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Covering India, Thailand, Malaysia, Volume 2 Number 5 September/October 2011 Singapore, The Philippines and Hong Kong

Four ways to reduce voids in BGA/CSP package to substrate connections The rush to clean no-clean Raminder Singh Soin Interview Inside Scavenging in today’s manufacturing operations leaflet 23/6/08 15:49 Page 8

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South East Asia Volume 2, No. 5 September/October 2011

Global SMT & Packaging is distributed by controlled Contents circulation to qualified Void personnel. For all others, EDITORIAL Outlines subscriptions are available at 2 Editorial Solder Pradeep Chakraborty Outline a cost of $19.99 for the 8 current volume (six issues). Technology Focus No part of this publication may 8 Four ways to reduce voids in BGA/CSP package be reproduced, stored in a to substrate connections retrieval system, transmitted Michael A. Previti, Mitch Holtzer, and Tom in any form or by any means Hunsinger, Cookson Electronics electronic, mechanical, 0.1 photocopying, recording 16 The rush to clean no-clean d or otherwise without prior Michael Konrad, Aqueous Technologies 0.25 written consent of the d Corporation d publisher. No responsibility is accepted for the accuracy of 20 Reducing defects with embedded sensing Example: information technology Total Void Diameter contained in the text, Tim Skunes, CyberOptics Corp. 16 0.10d + 0.25d = 0.35d illustrations or advertisements. The opinions 30 Future industry directions expressed in the articles are Michael Ford, Valor Division, Mentor Graphics not necessarily those of the Corp. editors or publisher. 36 Scavenging in today’s manufacturing operations © Trafalgar Publications Ltd Harold Hyman, VJ Electronix

Designed and Published by Special Features 20 Trafalgar Publications Ltd, 34 Interview—Raminder Singh Soin, QUAD Bournemouth, UK Electronics 40 electronica India 2011 and productronica India 2011 open their gates Download this issue to your regular columns mobile phone: 24 Outlook for 2H’11 and beyond Walt Custer and Jon Custer-Topai

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www.globalsmtseasia.com Global SMT & Packaging South East Asia – May/June 2011 – 1 TitleEditorial www.globalsmtseasia.com [email protected] Editorial Offices Europe Crown House, 72 Hammersmith Rd, Hammersmith, London, W14 8TH United Kingdom Pradeep Chakraborty Tel: +44 7924 581 523 Technical Editor United States Global SMT & Packaging PO Box 7579 Naples, FL 34102, USA Tel: +1 (239) 245-9264 Editorial Fax: (239) 236-4682 China Global SMT & Packaging he India Semiconductor Association focused on a very relevant theme. Electronics Second (ISA) has undergone a makeover. He acknowledged that while India was Research Institute Ms Poornima Shenoy, the presi- fairly well known in software, it lacked in No.159, Hepin South Road Tdent, from 2005 onward, has now moved electronics system and manufacturing. Taiyuan City, PO Box 115, Shanxi, Province 030024, China on, giving way to PVG Menon, a former As per the task force in 2009, demand for Tel: +86 (351) 652 3813 member of Philips and NXP. electronic systems is projected to grow Fax: +86 (351) 652 0409 The reign of Poornima Shenoy is best from $45 billion to $400 billion. At the cur- Editor-in-Chief remembered for the revival of the Indian rent rate, approxiately $104 million can be Trevor Galbraith electronics and semiconductor industry. manufactured here and the rest needs to be Tel: +44 7924 581 523 (Europe) Tel: +44 20 7792 0792 (UK) Back in 2005, there was hardly any taken care of by imports. Tel: +1 (239) 245-9264 x101 (US) system in place that talked about the Indian It was in this context, he said that elec- [email protected] semiconductor industry. Of course, there tronic system design and manufacturing Managing Editor were some Indian electronics and semicon- can propel the industry toward energy effi- Heather Lackey ductor firms, albeit small. ciency. The time has come to show India’s Tel: +1 (239) 245-9264 x105 At that juncture, the industry was might. [email protected] deliberating whether India should focus So, that leaves a major challenge for Technical Editor on design services, and if yes, then, which PVG Menon to handle! Pradeep Chakraborty route should be followed? This debate con- Some questions that need to be Tel: +91-9945127632 tinued for a couple of years, till the time answered are: what are other countries [email protected] 2007 arrived. Even I, among many, was doing to favor industrialization in this Associate Editor pleasantly surprised when the ISA came up space, and how they are benefiting from the Usha Prasad with SIPS, or the Special Incentive Package same? This will help strengthen the policy, [email protected] Scheme, better known as the Indian while making it relevant for every stake- Circulation & Subscriptions Semiconductor Policy. holder or beneficiary. Kelly Grimm At that point of time, I had just returned Should the government give incen- Tel: +1 (239) 245-9264 x106 from Hong Kong, excited by the prospects tives to companies to create semiconductor [email protected] that SIPS held for India. manufacturing capacities on Indian soil, A few weeks prior to the announce- instead of buying re-furbished and lower Advertising ment of SIPS in 2007, an Israeli delegation cost equipment at previous generation India—Amitava Sarkar was in town, looking to develop business in technology nodes? 09379229397 [email protected] India. A few of them even sounded upbeat There is talk about extending the policy about SIPS. till 2015. Three years seems too short a time Singapore & Hong Kong— Philip Lim Now, all of this really excited me, as for developing a capital-intensive industry +65 6552-7388 one could see all the possibilities in front of semiconductor manufacturing. It takes [email protected] of India. One felt that, should SIPS 2007 go time for big investment decisions to be Korea—Amy Kim well, India could be in for a great ride in made, and it is just about started happen- [email protected] electronics manufacturing and in the semi- ing, is another remark. Americas—Shana Harris conductor space. India, back then, was on The India semiconductor story has so Tel:+1 (408) 946-8109 the threshold of major initiatives in elec- far been something like this: Lots of high- Mobile: +1 (510) 673-2407 tronics manufacturing space. end designs are being done here. Lot of key [email protected] Only for the story to spoil itself! decisions are being made out of India. The Europe—Andy Kellard First, SEMIndia and then HSMC flat- talent pool is very much present and intact, Tel: +44 7432 652709 [email protected] tered to deceive, with their fab fables. And and growing! We are leaders in design ser- since 2009, there have been no further dis- vices and embedded, make no mistake. cussions about having a fab in India. Now, do we need any semiconductor Early this year, at the ISA Vision fabs at all? You decide and let me know! Summit, Dr. Ajay Kumar, joint secretary, Department of IT, Government of India, said that the ISA Vison Summit 2011

2 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com

TitleIndustry news Industry news

the latest forecast was reached by the indus- for industry relevant research. In this role, try group Semiconductor and Electronics Menon would be responsible for oversee- Industries of the Philippines Inc. (SEIPI) at ing the operations of ISA and will work a recent meeting of members in Cebu City. as a member of its Executive Council on “In Cebu, they said it’s going to be a strategic issues related to the growth of the negative 5 percent because Japan has not semiconductor and the electronics indus- recovered from the impact of the disasters try in India. and the US is experiencing a little weak- ness. Both resulted in a weaker picture of Panasonic to start production in exports as a result of lower supply and weak India at Haryana’s Jhajjar facility by demand of electronics and semiconductor Nov, 2012 products. Japan has stopped buying,” Japanese electronics major Panasonic will SEIPI expects electronics shipments to start production from its upcoming manu- normalize by the third and fourth quarter. facturing facility at Jhajjar, in Haryana, by November, 2012. Panasonic India, a 100 Everett Charles Technologies Tailyn Communication Company, Ltd. per cent subsidiary of Japan-headquartered appoints technical marketing adds SMT line Panasonic Corporation, is in the process director for Asia Tailyn Communication Company, Ltd., of investing USD 200 million over a five- an advanced electronics manufacturing Everett Charles Technologies—Electrical year period on the facility, dubbed the services (EMS) provider, has enhanced Test (ET) has appointed Vincent Yu as Panasonic Techno Park. its manufacturing capabilities with the the technical marketing director for Asia. The company also said it will increase addition of a new surface mount technol- Vincent brings valuable business experi- its overall workforce in India to 12,650 ogy (SMT) line. The line includes a DEK/ ence to help ECT-ET expand its Asian employees by the end of this year from Horizon solder paste printing machine, market presence. Vincent will be based in the current strength of 10,500 employees. Panasonic CM602 high speed mounter, Taiwan, where he will oversee the comwww.panasonic.co.in Panasonic DT401 multi-function mounter, pany’s marketing and technical customer a Heller 1912EXL nitrogen reflow oven and support efforts. www.ectinfo.com Sales of television sets expands in a TRI 7500 serial AOI unit. The combina- Southeast Asia in 1h2011 Freescale opens India R&D center in tion of additional equipment and faster The television market in Southeast Asia placement speeds increases production Hyderabad’s Special Economic Zone expanded in the first six months of 2011, capacity by 89 percent. compared to the same period last year, with US-based Freescale Semiconductor has consumers having spent over US$2.1 bil- set up its India research and development InkTec opens dedicated production lion on 6.33 million units. centre in Hyderabad to drive innovation facility for Thinfilm Memory According to GfK Asia, Indonesia, and development of solutions for the com- Thin Film Electronics’ memory production Malaysia, the Philippines, Singapore, pany’s new platforms. partner InkTec, headquartered in Ansan, Thailand and Vietnam contributed to an The company has established its centre South Korea, has opened a new dedicated overall industry growth of 16 percent here to take advantage of India’s cost production facility for Thinfilm Memory. and 11 percent respectively in value and advantage and easy availability of techni- In 2009, Thinfilm and InkTec were the volume terms. cally skilled manpower. first in the world to produce polymer It also said the latest retail audit report Activity at the new facility is expected memories at large scale using roll-to-roll reflects continuing demand for LCD sets to deliver solutions that enhance Freescale’s printing. The new, upgraded facility has a which achieved nearly 30 per cent more platform for applications including data production capacity of 10 million tags of in value sales over the first half of 2010, center, security appliances, mobile wireless Thinfilm Memory per month, and will sup- making it the key driver of the overall tele- infrastructure and small business network- port production of passive array memory. vision industry across Southeast Asia. ing among other leading edge technologies. Thinfilm and InkTec will also work on the www.freescale.com development of addressable memories, Global Sources’ fall electronics Philippine electronics exports face which combine memory and logic in an shows to feature over 3,800 booths integrated device. www.thinfilm.no 5% decline in 2011 Exhibitor booths at Global Sources’ electronics trade shows, scheduled to run Exports of electronics and semiconductors PVG Menon appointed president of Oct. 12-15 at the AsiaWorld-Expo in are likely to drop 5 percent in 2011 due to India Semiconductor Association Hong Kong, have been sold out. The co- the impact of the Japan tragedy and weak- India Semiconductor Association (ISA) located China Sourcing Fairs: Electronics ness of the US economy. This is a reversal has appointed PVG Menon as its new pres- & Components, Security Products, Solar from the growth in 2010 and well below ident. Menon brings with him an excellent & Energy Saving Products and Korea the projected 8 to 12 percent growth for combination of domain knowledge, focus Sourcing Fair: Electronics & Components the year. towards membership promotion and a flair will feature over 3,800 booths, a 15 percent Trade Secretary Gregory Domingo said increase from last fall.

4 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com

Industry news

“Our electronics shows continue to vicing the electronics and automotive subsidiary company located in the United attract the world’s top buyers and this is industries, and another in Taiwan, focus- States, where he will continue his duties in driving demand for exhibitor space at our ing on the electronics and communica- addition to his new responsibilities. shows. This year, we sold out all booths two tions markets. Beginning in autumn, new In his new position, Black will report to months ahead of the shows—which is ear- Innovation Centers in Thailand and India the top management of Juki Corporation lier than any of our previous fall electron- also will be ready to collaborate with cus- where he will advise on the worldwide ics events,” said Tommy Wong, president of tomers around renewable energy initiatives SMT market, strategies to continue Juki’s Global Sources Exhibitions. and innovations. growth in electronics assembly and assis- While the majority of exhibitors for DuPont’s goal is to partner on solutions tance to other Juki subsidiary companies. the October 2011 event are from mainland that fuel local collaboration and applica- Black becomes the first non-Japanese China, buyers can also have the opportu- tion development and engage customers in Executive Officer in Juki’s 73 year history. nity to see competitive electronics prod- inclusive innovation—wherever they are in His appointment took effect July 1, 2011. ucts from other production centers includ- the world. www.dupont.com www.jas-smt.com ing Hong Kong, Taiwan, South Korea, Malaysia, Japan, India, the Philippines, Momentive to open new Business & Karbonn Mobiles to set up Australia and Italy. www.chinasourcingfair. Technology Centre in Bangalore manufacturing in India com Momentive Performance Materials According to Voice & Data (voicendata. Holdings LLC’s subsidiaries—Momentive ciol.com), low-cost India-based handset RS Components debuts industry’s Performance Materials and Momentive provider Karbonn Mobiles has plans to first rewards programme for Specialty Chemicals—will open a new set up a manufacturing plant by the end of Malaysia customers regional business headquarters and state of this month. It is expected to begin rolling RS Components, a high service dis- the art Global Research and Development out the company’s own products—to the tributor of electronics and mainte- Centre in Bangalore, India. tune of around six lakh mobile phones a nance products and the trading brand The new facility will be located on month—in August. The company is invest- of Electrocomponents plc., has launched a two-acre plot in the second phase of ing Rs. 100 crore for the new plant. a new rewards programme that is avail- Bangalore’s “Electronic City” and will ini- The company has recently forayed into able exclusively to its business-to-business tially house 125 associates. Research scien- international markets like Bangladesh, customers across South East Asia. RS tists based at the facility will work on new Nepal, Sri Lanka, West Asia and Africa Components is the first in its industry and technology platforms and product devel- along with other companies like Intex, one of the first business-to-business play- opment for new and existing applications. Lava, Micromax and Maxx Mobile. It has ers to pioneer a rewards programme on a www.momentive.com been selling around 600,000 to 750,000 regional scale for its customers. handsets a year in India. “RS REWARDS” is a loyalty programme Juki Corp. appoints Robert J. Black Karbonn Mobiles is a joint venture that promises to deliver more value to to executive operating officer company between Delhi-based Jaina customers who purchase frequently from Group which was a distribution house and RS Components. The programme has the Bangalore based UTL Group, a multi- been rolled out in Singapore, Philippines, division telecom group with an annual Thailand and Malaysia. Response to turnover of Rs.1600 crore and manpower the programme has been very positive. of 2000. www.karbonnmobiles.com www.rs-components.com Danfoss appoints president for Morpho’s Indian subsidiary Syscom Danfoss India wins award as “Best Exporter Danfoss Industries Private Limited, which Electronic Hardware” is into mechanical and electronic com- The Indian subsidiary of Morpho (Safran ponents and solutions, has appointed group), Syscom orporation Limited, has Noel Ryan as president of Danfoss India. been honored as Best Exporter in the elec- Having been with Danfoss since 1997, tronic hardware sector for the year 2009- an important aspect of Noel’s new role 2010. This selection was made by the Noida will be to establish support to the group’s Special Economic Zone (NSEZ), based on growth and also ensure the companies the outstanding export performance of the continued expansion in the country. company in that period. The award cer- www.danfoss.com emony was attended by all units operating in the NSEZ. www.safran-group.com

DuPont to open new Global Innovation Centers Juki Corporation, headquartered in Tama DuPont plans to open new global Center, Tokyo, Japan, has appointed Robert Innovation Centers, with the first in Asia J. Black, Jr. to the position of executive Pacific. The two Innovation Centers open- operating officer of Juki Corporation. ing this month include one in Korea, ser- Black currently serves as President & CEO of Juki Automation Systems, Inc., Juki’s

6 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Head of Application Technology – ZESTRON

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1108-global-smt-sea.indd 1 04.08.2011 11:28:00 Four ways to reduce voids in BGA/CSP package to substrate connections Four ways to reduce voids in BGA/CSP package to substrate connections Michael A. Previti, Mitch Holtzer, and Tom Hunsinger, Cookson Electronics

Voids in BGA/CSP package to Introduction tures of many constituents are less than substrate connections can cause Voids in solder joints are considered one of 250˚C. Other outgassing sources may be the more detrimental defects in electronic substances generated from or reactions issues with thermal management, assembly as area array devices have now with the substrate, component metaliza- drop shock resistance and signal evolved to a point where mass production, or the solder powder or sphere sur- interference. Zero voids are always tion of fine pitch devices with increasing faces. the best solution, but this is not functionality are common. The factors The location and the size of the voids affecting void formation are complex and are perhaps the key factors that influence always easy to achieve. Solder involve the interaction of many factors. In the effect of the voids on the performance paste printing, reflow, alloy and area array components such as BGA (ball and reliability of solder joints. It has been flux chemistry all have significant grid array), PBGA (plastic ball grid array) an industry observation that voids in or CSP (chip scale packages), solder joint solder joints tend to accumulate towards influences on the amount of reliability between the component and the the top of the solder joint (the interface voiding one can expect in an board is one of the most critical factors between the package and the solder joint). assembly. This paper will discuss as finer pitches and smaller component Size is perhaps the most critical factor solder sphere volumes reduce the amount negatively impacting the solder joint by how print volume (stencil design), of solder in the corresponding solder joint. becoming a source of entrapment, a stress peak reflow temperature, paste Voids have shown to reduce mechanical riser, thermal barrier and electrical degra- flux chemistry and alloy selection robustness of the board level interconnec- dation by restricting the path of current tion and consequently affect the reliability flow. Larger voids typically reduce the affect the level of voiding to be and the conducting performance of the robustness of the solder joint compared to expected when BGA/CSP packages solder joint. The effect of voids on the reli- small voids because the incidence of failure are assembled in a lead free process. ability of a solder joint depends on size, fre- increases dramatically as the solder mate- quency and location1. rial thickness between the void and the ball Voids are defined as cavities formed in exterior decreases. For example a 0.007” the solder joint. Voids are largely caused ball with a 50% void has approximately by the amount of outgassing flux that gets 0.0017” on each side of the void, while a entrapped in the solder during reflow2. 0.004” ball with a 50% void has only 0.001” Voids are essentially gas bubbles that have on each side. The voids impact becomes a much lower density than molten solder. more severe if it is near one of the bond- The buoyancy of these regions causes the ing interfaces. Void location may be equally bubbles to rise to the top of the solder join3. important as reduced cross sectional area Other sources of voids can be via in pad. near the bonding interfaces can adversely The outgassing flux is typically pro- affect reliability. A reduction in cross sec- duced by the evaporation and thermal tional area, specifically when voids are decomposition of flux constituents get- located at the ball/interface attach site, ting trapped in a solder joint during reflow. current flow is restricted, shear strength Reactions of chemical constituents in the is reduced proportionally to the decrease flux and substrate at elevated or solder in bonded material and the solder joint reflow temperatures are also a common stability will degrade more rapidly with cause for gas evolution. Flux is typically a increased temperature cycling. Voids near complicated homogeneous solvent-based the interfaces with the greatest CTE (coef- mixture with many organic additives. ficent of thermal expansion) will degrade Being organic in nature the boiling points and fail in the shortest time. and/or thermal decomposition tempera- A solder joint in an electronic assembly

This paper was originally presented at the SMTA China East Conference 2011.

8 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Four ways to reduce voids in BGA/CSP package to substrate connections serves electrical, mechanical and thermal Location of Void Class I Class II Class III functions, the most important being the Void in Solder 60% of Diameter 45% of Diameter 30% of Diameter conduction of electrical signals. Inherently, (Solder Sphere) = 36% of Area = 20.25% of Area = 9% of Area the resistance of the solder joint should Void at Inteface of Solder 50% of Diameter 35% of Diameter 20% fo Diameter be as low as possible and there should not Sphere and Substrate =25% of Area = 12.25% of Area = 4% of Area be much deviation in resistance between adjacent solder joints in order to achieve Table 1. IPC 7095 requirements for void classification. uniform conductivity. It has been observed in industry that the resistance of the solder reliability difference has been seen with a Void joint will increase with the occurrence of solder joint containing no voids or small Solder Outlines large or many voids as the cross sectional voids. However the frequency and location Outline area of the solder joint is considerably of the voids in a solder joint have an effect reduced. The mechanical function of the on reliability, reducing solder joint life in solder joint is to provide the connection thermal cycle testing. Voids that are greater and support to the component. The elec- than 50% of the solder joint cause a poten- tronic component is continuously affected tial reliability problem causing a 25-50% by the stress and strain as a result of the reduction in solder joint life in mechanical mismatch in the CTE, and the solder joint testing1. 0.1 should be able to withstand all the stress Voids themselves may not be the root d and strain imposed on the component. cause of failures in solder joints, but voids 0.25 An active component in use can pro- d may provide nucleation sites for defects d duce a significant amount of heat during that lead to catastrophic failure. its operation, and this heat needs to be dis- Example: sipated to prevent overheating or cause the Voiding Total Void Diameter breakdown of the component. The con- 0.10d + 0.25d = 0.35d IPC-7095A is the IPC Specification ductive heat transfer through a solder joint for the Design and Assembly Process can be modeled based on Fourier’s law: Figure 1. Solder outline with voids. Implementation for BGAs. The IPC cri- Q = KA (T1-T2)/L teria provide three classes of acceptance criteria for both the solder sphere and designed for evaluating solder paste for Where Q is the heat transferred, K is the sphere-pad interface. Where multiple processing, assembly and reliability. The the thermal conductivity, A is the cross voids exist, the dimensions will be added test board is a 5.25 x 10.0 in., 4 layer FR-4 sectional area of the solder joint, L is the to calculate total voiding in the joint. board. Solder mask was PSR 4000 from length of the solid element and T1 and Inspection criteria used in this paper is the Taiyo. The pad finish used was Entek T2 are the temperature of the source and IPC 7095 requirement for solder joint area. Plus HT copper OSP (organic solder pre- sink. It can be inferred from Fourier’s law Class III voids or better are the most desir- servative) by Enthone. The component that the heat transferred is directly pro- able, being voids less than nine percent of evaluated in this study attached to the test portional to the cross sectional area. A the solder area. boards were 256 IO PBGA packages with solder joint with voids may have a greater lead free spheres. These PBGA packages diameter or an increased standoff to main- Assembly are (17 x 17 mm), 16 x 16 full array with tain the same volume in the solder joint. 1 mm pitch and 0.51mm/20mil diam- A test vehicle was assembled to focus on However, the area of cross section may or eter solder spheres. These are supplied in issues in producing CSP/BGA in a high- may not be the same. A solder joint with SAC105 and SAC305 alloys. SACX Plus™ volume manufacturing environment. The voids may have a smaller area, which may 0307 used in this test were re-balled onto test board used in this experiment was an interrupt the flow of heat. No significant the package. The solder paste used was a existing test board

Figure 2. Low peak temperature, short soak profile. Figure 3. High peak temperature, long soak profile.

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 9 Four ways to reduce voids in BGA/CSP package to substrate connections

Pitch Pad Size Aperture Stencil Thickness Aspct Lead Pitch Powder Powder Size Ratio Inches µm Type Distribution Inches µm Inches µm Inches µm Inches µm 0.025 635 3 25-45µ 0.025 635 0.015 381 0.0012 305 0.006 152 2 0.020 508 3 25-45µ 0.020 508 0.012 305 0.010 245 0.005- 127- 1.7 0.006 152 0.016 406 3,4 25-45µ, 20- 38µ 0.015 406 0.010 254 0.008 203 0.005 127 1.6 0.012 305 4 20-38µ 0.012 305 0.008 203 0.006 152 0.004 102 1.5 Table 2. Recommended sizes, pad width and tolerance. Table 3. Paste type based on lead pitch. high volume commercially available paste of numerous factors that all influence how stencil is approaching or equal to the area made with SACX Plus™ 0307, SAC105 well the solder paste printing process will of the walls of the aperture, area ratio is a and SAC305 type 4 powder. Reflow pro- perform. vital calculation to design a stencil that will files run in Figures 1 and 2 were on a Four main elements define the typical print well with minimum aperture clog- Speedline Omniflo 7. All voiding x-ray stencil design: material, thickness, image ging and maximum solder paste transfer 4 measurements were taken using a Phoenix pattern and aperture size. There is no efficiency . Micromex-HLN. single combination of these elements that An aspect ratio of 1.5 or greater and an Pad metallization and reflow atmo- can be recommended as the best choice. area ratio of 0.6 or greater are required to sphere were not studied in this experiment Instead, the various options available must insure maximum solder paste transfer effi- as previous studies shown that these two be considered in the context of the overall ciency and minimum aperture clogging. factors do not have a significant effect on assembly process. The main factors that affect solder paste void formation1. One of the key elements in stencil printing are its rheology, tackiness, and Figure 2 shows the low soak profile design is to maximize the amount of solder powder particle size and shape. For exam- with a 175˚C soak for 60 seconds followed paste that is transferred through the sten- ple, Type 4 solder paste is typically required by a peak temperature of 240oC with total cil aperture onto the printed circuit board for pitches under 0.4 mm. This is based on time above liquidus (TAL) of 60 seconds. pad. This is called “transfer efficiency.” The experimentation that has shown that four The high soak profile in Figure 3 is a 160- proper stencil design will ensure the force or more solder particles are needed to span 180˚C soak for 120 seconds followed by a that adheres the solder paste to the PCB the stencil aperture to achieve consistently 250˚C peak temperature with a TAL of 60 pad will overcome the force that retains good solder paste deposition. Similarly, seconds. the solder paste in the stencil aperture. The with 0.3 to 0.4 mm pitch, the stencil open- two calculations that must be considered ings should be between 0.005” and 0.008” Printing volume & stencil in stencil aperture design to maximize wide. Since Type 4 paste has solder particles design solder paste transfer efficiency are “aspect ratio” and “area ratio.” Aspect ratio con- <0.0014”, this criterion is statistically met. The goal of the solder paste printing pro- Recommended paste types, based on lead cess either on rigid or flexible circuits is siders the ratio between the width of the aperture and the thickness of the stencil. pitch, are provided in Table 3. simple to understand; place the correct Paste selection and processing param- amount of solder paste in the correct Area ratio considers the ratio between the opening of the aperture (the area of the eters have been observed as critical factors location at an acceptable rate, twenty four affecting void formation and subsequent hours per day seven days per week. This printed circuit board pad that will be covered with solder paste) and the total sur- solder joint reliability. Figures 4 & 5 show goal may be simple to understand but the the effect of a ten-percent aperture reduc- execution of the goal requires the identi- face area of the aperture walls. For small components where the opening of the tion resulting in reduced volume of solder fication, understanding, and optimization paste transferred to the corresponding pad

Figure 4. Void size distribution of BGA 256 with three different reflow Figure 5. Void size distribution of BGA 256 with 10% aperture profiles. reduction.

10 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com

Four ways to reduce voids in BGA/CSP package to substrate connections

Figure 6. Two different flux activators run at same reflow temperature. Figure 7. Voiding of same activator run at two different temperatures.

Figure 8. DSC scan of a solder paste activator run directly on a cop- Figure 9. Voiding analyses of solder pastes in reflow profiles. per substrate.

profiles will yield material clearly shows less voiding than an and its affect on voiding performance. The different voiding alternative material. Figure 7 shows the ten percent volume reduction resulted in performance. In almost all cases, a lower voiding levels measured of the same flux much lower voiding results in all cases peak temperature profile will yield better composition run at two different reflow using the same solder paste and three reflow voiding results than a higher peak temper- peak temperatures of 230˚C and 240˚C. profiles. Thus stencil design and printing ature profile[5]. This is generally accepted Figure 7 provides evidence that peak reflow parameters are critical factors in reducing as the boiling points and reaction tempera- temperature has an effect on voiding and voids. Figure 5 shows that size and level of ture of a fluxes constituents will be further that selecting materials with specific sub- voids are lowered significantly by reducing from their boiling points and reaction limation and boiling characteristics should solder paste volume by approximately ten temperature in a lower peak temperature be kept in mind. percent compared to Figure 4 under identi- reflow process compared to a reflow profile Figure 8 shows the behavior of a spe- cal reflow profiles. Solder paste reduction having a higher peak temperature. cific constituent (Activator 1) in a DSC is not seen as a drastic measure to reduce Another technique in flux composition (differential scanning calorimeter). Using voiding as the largest volume of the solder evaluation is to evaluate specific compo- a DSC measuring a single substance on a for the joint comes from the sphere of the nents of a flux system separately and exam- specific substrate, the reaction tempera- package being attached. However, a typical ine their direct effect on voiding based on tures, boiling points and any subsequent solder paste is 50% by volume flux, so the various concentration levels. In these tests weight loss at a specific temperature can 10% reduction in solder paste volume has the voiding data is compared to alterna- be measured to evaluate potential voiding a larger affect on total flux content used in tive substances that may be used and run of a flux’s constituents. This information forming the metallurgical joint. under identical conditions. Figure 6 shows can then be used to determine if the flux an example of the difference between two activator would be a source of voiding in a Flux composition different activator levels in respect to void- final solder paste formula. Employing the It is empirically observed that for the same ing keeping the reflow temperature at a same methodology using a flux’s complete reflow profile, different flux formulations 240˚C peak. This provides clear evidence activator system can also be employed. have different voiding performance. For an that different activator systems need to be This compensates for assumptions based identical flux formulation, different reflow evaluated when considering voiding as one on boiling point depression of mixtures or

12 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Four ways to reduce voids in BGA/CSP package to substrate connections

Figure 10. XY matrix of alloys tested and reflow profile. unintentional reactions of these compli- balls or flux spattering to cated systems. appear. The soak zone may Figure 11. Voiding analyses of SACX PlusTM 0307 solder Reflow profile be the most critical part paste with SAC105 & SAC305 BGA spheres. The critical reflow profile parameters that of the reflow profile in are responsible for voiding are preheat which to reduce voids and temperature, ramp-up rate and peak tem- subsequently the greatest perature. area where defects have During this study all were varied their origin. If a soak within the allowable process limits to verify temperature is exces- if voiding could be minimized. Reflow pro- sive, the flux constituents filing and controlling ramp rate and peak may be depleted. The end reflow temperature are generally accepted result will be re-oxidation as known methods of managing voiding in of the solderable surfaces, SMT and semiconductor package assem- solder powder, spheres blies. The need for proper setup of the oven and result in defects such profile to limit temperature extremes and as head-in–pillow, void- thermal shock to components and PCB ing and improper coales- is also known. Unfortunately this is the cence. If the soak temper- limit of process control in many reflow ature is too low the flux processes. Many electronic assemblers may not be consumed ignore the potential for variance in solder or activated resulting joint quality due to variations in the reflow in excess residues or Figure 12. Voiding analyses of SAC105 solder paste with SACX profile. Additionally, many manufacturers improper solder wetting PlusTM 0307, SAC105 & SAC305 BGA spheres. desire to achieve higher production vol- as de-oxidation has not umes without increasing floor space may taken place. Typical soak develop profiles that increase reflow oven temperatures are usually belt speed to increase throughput5. This 160˚C to 180˚C. leads to a reduction or elimination of the Time above liquidus soak portion of the reflow profile. (TAL) of the alloy also has During the reflow process, the solder an affect on solder joint paste will experience temperature gradi- reliability and defects. ents that will impact its chemistry, void- For SAC alloys it is rec- ing and the final soldering results. Proper ommended that a board optimization of the thermal profile will spend approximately 60 result in a net reduction of defects and seconds above liquidus increased reliability of the solder joint. In with a peak temperature the initial ramp up stage of the profile, the 15-20˚C above its melting low boiling solvents in the flux system temperature. As an exam- will volatilize. The recommended ramp ple, if SAC305 is used up temperature for lead free SAC reflow its melting temperature profiles is 0.75-4˚C per second and may be range is 217 to 220˚C, the limited by the thermal stability of the com- peak temperature should be in the range of 230˚C ponents. Excessive ramp up temperature Figure 13. Voiding analyses of SAC305 solder paste with to 245˚C. In Figure 8, the may at times cause explosive release of the SACX PlusTM 0307, SAC105 & SAC305 BGA spheres. low boiling constituents and cause solder DSC exotherm demon- strates a reaction between

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 13 Four ways to reduce voids in BGA/CSP package to substrate connections the flux constituent and copper substrate at Alloy composition SAC105 paste, meeting Class III voiding 247˚C confirming at excess high tempera- Since 2006 there has been a trend for criteria. This is believed to be due to the tures other gases can be formed increasing BGA and CSP package makers to supply alloys having very similar silver and tin voiding, thus excessive reflow tempera- components with lower silver alloys. The content. In all cases with the solder paste tures should be avoided when targeting leading low silver alloy is SAC105 with flux formulation which was developed voiding performance. significant levels of SAC305 still being with a focus on reduced voiding, class III In this study particular attention was employed. SACX Plus™ 0307 & 0807 are voiding levels were attained. focused on peak temperature and its also now being used commercially. Other In Figures 11, 12 and 13, the solid line affect on voiding. Besides volatilization of alloys supplied on these packages are represents the data run on the low soak organic flux constituents at elevated tem- SAC405 and SAC387. Besides lower silver reflow profile in Figure 2 with a 175˚C soak peratures, excessive peak temperatures content spheres being lower cost, they are of 60 seconds, a 245˚C peak reflow having can cause oxidation of the solder spheres also known to have better drop shock resis- a TAL of 60 seconds. The dotted lines in and flux residue darkening. Excessive time tance. This is typically the factor dominat- Figures 11, 12 and 13 represents the data above liquidus is also known to promote ing their selection for hand held and con- run on the high soak reflow profile Figure intermetallic growth in the solder joint sumer applications. 2 with a 160-180˚C soak of 120 seconds, causing reliability concerns. Low peak One of the goals of this study was to a 250˚C peak reflow having a TAL of 60 temperatures or a low amount of time evaluate the effect of the solder sphere seconds. above liquidus may also result in soldering alloy and corresponding solder paste alloy Figure 14 shows an x-ray photo of defects. The issues being typically, insuf- and their total affect on voids. The study a SAC305 sphere BGA package with a ficient wetting of the solder joints or flux also looked at the affect of two different SAC305 alloy solder paste. Voiding is voids within the solder joint. The reflow reflow profiles on the sphere and paste minimal for this specific paste type, paste profile used should remain at least 30 sec- alloy matrix. Figure 10 shows the matrix alloy and sphere alloy. Figure 15 is a simi- onds above the liquidus temperature of the of alloys studied for the sphere and solder lar x-ray showing SAC305 sphere package alloy. paste. The reflow profiles used are from with a SACX Plus™ 0307 solder paste. The In this experiment the data in Figure Figures 2 and 3. data suggests a high silver content alloy 9 came from running three solder pastes The void analyses data focused on such as SAC305 when joined with a lower under identical reflow profiles. Solder the alloy of the sphere and paste yielded silver alloy will have a higher incidence of paste A was run under both the reflow pro- interesting results in that matching the voiding. files shown in both Figures 2 and 3 in an sphere alloy and paste alloy, resulted in attempt to fine tune its optimum voiding most cases, in lowering voiding and void Conclusions reflow profile. In Figure 9, it can be seen size significantly compared to mixed alloy Combining all four aspects of alloy match- that solder paste A yielded better voiding systems. This is believed to be due to the ing, optimized reflow while employing results over the other two products. This matching melting points of the sphere and stencil design and a paste developed with shows a solder pastes total flux system can paste material during reflow. It was also minimizing voiding can effectively meet or be tuned to reduce voiding as well as the observed that the high/long soak reflow exceed Class III voiding criteria. profile used affects voiding performance. profile reduced voiding in SAC105 and Based on this study and field validation SAC305 combinations, but was not as pro- Alloy a reflow profile with a longer soak and nounced with the SACX Plus™ 0307 com- • Matching sphere and paste alloys lower peak resulted in a lower voiding bination. tends to produce fewer large voids system everything else being equal. This However the SACX Plus™ 0307 spheres than mixed alloy combinations. also combined with the previous flux data in all paste alloy combinations exhibited • The number of voids between having higher boiling points or reaction low voiding meeting class III require- like alloys of the solder sphere point constituents combines in a system to ments. The SACX Plus™ 0307 alloy spheres and paste were also shown to be 6 reduce overall voiding effects . also showed excellent voiding results with reduced.

Figure 15. X-ray analyses SAC305 spheres and SACX Plus™ 0307 Figure 14. X-ray image of voids in SAC305 sphere and paste. paste.

14 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Four ways to reduce voids in BGA/CSP package to substrate connections

• SAC Plus™ 0307 spheres have overall Acknowledgements From One Engineer good performance The authors would like to thank with all paste alloy the Cookson America & India ® combinations meet- Research Centers for the board To Another ing class III voiding assembly, flux formulation requirements. work and analyses.

Peak Reflow References • Peak reflow tempera- 1. M. Yunis, K. Srihari, J.M. ture has a significant Pitarresi, A. Primavera. effect on voiding due “Effects of voids on the reli- to the interaction ability of BGA/CSP solder of the flux with the joints,” Microelectronics copper substrate at key Reliability 43, (2003) 2077- temperatures. 2006, Elsevier Ltd. • Boards with a peak 2. LeeNch, O’Hara, Voiding reflow of 240oC in BGA. In: Proceeding produced less voiding of Surface Mount than the components International, San Jose, assembled with a peak California, 1995. reflow of 250oC. 3. Hwang JS, Solder paste • The total number of in electronics packaging, voids found when Dr. Ning-Cheng Lee, Vice President of Technology New York; Van Nostrand [email protected] comparing peak tem- Reinhold; 1989. perature of the reflow 4. R. Pandher, C. Shea, were about 25-30% Optimizing Stencil Design “ Voiding under low stand-off higher for a peak tem- for Lead-Free Processing, components, such as QFNs, perature of 250oC than Proceeding of Surface for a peak of 240oC. Mount International, can be effectively minimized • Boards assembled Chicago, Illinois, 2004. through material and process using a low ramp rate 5. M. Holtzer, BGA Voiding of 0.75oC/sec pro- Prevention, Technical optimization. Let me show duced less voiding than Report, Cookson you how.” the boards assembled Electronics, South using a faster ramp rate. Plainfield, New Jersey, 2009. 6. S. Eckel, N. Kani, D. Le, Find out: indium.us/D154 Flux Formulation “Impact of PCB Surface Pad • Solder paste formula- Finish and Contamination • answers tion has a significant on BGA Solder Joint • blogs effect on voiding due Voiding”, Proceeding to the type of chemis- of Surface Mount • tech papers tries used and where International, September, • one-on-one they become reac- 2001. tive with the copper • support substrate. scan code with • A solder paste flux • live chat mobile device system developed for low voiding can still be affected by the reflow profile, soak and peak reflow temperatures.

Solder Paste Volume • Reduced volume of paste and/or sphere reduces voiding. • A 10% solder paste reduction by stencil design has shown to ASIA • CHINA • EUROPE • USA decrease BGA voiding significantly. www.indium.com ©2011 Indium Corporation

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 15 The rush to clean no-clean Conductive crystals, white residues, and decreased reliability The rush to clean no-clean Michael Konrad, Aqueous Technologies Corporation, Rancho Cucamonga, California, USA

Just as the little girl in the 1982 film Context Poltergeist eerily exclaimed, “they’re back,” The concept of personal hygiene was the electronics assembly industry has greatly enhanced by the Romans in 312 witnessed the return of a familiar yet BC with the invention and introduction of unappreciated process step: cleaning. public baths. This was further enhanced by Once commonplace, then relegated to the end of the second century AD with the introduction of soap, invented by the Greek military and other high reliability appli- Physician Galen. cations, today defluxing has once again In 467 AD, Rome fell, as did many of moved toward the mainstream. The min- its then modern inventions and influ- iaturization of electronic assemblies and ences. This included public baths. The fall their components, implementation of of Rome and its public bathing is cited by lead-free alloys, combined with improved modern day historians as one contributing quality standards and higher reliability factor to the spread of the great plagues of expectations have culminated to form a the middle ages and, in particular, the Black Figure 1. Ozone Depletion, 1989. growing demand for ionicly clean elec- Death of the fourteenth century. tronic circuits. Modern day Let’s travel back in time, specifically to This paper will review the major pre-1989. Before 1989, nearly all assem- Today, thankfully, cleanliness has causes of residue-related failures includ- blies were cleaned. Components were entrenched itself into all aspects of human ing dendritic growth, electrical leakage, “stuffed” into assemblies. Assemblies were civilization. In fact, the word “clean” has and under-coating adhesion failures. soldered, leads were trimmed and assem- become part of our modern vernacular. We blies were cleaned to remove the flux resi- Why we clean, what we are removing, and admonish our boxers to “have a clean fight.” dues. Cleaning was an integral part of the how clean is clean will be presented. We wish upon our favorite sports teams a assembly process. With few exceptions, “clean sweep” When at the doctor we hope assemblies were cleaned using one of three for a “clean bill of health” and we hope to medias; 111 Trichloroethane, Freon TMS “clean up” at the tables in Las Vegas. (or generic equivalent) or water. This author has spent 26 years in the The great buzzkill of the 20th century electronics cleaning industry and has seen arrived in 1989 in the form of an interna- many trends. Today’s modern cleaning tional treaty entitled the Montréal Protocol. trend is curious. If I ask an audience of Apparently, these CFC-based cleaning sol- engineers “what is the most common flux vents had been busy destroying the Earth’s removed from circuit assemblies today?,” I ozone layer (Figure 1) and the United can rely on the consistency of the answers. States, Canada and about nine other coun- The most common answer is water soluble tries were determined to stop it. As a result, (OA). Second to water soluble is RMA. many CFC-containing products were Actually, neither answer is accurate. The banned under this treaty including the two correct answer is no-clean. No-clean flux major cleaning solvents used in electronics is the most common flux removed after production. reflow. Why? The answer is ironic. Amidst the industry wide panic, fueled by several trade magazines cover pages Déjà vu with their countdown to the end of CFCs To understand why no-clean fluxes are came a new technology called “No-Clean being removed from assemblies after reflow Flux.” More than just a technology, it was in record numbers we need to understand Keywords: Cleaning, Cleanliness, a concept. Reduce the volume, visibility the history of flux removal and assembly and affect of residues and leave them on an Defluxing, Electro-Migration, Electrical designs from an historic perspective. Leakage, Cleanliness Testing assembly. Problem solved!

This paper was originally presented at the International Conference on Soldering & Reliability (ICSR) 2011

16 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com The rush to clean no-clean

While assemblers of military, medical the humidity-caused moisture has disap- and other high-reliability products con- peared. This results in a NTF status and the tinued to remove flux residues by cleaning product (and the problem) is returned to their assemblies (using alternative tech- the customer. At issue is the flux residue nologies), the greater commercial industry, that becomes more active when subjected having no specific mandate to clean, aban- to moisture, allowing increased conduc- doned cleaning by switching to a no-clean tivity to alter a product’s function but not process. enough to create a short. This bi-polar approach (cleaning is required/cleaning is not required) was Why now? What changed? largely successful. No-clean technology, in Figure 2. Dendritic growth on component As previously stated, we have been using most cases, left behind mostly benign resi- with 5 VDC applied (courtesy Foresite). no-clean flux, mostly successfully, for dues that did not negatively affect most elec- 22 years. Why is our industry seeing an tronics assemblies. In recent years, however, increase electrical conductivity between increase in electro-migration and elec- there are a growing number of commercial two points, causing instrument errors and/ trical leakage now? The answer is simple. assemblers that have rejoined the ranks of or electrical shorts. There are two reasons for the increase in military and medical processes and turned The nefarious nature of dendrites residue-related failures. One factor is the to cleaning. Our industry is seeing a resur- comes from the fact that they are implementation of lead-free alloys. gence of cleaning. Because RMA and OA extremely slow growing. While rapid den- First, let’s consider the purpose of flux. flux residues have always been removed via dritic growth can be demonstrated in a lab Flux reduces oxidation during the reflow a cleaning process, the growth in cleaning environment, in a ‘normal” environment, process when solder changes from a solid is represented by commercial assemblers state to a liquid state. The flux’s responsibil- removing no-clean flux residues. Because there are many times more commercial products being built compared to specifically high-reliability products, the growth “Today, there are two primary problems in cleaning is no-clean based, hence the fact that no-clean represents the highest associated with residues left on a circuit share of flux cleaning today. assembly” Houston, we have a problem As previously mentioned, there is a they may take from 8-18 months to grow. modern migration toward a cleaning Unless accelerated age testing (e.g., steam- ity is to reduce oxidation and to encapsu- process. No-clean processes have been in age testing) is performed, it is impossible to late the metal salts that form when solder popular existence for 22 years. Why now predict the likelihood of dendritic growth is in a liquid state. Historically, flux had a are no-clean processes being replaced with until a catastrophic event occurs. solids content of 30-50%. A higher solids cleaning processes? What changed? flux maintains a greater ability to remain Today, there are two primary problems Electrical leakage useful during the entire reflow process. associated with residues left on a circuit Today’s no-clean fluxes maintain very low The other issue associated with assem- assembly—electrical migration and elec- solids content, normally 1-3%. Lead-free bly residues is electrical leakage. This is a trical leakage. These problems are hitting solder requires a higher reflow tempera- particularly difficult diagnosis to confirm many assemblers hard and, in a growing ture compared to traditional 63/37 alloys. because the results of electrical leakage number of cases, have lead to a rush to An increase of 50˚-60˚C on a low solids tend to be of a temporary nature. At issue clean no-clean. content flux may result in the flux volatiliz- is the fact that electrical leakage is a tem- Electrical migration can occur when ing or polymerizing too early in the reflow porary problem. Its affects are witnessed three key elements combine on an assem- process. This action may result in the flux’s only when the assembly adsorbs moisture. bly: inability to encapsulate the metal salts that When the moisture is removed, the prob- • Voltage differential (power to are generated during the reflow process, lem disappears, frequently resulting in ground). As little as 1.5 V resulting in unencapsulated metal salts no-trouble-found (NTF) field returns. A • Moisture on the surface of a circuit assembly. These typical scenario goes like this: An assem- • A corrosive or conductive residue metal salts, and other residue species, have bly is tested and shipped to a customer When the three key elements are pres- the potential, when combined with electri- in Mississippi in February. The customer ent with other factors, it is possible to cal voltage and moisture to produce a fer- begins to use the product, a hand-held por- experience electro-migration, commonly tile breeding ground for dendritic growth table instrument. By August, the customer in the form of dendritic growth between or electrical leakage. notices that the instrument is not working two electrical connections on the assem- Another contributing factor is min- properly and returns it to the manufacturer bly. A dendrite is a metal crystal (Figure 2) iaturization. Our assemblies are getting for inspection. Upon receipt by the manu- that forms as metal dissolves at an anode smaller and, as a result, the component facturer, the product is tested within the and is electro-deposited at a cathode. The densities are getting higher. In any reflow air conditioned and humidity-controlled electro-deposited metal takes the form of process, flux, embedded into the solder environment of the test lab. Of course, the metal crystals. paste, oozes from a pad when subjected to problem cannot be duplicated because Dendrites are harmful because they heat. Like ice melting on a table, flux will

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 17 The rush to clean no-clean drain from a pad. Historically, this was not a major issue because the assembly’s pads were physically far enough apart as to leave a flux-free gap between two pads (Figure 3). As assemblies were miniaturized and component densities increased, the flux residue would spread from pad to pad, forming a bridge (Figure 4) of residue between cathodes and anodes. Even though no-clean flux residues are ionically weak and are hardly corrosive, the physical close proximity between components combined with excessive heat and its negative effects on flux create the Figure 3. Gap between pads provide flux- Figure 4. Flux bridge. perfect storm for potential failures. free zone. Preventing residue-related failures sis of a cleaning program is flux removal, A robust cleaning process can elimi- it is important to consider the many other nate all or most of the residues that become There are three proven methods to prevent sources of potential contamination (Table stowaways on an assembly during its jour- residue-related failures: 1). ney through the fabrication and assembly 1. Remove the electrical voltage. It is highly possible for residues to processes. While this method is highly effec- remain on a circuit board as a result of tive, it is absurdly unpractical. the board fabrication process. Additional 2. Prevent assembly contact with Cleaning is an all or nothing residues may contaminate components moisture. This is commonly accom- proposition from the component manufacturing pro- plished by the application of con- The science of post-reflow cleaning of cir- cess. The assembly process, in addition to formal coating. Contrary to popu- cuit assemblies is an all or nothing proposi- flux residues, also contributes to exces- lar belief, conformal coating, while tion. If you cannot fully clean an assembly, sive assembly contamination by way of providing an excellent barrier to do not clean it. The only thing worse than machine and human contact. Contact with fluids, does not prevent all contact assembly-related residues on an assembly industrial and human sources can transfer with moisture. Over time, moisture is a partially cleaned assembly. There are residues that carry a reliability lowering can penetrate coatings, (Figure 5) numerous reasons for this. First, the most potential. resulting in residue-related failures critical part of a cleaning process often is as previously described. thought to be the wash cycle. This is not Even if coatings were to pro- accurate. The most critical function of any vide an effective barrier to all forms cleaning process is rinse. of moisture, coating manufacturers Defluxing chemicals are highly ionic require clean, residue-free surfaces and corrosive. During a wash cycle, flux for good adhesion. Failure to pro- and other residues are solublized and held vide a residue-free surface can in solution within the wash chemical. After result in coating delamination and/ wash, the assembly is covered with wash or under-coat corrosion. solution that contains the flux and other 3. Remove the residues that contrib- residues. If an assembly were removed ute to electro-migration and elec- from a wash cycle without the benefit of

trical leakage. rinse, the assembly would soon fail. Solder Figure 5. Dendrite grows under conformal joints would be attacked, electrical migra- With option #1 not on the table and coating (Courtesy Foresite). options #2 and #3 all requiring cleaning, it continued on p. 23 is clear that a cleaning/de-fluxing process is the best method of preventing assembly Board Fabrication Component Fabrication Assembly Process failures due to electro-migration and elec- Etch residues Plating bath residues Solder paste trical leakage. Developer chemicals Water quality rinses Flux–wave/core Additional benefits of Water quality rinses for Deflashing chemicals Reworked/repaired fluxes cleaning electronics inner layers assemblies Water quality rinses for Mold release agents Cleaning chemicals In addition to the elimination of post- outer layers reflow residue-related product failures, the HASL fluids (HO) and Preplating oxide cleaning Water rinse quality cleaning of electronic assemblies, while final rinses intended for the removal of flux residues, Alkaline cleaners Pretinning flux residues Rework cleaner actually provides for the removal of other contamination species. While the empha- Table 1. Multiple possible contamination sources.

18 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com

Reducing defects with embedded sensing technology Reducing defects with embedded sensing technology

Tim Skunes, CyberOptics Corp., Golden Valley, MN, USA, and Gerry Padnos, Juki Automation Systems, Inc., Morrisville, NC, USA

Typical SMT production lines are a col- Introduction attractive from several perspectives: lection of disconnected machines per- Electronic assembly manufacturers are • Real-time process monitoring of forming various tasks. Errors can occur under constant pressure for yield improve- the actual assembly operation, at any step during this process but often ment and higher efficiencies as margins • Elimination of redundant mechan- go undetected until the PWB is completed continue to be squeezed. Another metric ical transport systems for both the optical sensor and the PCB, and and soldered, and it is too late to do any- that has gained increasing attention over the past several years for these manufac- • Reduced line length to improve the thing other than re-work or scrap it. turers is the throughput per square foot throughput per square foot metric. To prevent defects from simply pass- of factory floor space. Process monitoring In many cases, embedded optical sensing from one machine on to the next, it is using optical sensor technologies has the ing technology brings a complementary necessary to have inspections throughout potential to greatly improve yields and fac- set of capabilities compared to standalone the line. Better yet, sensing at different tory efficiency, but can only be practical inspection systems, with each approach points should be linked to form a com- when the benefits outweigh the additional providing valuable improvements in yield plete solution. This is especially critical in cost and space to install and operate these and efficiencies. Three embedded opti- the placement phase of assembly due to technologies. cal sensing technologies will be discussed the wide variety of inputs (components) The digital camera revolution has that provide continuous process monitor- and movements. The assembly system enabled a whole new generation of cost ing throughout the assembly process: on- the-fly laser centering, embedded micro- has to take up to hundreds of different effective, compact, high speed, and high- resolution optical sensor technologies to cameras, and strobed imaging modules. An components and individually place them be developed. Compared to distributing example assembly line is shown in Figure 1, at different locations on the PCB. This standalone inspection systems through- with the locations of the various embedded complicated task requires more thorough out the assembly process, embedding and optical sensors. oversight to ensure defects are not created integrating these new optical sensors into or passed on. Optical sensors can provide the automated assembly equipment can be this oversight into the assembly process and offer the benefits of being fast, accurate, and non-contact. Some of the challenges of integrating these sensing technologies are cost and space. It would be too expensive to have a complete inspection machine before and after each assembly system, and take up far too much space. New generations of optical sensors are compact enough to be embedded at key locations within the PCB assembly process, forming a complete web of error prevention. This paper discusses the new integrated optical sensing technologies that make it possible to virtually guarantee that only good PCBs will pass through the assembly process, reducing costly Figure 1. SMT assembly line showing embedded sensor locations. rework or scrapped PCBs and improving efficiency. This paper was originally presented at IPC APEX Expo 2011.

20 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Reducing defects with embedded sensing technology

enable real-time monitoring and verification of both the pick and place operations. The cameras are oriented to provide high speed and high-resolution images directly below the vacuum nozzles. High intensity LED illumination technology is used to freeze the affects of motion blurring. The cameras and LEDs are then synchronized Figure 2. Principle of on-the-fly laser centering. with the action of the nozzles to acquire the images at the proper times. Example micro-camera images from a successful pick operation are shown in Figure 5. Common causes for a pick error include damaged nozzles, a missing component in the tape, the feeder not advanc- ing properly, or perhaps the cover tape didn’t peel back properly. A micro-camera image sequence start- ing just before component placement, at the time of placement, and just after placement is shown in Figure 6. By subtracting the “before” image from the “after” image Figure 3. Real-time processing monitoring for presence and tombstone pick. gives an indication of the change that occurred. This “difference” image shown in Process monitoring with Figure 6 reveals the component just placed embedded micro-cameras and is a powerful technique to identify the newly placed component from all other Micro-camera technology that is embed- features in the image and verify a proper ded into the moving placement head has placement. become available recently. These cameras

Figure 4. Micro-cameras embedded into placement head.

Process monitoring with on-the-fly laser centering sensors On-the-fly laser centering technology Figure 5. Successful pick operation. has been available in the market for a number of years and continues to evolve before image and improve. With this technology, a laser place image stripe is focused on the component. The component is rotated as it travels from the feeder to the placement site, and the shadow of the component is measured by a detector array. The component’s center, dimensions and angular correction are cal- culated using a tomographic reconstruc- tion algorithm. In addition to measuring the placement offset correction, this sens- difference image after image ing technology provides real-time monitoring of the placement to verify the component’s presence immediately prior to the placement and then to verify the release of the component. Tombstone picks are also easily detected since the measured component size won’t match the nominal dimensions. Figure 6. Component placement image sequence.

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 21 Reducing defects with embedded sensing technology

Figure 7. Locations of embedded SIM sensors.

New optical sensor rectangular image zone is acquired. This technology—strobed imaging process continues until images have been modules acquired for the remainder of the PCB. Each successive rectangular image zone A new optical sensor technology referred slightly overlaps with the previous image to as a Strobed Imaging Module (SIM) zone. This allows the software to stitch Figure 8. Strobed imaging module (SIM) sensor has also recently become available. image acquisition sequence. together all of the image zones into a single, The SIM sensor incorporates an extremely fast image acquistion system and is simple to integrate for embedded applications since it can be statically mounted above a conveyor. The SIM sensor captures high resolution images as a PCB is continuously transported by the conveyor past the SIM sensor. The illumination is strobed to eliminate any affects of motion blurring. Cutaway views of the screen printer and PCB assembly machines in Figure 7 illus- trate the location of the embedded SIM sensors. Cycle time is not affected as the PCB travels from the output buffer section Figure 9. Solder paste image and segmentation results. of one system to the input buffer section of the next system. An intermediate buffer section or stack buffer with review capabilities can also be an option. If the embedded SIM sensor is not available in the screen printer, then the first SIM sensor can be located at the input buffer section of the first chip shooter. An array of cameras in the SIM sensor captures high resolution PCB images while the PCB is in motion. Figure 8 illustrates a portion of a SIM sensor image acquisition sequence. The illumination is strobed as the PCB passes through position 1 and a rectangular image zone is acquired by an internal array of cameras. The camera fields of view slightly overlap one other and then are automatically stitched together by software to provide a seamless image. For instance, one variant of the SIM sensor includes eight 5-megapixel cameras with a rectangular image zone, or effective field of view, of approximately 30 mm x 300 mm. The PCB continues to pass through position 2, and then when it passes position Figure 10. Stray component detection. 3 the illuminator is strobed and another

22 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Reducing defects with embedded sensing technology seamless image for the entire PCB which is Component presence, position, and Conclusion used by the process monitoring software. orientation can be monitored after the PCB New generations of optical sensors such exits the final chip shooter and before fine as on-the-fly laser centering, embedded Process monitoring with pitch placement. Another unique capabil- micro-cameras, and strobed imaging mod- strobed imaging modules ity provided by the embedded SIM sensor ules can provide cost effective, real-time, A strong driving force for all of the embed- technology at this process stage is to check continuous process monitoring through- ded process monitoring systems presented for stray chip components at BGA or other out the assembly process. Catching defects in this paper is the reduction or elimination fine pitch sites. This is particularly valu- early can increase yields and improve effi- of any additional programming beyond able since these stray components cannot ciencies. Costs can be reduced by not allow- that required to perform the assembly be detected directly by an end of line AOI ing errors to propagate through the assem- operations. Nominal component locations, system. The components placed by the fine bly process where they become increasingly orientations, package type, and sizes are pitch assembly systems are also monitored more expensive to correct. Of course the all directly available to the embedded pro- for presence, position, and orientation by monitoring system should be simple to cess monitoring software since this data is the final embedded SIM sensor. use and not create a big additional over- already required by the assembly systems. Figure 10 illustrates stray component head, so the embedded optical sensor tech- Stencil CAD data can also be provided by detection. An image of the fine pitch site is nologies capitalize on the component and the screen printer to the embedded process acquired after the screen printer and before solder paste data already available during monitoring system. any components are placed on the PCB. The the assembly process to reduce or elimi- Embedded solder paste monitoring image of this site is then acquired by the nate additional programming. Finally, an is provided using the SIM optical sensor SIM sensor as it exits the last chip shooter. embedded sensor network distributed at technology integrated with a screen printer. A difference image is generated to detect multiple locations in the assembly process The printing process can be monitored to the stray component and no sophisticated dramatically improves the likelihood that assure proper solder paste coverage, regis- user programming is required to ignore the only good PCBs pass through the assembly tration, and ensure there are no unwanted complex background information. process. bridges.

The rush to clean no-clean—Continued from p. 18 tion and leakage could become rampant. Hubble Telescope. Mobile phones and defi- Post-reflow residue-related failures are Only a thorough rinse process would ade- brillators each have their own unique level on the rise as are quality expectations. A quately displace the wash solution and the of consumer confidence and degrees of cleaning process will increase reliability residues within it. A high-quality DI water liability if failure occurs. and, therefore, decrease potential assem- rinsing process will ensure that all solub- There is considerable debate about bly failure liability. Cleaning materials and lized residues and the corrosive wash solu- which cleaning standard and cleanliness equipment have evolved significantly over tions have been removed. Ionic verification testing method to adopt. Ion chromatog- the past 22 years. Today’s modern clean- of the absence of wash solution during a raphy, ROSE testing, SIR, visual and other ing materials and processes provide an rinse cycle will confirm that the assemblies methods are all valuable tools to determine environmentally responsible alternative are free from wash solution and, one pre- if an assembly is clean and each carry both to the processes of the last century. With sumes, free from flux and other forms of benefits and drawbacks. While ROSE test- the ever-decreasing size of a circuit assem- contamination. A weak cleaning process ing remains by far the most popular and bly, the increasing densities of components, may actually increase assembly residues accessible method of post-reflow clean- and the increasing demand for reliability, it and, consequently, the risk of failure. liness testing, it is not without its faults. is time to return “clean” to the electronics Many assemblers rely on ROSE testing manufacturing vernacular. How clean is clean? results based on the standards designed in 2 This is one of the most popular questions. the late 1970s (10 ⎧g NaCl/in ). Acknowledgements The military attempted to tell us in the The fact is ROSE testers, while fast and Thanks to Foresite for providing dendrite form of WS6536, MIL STD 2000A and inexpensive, are not capable of detect- photographs. other standards. IPC has told us in the ing all forms of possible contamination. form of J-STD001-TM650 and other stan- Additionally, they assume that all detected Original publication dards. The reality is that these and other contamination is evenly spread across the Originally published in the Proceedings standards were written in the 1970s and assembly. In reality, contamination fre- of the SMTA International Conference on 1980s. quently is concentrated in or under high- Soldering and Reliability, Toronto, Ontario, Consider the magnitude of evolution density assembly areas. For these reasons, Canada, May 3rd-6th, 2011. that has occurred in the design of elec- one should consider an internal standard tronic assemblies over the past 30+ years that is much lower than the ones published. and ask yourself if you feel comfortable How clean is clean? On a ROSE tester, with these cleanliness standards. The real 0.0 is clean. Every value above 0.0 is a step answer relies on another question: what toward possible contamination and related happens if it fails? consequences. A failure in a GameBoy carries far different consequences than a failure on the Conclusion

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 23 Outlook for 2H’11 and beyond

Outlook for 2H’11 and beyond

Walt Custer and Jon Custer-Topai

Electronic equipment shipments grew 11% slowing but is still positive. However sup- $1.34 billion by 2016.—ABI Research in 2Q’11 vs. 2Q’10 based upon the prelimi- pliers further back on the supply chain Mobile communications nary composite revenues of 96 OEMs pro- should brace for more difficult times. The • Worldwide handset sales expanded ducing over 50% of the world’s electronic JPMorgan global PMI (leading indicator) 16.5% y/y to 428.7 million units in gear (Chart 1). The second quarter of 2011 points to weaker than normal months 2Q’11; smartphone sales grew 74% was the seventh consecutive quarter of ahead for materials, electronic compo- and accounted for 25% of all handset growth in the global end markets (Chart nents and process equipment. Fortunately sales.—Gartner • Global smartphones sales are forecast 2). The ratio of inventories/sales remained autumn seasonality will partially offset the to grow from 420 million units in 2011 generally in control throughout the supply slowdown until November, but year-end to more than 1 billion in 2016.—IMS chain however semiconductor inventories 2011 and early 2012 may be difficult. Research climbed (Chart 3) in the second quarter. We have lived through many business • Mobile broadband device shipments Although electronic equipment growth cycles. This one is complicated by global are projected to climb from 100 million held in the second quarter there were economic uncertainty and domestic politi- units in 2010 to 158 million units in certainly signs of a coming slowdown. cal wrangling. 2011.—IHS iSuppli Suppliers of components (semiconduc- Chart 9 summarizes our colleague Ed Consumer electronics tors, PCBs and other passive devices) saw a Henderson’s recent regional growth fore- • Consumer electronics sales revenue 2Q’11 downturn (Chart 4). So did military casts for electronic equipment production is expected to reach $190 billion in equipment vendors. by year. 2011.—CEA Based upon monthly electronic equip- • Global LCD TV shipments are ment sales by region (Chart 5), end market End markets expected to top 205 million units in 2011.—AUO Ex. VP demand flattened in the third quarter. We Computers & peripherals • Global TV shipment outlook for 2011 can expect a traditional autumn seasonal • Asia-Pacific PC shipments grew 13% was reduced by 3% to 252 million units upturn but this will likely be muted by gen- year-on-year to 30.1 million units in by DisplaySearch. erally weaker buying activity. Fortunately 2Q’11 • India’s consumer electronics market is • Femtocell market is forecast to grow smartphones (Chart 6) and media tablets anticipated to grow at 18% CAGR to from $300M in 2011 to $1 billion (Chart 7) are driving growth even in these US$13 billion by 2014.—RNCOS in 2013 and $3 billion in 2015.— difficult times. • Video game revenue fell 29% y/y to Infonetics Research Looking forward we appear to now be $223 million in July 2011.—NPD in the negative portion of the current busi- • Worldwide Wi-Fi access point hardware, software, and services will grow to Other ness cycle (Chart 8). End market growth is • Global wireless power market is pro-

20110811 20110811 Electronic Equipment Suppliers Electronic Equipment Suppliers Composite of 96 Public Companies Composite of 96 Public Companies Revenue, Net Income & Inventory Quarterly Revenue Growth $ Billion % Growth (quarter vs same quarter in prior year) 300 20.0 Preliminary 2Q'11 estimate based upon partial results +11 250 15.0

200 10.0

150 5.0 100 0.0 50 -5.0 0 -10.0 -50 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 00 01 02 03 04 05 06 07 08 09 10 11 -15.0 Revenue 140144149157136141134143128131133146135142148 166160 169167187173179180198185194198218203216225250229241240233202212222251230241254280256268 Income 12 12 11 8 -1 -5 -12 0 3 -11 0 1 6 5 8 12 12 13 13 16 14 14 14 22 16 12 18 19 19 21 19 21 20 19 17 -3 10 15 18 24 20 23 27 33 27 31 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 Inventory 62 64 67 69 70 64 57 52 51 49 48 44 44 45 44 46 47 49 49 49 50 50 51 50 53 56 58 58 57 60 62 63 66 68 68 63 59 59 59 59 60 62 65 68 68 72 01 02 03 04 05 06 07 08 09 10 11 Computer 11, Internet 5, Storage 7, Communication 11, SEMI 13, Medical 24, Instruments 6, Military 6 Computer 11, Internet 5, Storage 10, Communication 9, SEMI 20, Medical 24, Instruments 11, Military 6

Chart 1. Chart 2.

24 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Outlook for 2H’11 and beyond

jected to grow 85.5% annually from China, facility. for Sonus Networks. US$100 million in 2010 to US$ 4.5 bil- Compal is recruiting more than 1,000 new • plans to terminate manufacturing lion in 2016.—IMS Research workers across the Taiwan Straits this year. operations in Denmark at the end of • Wireless sensor networks will grow Dynamic Manufacturing is adding a 4,000 the year. from US$ 0.45 billion in 2011 to US$ 2 SF expansion in Northpointe Industrial Foxconn/Hon Hai: billion in 2021.—IDTechEx Park, in South Buffalo Township. • acquired Cisco’s Juarez, Mexico, manu- Elcoteq: facturing operations. EMS, ODM & related • laid-off 400-500 employees in Pécs, • applied for a license to produce printer assembly activity Hungary. cartridges in Kulai in Malaysia’s Johor State. EMS and ODM companies will produce • President and CEO Jouni Hartikainen resigned. • received a digital still camera pro- 128 million LCD TVs in 2015, up from 65 • duction outsourcing contract from million in 2010.—IHS INC received controlled management approval from the Court of Panasonic. A1 Electronics added a Mydata Luxembourg. • plans to replace some of its workers MY100SX14 pick & place machine. eXception integrated GOEPEL’s Boundary with 1 million robots in three years to API Technologies received $2.7 million in cut rising labor expenses and improve Scan into its Teradyne Test Station. contracts to produce circuit card assem- efficiency. FCT Assembly relocated its Fort Collins, blies for counter-explosive equipment • looking for land to build a dormitory Colorado, operations to a 1974 SF facility under the JCREW program. for 3,000 new employees it plans to to accommodate the company’s continued Autosplice was acquired by J.H. Whitney. recruit for its planned cloud comput- growth. Celestica: ing center in Kaohsiung, Taiwan. • Flextronics: • will construct a NT$100 billion received EUR 467,000 in incentives • from the Spanish government for became an end-to-end manufacturing Automation Park in Taichung which development programs in Valencia. partner for production, order fulfill- will accommodate machine tool, auto- • received recommendation for ment, new product development and matic equipment, robot, and solar AS9100C certification at its Suzhou, post-manufacturing logistic services energy factories.

20110813 20110813 Inventory/Sales Ratio Global Electronic Supply Chain Growth Large Component Distributors, Semiconductor, EMS & 2Q'11 vs. 2Q'10 (Preliminary) Quarterly Inventory/Sales ($) 0.90 OEM Companies Electronic Equipment 11 0.85 Semiconductor Military -5 Business & Office 2 0.80 EMS OEM Instruments & Controls 18 0.75 Component Distrib Medical 11 0.70 Communication 7 0.65 Internet 5 0.60 Computer 17 0.55 Data Storage 14 SEMI EquipTBD 26 0.50 0.45 Chips Semiconductors (SIA) -1 0.40 Distr Passive Components -5 0.35 Component Distrib 23 EMS 0.30 EMS-Large 23 EMS-Medium 15 0.25 OEM ODM 1 0.20 PCB -3 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 00 01 02 03 04 05 06 07 08 09 10 11 PCB Process Equip 21 CY -10 -5 0 5 10 15 20 25 30 4 Component Distributor, 18 Semiconductor, 12 EMS and 78 OEM Company Composite % Change US$ equivalent at fluctuating exchange; based upon industry composites including acquisitions Chart 3. Chart 4.

20110811

World Electronic Equipment Monthly 20110813 Shipments Smartphone Unit Shipments to End Users

Converted @ Constant 2008 Exchange Rates Units (Millions) World $ Billions 120 120 N America Europe Japan SE Asia 100 100

80 80

60 60

40 40

20 20

0 0 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 1 3 5 79111 3 57 9111 3 5 79111 3 57 9111 3 57 9111 3 57 9111 35 7 9111 35 7 9111 35 7 9111 35 7 9111 35 7 91113 5 7 07 08 09 10 11 00 01 02 03 04 05 06 07 08 09 10 11

Source: Custer Consulting Group CALENDAR YEAR Gartner DataQuest 5/11 Chart 5. Chart 6.

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 25 Outlook for 2H’11 and beyond

Chart 7. Chart 8.

20110805 20110813 Media Tablet Shipments World Global PMI, Electronic Equipment, PCB & World Semiconductor Shipments Units (millions) Converted @ Constant 2008 Exchange Rates 25 3/12 rate of change iPad non iPad PCB "0" Growth SIA 1.5 20 El Equip Global PMI

1.3 15 1.1

10 0.9

5 0.7

0.5 0 3 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 9123 6 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 00 01 02 03 04 05 06 07 08 09 10 11 10 11 CALENDAR YEAR Digitimes 7/11, updated values through 2Q'11 on 8/4/11 Source: Custer Consulting Group

FTG Aerospace completed its recertifica- Surface Mount Technology entered exclu- employees. tion audit to the ISO9001:2008/AS9100C sive negotiations with a potential investor • achieved Nadcap AC7119/3. standard. for a restructuring proposal for the Group. ggp-Schaltungen successfully qualified HansaMatrix received medical certifica- Tailyn added a SMT Line which includes the LDI solder mask ELPEMER SD 2467 tion ISO 13845:2003. a DEK/Horizon solder paste printing SM-LDI produced by Lackwerke Peters. Hunter Technology named Bryan machine, Panasonic CM602 high speed HannStar Board acquired 329.2 million McCreedy VP of sales and marketing. mounter, Panasonic DT401 multifunc- shares, equivalent to a 25.01% stake, of its IEC Electronics received a $5.2 million tion mounter, a Heller 1912EXL nitrogen subsidiary HannStar Board International military and defense order for ground sup- reflow oven and a TRI 7500 serial AOI unit. Holdings (HBI) at HK$1.25 per share. port equipment and unique flight systems t-mac Technologies acquired electronics Inari Bhd is building fourth plant in Free cables and wire harnesses. manufacturing firm FAW Electronics. Industrial Zone in Bayan Lepas, Penang. Integrated Micro-Electronics completed USR Electronics Systems added a new line Mass Design received Medical Device its acquisition of EPIQ Subsidiaries in with three Siplace SX2 machines. Manufacturing certification ISO Europe and Mexico. VadaTech purchased two XPii-IIT pick & 13485:2003. Jabil Circuit inaugurated its HUF 612 mil- place machines for its plant in Henderson, Merlin Circuit installed a Dynachem a PH lion facility in Polgár, Hungary. Nevada. 8030 SmartLam 5000 automatic cut sheet Limtronik added an EMS services office in Variosystems is building a plant on its laminator at its Chester facility in North Denver, Colorado. newly acquired 80,000 m2 site in Sri Lanka. Wales. Macrotron Systems upgraded its Silicon Videoton purchased 94% ownership in Practical Components added additional Valley facility to assemble PCBs with 0201 Ventifilt Zrt mechanical (Hajdúnánás, test boards for cleanliness testing and con- size SMT components. Hungary). formal coating. pb tec named Dirk ruhstein director SCHWEIZER added a nickel-gold and of sales and support for Bavaria and PCB Fabrication nickel-gold-palladium line, an Interposer Switzerland. All Flex is celebrating 20 years of business. pick & place-system and an HDI Laser Plexus named Jürgen Seibert senior direc- American Standard Circuits added both system in Schramberg, Germany. tor, business development EMEA. new tin lead plating and hot oil reflow pro- Shax Engineering and Systems received Sanmina-SCI received a contract to design, cess. ISO 9001 certification. manufacture and ship EarCheck medical Atotech licensed an immersion tin patent Sierra Circuits installed new equipment devices for Innovia Medical. from Enthone. and chemistry techniques to produce Sievi Capital demerged its contract manu- Automated Circuit Design implemented ENEPIG (Electroless Nickel—Electroless facturing unit. Its proposed new name for MaxQ SCP software at its plant in Palladium) surface finish on PCBs. the contract manufacturing company is Richardson, Texas. Somacis Spa achieved Nadcap AC7119/3, Scanfil plc. Capital Electro-Circuits received ISO HDI PCB accreditation in Castelfidardo, SIT added a Mydata MY100DX14 pick & 9001:2008 certification. Italy. place machine at its Dutch plant. DVEO Unimicron: purchased Linear Systems. • SMTC received a contract to build Redline Eltek received medical equipment PCB acquired a 35% share in RUWEL International. Communications’ RDL-3000 next genera- orders valued at $490,000. • PCB subsidiary in China Trendtronic tion broadband radios. Endicott Interconnect named Warren Technology has begun construction on Solid Semecs’ manufacturing plant Dannelly VP of worldwide sales. its second-phase 60,000 m2 expansion received EN-ISO13485 certification for eXception VAR hired and appointed factory. producing medical devices. David Fletcher strategic account manager. Suntron hired Michael Oliveri as VP and FTG Circuits, Toronto: GM for its OSS business unit. • reached three-year contract with

26 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com It’s LEAN It’s MEAN and ready to PRINT

Our latest creation, the TouchPrint TD2929-E “Essentials” model was created for two specific reasons, to give you lightning fast speed with accuracy you demand.

Milara has streamlined our high-end printing systems to deliver the finest quality printing the industry has yet to experience. MEAN because this platform is structurally stable combined with overall rigidity to ensure accuracy at high production speeds. LEAN because we only put in what you need to produce a high quality product and to hit the price points you require. Although lean, Milara still offers the best of our technology found in our high end system at an affordable price. Let us prove what our Essentials model will do for you.

Milara Incorporated 4 Marc Road Medway, MA 02053 Phone: 508.533.5322 Fax: 508.533.8686 www.milarasmt.com Email: [email protected] Outlook for 2H’11 and beyond

20110811 tronic assembly (US Viscom named Dirk Schwingel CFO. Electronic Equipment Production Growth West Coast) and Mike Vishay Current $ Growth Rates Converted @ Constant Exchange Rates promoted Dieter Wunderlich to Burgess process support executive VP, COO, and Johan Vandoorn products sales manager 2009 2010 2011 2012 2013 to executive VP, CTO. World -10.6 16.3 5.3 8.4 6.9 (North America). Vitronics Soltec USA moved to new head- Digitaltest achieved quarters in Hampton, New Hampshire. USA -8.5 7.8 2.4 4.4 2.5 ITAR certification. Dow Electronic W Europe -18.0 7.9 4.1 3.5 4.8 Semiconductors & other Materials received “First components Japan -24.1 8.2 -5.4 6.6 4.3 Prize—Excellent Dow Team Award” from Worldwide semiconductor revenues are Four Tigers -8.3 15.3 6.4 8.7 7.1 Multek. projected to grow at a 6% CAGR from Ellsworth Adhesives $303 billion in 2011 to nearly $378 billion China -5.2 30.4 8.8 12.8 9.8 named Dymax its dis- in 2015.—IDC IC Insights lowered its 2011 worldwide Henderson Ventures 8/2011 tributor in Australia. www.hendersonventures.com Eltraco Group split into semiconductor industry growth forecast Chart 9. two companies: Eltraco from 10% to 5% and 2011 IC market fore- A/S and SMT House AB. cast from 10% to 4%. Materials, EMC Technologies Global DRAM industry revenue was process equipment & support acquired Speccon. approximately US$8.1 billion in 2Q’11.— services Everett Charles Technologies appointed DRAMeXchange Global NAND flash memory revenues EDA industry revenue Vincent Yu technical marketing director increased 16% for fell 9% q/q to US$4.88 billion in 2Q’11.— 1Q’11 to $1446.4 million; PCB & MCM) for Asia. Henkel Electronic Materials introduced DRAMeXchange revenue grew 28.3% to $140.4 million. India’s semiconductor consumption ACD appointed Jerry Cupples Process pressureless silver sintering technology. Illinois Tool acquired Teknek. will grow 15.5% to $8.2 billion in 2011.— Manager in Richardson, Texas. Gartner Air Products Isola: is building a new nitro- • High brightness LED shipments are gen plant at its site in the Gumi National appointed Robert Chaney president— Americas. expected to grow from <100 billion in 2010 Industrial Complex 2 in North Gyeongsang • joined the Electronic Industry to >135 billion in 2011.—The Information Province, Korea. Citizenship Coalition. Network Alpha’s global director of technical support Nordson: Silicon wafer shipments increased 5% Paul Lotosky passed away. • acquired Value Plastics. to 2.392 billion square inches in 2Q11.— ASM Assembly Systems (formerly Siemens • DAGE opened a repair and calibration SEMI Electronics Assembly Systems): facility in Suzhou, China. Worldwide PC microprocessor unit ship- • added eight additional field service • MARCH and Science College of ments declined 2.9% q/q in 2Q11and rev- engineers for 24-hour service and sup- Donghua University partnered on a enue declined 4.0% q/q to $9.49 billion.— port. R&D laboratory to develop plasma • appointed Sven Buchholz the new IDC applications in manufacturing. Semiconductor equipment sales are pro- head of SIPLACE’s CEE (Central and NSCC acquired the flexible laminate busi- jected to grow 12.1% y/y to $44.33 billion Eastern Europe) cluster. ness from Mitsui Chemical. Christopher Associates in 2011.—SEMI became ShineMore Technology is expanding its TECHNICA USA’s exclusive distribu- North America-based manufacturers monthly production capacity of alumi- of semiconductor equipment orders tor of OTC solder masks and inks to the num-based CCLs from 20,000-30,000 electronics interconnect industry in the (3-month average basis) fell 4.4% m/m to units to 100,000 units by the end of 2011. US$1.55 billion in June 2011.—SEMI Western U.S. Speedprint appointed Assembly Resource Consona released Cimnet Systems’ as its representative for northern California, Engenix v3.3 engineering solution for PCB Walt Custer is an independent consultant FHP Reps as its representative in Mexico, who monitors and offers a daily news manufacturing. central and southern Texas and Puerto Co-Tech is boosting its copper foil produc- service and market reports on the PCB and Rico and TechSystems as its sales repre- assembly automation and semiconductor tion capacity by 150 metric tons by end of sentative for Southern California and Baja 2011. industries. He can be contacted at walt@ territories. custerconsulting.com or visit www. Datest purchased an Akila XR-3 x-ray Technic released Technistan HTM 4089, custerconsulting.com. inspection system from Christopher a High Throw Matte (HTM) tin sulfate Associates. process engineered to increase yields in DEK Jon Custer-Topai is vice president of Custer : advanced printed circuit boards. • appointed Eszter Galántai as one of the Consulting Group and responsible for the Technica began distributing Hitachi European distributor managers for its corporation’s market research and news Electronics Assembly Division. Chemical’s photosensitive materials for analysis activities. Jon is a member of the • licensed a VectorGuard stencil system PCB fabrication industry. IPC and active in the Technology Marketing Techspray to Great Lakes Engineering. expanded its cleaning test lab to Research Council. He can be contacted at • named Brian Smith GM for elec- include batch cleaning, ultrasonic cleaning [email protected]. tronic assembly (Americas); Jim and vapor degreasing. Price regional sales manager for elec- Tektronix acquired Optametra.

28 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Activities vs Results

Reflow o ven

Activities Temperature control, flux management, static pressure, heat transfer rates, fan speed, side to side variations, preventive maintenance, conveyor speed, exhaust variations, cooling zones, safety features, power management, PC control, user interface...

Kic Results KIC ON The PCB Profile BOARD

Get in Spec - Stay in Spec

KIC World Headquarters KIC International Sales - Europe KIC International Sales - Singapore KIC International Sales - China 858.673.6050 +39.342.147.9460 +65.6744.4998 +86.512.6763.5171 [email protected] [email protected] [email protected] [email protected] www.kicthermal.com www.kicthermal.com www.kicthermal.com www.kic.cn Future industry directions Future industry directions Michael Ford, Valor Division, Mentor Graphics Corp.

East perhaps, or maybe west? The here is the industry now as com- simple assumption model at best, if at all. industry has already “gone south” pared to a year ago, or even five Looking from the other point of view, recently, that was not a good direc- years ago? Has anything funda- a contract manufacturer has the request to Wmentally changed? Probably not so much build a new product. The risk is in the quo- tion. Trying to predict future indus- for most companies. Perhaps then, predict- tation process. If there are extraordinary or try directions and not just expanding ing the future is going to be a little easier simply unknown requirements that affect on current ones is not easy, especially than we imagine. Or perhaps, the industry the manufacturing process, it may be too considering the vast diversity of prod- has been rather stagnant of late, repeat- late before these are discovered, which can ing cycles in slightly different ways with lead to significant excess costs, especially ucts, locations, business models, and slightly different tools. Time now though if found late in the introduction process. end-customers’ changing needs. Some to look into the future, to look forward to This is a significant issue of New Product of us, however, have to do this on a some real improvements and innovations. Introduction and is simply due to an regular basis. Anyone that provides Here are my top five directions that the absence of communication between design solutions for the industry needs time industry may take in the future. and manufacturing. There are two directions of poten- to develop their products. These prod- Direction #1: upstream & tial benefit then. Upstream, the design ucts are best aimed at solving future downstream team having access to an advanced set of needs, not necessarily current ones. These are actually two complementary information through specialist tools that For sure, we cannot ignore current directions. The worst kind of problem in represent more specific manufacturing needs or pains, but if we are to make manufacturing is an unexpected one. Take constraints, can optimize the design for the case of new product introduction (NPI). real-world manufacturing. Downstream, a real difference, we need to aim fur- using the same family of tools, the manu- ther forward. The priorities for design are to make the best product they can in terms of function- facturing engineering team get a clear ality, style, cost, etc., with some regard for “heads-up” of all of the key information manufacturability. In reality though, how that they need to be aware of, to accurately can the design team and their tools know and confidently cost and prepare the pro- exact capabilities and constraints of the cesses for the NPI. Creating solutions to manufacturing facility that will build the the issues upstream and feeding vital infor- product? Consideration is based on a very mation downstream in an intelligent way,

Figure 1. Planning, with emphasis on “lean thinking” has become viable with the availability of real-time machine and inventory dats.

30 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com Future industry directions connects the two sides of the NPI process a new tool set founded most likely on the information from the machines, create vis- and resolves what has been forever a major principles of “lean thinking” and the pull ibility of the whole operation and use it to bottleneck in the industry. system are far more viable today given the proactively manage, taking out the ineffi- reliable real-time communication capabili- ciencies and questioning the excuses. The Direction #2: A little more ties. How hard can it be? CIM/CAM tools that are available today planning with that? have certainly evolved from their initial form into a critical tool that should be in A guy walks into a bar. “A beer?” OK, it Direction #3: The environment—turn those every electronics manufacturer’s arsenal— could have been any other beverage, but a small investment of energy for a very beer is fine, so, “which do you have on lights on! significant reduction. No more excuses draught?” Billions of purchase decisions Lights are there for a reason. You use them please! are made by all of us every day (sorry for to see clearly when it’s dark. Lights avoid lack of a punch-line there, by the way). nasty accidents. Common sense? So why Direction #4: Get lean on We each enjoy some degree of freedom of are the “lights off” in manufacturing? choice in the products that we buy. Significant losses in manufacturing materials Well, almost. Targeted advertising cam- are continuously being ignored, or at best, The investment in materials remains the paigns influence us more than we care to tolerated. Go into manufacturing sites and highest single cost in electronics manu- admit, but still we go for what appeals to look around to see how many machines facturing. Holding materials at a manufac- us: it is the definitive demand for products. are actually running. Don’t just look at the turing site cannot be avoided most people The demand signal at this stage is pure and sea of green lights, they are only there for would say, but actually, why do they need clean, reflecting exactly what the custom- the “boss”. Count how many of the produc- to be there? Of course, if materials were ers need. tion processes are actually adding value missing, production would stop. If we want A lot of science goes into the under- making products. Fewer than you might to have flexibility, we need to keep mate- standing of demand patterns, especially, for expect. There are reasons of course, mostly rials for any product that we may choose example, in the food and drink industry excuses actually. to manufacture in the immediate future. where shelf-times are short, competitive Reporting is based largely on the The lead-time on most materials is such elements between major stores are high, acceptance of these excuses—sorry—rea- that we need to maintain a certain defined and people get upset when they cannot sons. The true underlying productivity is stock on site, in terms of number of days of get the food they want, especially in times something that no one seems to want to product production. The long proven ERP/ of difficult weather conditions. The algo- talk about—as if competitiveness and the MRP systems take care of all of this for us, rithm to supply fresh bread to stores is very drive for efficiency over the years have not which is fine. much dependent on a daily weather check been enough to make us want to improve. Now, look into a typical manufacturing for example; if snow, then deliver at least 2 Now we have a new consideration, the operation and divide up the materials that times more than normal. environment. need to be there according to what we’ve Electronic products also have a The sustainability of our lives and just defined, and what materials are there demand pattern that is actually very pre- lifestyle is rapidly increasing in impor- for some other reason. In most cases, the dictable. What manufacturing sees of this tance, to the people who matter most, the actual inventory is two to four times the demand signal however is not the “pure customer. It is not just about hazardous actual needed amount. On investigation, demand signal” that is seen at the point materials and recycling, it is about energy this is mainly due to internal inventory of sale. Particularly towards the end of life efficiency. Consider the estimated 50%- inaccuracy. Accuracy means quantity and of products, manufacturing sees a square 70% of energy that manufacturing opera- location of materials. wave demand pattern, on or off, boom or tions “throw away” due to inefficiency of Due to the inaccuracies, material prep- bust, as the logic inside the traditional dis- the operations. Think of the excess CO2 aration and storage processes have gradu- tribution systems struggles to cope with emissions. Think of the increase of taxes ally grown up to ensure that the machines contradicting needs. The product price is being imposed on industries in order to should never stop due to lack of materials. falling, the value of stocks in the various regulate such emissions. This has become This has been quite the normal process warehouses is plummeting, run it down, a new direct cost. It’s time to re-think how no doubt since the first artificial “internal” run it out, but, hang on, we are still sell- energy is used. Use the right machines for materials shortage was discovered. What ing products, we need more! Product lines the job, keep them fully utilized, plan more happens now works, but at a cost that is have died out “prematurely” due to this effectively, it is the same story as in the quite crippling for a business. distortion of the demand pattern. How can past, but now moving it up to another level. It starts with the money invested in the manufacturing optimize their planning Turn the lights on! excess materials. There is also the overhead based on such chaotic forecasting? Today’s comprehensive CIM/CAM to manage such large stocks, move them, The future direction has to be to purify solutions provide an unprecedented abil- store them, the space, the warehouse orga- the demand signal from point of sale to ity for electronics manufacturers to have nization, the line stocks, the many kits that manufacturing, allowing a much more incredible visibility into their manufactur- are prepared in advance, the security of managed schedule and process plan- ing operations. Operational Intelligence materials to ensure they don’t go “missing ning. Today’s tools, founded on principles (OI) to provide active feedback of in the night”, and the inevitable fire-fight- dating back to the 1970s, have been quite improvement opportunities, and Business ing operation when it is found that they challenged already as lead times between Intelligence (BI) to report the full extent have. (Breathe!). manufacturing and the shelf have been the view of the manufacturing operation There is yet more; the MSD control forced to decrease. Time now for a change, is a very realistic expectation. Use the issue of stock as it ages, the lack of ability to

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 31 Future industry directions change the production plan at short notice due to the huge potential work to re-factor all of those kits. (Breathe!) There is still more! The hidden causes of the material inaccuracies that continue to accumulate and inevitably will be noticed. These now manifest themselves as the need for very significant write-offs of materials after very disruptive stock-takes, which need to happen frequently in order to sustain the operation. Does this still sound like a good idea? Yet manufacturing operations are so sensitive to stoppages due to lack of materials that this area is like a sacred process Figure 2. Mixing machine and tool vendors should result in optimum performance, not that it seems few dare to question, or introduce roadblocks. attempt to change the procedures. Recently, however, with the availability of lean material management tools specifically careful not to expose themselves to issues ing system solution has the breadth and designed for electronics manufacturing, outside of the area of the machines, since capability to understand and combine all some companies now enjoy a revolution in the wish-list of most manufacturers is long aspects of manufacturing into a single the way materials are managed. Through and complex extending into the supply environment. The environment has to be the use of these tools, the majority of the chain, quality management, and even total open and available to encourage machine excess materials have been eliminated. It plant performance and traceability. vendors to integrate into the platform in is a quiet revolution; those who have gone Standards in the industry have come such a way that also allows them to con- ahead have achieved a very significant and gone over the years. One area is the tinue to provide their solutions within advantage over their peers. At some point, way the machines communicate through their comfort zone to their customers. as understanding and realization develop, some standard interfaces. A great idea on There are strong benefits here for the lean material management is going to gain paper, but this is little more than “pipe defi- machine vendors as well as the manufactur- huge momentum: a very strong industry nition.” What is the flavor or meaning of ers. There is still today a natural resistance direction for the future. the data that flows through the pipe? How for machine vendors to become dependent the data can be turned into information at on third parties and also for them to allow the other end combining it with other stuff the customers who are single, or at worst Direction #5: Close the door coming out of other pipes remains the real dual vendor sites, to have the barriers and enjoy the open door issue. removed potentially for other third par- policy There are the standards related to data ties to come in. Such barriers are artificial; SMT machine vendors are to be admired. and reporting that define how to turn data the customers of the machines may argue They have technology and have made into information. These are very difficult that machine vendors should compete on investments that are put into their prod- to implement due to the different data the merits of their machines and not create ucts, which do things that today seem to streams available and the requirement artificial costs and barriers for them. A rise defy the laws of physics. The marketplace to mix data from several different disci- in such sentiment would lead to significant for such machines is, and has always been, plines—manufacturing, test, quality, mate- market pressure on machine vendors to re- fiercely competitive—so much so that rials etc. For many, they have little mean- evaluate their positions. there has been no successful standardiza- ing or are too complex to follow. For these Today already, a small selection of tion of engineering or performance data to and other reasons, the standardization of key machine vendors are providing the feed or manage these machines. the SMT manufacturing environment has tools with which manufacturing system Vendors successively introduce key never been successfully realized in com- solutions providers can fully integrate the new features that create new demands on parison say to that of semiconductor man- machines into a standard manufacturing the data they need and generate. There ufacturing. environment. The direction is indicated, is value, and certainly there is customer How are SMT manufacturers sup- now we need to move forward. demand for the machine vendors to proposed to optimize their operations when vide related support software to support they have a mix of different vendor equip- the complex NPI process preparation, as ment? Some machine vendors use this as a well as provide data for performance anal- tactic to create loyalty to them as a single ysis and traceability. Sometimes, machine supplier. While there are benefits to this, it vendors are pushed to provide function- also introduces restrictions and risks. The ality that strays outside of the comfort future direction here is to find a new way zone of the machine itself. The data and to provide the benefits of standardization. supporting systems are almost always pro- Close the door now on attempts to prietary to each vendor. Vendors cannot blindly standardize and open the door to support each other’s machines due to the a more sophisticated approach. This is an competitive issues. Vendors also are very approach where an intelligent manufactur-

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kyzen_GlobalSMT_SEAsia_2011_compass Monday, May 16, 2011 8:31:19 AM InterviewTitle Interview— Raminder Singh Soin, QUAD Electronics QUAD Electronics is a premier product life-cycle management company in Hyderabad, India. Since inception, collaborative partnerships and ground breaking solutions have converged to enable customer’s success. QUAD deliver unparalleled quality and support to original equipment manufacturers (OEMs), transform- ing thought leaders to market leaders. In an exclusive interview with Pradeep Chakraborty, Raminder Soin, chairman and managing director of QUAD, highlights the company’s capabilities and offers his take on the Indian electronics industry.

Please provide an overview of QUAD Electronics. What are the key areas you are working in? QUAD Electronic Solutions Pvt Ltd. is the premier and only product life cycle management (PLM) company in India in the field of electronics. We are an Indian company with a global DNA. We are based out of the city of Hyderabad, in the southern part of India. We provide a full range of PLM services to some of the biggest OEMs globally. We are a Tier-2 company with processes at par with those of Tier-1 companies. It is this unique value proposition of ours which prompted some of the prestigious names in the industry to associate with us for their global manufacturing requirements. We have demonstrated our competitiveness on both price and quality, vis-a vis global players. QUAD numerically connotes “4”— which represents the core domains of design, manufacturing, fulfillment and after-market services. We serve as an extended supply chain to our custom- communications, consumer, industrial, one each in Vishakhapatnam, Vijayawada ers, managing their procurement of com- enterprise and networking, power, and and Tirupathi. Apart from these locations, ponents/parts from preferred (least cost, defense. QUAD also has an office at Manchester, good quality) vendors worldwide, leverag- QUAD operates a network of five UK, for catering to its European clientele. ing economies of scale. sites in India—two in Hyderabad and QUAD offers its customers a unique At present, the markets we serve are

34 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com InterviewTitle blend of global processes and local deliv- lion by 2014 and to $320 billion by 2020. How do you see the future of developing ery, which supplements its knowledge of This would constitute a very significant the semiconductor Industry in India? Is the Indian business scenario. contribution to the GDP, at 20 percent for there any “limitation of growth” of EMS 2020, at par with other economies. business without developing the semicon What has QUAD recently done in elec- There is a clear upward trend for the business in India? tronics specifically? What’s planned appetite of electronics goods in India and The Indian government has taken certain ahead? the signs are very encouraging in turn for steps to revive the semiconductor business EMS players catering to OEMs. In the recent past, QUAD has added in India. The previous attempts could not another feather to its cap by way of getting yield desired results, but there has been a Has enough has been done about the the world’s largest computer peripherals recent revival in their efforts to push this Indian electronics industry? What more company to manufacture in India, with business. needs to be done? QUAD. Also, we now offer our manu- Earlier this year, various government facturing solutions for telecom products The Indian electronics industry continues delegations have visited countries such catering to the European markets. We have to grow at a healthy pace. A significant and as Taiwan with the purpose of attract- also started manufacturing of tablet PCs interesting statistic to note is that India’s ing investments into semiconductor fabs for a global player. import bill for electronics is projected to in India. Also, the GOI recently released The plan ahead is to target inorganic be bigger than its import bill for oil! Taking an EOI in this regard. The EMS business growth for QUAD and spread our foot- cognizance of this, the Indian government would derive a huge advantage with the prints into other markets. We would also has taken serious steps to encourage Indian development of the semiconductor indus- be focusing on venturing into the auto- electronics manufacturing going forward. try in India. motive, aerospace and medical segments, The National Manufacturing Policy has with increased focus on solutions for the recently got an in-principle approval from defense space. the central government. This policy calls for radical measures in Indian manufac- Healthcare and medical are said to be turing, in order to create sustained devel- key segments for India. What has QUAD opment for this country. been doing in these areas? However, concrete steps have to be taken in order to create an ecosystem for As far as the medical segment is concerned, components in India. This should be the we presently do not cater to this segment. top-priority going forward, in order for However, we do plan to add a customer in Indian electronics manufacturing to have this space by 2012. a strong and sustained growth. Also, the government needs to ease customs clear- What are you doing in enterprise and ance procedures for EHTP/SEZs for a networking sectors? Please elaborate. faster TAT. We have started manufacturing of tablet PCs, which has already put us into the What are your expansion plans? What enterprise and networking space. We are your biggest challenges currently? intend to grow this business further. Our plans for the future are aimed at domi- nating the PLM space in India and to grow What is your take on the Indian power our business globally through both organic electronics scenario for 2011-12 and and inorganic means. The biggest chal- beyond? lenges we see going forward are the lack This is a growing sector, and the demand of a supply chain ecosystem and access to for these products is increasing at a rate low-cost funding. greater than 20 percent year-over-year in India. Are there any plans to enter the solar business? How do you see the electronics indus- At present, the solar space in India is try in India performing in 2011-12 and very crowded, with not a very significant beyond? demand in India. With the National Solar As per recent market reports, the Indian Mission (NSM) in place, we would evalu- electronics market presently stands at ate the developments in this sector in the a value of $40 billion. This is slated to near future, and then strategize on what increase to a mammoth $400 billion by areas to target in this space, if lucrative. 2020, vis a vis the global market at $1.7 tril- lion. The present domestic production is around $20 billion—about 50 percent of the domestic demand! Domestic companies can expand the production to $85 bil-

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 35 Scavenging in today’s manufacturing operations Scavenging in today’s manufacturing operations Harold Hyman, VJ Electronix

Scavenging, site dressing, residual Introduction some form of height sensing automatically solder removal. What is in a There are numerous ways of performing sets the gap between the tool and the sur- this operation, bearing in mind that all sol- face of the board, resulting in a damage- name? “That which we call an dering becomes more critical when dealing free, high-reliability solution to the cleanup onion, by any other name would with lead-free alloys and elevated tempera- requirement. smell as strong” (apologies to the tures. Using a Soldering Iron and Solder Comparisons immortal bard). And, regardless Braid or Wick. This method is cheap, rela- Hand Scavenging with Soldering Iron. of the name you give it, the tively fast and does a reasonably good job, This relies on the capillary action that objective is the same—namely, the although it requires a skilled operator, is causes liquid solder to “wick” along a piece cleanup of remaining solder after difficult to control and suffers greatly from of copper braid. Heating is done with a sol- inconsistency. It also is quite labor-inten- dering iron that, together with the braid, is a component (particularly a BGA) sive. positioned on the solder to be removed. If or RF shield has been removed Manual Vacuum Scavenging, which done correctly, with suitable application of from a PCB. This article describes also is labor-intensive, is performed with flux, this operation can effectively remove hand tools or on a rework system and uses solder from pads or conductors on a PCB. the various methods that are a special concentric convective heating/ Millions of successful hand scavenging available and discusses the pros suction tool that melts the solder and sucks operations are performed daily. However, a and cons of each. it off the PCB. This approach is a non-con- great deal of skill is required and the correct tact method that alleviates the problems tools and materials are essential. A poorly associated with conductive tools, but it still executed job will not only fail to adequately relies on a skilled operator to perform the remove the solder but also can result in any lateral movements. number of defects. Automatic Scavenging uses the same The soldering iron must be of the cor- procedure as the manual approach except rect wattage to be capable of transferring that the lateral motions are motorized and enough heat to melt solder and cause wick-

Figure 1. Automated surface mount rework system.

36 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com HalogenFreeAd_603_605_044_Eng_EM_China.pdf 1 4/21/11 1:48 PM Scavenging in today’s manufacturing operations

The scavenging tool is height adjust- able to suit boards of different thickness, resulting in a truly non-contact operation that avoids damaging the board. This approach ensures users that the critical parameters are carefully controlled and potential damage is avoided with the possible exception of accidental contact. Automatic Scavenging. This follows much the same procedure as used in manual vacuum scavenging; however, this automates it so that, apart from the load- ing and unloading of the assembly to be scavenged, all the elements of the operational sequence and associated processes are preprogrammed, and further operator involvement is unnecessary. An automated surface mount rework system with motorized X-Y motion is taught to scan a component site so that once the assembly is correctly located on the system, the complete sequence of operations is performed automatically. Figure 2. Dynamic Height Sensing automatically maintains a consistent gap between the Identification of the board/site combina- scavenging tool and the surface of the board. tion automatically selects the correct set of times, temperatures, motion directions, ing. Too little heat obviously will not do an of this hand operation open the door for speeds and any other relevant parameters adequate job of melting the solder, with a method that is based on precise control for the procedure (Figure 1). disastrous results. and repeatability of critical parameters. Essential to the success of this opera- There always is the temptation to Manual Vacuum Scavenging. The tion is the incorporation of a feature increase the wattage/tip temperature with objective here is to control those process such as VJ Electronix’s Dynamic Height a view to completing the task very quickly. parameters that are major contributors to Sensing (DHS). This is invaluable because However, unless the operator is experi- board damage—temperature and contact. it automatically maintains a consistent gap enced and well skilled, there is a high prob- This is achieved by changing from conduc- between the scavenging tool and the sur- ability of board damage. Too much heat tive (soldering iron) to convective (hot gas) face of the board (Figure 2). This not only can be harmful and damaging to the PCB heat transfer. guarantees repeatable, optimum process substrate: delamination, blistering, break- Convective heating is performed by conditions but also ensures that there will down of copper/substrate adhesion, solder directing a flow of hot gas, typically air or be no contact between the tool and board, resist degradation, excess Cu/Sn interme- nitrogen, to the discrete point where the thus avoiding any damage. tallic compound formation, resulting in solder needs to be melted, after which the an unsolderable surface are a few of the resulting liquid solder is removed by apply- Conclusion potential problems. ing vacuum sufficient to extract the molten Hand Scavenging with Soldering Iron— Good practice requires the tip to be globule. A special coaxial tool is used, con- QUESTIONABLE! This method is prone placed on the braid and left there until the sisting of a small diameter vacuum probe to high defect rates and depends on the solder has melted and been absorbed by surrounded by a concentric tube that deliv- operator’s skill level of operator. The only for electronic manufacturing the wick, after which both the braid and ers the hot gas. Solder melting and removal advantage is low upfront cost. tip are removed together. If only the tip is occur very quickly. Once this happens, the Manual, Non-Contact Vacuum moved, the braid can remain soldered to board is moved laterally with respect to the Scavenging—BETTER! This method pro- the pad or conductor—a sure recipe for heating tool (or vice versa) so that the next vides much lower defect rates but still is pulled pads or conductors. point is treated in the same way. In practice, operator dependent. Another common problem is associ- an operator provides the lateral motion on Automatic Scavenging—BEST! ated with the tendency to agitate or move a continuous basis, rather than as a series Automatic scavenging is software-driven, the soldering iron and press the tip into of discrete steps, resulting in a rapid, effi- requires minimum operator involvement, the braid to bring about faster melting of cient operation. and provides consistent results as well a the solder. Because the braid is composed This procedure is performed on a semi- very low defect rates. of a mass of fine copper wires, it exhibits a automated surface mount rework system 19th International Trade Fair somewhat abrasive nature and acts rather that incorporates a movable, linear bearing like a scouring pad, which is effective in X-Y table and work holder to accommo- for Innovative Electronics Production scratching solder mask or otherwise dam- date the board, a platform for the heating/ aging board surfaces. The more the tip is vacuum tool and a large area bottom heater moved, the more this effect is exaggerated. together with a highly intelligent software november 15– 18, 2011 The shortcomings and inconsistencies program for process control. new munich trade fair centre innovation all along the line www.productronica.com

38 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com for electronic manufacturing

19th International Trade Fair for Innovative Electronics Production

november 15– 18, 2011 new munich trade fair centre innovation all along the line www.productronica.com electronica India 2011 and productronica India 2011 open their gates this September electronica India 2011 and productronica India 2011 open their gates

he electronics industry in India has been very optimistic and consump- Play KIC’s man vs. machine reflow profiling game for a chance to win an tion of electronic components is on Apple iPad2 at Electronica/Productronica India 2011 Ta new high. Messe München International KIC, manufacturer of thermal process (MMI) has sought this opportunity and development and control products, is has organized electronica India 2011 and offering Electronica/Productronica India productronica India 2011 which is set to visitors an opportunity to win an Apple start on September 13, 2011, at Pragati iPad2 by beating the company’s award- Maidan, New Delhi. This is the best place winning Auto-Prediction Navigator to gather information to build the technol- Profiling Software. In addition to the ogy roadmap and identify ways to make chance to win an iPad2, all participants will business more agile and efficient. The four come away with a certificate for a free KIC day exhibition provides comprehensive Navigator or Auto-Focus Power upgrade, a $975 value*! thought leadership in electronic and prod- The competition consists of three real-life challenges, each of which represents an uct technology driving the business tech- actual PCB. In each challenge, the KIC Navigator finds an in-spec solution in less than nology market in India. 15 seconds. Can you do that? After a successful show in 2010 in Visit distributor Mectronics Marketing Services’ Booth #1230 at the Electronica Bangalore, electronica India 2011 and International Trade Fair, or visit http://kicthermal.com/man-versus-machine.html. productronica India 2011 will play host to * Navigator or Auto-Focus is required to run the Navigator Power. The certificate is valid until October 31, 2011. over 900 exhibitors with country pavilions from China, Germany, Hong Kong Korea, Singapore and Taiwan. The events will also is fuelling a massive consumer boom. have participation from Japan, Switzerland, Demand for electronic gadgets, appliances India is a growing market and the USA, Italy, Spain, and Malaysia, all together and equipment is growing briskly, compa- events prove to be good platforms for com- from 25 countries. nies are increasingly turning to EMS firms panies to showcase their products and get Major players exhibiting this year to fill the gap, as said by Darryl Dasilva, a feel of what is happening in the industry include Agilent Technologies, element14, CEO - MMI India. in terms of new technology and offerings. Infineon Technologies, Juki India, Kaynes Dasilva further adds: “Despite difficult electronica India and productronica India Technology, Leaptech Corporation, global economic conditions, the Indian are established platforms for electronic National Instruments, NMTtronics, NXP economy is on a steady growth plan. If we components and electronics production Semiconductiors, Panasonic Corporation, look for impulses behind this growth, the and a good experience to see many inter- RS Components & Controls, Rohde & electronics industry is definitely an impor- national participants providing access to Schwarz India, STMicroelectronics, Sony, tant part. India, as a market, is still growing the emerging Indian market. The strong TATA Power. and is one of the most important future presence of companies with the product The events will be accompanied by two markets for the electronics industry, due to spectrum of semiconductors, passive com- concurrent technical conferences where its innovation, strength and growth poten- ponents, material processing, soldering industry experts from India and overseas tial. The long term for India as an outsourc- technology and many more make the event will share their knowledge and expertise, ing location is also very promising.” one of the hot spots for electronics. and work towards creating a roadmap for sustainable growth and enable global competitiveness. electronica India 2011 is India’s and productronica India 2011 is an innova- electronica India 2011 and produc- South Asia’s leading fair for electronic tive platform for production technologies tronica India 2011 co-operate with min- components, systems and applications. covering as wide as packaging, material istries and official organizations and are As the most important communication processing, component manufacturing, supported by all important industry asso- platform for the electronics industry, manufacturing equipment and logistics ciations. One important partner in this electronica India displays all a special- for PCBs and other circuit carries, tech- respect is the “Ministry of Communications ized fair can offer with products ranging nologies in cable processing, soldering and Information Technology, department from semiconductors, sensors, relays, technology, manufacturing equipment of Information Technology. More than 15 switched and interconnection technol- and logistics for assemblies, modules industry associations which are working ogy to passive components, motors/ and hybrids, general operation aids, pro- around for the development of the indus- drives, cables, ED/EDA, assemblies and duction subsystems, production related try support these events. subsystems to test and measurement services, laser and laser systems for India has already emerged as a hot spot technology, Displays and power sup- electronics production. for Contract Manufacturing (Electronics plies. With electronica India, the entire Manufacturing Services—EMS and value-added chain of the electronics Original Developer Manufacturing— industry is presented. ODM). The growing Indian economy

40 – Global SMT & Packaging South East Asia –September/October 2011 www.globalsmtseasia.com New productsTitle New products

tive dispensing in electronics manufacturing, LED assembly and other industries. www.essemtec.com

SIPLACE Alternative Components for component bottlenecks With SIPLACE Alternative Components, ASM Assembly Systems GmbH & Co. KG presents a software add-on that allows electronics manufacturers to define alternative components for each placement position. This makes it possible to seamlessly switch to functionally identical components (for example, alternative/second-source components from other manufacturers) when bottlenecks occur, even if these components have a slightly different packaging or shape. Electronics manufacturers also save the expense of having to change and administer different placement program versions to accommodate different component manufacturers. www.siplace.com

Miyachi Unitek introduces single Data I/O Corporation introduces new mode Fiber Laser Marker RoadRunner3 inline programming Miyachi Unitek Corporation announces system the release of its new 20 W single mode Data I/O Corporation announced the new fiber laser marker, which yields a finer RoadRunner3 inline programming system. beam with a variety of advantages for With its Factory Integration Software, marking, scribing and cutting applications. RoadRunner3 streamlines the production The new LMF 2000-SM laser marker can process and eliminates operator errors produce finer lines and increases the mark through its connection to a firm’s manu- working area. It also has an increased depth facturing execution system or other shop- of focus for marking on curved surfaces. floor control software. RoadRunner3 easily The new model is ideal for the scribing and Essemtec doubles dispensing speed integrates into existing SMT processes. By cutting a wide variety of materials, includ- removing unprogrammed Flash memory and accuracy ing alumina, silicon, copper and aluminum devices from tape, the RoadRunner3 pro- Essemtec introduces the new Scorpion foils. www.miyachiunitek.com grams four devices in parallel and then automatic dispensing system. The machine delivers the programmed parts to the is built on the Paraquda machine base, Medical grade epoxy adhesive pickup point of the placement machine. which enables highly accurate dispensing withstands high temperatures and www.dataio.com and performance of up to 100’000 dots repeated sterilization per hour. The machine can be equipped Capable of tolerating the harsh environ- JBC Tools Inc. introduces C245 with up to four different dispensing valves ments of the medical industry, Master Super Cartridges for high thermal and is designed for flexible and produc- Bond EP42HT-2ND2MED fully complies efficiency with the testing requirements of USP Class JBC Tools, Inc. introduces its new VI plastics. This two component epoxy C245 Super Cartridges for high resists recurrent autoclaving and steriliza- thermal efficiency. JBC’s R&D tions including radiation, steam, ethylene team developed a new range of oxide, and chemical sterilants. EP42HT- high thermal efficiency cartridges 2ND2MED is an electrical insulator with that allow the T245 hand piece a volume resistivity over 1012 ohm-cm, station to supply the most power a thermal expansion coefficient of 35 to possible to the solder joint. This 40 in/in x 10-6/°C, a dielectric constant is achieved through redesigning of 3.8, and a tensile strength exceed- tip geometries for optimal ther- ing 12,000 psi at ambient temperatures. mal transfer. www.jbctools.com www.masterbond.com

www.globalsmtseasia.com Global SMT & Packaging South East Asia –September/October 2011 – 41 New products

cations in production. Because these fluids change viscosity over time, they pose a unique challenge. To solve these problems, Nordson EFD developed the Ultimus™ V High Precision Dispenser, which eliminates viscosity-related issues by automatically adjusting dispensing parameters over the course of the fluid’s working life to maintain uniform shot size. www.nordsonefd.com

Multitest introduces new MEMS test and calibration equipment

Breakthrough pressureless silver with improved sintering technology delivers high environmen- UPH, high reliability solution tal properties. Henkel Electronic Materials announces Electrolube’s its success with a silver (Ag) sintering FREH Freezer, a technology that enables production of powerful refrig- modern power packages in a process that erant, and the does not require pressure. Henkel’s Ag sin- EADH Air Duster tering capability has been designed into have been devel- Ablestik SSP2000. With Ablestik SSP2000, oped without the because the silver particles are joined via use of harmful a unique surface tension mechanism, the gasses. Both prod- pressure requirement is eliminated and the ucts contain a novel hydrofluo- material can be cured in a standard batch Multitest has successfully added a new rocarbon propel- oven at a temperature as low as 200˚C. application to its MEMS test and calibra- lant with improved environmental properties. www.henkel.com/electronics tion product line. With the new applica- The propellant used in alternative products is tion, 3-D earth magnetic field sensors can usually HFC-134a or a blend thereof; switch- Techcon Systems enhances the be used for innovative mobile applications ing to the propellant used in FREH and TS6500CIM Techkit mixer and state-of-the-art navigation applica- EADH can reduce the equivalent CO2 emis- Techcon Systems intro- tions without the use of a GPS. In addi- sions by >99.5%. www.electrolube.com duces the updated tion to being an alternative to using the TS6500CIM Techkit High Precision Dispenser Ultimus™ earth’s magnetic field, the application can mixer. The TS6500CIM be configured with external magnetic coils. V—a new way to handle changing Series cartridge mixer This configuration provides high magnetic incorporates many fluid viscosity force at the highest accuracy. www.multit- high-quality safety fea- est.com/MEMS tures including a two- hand start, a strength- MARTIN can remove & replace even ened metal door with the smallest LEDs acrylic windows that MARTIN GmbH is offering equipment is fitted with a safety that enables the removal and replacement interlock, preventing of even the smallest LEDs. In contrast to accidental start up, and the carrier material, the active parts of the an emergency stop LEDs can tolerate only relatively moderate button. With the introduction of a pressure exposures to elevated temperatures. Heat relief valve, the plunger assembly depres- discolouration of the lenses can lead to the surizes when the safety door is opened. components becoming unusable. This can www.techconsystems.com be avoided by using Martin EXPERT 10.6 rework systems which combine powerful Electrolube adds to its hybrid underheating, precisely controlled Silver epoxies, die-attach epoxies and green credentials hot air top heating, and innovative EASY underfill materials are used in many Electrolube has added to its green cre- SOLDER software. www.martin-smt.de dentials by introducing two new products electronics and other assembling appli-

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FlashCoreIIIad2.indd 1 9/28/09 8:58:00 PM Title

International Diary

electronica India + electronicAsia India Telecom productronica India October 13-16 New Delhi, India September 13-16 Hong Kong December 7-9 Bangalore, India electronicasia.com www.indiatelecom.org electronica-india.com EPTC Electronics Packaging Hong Kong Electronics NEPCON Vietnam Technology April 13-16, 2012 October 6-8 December 7-9 Hong Kong Hanoi, Vietnam Singapore hkelectronicsfairse.com nepconvietnam.com www.eptc-ieee.net

Six s

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India: DVS DVS Bangalore Office3 MORSE ROADMalaysia • :OXFORD, Crest Systems CT 06478Indonesia: Headquarters S-131, Lower Grnd Floor No. 201, APHONE: Wing (+1) 203-881-5559No. 9 Jalan TK• FAX: 2/1C,Taman (+1) 203-881-3322 PT. SMT Solution MIRTEC Panchsheel Park SMR VinayPHONE: Estate (+1) 203-881-5559Kinrara,Jalan • Puchong,FAX: (+1) 203-881-3322Jl. Industri Selatan 8 Block Suite 801-3 103 Dong New Delhi-110017 India Horamavu cross www.mirtecusa.com58200 Puchong, Kuala EE-6A Kawasan Industri SK Ventium 522 (0) 91-11-26016672-73 Outer Ring Road Lumpur,Malaysia Jababeka II Cikarang, Bekasi Dangjung Dong Mr. Snehashis Khan: Dodda Banasawadi +603-80752268 17530 Indonesia Gunpo, South Korea [email protected] Bangalore - 56 00 43 India www.crest-systems.com [62]-21-8983-5903 www.mirtec.com +91-80-2545 7241 Mr. Au CM: cm.au@ Han, Sangrin: www.globalsmtindia.in crestsystems.com.myGlobal SMT & [email protected] Southeast Asia – Spring 2010 – 37

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