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A Copper-Nickel-Silicon- Chromium Alloy for Mold Tooling

A Copper-Nickel-Silicon- Chromium Alloy for Mold Tooling

mold material form a Cr­ a form will Likewise, . of pure that nearer conductivity and electrical thermal keeping copper—while the on effect strengthening significant in f n X an of tion forma- the in results 1:2 of ratio metric of and or addition in a stoichio- small a copper, In based. cobalt- or chromium- nickel-, be could bronze.,Corson this In silicide the T by weight resulted in a higher strength higher a in resulted weight by percent 7 2 about to about silicon and percent to concentration nickel the copper. balance the and chromium percent 0.4 silicon, percent 0.75 nickel, percent 2.5 an of with weight by composition approximate C18000, designation given was UNS alloy This W/m/K. 200 of excess in conductivity and HRB 92 of excess in provided alloy this silicides. With a two-stage aging process, that contained both nickel and chromium Corson. Michael by patented was system alloy system. silicon nickel copper the is conductivity century that provides good strength and with the introduction of a copper alloycopper a introductionthe with of industry mold plastic the applicationin use. limited found system silicide simple the (75 135 only of hardness Brinell lo sse dvlpd n h 20 the in developed system alloy copper One seriously conductivity. but deteriorates strength, tin the and improves aluminum as such elements cavities.and cores Alloyingwith copper molding injection as such applications, has insufficientstrengthfor many industrial but conductivity, high provides Robert E.Kusner,Robert C.KuliJr.John B. Douglas and Veitch applications. in mechanically and thermally perform will alloy this how understand better moldmakers help will system alloy copper one of properties mechanical and physical the of review A Tooling Mold for Alloy Chromium Copper-Nickel-Silicon- A Modifying C18000 by increasing increasing by C18000 Modifying -silicide copper this 1928, In h aly ytm on widespread found system alloy The here are many industrial uses for uses industrial many are here ih tegh hg conductivity high strength, high los Cpe, n t pr form, pure its in Copper,alloys. 1 It was subsequently known as knownsubsequently was It 2 Si 3 silicide. However, with a However,silicide.with 2 i iiie ht a a has that silicide Si HRB), th 2

s N- fr opr ikl silicide, nickel version 5). copper for CNS-V as paper this in (denoted bronze Corson Measured physical properties and the ASTM test method employed. *No ASTM test method published. method test ASTM *No employed. method test ASTM the and properties physical Measured iiain. hs ae oprd with compared are These limitations. understand its applications, benefits and better moldmakers help will properties mechanical and physical its of review a young, fairly is system alloy this As tool and C17200 copper beryllium. replacement for mold alloys such as P-20 a as applicationfound alloy the 25mm, than larger sections wrought in W/m/K and a about of 140 Hardness capacity Heat diffusivity Thermal conductivity Electrical Property T Fatigue strength Fatigue strength Impact strengthCompression ensile properties ensile Thermograph of polycarbonate lens cooled in 15 Btu steel mold and 60 Btu copper mold. copper Btu 60 and mold steel Btu 15 in cooled lens polycarbonate of Thermograph 3 With a hardness of 29 HRC With a hardness of Reprinted From: Figure1 ASTM ASTM ASTM ASTM TestMethod ASTM rotary fatigue* rotary ASTM ASTM 10, E 1269 E 1461 E 1004 E 8, E 23 E 9 E mold tooling. mold alloyin this using in designer the aid to materials mold common other of that Thermal Conductivity Background Conductivity Thermal core and cavity applications to remove to applicationscavity and core mold injection in used be can alloy the , tool common of that times tool five by of excess in provided conductivity With steels). easily is strength (high conductivity thermal high its is makes it attractive to the mold industry The primary attribute of The CNS-V primary thatattribute of 111 E 18, E 384 E Table1

Figures courtesy of Brush Wellman. Tables courtesy of Brush Wellman. Robert E.Kusner,Robert C.KuliJr.John B. Douglas and Veitch applications. in mechanically and thermally perform will alloy this how understand better moldmakers help will system alloy copper one of properties mechanical and physical the of review A Tooling Mold for Alloy Chromium Copper-Nickel-Silicon- A Thermograph of polycarbonate lens cooled in 15 Btu steel mold and 60 Btu copper mold. copper Btu 60 and mold steel Btu 15 in cooled lens polycarbonate of Thermograph

Figure2 Figure3 Alloys Mold Evaluating Testfor Procedures time.cycle reduce and warpage reduce spots, hot cooling than the mold. steel stainless the than cooling more provided mold conductivity high the seconds), 25 vs. (10 shorter percent 60 cycle cooling a with even that show the fromaremold shown in ejected lenses the of images Thermographic 55˚C. at circulated was polycar grade bonateatinjected 310˚C. ophthalmic formed and an thick from mm 2 were lenses polycarbonateinserts.alloyThe copper in also 130 and inserts steel stainless 420 24 in molded were lenses which ophthalmic polycarbonate in conducted was study materials, case a mold conductivity high of productivity. 500X backscattered electron image of CNS‑V.of image electron backscattered 500X testing lacks a are recognized test procedure. methods givenTablein Only1. rotarythe test fatigue ASTM their respective and CNS-V of samples more or A schematic of an RR Moore type rotary fatigue test. fatigue rotary type Moore RR an of schematic A Toefficiencycooling demonstrate the The properties measured on one one on measured properties The // (5 t/rf/F C17200 Btu/hr/ft/˚F) (75 W/m/K 4,5 The overallThe bettereffect is // (4 Btu/hr/ft/˚F) (14 W/m/K FigureimagesThe 1.

- Table2 while the smaller dark regions are are regions dark Cr smaller the while finish. surface and toughness strength, fatigue large affectadversely can which precipitates contain many will material In the 4. cases, Figure something like is alloy consistently this from expect can one that quality microstructural best the sections,large plate.In the of direction rolling the in elongated are largermicron)(100 Ni at 50X, shown in micrograph optical Another 4. in Figure shown is 260X at material that of Microstructure Figure4 0 irn ein ae Ni are regions micron 10 large The 3 . Figure in shown is sample CNS-V polished a of image) electron 260X optical image of CNS-V.of image optical 260X turer of this type of apparatus. of type this of turer manufac- the after testing Moore as RR known is testing This rod. test the of center fully the on a -1) (R= in load reversed results This 2). Figure axis (see the on moment fixed a applying while mid-section reduced a with rod a rotating by performed is testing This Useful properties of several mold alloys. mold several of properties Useful ensity @ 20° C 20° @ C 20° @ Conductivity Electrical Capacity Heat Elongation T Elastic Ultimate YieldCompressive Charpy Strength Fatigue 107 hermal Conductivity @ 100° C 100° @ Conductivity Thermal Hardness Property An SEM micrograph (backscatteredmicrograph SEM An ensile Yield StrengthYield ensile 2 Si 3 particles. An optical micrograph Modulus Energy T ensile Stength ensile Figure 5, shows much 2 Si particles thatparticles Si 2 Si particles, particles, Si % in 3D in % W/m/K J/kg/K kg/m Units MS/m HRC MPa MPa MPa MPa GPa J 3 Figure5 V with large silicide particles. silicide large with CNS-V of image optical 50X CNS-V Results of Conductivity TestingConductivity of Results of 26 HRC.26 of hardness a IACS)and (34% MS/m 19.7 of conductivity electrical temperature room a has sample other HRC.The 28 MS/m of hardness nominal a IACS)and (31% 18.0 temperature of room conductivity a electrical has plate This surface. the normal to perpendicular one one plate: and same the of orienta- tions different the from of were Two samples measured. was samples strength. peak the beyond treatments different heat overaging several undergone has material tensile that of heat single and a for strength conductivity electrical aging at intermediate temperature. temperature. 6 intermediate Figure at after aging achieved is strength maximum 18.0 near tivity conduc- A hotworking. after treatment heatinitial the annealing, solution after its strength) attains (and conductivity alloy minimum The of material. treatment the heat the on dependent 18-20 8690 160 410 790 880 827 137 275 < 7 < 28 h teml odciiy f three of conductivity thermal The h eetia cnutvt is conductivity electrical The 7 C17200 hw a eainhp between relationship a shows 16-20 8320 8-20 155 435 770 960 850 137 345 LH 30 15 MS/m (31% IACS) and IACS) (31% MS/m C96970 CuNiSn 8940 390 720 770 790 125 250 8.0 67 29 19 6 P-20 1020 7800 AISI 460 895 850 205 29 32 20 30 -- --

Topic topic mold material are a linear least squares fit of the data. the of fit squares least linear a are lines The hardness. to respect with material the of properties tensile the of graph A Figure8 data. the to fit linear,squares the least is line The material. of heat single a of conductivity electrical and strength tensile ultimate of graph A Figure6 Figure10 that of other common mold materials to aid the mold designer in using this alloy in molding tooling. molding in alloy this using in designer mold the aid to materials mold common other of that moldmakersbetter understand itsapplications, benefits andlimitations. help will properties mechanical and physical its of review a young, fairly is system alloy this As fatigue machine. fatigue rotary type Moore RR a with taken alloys mold base copper several of data Fatigue Reprinted from theNovember 2007MOLDMAKING TECHNOLOGY Magazine and 6915 Valley Ave., Cincinnati, Ohio45244-3029. Figure9 Figure7 V plates. CNS-V commercial two from taken data hardness C Rockwell of histogram A sample. CNS-V IACS) (31% MS/m 18 an for temperature vs. conductivity of Graph Figure11 Hardness and conductivity for several common mold alloys. mold common several for conductivity and Hardness Copyright © 2007 by Gardner Publications, Inc., T heseare compared with

120 opr eylu. h graph The beryllium. copper C17200 and CNS-V of graph fatigue number) indenter.C Rockwell the than silicides harder the of more contacts indenter largerBrinell variation. thatthe probablyfact is the This to greater due show and average on lower generally are measurements Rockwellhardness 29.4. is Table1 140, 281.4 averaged plate HBW. Conversion this to HRC per ASTM E of testing hardness tested Brinell HRC. was 27.9 averaged that commercially material available hardest The HRC. 29 exceeds readings the of None in 9. Figure shown is suppliers other two from MPa. 800 of strength yield and MPa 883 of strength a tensile at HRC 29 of hardness a achieving alloythe with consistent aredata These from plate.mm 50 derived variousheat treatments of properties tensile yield and ultimate the and hardness between Results of Mechanical TestingMechanical of Results in given is conductivity the thermal temperaturedependence of the of graph A hr/ft/˚F). Btu/ (114 W/m/K 198 reached sample (100 W/m/K 174 of conductivity a reached tempera- 18.0 the 150°C, At ture. increasing with increases conductivity thermal the temperature, conductivity. thermal the mationof electrical conductivityprovideto approxigood a the - of and measurement alloys allows copper other of that with a Lorenz number of 2.78 x 10 a Lorenz number of 162 W/m/K of (94 Btu/hr/ft/˚F). This yields conductivity room a thermal had temperature sample MS/m 19.7 The 18 MS/m (31% IACS).(31% MS/m 18 is conductivity electrical its and 7.5% is The measuredthis sample elongation of HRC. 29.0 and offset 0.2% at strength tensile strength, 800 MPa (116 ksi) yield CNS-V were 883 MPa (128 of sample commercial a on measured K sample. number (81 W/m/K 140 be to calculated was tivity conduc- temperature, roomthermal the At directions. two 2 the between about percent by differed plate MS/m 18.0 2 Figure 10 Figure hardnessRockwell C of histogram A Like most copper alloysLikecopper roomatmost near iue 8 Figure properties mechanical highest The h teml odciiy rm the from conductivity thermal The Ti Lrn nme i consistent is number Lorenz This . t/rf/F. hs ils Lorenz a yields This Btu/hr/ft/˚F).

Btu/hr/ft/˚F). The 19.7 MS/m MS/m 19.7 The Btu/hr/ft/˚F). 6 f .5 10 x 2.65 of Figure 7 Figure shows a “SN” (stress, cycle(stress, “SN” a shows hw te correlation the shows for the 18.0 MS/m 18.0 the for -8 MS/m sample MS/m W-/K ksi) ultimate ‑8 W ‑ohm/ 2 . to three). to one (from samples of number small a from are alloys copper the all for data conductivity thermal and samples.Compression production a of for number values large mean the copper are for beryllium data tensile The samples. mean arevalues for production a large number of C96970 for data CVN and tensile The sample. “best-in-class” the of properties the represent data these developmentalused, are whereranges Exceptmaterial. some and plate) thick available material (approximately 50mm measurements on of some commercially for data CNS-V were The derived from a datasheets. small number published in summarized and are conductivity hardness thermal The range. HRChardness 26-32 the in supplied are these alloys of All steel. tool Cr-Ni-Mo a is P-20 AISI alloy. hardened spinodally rm mc lre st f aus that wereaveraged. values of set larger much derived a from values typical are beryllium cycle copper fordata The displayed. is count highest the and measured were ForCNS-V, two stresslevelper samples lower beryllium. copper than strength slightly fatigue have to CNS-V shows Comparison with Other Mold Alloys Mold Other with Comparison Conclusion Applications C96970 beryllium. copper C17200 over-aged is is shownin alloys mold common of properties hr srnt ad ades s not is hardness and strength where applications in replacement suitable a be may it shows beryllium copper with comparison A W/m/K. 138 of excess in about of 29 HRC at hardness a thermal conductivity maximum a achieving of corrosionatelevated temperatures. copper alloy, it is high susceptible to a oxidative being although nozzles; runner C), it also can be used successfully in hot (425° temperature working upper high sprue include bushings and ejector pins. uses its Because of Other slides. and inserts cores, include applications mon molds,com- and injection inserts.In handle rings neck pinch-offs, as used be the mold industry. In blow molding it can in applicationsmany has tivity,CNS-V 0 ee ae from taken were P‑20 for data The A comparison of several physical physical several of comparison A N- i a aly ytm capable system alloy an is CNS-V conduc - and strength high its With Figure 11 (page 20). (page 11 Figure 7 s N C67 Cu-Ni-Sn C96970 UNS is . C17200 LH C17200 19). Table(page 2

mold. steel a in insert an as CNS-V for application typical A treating. heat during sections such cooling and heating uniformly in difficulties to due produced consistently be cross-sec - not will minimum tion) in inches 6 Experience (greater than sections inches. large that 4 indicates than thicker sections provides no supplier Currently commercial sections. large in alloy the provide to suppliers the of ability temperatures below315°F. to limited copper is C17200 beryllium while 425°C of ture tempera- operating upper an having of advantage the have does HRC.CNS-V tently providing hardness in excess28 of consis- of capable be to appeardoesn’t CNS-V hardness, HRC 40 of conductivity. capable similar is which beryllium copper unlike a Also, at higher strength slightly has beryllium However, copper importance. paramount of XL References 7, 1981. 7, April 4,260,435, Patent US Ingerson, Quentin and Edens Walter C18000. designation UNS February1928. 7, i te boue eprtr and conductivity. temperatureelectrical absolute the is T by givenκ = LT conductivity where σ, thermal the and tivity conduc- electrical the between proportionality Temperature Profiles and Warpage,” SPE SPE Warpage,” Proceedings,ANTEC (1997). and Profiles Temperature Performance,Process Cores: Steel vs. “Copper provedforuse.brittle too that nickel 10% about with composition a and original chromium 1% and nickel 2% to the up containing than invention (C64700) and C18000 is other a cast version commercialized Copper Alloys Using New Mold Cooling Cooling Mold New Software,”Proceedings,ANTEC SPE (1996). Using Alloys Copper “Applying Monfroe, Michael and Shoemaker hs ril hs o dat ih the with dealt not has article This 7 6 5 4 3 2 1 ® Brush Wellman proprietary alloy MoldMAX MC’ Aly 940 Alloy AMPCO’s Michael Corson, US Patent 1,658,186, 1,658,186, Patent US Corson, Michael The Lorenz number, L, quantifies the the quantifies L, number, Lorenz The The versions of copper nickel silicon silicon nickel copper of versions The Paul Englemann, and Eric Dawkins, Dawkins, Eric and Englemann, Paul al nlmn, rc akn, Jay Dawkins, Eric Englemann, Paul . is the thermal conductivity, thermal the is κ ® , presently given given presently , s the is σ MMT

TopiPhotoc courtesy topi of cBrush Wellman.

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