Federal Register/Vol. 65, No. 156/Friday, August 11, 2000/Notices
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Wind River Vxworks Platforms 3.8
Wind River VxWorks Platforms 3.8 The market for secure, intelligent, Table of Contents Build System ................................ 24 connected devices is constantly expand- Command-Line Project Platforms Available in ing. Embedded devices are becoming and Build System .......................... 24 VxWorks Edition .................................2 more complex to meet market demands. Workbench Debugger .................. 24 New in VxWorks Platforms 3.8 ............2 Internet connectivity allows new levels of VxWorks Simulator ....................... 24 remote management but also calls for VxWorks Platforms Features ...............3 Workbench VxWorks Source increased levels of security. VxWorks Real-Time Operating Build Configuration ...................... 25 System ...........................................3 More powerful processors are being VxWorks 6.x Kernel Compatibility .............................3 considered to drive intelligence and Configurator ................................. 25 higher functionality into devices. Because State-of-the-Art Memory Host Shell ..................................... 25 Protection ..................................3 real-time and performance requirements Kernel Shell .................................. 25 are nonnegotiable, manufacturers are VxBus Framework ......................4 Run-Time Analysis Tools ............... 26 cautious about incorporating new Core Dump File Generation technologies into proven systems. To and Analysis ...............................4 System Viewer ........................ -
Intel Quartus Prime Pro Edition User Guide: Programmer Send Feedback
Intel® Quartus® Prime Pro Edition User Guide Programmer Updated for Intel® Quartus® Prime Design Suite: 21.2 Subscribe UG-20134 | 2021.07.21 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Intel® Quartus® Prime Programmer User Guide..............................................................4 1.1. Generating Primary Device Programming Files........................................................... 5 1.2. Generating Secondary Programming Files................................................................. 6 1.2.1. Generating Secondary Programming Files (Programming File Generator)........... 7 1.2.2. Generating Secondary Programming Files (Convert Programming File Dialog Box)............................................................................................. 11 1.3. Enabling Bitstream Security for Intel Stratix 10 Devices............................................ 18 1.3.1. Enabling Bitstream Authentication (Programming File Generator)................... 19 1.3.2. Specifying Additional Physical Security Settings (Programming File Generator).............................................................................................. 21 1.3.3. Enabling Bitstream Encryption (Programming File Generator).........................22 1.4. Enabling Bitstream Encryption or Compression for Intel Arria 10 and Intel Cyclone 10 GX Devices.................................................................................................. 23 1.5. Generating Programming Files for Partial Reconfiguration......................................... -
A Superscalar Out-Of-Order X86 Soft Processor for FPGA
A Superscalar Out-of-Order x86 Soft Processor for FPGA Henry Wong University of Toronto, Intel [email protected] June 5, 2019 Stanford University EE380 1 Hi! ● CPU architect, Intel Hillsboro ● Ph.D., University of Toronto ● Today: x86 OoO processor for FPGA (Ph.D. work) – Motivation – High-level design and results – Microarchitecture details and some circuits 2 FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT6-LUT 6-LUT6-LUT 3 6-LUT 6-LUT FPGA: Field-Programmable Gate Array ● Is a digital circuit (logic gates and wires) ● Is field-programmable (at power-on, not in the fab) ● Pre-fab everything you’ll ever need – 20x area, 20x delay cost – Circuit building blocks are somewhat bigger than logic gates 6-LUT 6-LUT 6-LUT 6-LUT 4 6-LUT 6-LUT FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 5 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel code and hardware accelerators need effort – Less effort if soft processors got faster 6 FPGA Soft Processors ● FPGA systems often have software components – Often running on a soft processor ● Need more performance? – Parallel -
EDN Magazine, December 17, 2004 (.Pdf)
ᮋ HE BEST 100 PRODUCTS OF 2004 encompass a range of architectures and technologies Tand a plethora of categories—from analog ICs to multimedia to test-and-measurement tools. All are innovative, but, of the thousands that manufacturers announce each year and the hundreds that EDN reports on, only about 100 hot products make our readers re- ally sit up and take notice. Here are the picks from this year's crop. We present the basic info here. To get the whole scoop and find out why these products are so compelling, go to the Web version of this article on our Web site at www.edn.com. There, you'll find links to the full text of the articles that cover these products' dazzling features. ANALOG ICs Power Integrations COMMUNICATIONS NetLogic Microsystems Analog Devices LNK306P Atheros Communications NSE5512GLQ network AD1954 audio DAC switching power converter AR5005 Wi-Fi chip sets search engine www.analog.com www.powerint.com www.atheros.com www.netlogicmicro.com D2Audio Texas Instruments Fulcrum Microsystems Parama Networks XR125 seven-channel VCA8613 FM1010 six-port SPI-4,2 PNI8040 add-drop module eight-channel VGA switch chip multiplexer www.d2audio.com www.ti.com www.fulcrummicro.com www.paramanet.com International Rectifier Wolfson Microelectronics Motia PMC-Sierra IR2520D CFL ballast WM8740 audio DAC Javelin smart-antenna IC MSP2015, 2020, 4000, and power controller www.wolfsonmicro.com www.motia.com 5000 VoIP gateway chips www.irf.com www.pmc-sierra.com www.edn.com December 17, 2004 | edn 29 100 Texas Instruments Intel DISCRETE SEMICONDUCTORS -
Introduction to Intel® FPGA IP Cores
Introduction to Intel® FPGA IP Cores Updated for Intel® Quartus® Prime Design Suite: 20.3 Subscribe UG-01056 | 2020.11.09 Send Feedback Latest document on the web: PDF | HTML Contents Contents 1. Introduction to Intel® FPGA IP Cores..............................................................................3 1.1. IP Catalog and Parameter Editor.............................................................................. 4 1.1.1. The Parameter Editor................................................................................. 5 1.2. Installing and Licensing Intel FPGA IP Cores.............................................................. 5 1.2.1. Intel FPGA IP Evaluation Mode.....................................................................6 1.2.2. Checking the IP License Status.................................................................... 8 1.2.3. Intel FPGA IP Versioning............................................................................. 9 1.2.4. Adding IP to IP Catalog...............................................................................9 1.3. Best Practices for Intel FPGA IP..............................................................................10 1.4. IP General Settings.............................................................................................. 11 1.5. Generating IP Cores (Intel Quartus Prime Pro Edition)...............................................12 1.5.1. IP Core Generation Output (Intel Quartus Prime Pro Edition)..........................13 1.5.2. Scripting IP Core Generation.................................................................... -
North American Company Profiles 8X8
North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications. -
Intel® Arria® 10 Device Overview
Intel® Arria® 10 Device Overview Subscribe A10-OVERVIEW | 2020.10.20 Send Feedback Latest document on the web: PDF | HTML Contents Contents Intel® Arria® 10 Device Overview....................................................................................... 3 Key Advantages of Intel Arria 10 Devices........................................................................ 4 Summary of Intel Arria 10 Features................................................................................4 Intel Arria 10 Device Variants and Packages.....................................................................7 Intel Arria 10 GX.................................................................................................7 Intel Arria 10 GT............................................................................................... 11 Intel Arria 10 SX............................................................................................... 14 I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17 Adaptive Logic Module................................................................................................ 17 Variable-Precision DSP Block........................................................................................18 Embedded Memory Blocks........................................................................................... 20 Types of Embedded Memory............................................................................... 21 Embedded Memory Capacity in -
Demystifying Internet of Things Security Successful Iot Device/Edge and Platform Security Deployment — Sunil Cheruvu Anil Kumar Ned Smith David M
Demystifying Internet of Things Security Successful IoT Device/Edge and Platform Security Deployment — Sunil Cheruvu Anil Kumar Ned Smith David M. Wheeler Demystifying Internet of Things Security Successful IoT Device/Edge and Platform Security Deployment Sunil Cheruvu Anil Kumar Ned Smith David M. Wheeler Demystifying Internet of Things Security: Successful IoT Device/Edge and Platform Security Deployment Sunil Cheruvu Anil Kumar Chandler, AZ, USA Chandler, AZ, USA Ned Smith David M. Wheeler Beaverton, OR, USA Gilbert, AZ, USA ISBN-13 (pbk): 978-1-4842-2895-1 ISBN-13 (electronic): 978-1-4842-2896-8 https://doi.org/10.1007/978-1-4842-2896-8 Copyright © 2020 by The Editor(s) (if applicable) and The Author(s) This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Open Access This book is licensed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made. The images or other third party material in this book are included in the book’s Creative Commons license, unless indicated otherwise in a credit line to the material. -
Moore's Law Motivation
Motivation: Moore’s Law • Every two years: – Double the number of transistors CprE 488 – Embedded Systems Design – Build higher performance general-purpose processors Lecture 8 – Hardware Acceleration • Make the transistors available to the masses • Increase performance (1.8×↑) Joseph Zambreno • Lower the cost of computing (1.8×↓) Electrical and Computer Engineering Iowa State University • Sounds great, what’s the catch? www.ece.iastate.edu/~zambreno rcl.ece.iastate.edu Gordon Moore First, solve the problem. Then, write the code. – John Johnson Zambreno, Spring 2017 © ISU CprE 488 (Hardware Acceleration) Lect-08.2 Motivation: Moore’s Law (cont.) Motivation: Dennard Scaling • The “catch” – powering the transistors without • As transistors get smaller their power density stays melting the chip! constant 10,000,000,000 2,200,000,000 Transistor: 2D Voltage-Controlled Switch 1,000,000,000 Chip Transistor Dimensions 100,000,000 Count Voltage 10,000,000 ×0.7 1,000,000 Doping Concentrations 100,000 Robert Dennard 10,000 2300 Area 0.5×↓ 1,000 130W 100 Capacitance 0.7×↓ 10 0.5W 1 Frequency 1.4×↑ 0 Power = Capacitance × Frequency × Voltage2 1970 1975 1980 1985 1990 1995 2000 2005 2010 2015 Power 0.5×↓ Zambreno, Spring 2017 © ISU CprE 488 (Hardware Acceleration) Lect-08.3 Zambreno, Spring 2017 © ISU CprE 488 (Hardware Acceleration) Lect-08.4 Motivation Dennard Scaling (cont.) Motivation: Dark Silicon • In mid 2000s, Dennard scaling “broke” • Dark silicon – the fraction of transistors that need to be powered off at all times (due to power + thermal -
Integrated Circuit Design
ICD Integrated Circuit Design Assessment Informal Coursework LEdit Gate Layout Integrated Circuit Design Examination Books Digital Integrated Circuits Iain McNally Jan Rabaey PrenticeHall lectures Principles of CMOS VLSI Design ACircuits and Systems Perspective Koushik Maharatna Neil Weste David Harris AddisonWesley lectures Notes Resources httpusersecssotonacukbimnotesicd History Integrated Circuit Design Iain McNally First Transistor John Bardeen Walter Brattain and William Shockley Bell Labs Content Integrated Circuits Proposed Introduction Geoffrey Dummer Royal Radar Establishment prototype failed Overview of Technologies Layout First Integrated Circuit Design Rules and Abstraction Jack Kilby Texas Instruments Coinventor Cell Design and Euler Paths First Planar Integrated Circuit System Design using StandardCells Robert Noyce Fairchild Coinventor Pass Transistor Circuits First Commercial ICs Storage Simple logic functions from TI and Fairchild PLAs Moores Law Gordon Moore Fairchild observes the trends in integration Wider View History History Moores Law Moores Law a Selffullling Prophesy Predicts exponential growth in the number of components per chip The whole industry uses the Moores Law curve to plan new fabrication facilities Doubling Every Year In Gordon Moore observed that the number of components per chip had Slower wasted investment doubled every year since and predicted that the trend would continue through to Must keep up with the Joneses Moore describes his initial growth predictions -
HOW DID SILICON VALLEY BECOME SILICON VALLEY? Three Surprising Lessons for Other Cities and Regions
HOW DID SILICON VALLEY BECOME SILICON VALLEY? Three Surprising Lessons for Other Cities and Regions a report from: supported by: 2 / How Silicon Valley Became "Silicon Valley" This report was created by Rhett Morris and Mariana Penido. They wish to thank Jona Afezolli, Fernando Fabre, Mike Goodwin, Matt Lerner, and Han Sun who provided critical assistance and input. For additional information on this research, please contact Rhett Morris at [email protected]. How Silicon Valley Became "Silicon Valley" / 3 INTRODUCTION THE JOURNALIST Don Hoefler coined the York in the chip industry.4 No one expected the term “Silicon Valley” in a 1971 article about region to become a hub for these technology computer chip companies in the San Francisco companies. Bay Area.1 At that time, the region was home to Silicon Valley’s rapid development offers many prominent chip businesses, such as Intel good news to other cities and regions. This and AMD. All of these companies used silicon report will share the story of its creation and to manufacture their chips and were located in analyze the steps that enabled it to grow. While a farming valley south of the city. Hoefler com- it is impossible to replicate the exact events that bined these two facts to create a new name for established this region 50 years ago, the devel- the area that highlighted the success of these opment of Silicon Valley can provide insights chip businesses. to leaders in communities across the world. Its Silicon Valley is now the most famous story illustrates three important lessons for cul- technology hub in the world, but it was a very tivating high-growth companies and industries: different place before these businesses devel- oped. -
Altera Petition
No. In the Supreme Court of the United States ALTERA CORPORATION & S UBSIDIARIES, Petitioners, v. COMMISSIONER OF INTERNAL REVENUE, Respondent. On Petition for a Writ of Certiorari to the United States Court of Appeals for the Ninth Circuit PETITION FOR A WRIT OF CERTIORARI G INGER D. ANDERS NICOLE A. SAHARSKY Munger Tolles & Olson LLP Counsel of Record 1155 F Street NW BRIAN D. NETTER Washington, DC 20004 MINH NGUYEN-DANG Mayer Brown LLP MARK R. YOHALEM 1999 K Street NW Munger Tolles & Olson LLP Washington, DC 20006 350 S. Grand Avenue (202) 263-3000 Los Angeles, CA 90071 [email protected] A. DUANE WEBBER DONALD M. FALK PHILLIP J. TAYLOR Mayer Brown LLP JOSEPH B. JUDKINS 3000 El Camino Real #300 Baker & McKenzie LLP Palo Alto, CA 94306 815 Connecticut Avenue NW Washington, DC 20006 THOMAS KITTLE-KAMP WILLIAM G. MCGARRITY Mayer Brown LLP 71 S. Wacker Drive Chicago, IL 60606 Counsel for Petitioners QUESTIONS PRESENTED For nearly a century, federal tax treatment of agreements between related companies (such as par- ents and subsidiaries) has depended on the “arm’s- length” standard: If unrelated companies operating at arm’s length would share a cost, then related com- panies must share the cost as well. 26 U.S.C. 482; 26 C.F.R. 1.482-1(b)(1). The United States has incorpo- rated the arm’s-length standard into many tax trea- ties, and all major developed nations now follow it. In 2003, the Treasury Department promulgated a regulation, purporting to follow the arm’s-length standard, in which it required related companies to share the cost of stock-based employee compensation.