and fabrication of committed II. NEED FOR RF MEMS MEMS for RF circuits. RF MEMS is a multi-disciplinary area MEMS switches combine the advantageous properties of in which the components operate Micromechanical And / Or mechanical and semiconductor switches.RF MEMS have components are fabricated using micromachining and these advantages such as, Low insertion loss, High isolation, Lower components are used in RF systems. The regular microwave switches currently employed in the microwave industry are power consumption, Excellent signal linearity, Better mechanical switches and semiconductor switches. Mechanical impedance match, Less dispersion , Miniaturization, Simple coaxial and waveguide switches offer benefits such as, low control circuits, High volume production possible, Very large insertion loss, large off-state isolation and high power handling bandwidth , Resistant to external environment. Table Iand Fig capabilities. Yet, they are bulky, heavy and slow. Semiconductor 1provide a comparison of RF MEMS Switches with the switches provide switching at a much faster speed and are conventional switches. smaller in size and weight, but are inferior in insertion loss, DC power consumption, isolation and power handling capabilities TABLE I. COMPARISON OF VARIOUS PARAMETERS[2] than their mechanical counterparts. MEMS switches promise to RF combine the advantageous properties of mechanical and Parameter PIN FET semiconductor switches. There are nevertheless few issues in RF MEMS MEMS Switch like, Actuation Speed, Power handling capacity, Voltage(V) 20-80 ±3-5 3-5 Stiction and Actuation voltage etc. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
Design of a Microelectronic Manufacturing Laboratory
2006-1635: DESIGN OF A MICROELECTRONIC MANUFACTURING LABORATORY Stilson Applin, Montana State University Todd Kaiser, Montana State University Page 11.407.1 Page © American Society for Engineering Education, 2006 Design of a Microelectronic Manufacturing Laboratory Abstract The design of an undergraduate microelectronic manufacturing laboratory for teaching will be described in the following paper. This laboratory emphasizes learning the processes of semiconductor manufacturing and clean room protocol. The laboratory is housed in a 500 square foot, class 10,000 facility. In the laboratory the students, with a junior standing and a science based background, will use a pre-made six mask set to create P and N type transistors as well as inverters and diodes. The students will be conducting oxidization, RCA clean, photolithography, etching, diffusion, metallization and other processes. A brief description of these processes and the methods used to teach them will also be described. In addition to these processes students will also learn about clean room protocol, chemical safety, and testing devices. All of these skills will be marketable to future employers and graduate schools. These same skills and processes will be covered in a seminar course for educators, with the main purpose of inspiring the high school teachers to teach about semiconductor manufacturing. The cost effective design is what makes the laboratory unique. The expenditure control is important due to the size of the Electrical Engineering department. The department has only 250 undergraduates and 40 graduate students, thus internal funding is difficult to obtain. A user fee paid by the students will cover the funding. This fee will be small and manageable for any college student. -
Introduction to Micro Electromechanical Systems”, F
A not so short Introduction to Micro Electromechanical Systems Franck CHOLLET, Haobing LIU 1 Please note that this work is published under a : Attribution-NonCommercial 2.5 You are free: • to copy, distribute, display, and perform the work • to make derivative works Under the following conditions: Attribution. Please attribute this work using: “A not so short Introduction to Micro Electromechanical Systems”, F. Chollet, HB. Liu, Jan. 2006, Noncommercial. You may not use this work for commercial purposes. • For any reuse or distribution, you must make clear to others the license terms of this work. • Any of these conditions can be waived if you get permission from the copyright holder. Your fair use and other rights are in no way affected by the above. This is a human-readable summary of the Legal Code (http://creativecommons.org/licenses/by-nc/2.5/legalcode). Table of Content 1. Why MEMS?.................................................................................................................4 1.1. What is MEMS and comparison with microelectronics .....................................4 1.2. Why MEMS technology .....................................................................................4 1.2.1. Advantages offered...................................................................................4 1.2.2. Diverse products and markets ..................................................................5 1.2.3. Economy of MEMS manufacturing and applications ..............................6 1.3. Major drivers for MEMS technology..................................................................8 -
Microelectronics: Devices to Circuits
MICROELECTRONICS: DEVICES TO CIRCUITS PROF.SUDEB DASGUPTA TYPE OF COURSE : Rerun | Core_Elective | PG/UG Department of Electronics & Communication Engineering COURSE DURATION : 12 weeks (26 Jul'21 - 15 Oct'21) IIT Roorkee EXAM DATE : 24 Oct 2021 INTENDED AUDIENCE : Any Interested Learners PRE-REQUISITES : First course on linear circuit analysis, A basic course on Semiconductor Devices and Digital Electronics. A course on Computer Organization will be also helpful (though not strictly required). INDUSTRIES APPLICABLE TO : Cadence; Synopsys; ST Microelectronics; NXP Semiconductors;Semiconductor Complex Limited; Design House in general COURSE OUTLINE : This course aligns with the core courses in Electronics Circuits taught to undergraduates in Electrical and Computer Engineering. The objective of this course is to develop the ability to analyse and design electronic circuits both analog and digital, discrete and integrated.The course starts with the basics of the device most seldom encountered in mixed designs and then go on to do circuit analysis in the later parts. ABOUT INSTRUCTOR : Prof. S. Dasgupta is presently working as an Associate Professor, in Microelectronics and VLSI Group of the Department of Electronics and Communication Engineering at Indian Institute of Technology, Roorkee. He received his PhD degree in Electronics Engineering from Institute of Technology-Banaras Hindu University (currently IIT-BHU), Varanasi in 2000. COURSE PLAN : Week 1 : Bipolar Junction Transistor; Physical Structure and Modes of operation,Operation in Active Mode, circuit symbols and conventions, BJT as an Amplifier, small circuit model, BJT as a switch and Ebers Moll Model, Simple BJT inverter and Second Order Effects Week 2 : MOS Transistor Basic,MOS Parasitic & SPICE Model; CMOS Inverter Basics-I Week 3 : CMOS Inverter Basics(contd), Power Analysis, SPICE Simulation-I Week 4 : Biasing of MOS Amplifier and its behavior as an analog switch, CMOS CS/CG/SF Amplifier Configuration, Internal cap models and high frequency modelling, JFET, structure and operation. -
Surface Micromachine Microfluidics: Design, Fabrication, Packaging, and Characterization
SURFACE MICROMACHINE MICROFLUIDICS: DESIGN, FABRICATION, PACKAGING, AND CHARACTERIZATION Paul Galambos*, William P. Eaton, Randy Shul, Christi Gober Willison, Jeffry J. Sniegowski, Samuel L. Miller and Daniel Gutierrez of Sandia National Labs, PO Box 5800, MS 1080, Albuquerque NM 87185-1080 http://www.mdl.sandia.gov/Micromachine, *(505)844-1542, FAX (505)844-2991, [email protected] ABSTRACT 1998). These devices are fabricated using a wide The field of microfluidics is undergoing range of technologies including: bulk micromachining rapid growth in terms of new device and system (e.g. KOH etch), high aspect ratio micromachining development. Among the many methods of (e.g. DRIE or LIGA), laser machining, very small fabricating microfluidic devices and systems, surface scale conventional machining (drilling and milling), micromachining is relatively underrepresented due to; capillary tubing assembly and various unconventional difficulties in the introduction of fluids into the very techniques (Whitesides 1997). Conspicuously absent small channels produced, packaging problems, and from this list is surface micromaching. difficulties in device and system characterization. The potential advantages of using surface micromachining Consider as a representative sample the microfluidic include: compatibility with the existing integrated papers presented at the ASME winter annual meeting circuit tool set, integration of electronic sensing and last October (Forster et. al. 1998). Of the 39 papers actuation with microfluidics, and fluid volume dealing with experimental microfluidic devices only 3 minimization. In order to explore these potential utilized surface micromachining. Of these 3 papers advantages we have developed first generation surface one (Tseng 1998) was a hybrid design utilizing both micromachined microfluidic devices (channels) using bulk and surface micromachining with the flow an adapted pressure sensor fabrication process to channels fabricated utilizing bulk micromachining. -
Micromanufacturing and Fabrication of Microelectronic Devices
Micromanufacturing and Fabrication of Microelectronic PART Devices •••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••V The importance of the topics covered in the following two chapters can best be appreciated by considering the manufacture of a simple metal spur gear. It is impor- tant to recall that some gears are designed to transmit power, such as those in gear boxes, yet others transmit motion, such as in rack and pinion mechanisms in auto- mobile steering systems. If the gear is, say, 100 mm (4 in.) in diameter, it can be produced by traditional methods, such as starting with a cast or forged blank, and machining and grinding it to its final shape and dimensions. A gear that is only 2 mm (0.080 in.) in diameter, on the other hand, can be difficult to produce by these meth- ods. If sufficiently thin, the gear could, for example, be made from sheet metal, by fine blanking, chemical etching, or electroforming. If the gear is only a few micrometers in size, it can be produced by such tech- niques as optical lithography, wet and dry chemical etching, and related processes. A gear that is only a nanometer in diameter would, however, be extremely difficult to produce; indeed, such a gear would have only a few tens of atoms across its surface. The challenges faced in producing gears of increasingly smaller sizes is highly informative, and can be put into proper perspective by referring to the illustration of length scales shown in Fig. V.1. Conventional manufacturing processes, described in Chapters 11 through 27, typically produce parts that are larger than a millimeter or so, and can be described as visible to the naked eye. -
Mobile Communication Using Radio Frequency MEMS Switches Nasreen Sultana1, Dr
IJRECE VOL. 2 ISSUE 2 APR-JUNE 2014 ISSN: 2348-2281 (ONLINE) Mobile Communication using Radio Frequency MEMS Switches Nasreen Sultana1, Dr. K. Ragini2 1Assoc Professor, ECE, Shadan Womens College of Engg. and Technology, JNTUH, Hyderabad, AP, India 2Professor, ECE, G.Narayanamma Institute of Technology and Science, JNTUH, Hyderabad, AP, India Abstract: Radio Frequency MEMS (micro- are advancing MEMS (Micro-Electro-Mechanical Systems) electromechanical systems) have been keyed out as Technology to create ultra-small switches that could have an technology areas that hold the potential to provide a major ultra-large impact on system design that will drive mobile impact on existing system architectures in wireless sensors devices of the future. These metal switches, which are no and mobile communications. Switched capacitors based on larger than the width of a human hair, can master the flow of radio frequency microelectromechanical systems (RF electricity of an arreay of electrical systems- from high- MEMS) can enable a breakthrough in radio technology. This power devices that use kilowatts of power, of an ordinary paper describes these technologies should bring down light bulb. weight, cost, size, and power dissipation by a few orders of MEMS are nowadays used in a wide range of everyday magnitude. Their switching principle is founded along the life applications, but also in space, instrumentation, RF mechanical movement of the dentures of a parallel plate applications... Their broadest use is in the sensor area capacitor using the electrostatic force. The resulting conflict andwireless communicational area. There exist MEMS in capacitance is used to switch an RF signal by MEMS. -
Fundamentals of MICROFABRICATION the Science of Miniaturization Second Edition
Fundamentals of MICROFABRICATION The Science of Miniaturization Second Edition Marc J. Madou CRC PRESS Boca Raton London New York Washington, D.C, Table of Contents Chapter 1 Lithography 1 Introduction 1 Historical Note: Lithography's Origins 1 Photolithography Overview 2 Introduction 2 Masks 3 Spinning Resist and Soft Baking 3 Exposure and Postexposure Treatment 4 Development 5 De-scumming and Postbaking '.'. 6 Resists 6 Wafer Priming 10 Wafer Cleaning and Contaminants: The Clean Room 10 Resist Stripping 13 Critical Dimension, Overall Resolution, Line Width 14 Lithographie Sensitivity and Intrinsic Resist Sensitivity (Photochemical Quantum Efficiency) 14 Lithographie Sensitivity 14 Intrinsic Sensitivity ofa Resist (Photochemical Quantum Efficiency) 15 Resist Profiles 16 Overview of Profile Types 16 Lift-Off Profile 18 Contrast and Experimental Determination of Lithographie Sensitivity 19 Resolution in Photolithography 21 Introduction , 21 Resolution in Contact and Proximity Printing (Shadow Printing) 21 Projection Printing 22 Planarization 31 Photolithography Resolution Enhancement Technology 32 Introduction 32 Strategies for Improved Resolution through Improved Resist Performance 33 Strategies for Improved Resolution through Improved Mask Technology 41 Beyond Moore's Law 44 Introduction 44 Moore's Law 44 Kurzweil 46 Next-Generation Lithographies 48 Introduction 48 Extreme Ultraviolet Lithography 48 X-Ray Lithography 49 Charged-Particle-Beam Lithography 52 Emerging Lithography Technologies 58 Introduction 58 Scanning Probe Lithography -
A Technology Overview and Applications of Bio-MEMS
INSTITUTE OF SMART STRUCTURES AND SYSTEMS (ISSS) JOURNAL OF ISSS J. ISSS Vol. 3 No. 2, pp. 39-59, Sept. 2014. REVIEW ARTICLE A Technology Overview and Applications of Bio-MEMS Nidhi Maheshwari+, Gaurav Chatterjee+, V. Ramgopal Rao. Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India-400076. Corresponding Author: [email protected] + Both the authors have contributed equally. Keywords: Abstract Bio-MEMS, immobilization, Miniaturization of conventional technologies has long cantilever, micro-fabrication, been understood to have many benefits, like: lower cost of biosensor. production, lower form factor leading to portable applications, and lower power consumption. Micro/Nano fabrication has seen tremendous research and commercial activity in the past few decades buoyed by the silicon revolution. As an offset of the same fabrication platform, the Micro-electro-mechanical- systems (MEMS) technology was conceived to fabricate complex mechanical structures on a micro level. MEMS technology has generated considerable research interest recently, and has even led to some commercially successful applications. Almost every smart phone is now equipped with a MEMS accelerometer-gyroscope system. MEMS technology is now being used for realizing devices having biomedical applications. Such devices can be placed under a subset of MEMS called the Bio-MEMS (Biological MEMS). In this paper, a brief introduction to the Bio-MEMS technology and the current state of art applications is discussed. 1. Introduction Generally, the Bio-MEMS can be defined as any The interdisciplinary nature of the Bio-MEMS research is system or device, which is fabricated using the highlighted in Figure 2. This highlights the overlapping of micro-nano fabrication technology, and used many different scientific disciplines, and the need for a healthy for biomedical applications such as diagnostics, collaborative effort. -
Introduction to MEMS Bruce K
Introduction to MEMS Bruce K. Gale Overview Mechanical Engineering Department ! What is micromanufacturing and MEMS? BIOEN 6421, ELEN 5221, MEEN 5960 and 6960 ! Why the interest in MEMS? ! IC Fabrication Processes ! Bulk Micromachining Processes ! Surface Micromachining Processes ! Combined Processes ! References MEMS - evolved from the Microelectronics So what exactly is MEMS? Revolution Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and IC Industry Timeline electronics on a common substrate through the utilization of microfabrication technology or “microtechnology”. 1947 1958 1999 single transistor first IC 10 million transistors MEMS Timeline MEMS Examples 1980 pressure sensors 1999 accelerometers flow sensors inkjet printers Bulk micromachined pressure sensor deformable mirror devices gas sensors micromotors microgears lab-on-a-chip systems 2030 TI DMD ? (1.3 million micro-mirrors) The Opportunity of MEMS Technology General MEMS Advantages ! Batch fabrication – Reduced cost ! Reduced size – Is everything better smaller? ! Reduced power ! High precision ! New capabilities? ! Improved performance? The MicroTechnology/MEMS Tool Set Micromachining Processes ! Standard Integrated Circuit (IC) Processes Cleanroom plus microfab processes – Identical to those used in IC fabrication – Generally used for surface micromachining + ! Surface Micromachining – Additive processes ! Bulk Micromachining – Subractive Process ! Dividing line can become very blurry Standard IC Processes Standard -
Publication List Ming C
Publications Ming C. Wu Publication List Ming C. Wu (PDF files of most publications are available at http://www.photonics.ucla.edu/publications.php ) Book Chapters B1. M.C. Wu, J.-C. Tsai, W. Piyawattanametha, and P.R. Patterson, “Optical MEMS and Nano- Photonics,” in MEMS/NEMS Handbook (translated into Chinese), Zhou Zhaoying, Editor, Chinese Science Publishing Company, to be published in 2005. B2. M. C. Wu and P. R. Patterson, “Free-Space Optical MEMS,” in MEMS Handbook, korvink and O. Paul, Editors, William Andrew Publishing, NY, to be published in 2004. B3. P. K. L. Yu and M. C. Wu, “Photodiodes for High Performance Analog Links,” in RF Photonic Technology in Optical Fiber Links, W. S. C. Chang, Editor, Cambridge University Press, Cambridge, UK, 2002. B4. M. C. Wu, S. S. Lee, L. Fan, and G. D. Su, “Optical MEMS: Huge Possibilities for Lilliputian- sized Devices,” in Trends in Optics and Photonics (TOPS), Vol. 23, H. Haus, Editor, Optical Society of America, Washington DC, October 1998. B5. M. C. Wu and Y. K. Chen, “Monolithic Colliding Pulse Mode-Locked Diode Lasers,” in Compact Sources for Ultrashort Pulses, I. Duling, III, Editor, pp. 381-424, Cambridge University Press, Cambridge, UK, 1995. Archival Journal Publications J1. J-A. Paik, S-K. Fan, H. Chang, C-J. Kim, M.C. Wu and B. Dunn, “Development of Spin Coated Mesoporous Oxide Films for MEMS Structures,” accepted for publication in J. Electroceramics J2. Dooyoung Hah, Patterson PR, Nguyen HD, Toshiyoshi H, Wu MC. “Theory and experiments of angular vertical comb-drive actuators for scanning micromirrors,” IEEE Journal of Selected Topics in Quantum Electronics, vol.10, no.3, May-June 2004, pp.505-13.