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Intel Atom® Processor Z3600 and Z3700 Series Datasheet, Vol 1

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Intel Atom® Processor Z3600 and Z3700 Series Datasheet, Vol 1 Intel® Atom™ Processor Z3600 and Z3700 Series Datasheet December 2014 Revision 003 Document Number: 329474-003 You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548- 4725 or visitwww.intel.com/design/literature.htm. Intel, Intel Atom and the Intel logo, are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. See Trademarks on intel.com for full list of Intel trademarks. © 2014 Intel Corporation. 2 Datasheet Contents 1Introduction............................................................................................................ 16 1.1 Terminology ..................................................................................................... 19 1.2 Feature Overview .............................................................................................. 20 1.2.1 Type 4 SoC............................................................................................ 20 1.2.2 Type 3 SoC............................................................................................ 24 1.3 SKU Information ............................................................................................... 29 1.4 Difference between SoC SKUs ............................................................................. 30 1.5 References ....................................................................................................... 30 2Physical Interfaces.................................................................................................. 32 2.1 Pin States Through Reset ................................................................................... 34 2.2 System Memory Controller Interface Signals ......................................................... 35 2.3 USB 2.0 Host (EHCI/xHCI) Interface Signals ......................................................... 37 2.4 USB 2.0 HSIC Interface Signals ........................................................................... 37 2.5 USB 3.0 (xHCI) Host Interface Signals ................................................................. 37 2.6 USB 2.0 Device (ULPI) Interface Signals ............................................................... 38 2.7 USB 3.0 Device Interface Signals......................................................................... 38 2.8 Integrated Clock Interface Signals ....................................................................... 39 2.9 Display - Digital Display Interface (DDI) Signals .................................................... 39 2.10 MIPI DSI Interface Signals.................................................................................. 41 2.11 MIPI Camera Serial Interface (CSI) & ISP Interface Signals..................................... 41 2.12 Low Power Engine (LPE) for Audio (I2S) Interface Signals ....................................... 42 2.13 Storage Control Cluster (eMMC, SDIO, SD) Interface Signals................................... 42 2.14 SIO - High Speed UART Interface Signals ............................................................. 43 2.15 SIO - I2C Interface Signals ................................................................................. 44 2.16 SIO - Serial Peripheral Interface (SPI) Signals ....................................................... 44 2.17 PCU - iLB - Real Time Clock (RTC) Interface Signals ............................................... 45 2.18 PCU - iLB - Low Pin Count (LPC) Bridge Interface Signals ........................................ 45 2.19 PCU - Serial Peripheral Interface (SPI) Signals....................................................... 45 2.20 PCU - Power Management Controller (PMC) Interface Signals .................................. 46 2.21 JTAG and Debug Interface Signals ....................................................................... 47 2.22 Miscellaneous Signals......................................................................................... 47 2.23 GPIO Signals .................................................................................................... 47 2.24 Power And Ground Pins ...................................................................................... 52 2.25 Hardware Straps ............................................................................................... 54 2.26 Configurable IO: GPIO Muxing............................................................................. 54 3 Processor Core ........................................................................................................ 78 3.1 Features .......................................................................................................... 78 3.1.1 Intel® Virtualization Technology (Intel® VT)............................................... 79 3.1.2 Security and Cryptography Technologies ................................................... 80 3.1.3 Power Aware Interrupt Routing ................................................................ 81 3.1.4 Intel® Burst Technology .......................................................................... 81 3.2 Platform Identification and CPUID........................................................................ 82 3.3 References ....................................................................................................... 83 4 System Memory Controller....................................................................................... 84 4.1 Signal Descriptions ............................................................................................ 84 4.2 Features .......................................................................................................... 88 4.2.1 System Memory Technology Supported ..................................................... 88 5 Graphics, Video and Display..................................................................................... 90 Datasheet 3 5.1 Features...........................................................................................................90 5.2 SoC Graphics Display .........................................................................................91 5.2.1 Primary Planes A and B ...........................................................................91 5.2.2 Video Sprite Planes A, B, C and D .............................................................91 5.2.3 Cursors A and B .....................................................................................91 5.3 Display Pipes.....................................................................................................91 5.4 Display Physical Interfaces..................................................................................92 5.4.1 Digital Display Interfaces .........................................................................92 5.5 References........................................................................................................99 5.6 3D Graphics and Video .......................................................................................99 5.7 Features......................................................................................................... 100 5.7.1 3D Engine Execution Units ..................................................................... 101 5.7.2 3D Pipeline .......................................................................................... 101 5.7.3 Video Engine........................................................................................ 102 5.8 VED (Video Encode/Decode).............................................................................. 102 5.8.1 Features.............................................................................................. 103 6 MIPI-Camera Serial Interface (CSI) and ISP.......................................................... 104 6.1 Signal Descriptions .......................................................................................... 104 6.2 Features......................................................................................................... 106 6.2.1 Imaging Capabilities.............................................................................. 106 6.2.2 Simultaneous Acquisition ....................................................................... 107 6.2.3 Primary Camera Still Image Resolution .................................................... 107 6.2.4 Burst Mode Support .............................................................................. 108 6.2.5 Continuous Mode Capture ...................................................................... 108 6.2.6 Secondary Camera Still Image Resolution ...............................................
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