REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT 3D Time-of-Flight Module in Meizu 17 Pro The first 3D ToF camera from Samsung with Lumentum’s VCSEL SP20571 - IMAGING report by Taha AYARI Laboratory analysis by Youssef EL GMILI November 2020 - Sample 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16
[email protected] www.systemplus.fr ©2020 by System Plus Consulting | SP20571 - 3D Time-o-Flight Module in Meizu 17 Pro | Sample 1 Table of Contents Overview / Introduction 4 Manufacturing Process 79 o Executive Summary o Global Overview o Reverse Costing Methodology o NIR Sensor Die Front-End Process & Fabrication Unit Company Profile 11 o NIR VCSEL Process Flow & Fabrication Unit o VCSEL Driver Die Front-End Process & Fabrication Unit Market Analysis 15 Cost Analysis 92 Physical Analysis 19 o Summary of the Cost Analysis o Summary of the Physical Analysis o Yields Explanation & Hypotheses o 3D Sensing System Assembly o NIR Camera Module ✓ Module Views ✓ Pixel Array, BSI & Optical Front-End Cost ✓ Module Opening ✓ NIR ToF Image Sensor Wafer & Die Cost ✓ System Cross-Section o Flood Illuminator Module o NIR Camera Module ✓ NIR VCSEL Front-End Cost ✓ Module Views & Dimensions ✓ NIR VCSEL Probe Test, Thinning & Dicing ✓ Module Cross-Section ✓ NIR VCSEL Die Wafer Cost o NIR CMOS Image Sensor ✓ Component Cost ✓ Die Overview & Dimensions o VCSEL Driver ✓ Die Process ✓ Front-End Cost ✓ Die Cross-Section ✓ Probe Test, Thinning & Dicing ✓ Die Process Characteristics ✓ Die Cost o Flood Illuminator ✓ Module Views & Dimensions o ToF Module ✓ Module Cross-Section ✓ Complete Module Cost ✓ Complete Module Price o NIR VCSEL Die ✓ Die Views & Dimensions Technical and Cost Comparison 121 ✓ Die Process o Meizu 17 Pro vs.